CN112399740A - EPS power module and preparation method thereof - Google Patents
EPS power module and preparation method thereof Download PDFInfo
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- CN112399740A CN112399740A CN202011138801.6A CN202011138801A CN112399740A CN 112399740 A CN112399740 A CN 112399740A CN 202011138801 A CN202011138801 A CN 202011138801A CN 112399740 A CN112399740 A CN 112399740A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides an EPS power module and a preparation method thereof, comprising the following steps: the circuit board is arranged in the shell; the housing includes: the bottom plate and the cover plate are buckled to form a cavity for accommodating the circuit board, and a plurality of pins are arranged at the buckling positions on the two sides of the bottom plate and the cover plate; one end of the pin is connected with the circuit board; the circuit board includes: the thermistor comprises a substrate, at least one field effect transistor arranged on the substrate and at least one thermistor arranged on the substrate. The EPS power module has a simple structure, meets the performance requirement of an EPS system, and can feed the temperature of the EPS power module back to the system.
Description
Technical Field
The invention relates to the technical field of power modules, in particular to an EPS power module and a preparation method thereof.
Background
Currently, an EPS (Electric Power Steering) system, which directly provides Steering assistance only by an Electric motor, has the advantages of simple adjustment, flexible assembly, and capability of providing Steering assistance in various situations. Therefore, the performance of the EPS power modules constituting the EPS system is particularly important.
Disclosure of Invention
One of the objectives of the present invention is to provide an EPS power module, which has a simple structure, meets the performance requirements of an EPS system, and can feed back the temperature of the EPS power module to the system.
An EPS power module provided in an embodiment of the present invention includes: the circuit board is arranged in the shell;
the housing includes: the bottom plate and the cover plate are buckled to form a cavity for accommodating the circuit board, and a plurality of pins are arranged at the buckling positions on the two sides of the bottom plate and the cover plate; one end of the pin is connected with the circuit board; the circuit board includes: the thermistor comprises a substrate, at least one field effect transistor arranged on the substrate and at least one thermistor arranged on the substrate.
Preferably, the cavity is filled with an insulating material.
Preferably, the pin comprises: the conductive part and the insulating parts are symmetrically arranged on two sides of the conductive part.
Preferably, the insulating portion has a thickness greater than that of the conductive portion.
Preferably, the circuit board includes: the thermistor comprises a substrate, six field effect transistors and a thermistor, wherein the six field effect transistors are arranged on the substrate and are numbered as a first field effect transistor, a second field effect transistor, a third field effect transistor, a fourth field effect transistor, a fifth field effect transistor and a sixth field effect transistor respectively; numbering eighteen pins according to the set positions, namely a first pin to an eighteenth pin; the numbering sequence is as follows: starting from one side of the shell, and respectively forming a first pin to a tenth pin from one end to the other end; then, an eleventh pin to an eighteenth pin are respectively arranged from one end of the other side of the shell close to the tenth pin to the other end of the shell;
the first pin is connected with the drain electrode of the fourth field effect transistor; the drain electrode of the fourth field effect transistor is connected with the source electrode of the first field effect transistor;
the second pin is connected with the grid of the first field effect transistor;
the third pin is connected with the source electrode of the first field effect transistor;
the fourth pin is connected with the drain electrode of the fifth field effect transistor; the drain electrode of the fifth field effect transistor is connected with the source electrode of the second field effect transistor;
the fifth pin is connected with the grid electrode of the second field effect transistor;
the sixth pin is connected with the source electrode of the second field effect transistor;
the seventh pin is connected with the drain electrode of the sixth field effect transistor, and the drain electrode of the sixth field effect transistor is connected with the source electrode of the third field effect transistor;
the eighth pin is connected with the source electrode of the third field effect transistor;
the ninth pin is connected with the grid electrode of the third field effect transistor;
the tenth pin is respectively connected with the drain electrode of the first field effect transistor, the drain electrode of the second field effect transistor and the drain electrode of the third field effect transistor;
the eleventh pin is connected with the source electrode of the sixth field effect transistor;
the twelfth pin is connected with the grid electrode of the sixth field effect transistor;
the thirteenth pin is connected with the source electrode of the fifth field effect transistor;
the fourteenth pin is connected with the grid of the fifth field effect transistor;
the fifteenth pin and the sixteenth pin are respectively connected with two ends of the thermistor;
the seventeenth pin is connected with the grid of the fourth field effect transistor;
and the eighteenth pin is connected with the source electrode of the fourth field effect transistor.
Preferably, the first pin, the fourth pin, the seventh pin, the tenth pin, the eleventh pin, the thirteenth pin and the eighteenth pin are all first L-shaped bodies:
the second pin, the third pin, the fifth pin, the sixth pin, the eighth pin, the ninth pin, the twelfth pin, the fourteenth pin, the fifteenth pin, the sixteenth pin and the seventeenth pin are all second L-shaped bodies;
the width of the first L-shaped body is larger than that of the second L-shaped body;
the first distance from the bending position of the first L-shaped body to the side surface of the shell is greater than the second distance from the bending position of the second L-shaped body to the side surface of the shell.
Preferably, the EPS power module further includes: the device comprises a first cooling capillary tube, a second cooling capillary tube, a flow driving assembly, a condenser and a filter;
a first cooling capillary tube is arranged in the cover plate, and a second cooling capillary tube is arranged in the bottom plate; the first cooling capillary and the second cooling capillary are both in a circuitous structure;
a first outlet and a first inlet are arranged on the surface of the cover plate; the first outlet and the first inlet are respectively connected with a first cooling capillary;
a second outlet and a second inlet are arranged on the surface of the bottom plate; the second outlet and the second inlet are respectively connected with a second cooling capillary;
the first cooling capillary tube, the flow driving assembly, the condenser and the filter are sequentially connected in series to form a first closed loop; the second cooling capillary, the flow driving component, the condenser and the filter are sequentially connected in series to form a second closed loop.
Preferably, a plurality of temperature sensors are embedded in the circuit board in an array manner and are electrically connected with a processor arranged outside the shell; the processor is electrically connected with the flow driving assembly;
the processor performs operations comprising:
establishing a space coordinate system by taking the center of the circuit board as an origin and the plane of the circuit board as the plane where the x axis and the y axis are located;
determining the position of each temperature sensor in a coordinate system;
acquiring temperature values monitored by the temperature sensors;
substituting the temperature value into a pre-established temperature monitoring model to determine the temperature value of each preset monitoring point, wherein the specific calculation formula is as follows:
wherein, T(x,y,z)Representing the temperature value of a monitoring point with coordinates (x, y, z) in a space coordinate system; m represents the number of temperature sensors; t isjThe temperature value detected by the jth temperature sensor; alpha is alphaj,(x,y,z)A relation coefficient of a temperature value detected by the jth first temperature sensor and a temperature value of a monitoring point with coordinates (x, y, z);
determining the first coordinate (x) of the monitoring point with the maximum temperature value in each monitoring point0,y0,z0)；
Inquiring a preset control table based on the first coordinate to determine a control coefficient beta of the flow driving assembly1；
Controlling the power of the flow driving assembly based on the control coefficient and the maximum temperature value; the calculation formula is as follows:
wherein, F1Representing the power of the flow driving assembly; f0Is a preset initial power value; t ismaxIs the maximum temperature value; t is0Is a preset standard temperature value.
In any of the above-described methods for manufacturing an EPS power module,
arranging a field effect transistor and a thermistor on a substrate; connecting the field effect transistor and the pin by using a conductive wire, and connecting the thermistor and the pin by using the conductive wire; manufacturing a circuit board;
and placing the circuit board between the bottom plate and the cover plate for pressing.
Preferably, after the pressing, insulating materials are injected into a cavity between the cover plate and the bottom plate;
or the like, or, alternatively,
firstly, insulating materials are injected between the cover plate and the bottom plate, and then pressing is carried out.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of an EPS power module according to an embodiment of the present invention;
FIG. 2 is a schematic circuit diagram of a circuit board according to an embodiment of the invention;
fig. 3 is an external view of an EPS power module according to an embodiment of the invention;
fig. 4 is a schematic interface diagram of an EPS power module according to an embodiment of the present invention;
fig. 5 is a schematic diagram of another EPS power module according to an embodiment of the present invention.
In the figure:
1. a housing; 2. a circuit board; 3. a pin; 11. a cover plate; 12. a base plate; 21. a substrate; 22. a field effect transistor; 23. a thermistor; 31. a first cooling capillary tube; 32. a second cooling capillary tube; 33. a flow driving assembly; 34. a condenser; 35. a filter; 36. a processor; 37. a temperature sensor; 101. a first pin; 102. a second pin; 103. a third pin; 104. a fourth pin; 105. a fifth pin; 106. a sixth pin; 107. a seventh pin; 108. an eighth pin; 109. a ninth pin; 110. a tenth pin; 111. an eleventh pin; 112. a twelfth pin; 113. a thirteenth pin; 114. a fourteenth pin; 115. a fifteenth pin; 116. a sixteenth pin; 117. a seventeenth pin; 118. an eighteenth pin; 121. a first field effect transistor; 122. a second field effect transistor; 123. a third field effect transistor; 124. a fourth field effect transistor; 125. a fifth field effect transistor; 126. and a sixth field effect transistor.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
An embodiment of the present invention provides an EPS power module, as shown in fig. 1, including: a housing 1 and a circuit board 2 disposed within the housing 1;
the housing 1 includes: the circuit board comprises a bottom plate 12 and a cover plate 11, wherein the bottom plate 12 and the cover plate 11 are buckled to form a cavity for accommodating the circuit board 2, and a plurality of pins 3 are arranged at the buckling positions on the two sides of the bottom plate 12 and the cover plate 11; one end of the pin 3 is connected with the circuit board 2;
the circuit board 2 includes: a substrate 21, at least one field effect transistor 22 disposed on the substrate 21, and at least one thermistor 23 disposed on the substrate 21.
The working principle and the beneficial effects of the technical scheme are as follows:
the pins 3 are arranged on the two sides of the bottom plate 12 and the cover plate 11 and positioned at buckling positions, so that the volume of the shell 1 is reduced; the thermal resistance of the heating part of the circuit board 2 contacting with the outside is reduced, so that a good heat dissipation effect is realized, heat cannot be accumulated in the shell 1, and the EPS system can detect the temperature in the shell 1 by detecting the change of the resistance value of the thermistor 23.
The EPS power module has a simple structure, meets the performance requirement of an EPS system, and can feed back the temperature of the EPS power module to the system.
In order to realize the shock absorption and insulation effects of the EPS power module; in one embodiment, the cavity is filled with an insulating material.
In one embodiment, pin 3 includes: the conductive part and the insulating parts are symmetrically arranged on two sides of the conductive part.
The working principle and the beneficial effects of the technical scheme are as follows:
when the potential difference between the pins 3 is large, a discharge phenomenon can occur, so that the use of the EPS power module is influenced, and even the EPS power module is burnt out; therefore, the structure of the pin 3 is changed, and the insulating parts are arranged on the two sides, so that the resistance between the pin 3 and the pin 3 is improved; preventing discharge when the potential difference between the pins 3 is large.
In order to improve the insulating effect between the pin 3 and the pin 3, the thickness of the insulating part is larger than that of the conductive part.
In one embodiment, the circuit board 2 includes: the thermistor comprises a substrate 21, six field effect transistors 22 and a thermistor 23, wherein the six field effect transistors 22 and the thermistor 23 are arranged on the substrate 21, and the field effect transistors 22 are numbered as a first field effect transistor 121, a second field effect transistor 122, a third field effect transistor 123, a fourth field effect transistor 124, a fifth field effect transistor 125, a sixth field effect transistor 126, a seventh field effect transistor and an eighth field effect transistor respectively; numbering eighteen pins 3 according to the set positions, namely a first pin 101 to an eighteenth pin 118; the numbering sequence is as follows: from one side of the shell 1, from one end to the other end, a first pin 101 to a tenth pin 110 are respectively arranged; then, the other end of the other side of the housing 1, which is close to the tenth pin 110, is respectively an eleventh pin 111 to an eighteenth pin 118 from the other end;
the first pin 101 is connected with the drain of the fourth field effect transistor 124; the drain electrode of the fourth field effect transistor 124 is connected with the source electrode of the first field effect transistor 121;
the second pin 102 is connected with the gate of the first field effect transistor 121;
the third pin 103 is connected with the source of the first field effect transistor 121;
the fourth pin 104 is connected to the drain of the fifth fet 125; the drain of the fifth field effect transistor 125 is connected to the source of the second field effect transistor 122;
the fifth pin 105 is connected with the gate of the second fet 122;
the sixth pin 106 is connected to the source of the second fet 122;
the seventh pin 107 is connected with the drain of the sixth field effect transistor 126, and the drain of the sixth field effect transistor 126 is connected with the source of the third field effect transistor 123;
the eighth pin 108 is connected to the source of the third fet 123;
the ninth pin 109 is connected to the gate of the third fet 123;
the tenth pin 110 is connected to the drain of the first fet 121, the drain of the second fet 122, and the drain of the third fet 123, respectively;
the eleventh pin 111 is connected to the source of the sixth fet 126;
the twelfth pin 112 is connected to the gate of the sixth fet 126;
the thirteenth pin 113 is connected to the source of the fifth fet 125;
the fourteenth pin 114 is connected to the gate of the fifth fet 125;
the fifteenth pin 115 and the sixteenth pin 116 are connected to two ends of the thermistor 23, respectively;
the seventeenth pin 117 is connected to the gate of the fourth fet 124;
the eighteenth pin 118 is connected to the source of the fourth fet 124.
The working principle and the beneficial effects of the technical scheme are as follows:
the tenth pin 110 is a power connection pin, and the eleventh pin 111, the thirteenth pin 113 and the eighteenth pin 118 are all ground pins; the fifteenth pin 115 and the sixteenth pin 116 are temperature feedback pins for linking the EPS system; the circuit of this embodiment constitutes simply, and each pin is as short as possible to pin connection position, makes the on-resistance lower, makes EPS power module generate heat less.
In one embodiment, the first pin 101, the fourth pin 104, the seventh pin 107, the tenth pin 110, the eleventh pin 111, the thirteenth pin 113, and the eighteenth pin 118 are all a first L-shaped body:
the second pin 102, the third pin 103, the fifth pin 105, the sixth pin 106, the eighth pin 108, the ninth pin 109, the twelfth pin 112, the fourteenth pin 114, the fifteenth pin 115, the sixteenth pin 116 and the seventeenth pin 117 are all second L-shaped bodies;
the width of the first L-shaped body is larger than that of the second L-shaped body;
the first distance from the bending position of the first L-shaped body to the side surface of the shell 1 is greater than the second distance from the bending position of the second L-shaped body to the side surface of the shell 1.
The working principle and the beneficial effects of the technical scheme are as follows:
the arrangement, the size difference and the bending position difference of the pins are designed, so that the pins are used for limiting the installation direction of the power module, and installation errors during installation are prevented.
In one embodiment, the middle of the side of the first pin 101 away from the second pin 102, the middle of the side of the tenth pin 110 away from the ninth pin 109, the middle of the side of the eleventh pin 111 away from the twelfth pin 112, and the middle of the side of the eighteenth pin 118 away from the seventeenth pin 117 are provided with protrusions.
The working principle and the beneficial effects of the technical scheme are as follows:
the protrusions define the height at which the power module is mounted to the EPS system control board to ensure the heat dissipation effect of the power module.
In one embodiment, the EPS power module further includes: a first temperature-lowering capillary tube 31, a second temperature-lowering capillary tube 32, a flow driving unit 33, a condenser 34, and a filter 35;
a first cooling capillary tube 31 is arranged in the cover plate 11, and a second cooling capillary tube 32 is arranged in the bottom plate 12; the first cooling capillary 31 and the second cooling capillary 32 both have a circuitous structure;
a first outlet and a first inlet are arranged on the surface of the cover plate 11; the first outlet and the first inlet are connected to the first cooling capillary 31, respectively;
a second outlet and a second inlet are arranged on the surface of the bottom plate 12; the second outlet and the second inlet are connected to the second cooling capillary 32, respectively;
the first cooling capillary tube 31, the flow driving assembly 33, the condenser 34 and the filter 35 are sequentially connected in series to form a first closed loop; the second temperature-reducing capillary tube 32, the flow driving unit 33, the condenser 34, and the filter 35 are connected in series in this order to form a second closed loop.
The working principle and the beneficial effects of the technical scheme are as follows:
the flow driving assembly 33, the condenser 34, and the filter 35 are not internal components of the power module, but are mounted on the circuit board 2 of the EPS system as the power module. The flow driving component 33 drives the cooling liquid to flow in the first cooling capillary 31 and the second cooling capillary 32, so as to absorb the temperature generated by the circuit board 2 and improve the cooling effect of the EPS module in operation; for example: the flow driving assembly 33 is a compressor, compressing the cooling liquid and pushing the cooling liquid to flow in the first closed loop and the second closed loop; the coolant releases heat in the condenser 34 and absorbs heat in the cooling capillary tube.
In one embodiment, a plurality of temperature sensors 37 are embedded in the circuit board 2 in an array and electrically connected to the processor 36 disposed outside the housing 1; the processor 36 is electrically connected to the flow driving assembly 33;
establishing a space coordinate system by taking the center of the circuit board 2 as an origin and the plane of the circuit board 2 as the plane where the x axis and the y axis are located;
determining the position of each temperature sensor 37 within the coordinate system;
acquiring temperature values monitored by the temperature sensors 37;
substituting the temperature value into a pre-established temperature monitoring model to determine the temperature value of each preset monitoring point, wherein the specific calculation formula is as follows:
wherein, T(x,y,z)Representing the temperature value of a monitoring point with coordinates (x, y, z) in a space coordinate system; m represents the number of temperature sensors 37; t isjA temperature value detected by the jth temperature sensor 37; alpha is alphaj,(x,y,z)A coefficient of relation between the temperature value detected by the jth first temperature sensor 37 and the temperature value of the monitoring point having coordinates (x, y, z);
determining the first coordinate (x) of the monitoring point with the maximum temperature value in each monitoring point0,y0,z0)；
Based on the first coordinate, a preset control table is consulted to determine a control coefficient beta of the flow driving assembly 331；
Controlling the power of the flow driving assembly 33 based on the control coefficient and the maximum temperature value; the calculation formula is as follows:
wherein, F1Represents the power of the flow driving assembly 33; f0Is a preset initial power value; t ismaxIs the maximum temperature value; t is0Is a preset standard temperature value.
The working principle and the beneficial effects of the technical scheme are as follows:
temperature monitoring is carried out through the temperature sensors 37 arranged at the preset positions in the shell 1, and the temperature monitoring of each monitoring point of the temperature can be realized by arranging less temperature sensors 37 through a pre-established temperature monitoring model. Determining the point with the highest temperature through temperature monitoring, and determining the control coefficient of the flow driving assembly 33 based on the position of the point with the highest temperature; and the flow driving assembly 33 is controlled based on the control coefficient and the highest temperature value, so that intelligent control is realized, and the temperature control mode is optimized. Wherein the processor 36 may directly employ the central controller of the EPS system.
In any of the above-described methods for manufacturing an EPS power module,
a field effect transistor and a thermistor 23 are provided on the substrate 21; connecting the field effect tube 22 and the pin 3 by using a conductive wire, and connecting the thermistor 23 and the pin 3 by using a conductive wire; manufacturing a circuit board 2;
the circuit board 2 is placed between the base plate 12 and the cover plate 11 in a press fit.
The working principle and the beneficial effects of the technical scheme are as follows:
the pins 3 are arranged on the two sides of the bottom plate 12 and the cover plate 11 and positioned at buckling positions, so that the volume of the shell 1 is reduced; the thermal resistance of the heating part of the circuit board 2 contacting with the outside is reduced, so that a good heat dissipation effect is realized, heat cannot be accumulated in the shell 1, and the EPS system can detect the temperature in the shell 1 by detecting the change of the resistance value of the thermistor 23.
In one embodiment, after the pressing, an insulating material is injected into the cavity between the cover plate 11 and the base plate 12;
or the like, or, alternatively,
an insulating material is injected between the cover plate 11 and the base plate 12, and then, the cover plate and the base plate are pressed together.
The working principle and the beneficial effects of the technical scheme are as follows:
in order to achieve the shock absorption and insulation effects of the EPS power module, an insulating material may be filled between the cover plate 11 and the bottom plate 12, and two schemes may be adopted during manufacturing: one injection scheme is to inject an insulating material after pressing through injection holes reserved on the cover plate 11 and the bottom plate 12; alternatively, the amount of the insulating material is calculated, and the insulating material is injected between the cover plate 11 and the base plate 12 before pressing, and then pressed.
In one embodiment, the pin includes: the conductive part and the insulating parts are symmetrically arranged on two sides of the conductive part.
The working principle and the beneficial effects of the technical scheme are as follows:
when the potential difference between the pins is large, a discharge phenomenon can occur, the use of the EPS power module is influenced, and even the EPS power module is burnt out; therefore, the structure of the pin is changed, and the insulating parts are arranged on the two sides of the pin, so that the resistance between the pin and the pin is improved; prevent the discharge when the potential difference between the pins is larger.
In order to improve the insulation effect between the pins, the thickness of the insulation part is larger than that of the conductive part.
In one embodiment, a first cooling capillary 31 is provided in the cover plate 11, and a second cooling capillary 32 is provided in the bottom plate 12; the first cooling capillary 31 and the second cooling capillary 32 both have a circuitous structure;
a first outlet and a first inlet are arranged on the surface of the cover plate 11; the first outlet and the first inlet are connected to the first cooling capillary 31, respectively;
a second outlet and a second inlet are arranged on the surface of the bottom plate 12; the second outlet and the second inlet are connected to the second cooling capillary 32, respectively.
The working principle and the beneficial effects of the technical scheme are as follows:
the first and second cooling capillaries 31 and 32 provide a conduit for the flow of the cooling liquid and separate it from the circuit board 2; the cooling effect is ensured without adverse effect on the circuit board 2.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. An EPS power module, comprising: the circuit board comprises a shell (1) and a circuit board (2) arranged in the shell (1);
the housing (1) comprises: the circuit board comprises a bottom plate (12) and a cover plate (11), wherein the bottom plate (12) and the cover plate (11) are buckled to form a cavity for accommodating the circuit board (2), and a plurality of pins (3) are arranged at buckling positions on two sides of the bottom plate (12) and the cover plate (11); one end of the pin (3) is connected with the circuit board (2);
the circuit board (2) includes: a substrate (21), at least one field effect transistor (22) arranged on the substrate (21) and at least one thermistor (23) arranged on the substrate (21).
2. The EPS power module of claim 1, wherein an insulating material is filled within the cavity.
3. The EPS power module of claim 1, characterized in that the pin (3) comprises: the insulation part is symmetrically arranged on two sides of the conductive part.
4. The EPS power module of claim 3, wherein the insulating portion thickness is greater than the conductive portion thickness.
5. The EPS power module according to claim 1, wherein the circuit board (2) comprises: the field effect transistor array comprises a substrate (21), six field effect transistors (22) and a thermistor (23), wherein the six field effect transistors (22) and the thermistor (23) are arranged on the substrate (21), and the field effect transistors (22) are numbered as a first field effect transistor (121), a second field effect transistor (122), a third field effect transistor (123), a fourth field effect transistor (124), a fifth field effect transistor (125) and a sixth field effect transistor (126) respectively; numbering eighteen pins (3) according to the set positions, namely a first pin (101) to an eighteenth pin (118); the numbering sequence is as follows: a first pin (101) to a tenth pin (110) are respectively arranged from one end to the other end of the shell (1); then, an eleventh pin (111) to an eighteenth pin (118) are respectively arranged from one end of the other side of the shell (1) close to the tenth pin (110) to the other end;
the first pin (101) is connected with the drain electrode of the fourth field effect transistor (124); the drain electrode of the fourth field effect transistor (124) is connected with the source electrode of the first field effect transistor (121);
the second pin (102) is connected with the grid electrode of the first field effect transistor (121);
the third pin (103) is connected with the source electrode of the first field effect transistor (121);
the fourth pin (104) is connected with the drain electrode of the fifth field effect transistor (125); the drain electrode of the fifth field effect transistor (125) is connected with the source electrode of the second field effect transistor (122);
the fifth pin (105) is connected with the grid electrode of the second field effect transistor (122);
the sixth pin (106) is connected with the source electrode of the second field effect transistor (122);
the seventh pin (107) is connected with the drain electrode of the sixth field effect transistor (126), and the drain electrode of the sixth field effect transistor (126) is connected with the source electrode of the third field effect transistor (123);
the eighth pin (108) is connected with the source electrode of the third field effect transistor (123);
the ninth pin (109) is connected with the grid electrode of the third field effect transistor (123);
the tenth pin (110) is respectively connected with the drain electrode of the first field effect transistor (121), the drain electrode of the second field effect transistor (122) and the drain electrode of the third field effect transistor (123);
the eleventh pin (111) is connected with the source electrode of the sixth field effect transistor (126);
the twelfth pin (112) is connected with the gate of the sixth field effect transistor (126);
the thirteenth pin (113) is connected with the source electrode of the fifth field effect transistor (125);
the fourteenth pin (114) is connected with the grid electrode of the fifth field effect transistor (125);
the fifteenth pin (115) and the sixteenth pin (116) are respectively connected with two ends of the thermistor (23);
the seventeenth pin (117) is connected with the gate of the fourth field effect transistor (124);
the eighteenth pin (118) is connected with the source of the fourth field effect transistor (124).
6. The EPS power module of claim 5, wherein the first pin (101), the fourth pin (104), the seventh pin (107), the tenth pin (110), the eleventh pin (111), the thirteenth pin (113), and the eighteenth pin (118) are all of a first L-type body:
the second pin (102), the third pin (103), the fifth pin (105), the sixth pin (106), the eighth pin (108), the ninth pin (109), the twelfth pin (112), the fourteenth pin (114), the fifteenth pin (115), the sixteenth pin (116), and the seventeenth pin (117) are all second L-shaped bodies;
the width of the first L-shaped body is larger than that of the second L-shaped body;
the first distance between the bending position of the first L-shaped body and the side surface of the shell (1) is greater than the second distance between the bending position of the second L-shaped body and the side surface of the shell (1).
7. The EPS power module of claim 1, further comprising: a first temperature-reducing capillary tube (31), a second temperature-reducing capillary tube (32), a flow driving assembly (33), a condenser (34), and a filter (35);
the cover plate (11) is internally provided with the first cooling capillary tube (31), and the bottom plate (12) is internally provided with the second cooling capillary tube (32); the first cooling capillary tube (31) and the second cooling capillary tube (32) are both in a circuitous structure;
a first outlet and a first inlet are arranged on the surface of the cover plate (11); the first outlet and the first inlet are respectively connected with the first cooling capillary (31);
a second outlet and a second inlet are arranged on the surface of the bottom plate (12); the second outlet and the second inlet are respectively connected with the second cooling capillary (32);
the first cooling capillary tube (31), the flow driving assembly (33), the condenser (34) and the filter (35) are sequentially connected in series to form a first closed loop; the second cooling capillary tube (32), the flow driving assembly (33), the condenser (34) and the filter (35) are sequentially connected in series to form a second closed loop.
8. The EPS power module according to claim 1, wherein a plurality of temperature sensors (37) are embedded in an array on the circuit board (2) and electrically connected to a processor (36) disposed outside the housing (1); the processor (36) is electrically connected with the flow driving assembly (33);
the processor (36) performs operations comprising:
establishing a space coordinate system by taking the center of the circuit board (2) as an origin and the plane of the circuit board (2) as the plane where the x axis and the y axis are located;
determining the position of each of the temperature sensors (37) within the coordinate system;
acquiring temperature values monitored by the temperature sensors (37);
substituting the temperature values into a pre-established temperature monitoring model to determine the temperature values of all preset monitoring points, wherein the specific calculation formula is as follows:
wherein, T(x,y,z)Representing a temperature value of the monitoring point with coordinates (x, y, z) in the spatial coordinate system; m represents the number of said temperature sensors (37); t isj-said temperature value detected for the jth of said temperature sensors (37); a isj,(x,y,z)A coefficient of relation between the temperature value detected by the jth first temperature sensor (37) and the temperature value of the monitoring point with coordinates (x, y, z);
determining a first coordinate (x) of the monitoring point having the largest temperature value in each monitoring point0,y0,z0)；
-querying a preset control table on the basis of said first coordinates, determining a control coefficient β of said flow driving assembly (33)1；
Controlling the power of the flow driving assembly (33) based on the control coefficient and the maximum temperature value; the calculation formula is as follows:
wherein, F1Representing the power of the flow driving assembly (33); f0Is a preset initial power value; t ismaxIs the maximum temperature value; t is0And the preset standard temperature value is obtained.
9. A method of manufacturing an EPS power module as claimed in any of claims 1 to 8,
a field effect transistor and a thermistor (23) are arranged on a substrate (21); connecting the field effect tube (22) and the pin (3) by using a conductive wire, and connecting the thermistor (23) and the pin (3) by using a conductive wire; -making the circuit board (2);
and placing the circuit board (2) between the bottom plate (12) and the cover plate (11) for pressing.
10. A method according to claim 9, characterized in that after pressing, an insulating material is injected into the cavity between the cover plate (11) and the base plate (12);
or the like, or, alternatively,
firstly, insulating materials are injected between the cover plate (11) and the bottom plate (12), and then pressing is carried out.
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