CN112399038B

CN112399038B - Laser packaging equipment and laser packaging method

Info

Publication number: CN112399038B
Application number: CN201910754510.0A
Authority: CN
Inventors: 刘晓; 魏礼俊; 陈志刚
Original assignee: Shanghai Micro Electronics Equipment Co Ltd
Current assignee: Shanghai Micro Electronics Equipment Co Ltd
Priority date: 2019-08-15
Filing date: 2019-08-15
Publication date: 2022-08-09
Anticipated expiration: 2039-08-15
Also published as: CN112399038A

Abstract

The invention provides an image scanning device, laser packaging equipment, mask plate measuring equipment and a mask plate measuring method. The image scanning device can execute line scanning at least once in a two-dimensional plane where the target object is located by utilizing the characteristic of TDI line scanning, process the line image and obtain the distribution information of the target object in the two-dimensional plane. The laser packaging equipment and the packaging method utilize the image scanning device to obtain the distribution information of the frame sealing material in the substrate to be packaged in a two-dimensional plane. The frame sealing materials can be regularly distributed or irregularly distributed, and the distribution condition of the frame sealing materials can be efficiently obtained at high resolution, so that an accurate packaging path can be obtained, and the packaging effect is improved. The mask plate measuring equipment and the mask plate measuring method also utilize the image scanning device, can quickly and accurately obtain the distribution information of the openings on the mask plate, and are favorable for timely knowing the quality of the mask plate or the quality of the expanded mesh.

Description

Laser packaging equipment and laser packaging method

Technical Field

The invention relates to the technical field of image scanning, in particular to an image scanning device, laser packaging equipment, mask plate measuring equipment and a method.

Background

In the manufacture of OLED devices, photovoltaic devices, including glass substrates, in order to prevent device degradation, or in order for a double-layer vacuum glass structure to require a high degree of vacuum to be maintained for a long period of time, another glass cover plate and a glass substrate are generally bonded using a polymer adhesive or a high-temperature sintered glass frit (glass frit) to form a glass seal. In the prior art, frame sealing glue or glass powder is printed and coated according to set parameters, but the frame edge positions of the frame sealing glue or the glass powder are not absolutely consistent in the printing process, but have certain manufacturing deviation. In the laser packaging process, the laser spot needs to be scanned strictly along a printing route (printing route for short) of the frame sealing adhesive or the glass powder to ensure a high irradiation area ratio, wherein the irradiation area ratio is the spot width/the frame edge width of the frame sealing adhesive or the glass powder) 100%. However, the current method for obtaining the printing route usually adopts a manual monitoring method, i.e. the moving route of the light spot is monitored and manually debugged according to the actual situation to make the moving route (i.e. the packaging route) of the light spot consistent with the printing route, but the method has low efficiency and affects the productivity, and the method which is not manually monitored also has the problems of large difficulty in monitoring the abnormal pattern, poor accuracy and the like.

In the OLED manufacturing process, a metal precise mask plate installed in vacuum thermal evaporation equipment is needed, pixel holes and a shielding area are formed on the mask plate, and materials to be deposited, which are heated and evaporated, are deposited on corresponding pixel areas on a substrate through the pixel holes in the mask plate. Before the mask plate is mounted on the vacuum thermal evaporation apparatus, in order to avoid deformation due to gravity, a certain pulling force is generally applied to an end portion of the mask plate by a mask-tensioning device, and the mask plate is welded to a mask frame (mask frame), that is, the mask plate is tensioned. In order to know the net-spreading effect, the positions and sizes of the pixel holes of the mask plate on the frame need to be measured, the currently adopted measurement mode is to measure the mask plate in each block range by using an area-array camera stepping mode, the measurement of the whole mask plate takes a long time, and the influence on the yield is large.

Accordingly, there is a need in the industry for an image capture device that can rapidly and clearly obtain a wide range of target images. For example, if the printing route of the frame sealing adhesive or the glass frit can be quickly and clearly obtained, the laser scanning route can be conveniently adjusted according to the printing route, so that the packaging quality is improved. For another example, for a mask plate after screening, the pixel holes are quickly and clearly obtained, which is beneficial to improving the quality of screening, and further improving the performance of the manufactured OLED device.

Disclosure of Invention

The invention provides an image scanning device for rapidly and clearly obtaining a wide range of target images. In addition, the laser packaging equipment and the laser scanning method as well as the mask plate measuring equipment and the mask plate measuring method are also provided.

In one aspect, the present invention provides an image scanning apparatus comprising:

the TDI linear array scanning module is configured to execute at least one line scanning in a two-dimensional plane where a target object is located and output line image information corresponding to each line scanning, and comprises a linear array scanning lens and a corresponding TDI line image sensor; and

and the image processing module is configured to process the line image information to generate a whole image covering the two-dimensional plane, and obtain the distribution information of the target object in the two-dimensional plane according to the whole image.

Optionally, the image scanning apparatus further includes at least one of the following modules:

a parameter setting module configured to set scanning parameters according to information of the two-dimensional plane, the scanning parameters including a number of line scans, a start point and an end point position of each line scan, and a line interval;

a motion control module configured to control movement of the TDI linear array scanning module within the two-dimensional plane to perform respective line scans; and

a TDI control module configured to start and stop imaging by the TDI line image sensor.

Optionally, the TDI linear array scanning module further includes:

an illumination module configured to provide a light source to the linear scanning lens;

a height sensor configured to acquire distance information between the linear scanning lens and the two-dimensional plane; and

and the lens adjusting module is configured to adjust the linear array scanning lens according to the distance information so that the two-dimensional plane is close to a focal plane of the linear array scanning lens.

Optionally, the illumination module includes a light source and an illumination light guide, the light source is an LED, and the illumination light guide is a linear light guide.

Optionally, the scanning directions of the line scans are parallel; the scanning ranges of the line scans are arranged in at least one row in the vertical direction of the scanning direction. The scanning directions of two adjacent line scans in the same column are opposite.

Optionally, the fields of view of two adjacent line scans in the same column in the vertical direction of the line scanning direction at least partially overlap.

Optionally, the magnification of the linear scanning lens is 2X, 3.5X, 5X, 7X, and 10X.

Optionally, the TDI linear array scanning module performs each line scanning with a uniform motion, where the rate of the uniform motion is a product of a sampling frequency of the TDI linear array scanning module and a field width of the linear array scanning lens perpendicular to the scanning direction.

The image scanning device provided by the invention comprises a TDI linear array scanning module, adopts a TDI (time delay integration) line scanning principle, performs at least one line scanning on a two-dimensional plane where a target object is positioned by utilizing the characteristic of the TDI line scanning, processes line image information generated by the TDI linear array scanning module by utilizing an image processing module, and obtains distribution information (such as the shape and the size of the target object, an extending track of the target object, the position of a straight-line segment part and the position of a bent segment part in the track, the size of a corner and the like) of the target object in the two-dimensional plane. The distribution of the target object in the two-dimensional plane aimed by the image scanning device can be in any form (for example, the track of the target object can comprise a combination of a rectangle, an arc and the like), and the image scanning device can be applied to various occasions needing to obtain the distribution of the target object at high speed and high resolution.

In one aspect, the present invention provides a laser packaging apparatus, configured to irradiate a frame sealing material in a substrate to be packaged with a laser beam to perform packaging, where the laser packaging apparatus includes the above image scanning device, and the image scanning device is configured to acquire distribution information of the frame sealing material in a two-dimensional plane where the substrate to be packaged is located.

Optionally, the laser packaging apparatus further includes:

a substrate stage configured to place the substrate to be packaged;

a laser system disposed above the substrate table configured to generate a laser beam for laser packaging; and

and the industrial personal computer is configured to set a packaging path according to the distribution information of the frame sealing material in the two-dimensional plane of the substrate to be packaged, and control the laser system to irradiate the frame sealing material in the substrate to be packaged according to the packaging path for packaging.

Optionally, the laser packaging apparatus further includes:

a base on which the substrate table is provided, the substrate table having a degree of freedom of movement in a first direction on the base, and the substrate table being rotatable with respect to the base;

the gantry is arranged on the base and strides over the substrate table, the laser system is arranged on the gantry, the laser system has freedom of movement along a second direction, and the first direction and the second direction are perpendicular to each other;

the TDI linear array scanning module in the image scanning device is arranged on the gantry, the linear array scanning lens faces the substrate table, and the TDI linear array scanning module also has freedom of movement along the second direction.

Optionally, the laser system includes at least one galvanometer carrier arranged on the gantry and a corresponding galvanometer module.

In one aspect, the present invention provides a laser packaging method using the above laser packaging apparatus, including the following steps:

aligning a substrate to be packaged; executing at least one line scanning in a two-dimensional plane where the substrate to be packaged is located, outputting line image information corresponding to each line scanning, and processing the line image information to generate an overall image of a frame sealing material distribution range so as to obtain distribution information of the frame sealing material in the overall image; setting the packaging parameters of the laser beam according to the distribution information of the frame sealing material in the distribution range; and carrying out laser packaging on the packaging substrate according to the packaging parameters.

Optionally, the method for aligning the substrate to be packaged includes the following steps:

performing at least one line scanning in a two-dimensional plane where the substrate to be packaged is located and performing image processing to obtain position information of an alignment mark on the substrate to be packaged; obtaining the offset of the substrate to be packaged according to the position information of the alignment mark; and compensating for an angular offset in the offset by rotating the substrate table.

The laser packaging equipment provided by the invention comprises the image scanning device, and utilizes the characteristic that the image scanning device can obtain the distribution information of the target object in the two-dimensional plane, and utilizes the image scanning equipment to obtain the distribution information of the frame sealing material in the substrate to be packaged in the two-dimensional plane of the substrate to be packaged. The frame sealing materials can be regularly distributed or irregularly distributed, for example, when the substrate to be packaged is used as an OLED bang-bang screen, the frame sealing materials have irregular printing patterns, but the distribution condition of the frame sealing materials can still be efficiently obtained at high resolution through the image scanning device, so that an accurate packaging path can be obtained, and the packaging effect is improved.

According to the laser packaging method provided by the invention, the laser packaging equipment is utilized to obtain the distribution information of the frame sealing material in the two-dimensional plane to set the packaging path of the laser beam, and the laser packaging is carried out on the substrate to be packaged along the packaging path, so that the packaging yield is improved.

In one aspect, the present invention provides a mask plate measuring apparatus, including the above image scanning device, configured to acquire distribution information of openings on a mask plate in a mask plate plane.

Optionally, the mask plate is a mask plate for OLED thermal evaporation, and the openings are pixel holes in the mask plate.

In one aspect, the present invention provides a mask plate measuring method using the above mask plate measuring apparatus, including:

providing a mask plate, and arranging a TDI linear array scanning module of the image scanning device above the mask plate for alignment;

and carrying out image scanning on the mask plate by using the image scanning device to obtain an overall image of the mask plate, and further obtaining distribution information of the openings in the plane of the mask plate.

The mask plate measuring equipment provided by the invention comprises the image scanning device, and can scan the mask plate with the openings so as to obtain the distribution information of the openings in the plane of the mask plate. By utilizing the image scanning device, the mask plate measuring equipment can quickly and accurately obtain the distribution information of the openings on the mask plate, and is favorable for timely knowing the quality of the mask plate or the quality of the expanded mesh. The mask plate measuring method provided by the invention utilizes the mask plate measuring equipment, so that the same or similar advantages are achieved.

Drawings

Fig. 1 is a block diagram of an image scanning device according to an embodiment of the present invention.

Fig. 2 is a structural diagram of a TDI line array scanning module according to an embodiment of the present invention.

Fig. 3(a) is a schematic diagram of a two-dimensional plane where a target object is located according to an embodiment of the present invention.

FIG. 3(b) is a schematic diagram of a two-dimensional plane setup line scan of FIG. 3(a) in an embodiment of the present invention.

Fig. 4 is a cross-sectional structural view of a laser packaging apparatus according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of a packaging unit according to an embodiment of the invention.

Fig. 6 is a schematic diagram of a plurality of packaging units according to an embodiment of the invention.

Fig. 7 is a schematic diagram of a pixel hole on a metal mask according to an embodiment of the invention.

Description of reference numerals:

110-TDI linear array scanning module; 111-linear scanning lens; 112-TDI line image sensors; 120-parameter setting module; 130-an image processing module; 113-a lighting module; 114-a height sensor; 150-a motion control module; 140-TDI control module; 10-a target object;

210-a substrate table; 220-a laser system; 221-galvanometer stage; 222-a galvanometer module; 230-a base; 240-a portal frame; 20-a packaging unit; 30-pixel aperture.

Detailed Description

The image scanning device, the laser packaging apparatus, the reticle measuring apparatus and the reticle measuring method according to the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the following examples are merely illustrative of specific embodiments to which the present invention may be applied and are not to be construed as limiting the scope of the present invention. In the present application, the embodiments and features of the embodiments may be arbitrarily combined with each other without conflict.

It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. Corresponding numerals and symbols in the different drawings generally refer to corresponding parts unless otherwise specified. Also, the terms "first," "second," and the like in the following description are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other sequences than described or illustrated herein. Similarly, if the method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method.

Example one

This embodiment describes an image scanning apparatus. Fig. 1 is a block diagram of an image scanning device according to an embodiment of the present invention. Referring to fig. 1, an image scanning apparatus includes a TDI line scan module 110, a parameter setting module 120, and an image processing module 130. The following is a detailed description.

The TDI line scan module 110 is configured to perform at least one line scan within a two-dimensional plane in which a target object is located, and output line image information corresponding to each line scan. The TDI line scanning module 110 includes a line scanning lens 111 and a TDI line image sensor 112. Here, the TDI (time delay integration) line scanning module 110 utilizes the principle of TDI line scanning. The method specifically comprises the following steps: assume that the TDI line image sensor 112 has m × n CCD (charge coupled device) pixels, m being the number of pixels in the horizontal direction, n being the number of pixels in the vertical direction, and n being the corresponding number of integration levels. During imaging, along with the relative motion between the linear scanning lens 111 and a scanning object, the linear scanning lens 111 performs at least one line scanning on the scanning object, correspondingly, the CCD photoreceptors the same scanning object step by step from the nth stage to the 1 st stage, charges are also accumulated step by step, when the photoreception of the last stage of pixel is finished, the accumulated charges are output, the imaging of the scanning object is completed, that is, line image information corresponding to the line scanning is output. Compared with an area scanning method, the method can obtain high-speed and high-resolution images at low cost, and compared with an area array camera, TDI linear array scanning is better in the comprehensive effect of resolution and speed. The TDI line scan module 110 of this embodiment may obtain line image information corresponding to each line scan by performing at least one line scan in a two-dimensional plane where a target object is located.

Fig. 2 is a structural diagram of a TDI line array scanning module according to an embodiment of the present invention. Referring to fig. 2, the TDI line scan module 110 includes a line scan lens 111 and a TDI line image sensor 112, the line scan lens 111 is configured to perform line scanning, transmit an optical signal reflected within a field of view to the TDI line image sensor 112, and the TDI line image sensor 112 is configured to convert an incident optical signal into an electrical signal and perform TDI processing, and output line image information corresponding to each line scanning. Further, the TDI line scan module 110 may further include an illumination module 113 configured to provide a light source to the line scan lens 111. As shown in fig. 2, the optical axis of the linear scanning lens 111 may be set to be perpendicular to the two-dimensional plane scanned by the linear scanning lens 111, and the light emergent surface of the linear scanning lens 111 is set to be parallel to the two-dimensional plane scanned by the linear scanning lens. The light source output by the illumination module 113 is emitted through the linear scanning lens 111 after passing through a reflective element, and enters the TDI line image sensor 112 after being reflected by a two-dimensional plane in the field of view of the linear scanning lens 111, that is, the optical signal in the field of view range acquired by the linear scanning lens 111 is input to the TDI line image sensor 112. The illumination module 113 includes a light source and an illumination light guide, the light source is preferably an LED to provide sufficient brightness, and based on the characteristic of TDI linear scanning, the scanning mode of the linear scanning lens 111 is line scanning, that is, the size of the light emitting surface of the linear scanning lens 111 along the line scanning direction (denoted as the field width of the linear scanning lens) may be set to be much smaller than the size perpendicular to the line scanning direction (denoted as the field length of the linear scanning lens). Therefore, the light beam output by the illumination module 113 to the line scanning lens 111 is preferably a line light beam, and the illumination light guide used is a line light guide.

The size of the line scanning lens 111 may be specifically set according to the processing capability of the TDI line image sensor 112 and the condition of a two-dimensional plane to be scanned. The TDI linear array scanning module 110 may perform each line scan by uniform motion, where the rate of the uniform motion is the product of the sampling frequency of the TDI linear array scanning module 110 and the size (i.e., the field width) of the linear array scanning lens 111 perpendicular to the scanning direction.

The TDI line image sensor 112 may have a structure disclosed in the art, and for example, may include a CCD and a TDI image acquisition card arranged in multiple rows, so as to process and convert optical charges in a time delay integration manner, transmit the obtained line image information to the TDI image acquisition card for storage, and further transmit the line image information to the image processing module 130, so as to obtain a line image obtained after each line scanning with the line scanning lens 111, and further generate a whole image.

Referring to fig. 2, the TDI line scan module 110 may further include a height sensor 114 and a lens adjustment module (not shown). The height sensor 114 is configured to acquire distance information between the linear scanning lens 111 and a two-dimensional plane scanned thereby. The lens adjusting module is configured to adjust the linear array scanning lens 111 according to the distance information, so that the two-dimensional plane is located near a focal plane of the linear array scanning lens 111. The lens adjusting module may be in communication connection with the linear scanning lens 111 to adjust the position of the focal plane by adjusting the magnification of the linear scanning lens 111, in another embodiment, the lens adjusting module may not be provided, and an operator may adjust the linear scanning lens 111 to enable the two-dimensional plane to be scanned to be located near the focal plane of the linear scanning lens 111. The magnification of the line scan lens 111 may be 2X, 3.5X, 5X, 7X, 10X, and the like.

The parameter setting module 120 is configured to set scanning parameters of the TDI linear array scanning module 110 according to information of a two-dimensional plane in which a target object is located, where the scanning parameters include the number of line scans, a start point and an end point of each line scan, and the like. Fig. 3(a) is a schematic diagram of a two-dimensional plane on which a target object is located according to an embodiment of the present invention. Fig. 3(b) is a schematic diagram of line scanning of the two-dimensional plane arrangement of fig. 3(a) according to an embodiment of the present invention. For the example of fig. 3(a) and 3(b), where the target object 10 is irregular in shape, the parameter setting module 120 may set four line scans, where the scanning directions of the four line scans are parallel to the AB direction and are sequentially arranged in a staggered manner in the CD direction. The sequence of the four line scans is, for example, the direction of the first line scan i and the third line scan iii is from side a to side B, and the direction of the second line scan ii and the fourth line scan iv is from side B to side a, i.e. the scanning can be performed back and forth along a serpentine path. Each line scan has a corresponding start and end point. In the preferred scheme, the scanning directions of each line scanning are set to be parallel, namely the scanning direction of the whole scanning process is unchanged, so that the scanning efficiency can be improved, and the image processing is convenient. In addition, according to the coverage range of the target object, the scanning range corresponding to each line scanning may cover all or part of the two-dimensional plane in the scanning direction, that is, the scanning ranges of each line scanning may be arranged in at least one column in the vertical direction of the scanning direction.

To make the TDI line scanning module 110 perform line scanning in the two-dimensional plane, the TDI line scanning module 110 may be moved, or the physical carrier on which the target object is located may be moved, that is, the TDI line scanning module 110 and the two-dimensional plane to be scanned are relatively translated to perform line scanning. Referring to fig. 1, for example, in an embodiment, the image scanning apparatus further includes a motion control module 150, and the motion control module 150 is configured to control the TDI line scan module 110 to move within the two-dimensional plane to perform each line scan according to the scan parameters set by the parameter setting module 120. For multiple line scans performed in the same two-dimensional plane, the multiple line scans may be arranged in the same column at a certain line interval, or may be divided into two or more columns, each column including at least one line scan, according to the situation of the target pattern. When performing multiple line scans, the scanning directions of the line scans may be the same, but in order to improve the scanning efficiency, the TDI line scan module 110 may be configured to perform line scans continuously in a serpentine (Mender) manner, that is, the scanning directions of two adjacent line scans in the same column may be opposite. In addition, in order to acquire enough image data for subsequent image processing, it may be set that the field ranges of the two adjacent line scans in the same column at least partially overlap in a vertical direction of the line scanning direction.

Since the distribution of the target objects in the corresponding two-dimensional plane may be partitioned or discontinuous, in order to improve the image processing efficiency, the TDI line scanning module 110 may not need to take pictures all the time during the scanning process, and specifically, the TDI line image sensor 112 may be started or stopped to perform imaging as needed. For example, during a time interval between two line scans, the photographing operation of the TDI line scan module 110 may be suspended, and for example, during a time interval between the end of scanning one block and the scanning of another block, the photographing operation of the TDI line scan module 110 may also be suspended. During the pause period, the TDI line array scanning module 110 and the scanned two-dimensional plane can still move relatively along the line scanning route. Therefore, in an embodiment, referring to fig. 1, the image scanning apparatus may further include a TDI control module 140, and the TDI control module 140 is configured to start and stop the imaging of the TDI line image sensor 112. Specifically, the TDI control module 140 may trigger the TDI line image sensor 112 to start or pause/stop imaging by using a timing control unit, or may trigger the TDI line image sensor 112 to start or pause/stop imaging according to the position of the linear scanning lens 111.

The image processing module 130 is configured to process line image information output by the TDI line array scanning module to generate an entire image covering a two-dimensional plane where a target object is located, and obtain distribution information of the target object in the two-dimensional plane according to the entire image. The processing procedure of the image processing module 130 illustratively includes the following procedures: the line image information corresponding to one or more line scans may be first processed into line images by the method disclosed in the image processing, and then the line images are processed by a method such as image stitching to obtain an entire image covering the two-dimensional plane, and then the distribution information of the target object in the two-dimensional plane may be obtained from the entire image by an image recognition method such as gray scale matching. That is, after the image processing module 130 obtains the line image information corresponding to each line scan, the distribution information of the target object in the two-dimensional plane may be obtained using a public image processing tool or an image processing algorithm, where the distribution information may include the shape of the target object, the extended trajectory of the target object, the position of the straight-line segment and the position of the curved-line segment in the trajectory, the size of the corner, the size of the target object in each direction, and the like.

The image scanning device performs at least one line scanning on a two-dimensional plane where the target object is located by utilizing the characteristic of TDI linear array scanning, processes line image information output by the TDI linear array scanning module by utilizing the image processing module to generate a whole image covering the two-dimensional plane, and obtains distribution information of the target object in the two-dimensional plane according to the whole image. The distribution of the target object aimed at by the image scanning apparatus in the two-dimensional plane may be in any form (for example, the trajectory of the target object may include a combination of a rectangle, an arc, and the like, and the sizes of the plurality of target images may be different from each other). The image scanning device can be applied to various occasions requiring high-speed and high-resolution acquisition of the distribution situation of the target objects.

Example two

The present embodiment mainly introduces a laser packaging apparatus and a laser packaging method. The laser packaging apparatus and method utilize the image scanning device of the foregoing embodiments.

As described in the background, the method of manual monitoring and adjusting the encapsulation path is inefficient, and the non-manual monitoring method includes the following cases, which are described as follows: one existing method obtains a laser packaging path by positioning and reasoning positions of a plurality of end parts in a packaging range, but the method cannot judge the packaging track of a special-shaped structure; another conventional method is to calculate the encapsulation path by obtaining the difference between the intensity of the reflected light of the adhesive or the frit and the intensity of the reflected light of the surrounding area, but actually, various process patterns arranged on the glass substrate increase the difficulty of obtaining the printing boundary, and affect the position measurement accuracy of the encapsulation path; in addition to poor measurement accuracy, it is necessary to ensure that the laser spot is located on the axis of the CCD system in actual operation because the CCD system cannot measure spot information in an off-axis state. Obviously, the existing method for obtaining the packaging path still has a plurality of problems.

Therefore, the laser packaging device of the embodiment is used for irradiating the frame sealing material in the substrate to be packaged by using a laser beam to perform packaging, and the laser packaging device includes the image scanning device, and the image scanning device is configured to acquire distribution information of the frame sealing material in a two-dimensional plane of the substrate to be packaged. The frame sealing material can be UV frame sealing glue or glass powder. The frame sealing material may be previously disposed between the two glass substrates as a substrate to be encapsulated by a printing coating method or the like.

The laser packaging device can comprise the following parts: a substrate stage 210 (see fig. 4), a laser system 220 (see fig. 4), and an industrial personal computer (not shown). Specifically, the substrate stage 210 is configured to place a substrate to be packaged. A laser system 220 may be disposed above the substrate table 210 and configured to face the substrate table 210 to generate a laser beam directed at a substrate to be packaged. The industrial personal computer is configured to set a packaging path according to distribution information of the frame sealing material in a two-dimensional plane where the substrate to be packaged is located, and control the laser system 220 to irradiate the frame sealing material in the substrate to be packaged according to the packaging path so as to perform laser packaging.

As an example, the laser packaging apparatus may have a cross-sectional structure as shown in fig. 4. Fig. 4 is a cross-sectional structural view of a laser packaging apparatus according to an embodiment of the present invention. Referring to fig. 4, the laser packaging apparatus further includes a base 230 disposed on a foundation and a gantry 240 disposed on the base 230. The substrate stage 210 may be disposed on the base 230, the substrate stage 210 has a freedom of movement in a first direction (e.g., Y direction in fig. 4) on the base 230, and the substrate stage 210 is rotatable with respect to the base 230 to facilitate alignment adjustment after a substrate to be packaged is loaded on the substrate stage 210. A gantry 240 is positioned on the base 230 and spans directly above the substrate stage 210, and the laser system 220 may be disposed on the gantry 240. In this embodiment, the laser system 220 has freedom of movement in a second direction (e.g., the X direction in fig. 4), and the first direction and the second direction are perpendicular to each other. The laser system 220 may be arranged to be slidable along a gantry 240, and the extension direction of the part of the gantry 240 directly above the substrate table 210 is the X direction.

The laser system 220 may include one or more than one galvanometer stages 221 (three galvanometer stages are provided in fig. 4) arranged on the gantry 240, each galvanometer stage 221 is provided with one galvanometer module 222, and when performing laser packaging, the galvanometer module 222 obtains information of a packaging path output by an industrial personal computer, and correspondingly outputs a laser beam to irradiate a substrate to be packaged for packaging. It can be seen that, with the above laser packaging apparatus, the position of the light spot irradiated by the laser system 220 onto the substrate to be packaged on the substrate table 210 can be changed by the movement of the substrate table 210 and the movement of the laser system 220, that is, the substrate to be packaged can be packaged according to a specific packaging path by the above laser packaging apparatus.

Because the actual printing position of the frame sealing material such as the UV frame sealing glue or the glass powder and the designed printing position often have a deviation, it is necessary to obtain the actual printing condition of the frame sealing material. In order to obtain an accurate packaging path, the laser packaging apparatus of the present embodiment employs the aforementioned image scanning device to determine the actual printing condition of the frame sealing material in the substrate to be packaged, so as to set an accurate packaging path.

As shown in fig. 4, in this embodiment, the TDI line scan module 110 in the image scanning apparatus may be disposed on the gantry 240. In order to not block the light beam of the laser system 220, the projection of the light-emitting surfaces of the TDI line scan module 110 and the laser system 220 on the substrate table 210 (i.e. the package or the scan plane) is preferably non-coincident, or the light-emitting surfaces do not affect each other by relative movement. The laser system 210 and the TDI line array scanning module 110 may be fixedly disposed on the upper and lower surfaces of the gantry 240, respectively. The linear scanning lens 111 of the TDI linear scanning module 110 faces the substrate stage 210 to perform TDI line scanning imaging on the substrate to be packaged on the substrate stage 210. Preferably, the TDI line scan module 110 also has a degree of freedom along the second direction (X direction) to move relative to the substrate to be packaged to scan the area where the framing material is located within the substrate. The present invention is not limited thereto, and in another embodiment, the substrate table 210 has both a degree of freedom in a first direction and a degree of freedom in a second direction perpendicular to the first direction on the base 230, and the substrate table 210 is rotatable in a horizontal plane with respect to the base 230, and in this embodiment, since the substrate to be packaged can be moved in the line scanning direction of the TDI line scan module 110 and the direction perpendicular to the line scanning direction, the TDI line scan module 110 can be disposed above the substrate to be packaged and is stationary with respect to the base 230, and the aforementioned line scanning process is performed mainly by the movement of the substrate to be packaged.

As an example, a laser packaging method using the above laser packaging apparatus is described below. Fig. 5 is a schematic diagram of a packaging unit according to an embodiment of the invention. In this embodiment, the substrate to be packaged may include one or more packaging units 20 with relatively independent areas, and the frame sealing material in each packaging unit 20 has a ring-shaped printing trace as shown in fig. 5. Referring to fig. 5, the printing traces of the framing material may be in an irregular planar shape. The special-shaped packaging unit is applied to a display panel of a mobile phone of a Liuhai screen, and the packaging path of the packaging unit cannot be accurately obtained by a conventional method for deducing the packaging path according to the end point positioning. In this embodiment, the laser packaging device is used to obtain an image of a two-dimensional plane including the packaging unit, so as to obtain the distribution of the packaging unit. The laser packaging method of the present embodiment will be described in more detail below.

Firstly, a first step is carried out, and a substrate to be packaged is aligned.

Before alignment, a substrate to be packaged, which includes a frame sealing material printed according to a designed route, may be placed on the substrate stage 210 by a mechanical device connected to a laser packaging apparatus. After the substrate to be packaged is loaded, alignment is first performed to obtain a specific position of the substrate to be packaged on the substrate stage 210. The alignment process can detect the alignment mark on the substrate to be packaged through a special alignment device on the laser packaging equipment, and then the alignment mark is compared with a standard position prestored in an industrial personal computer, and alignment is carried out by adjusting the position of the substrate.

In this embodiment, the substrate to be packaged is loaded on the substrate stage 210 and aligned by using the image scanning device 110 disposed on the gantry 240. The method specifically comprises the following steps: firstly, at least one line scan is performed in a two-dimensional plane where the substrate to be packaged is located, and image processing (which can be performed by using the image scanning device 110) is performed to obtain position information of an alignment mark on the substrate to be packaged; then, according to the position information of the alignment mark, obtaining the offset of the substrate to be packaged relative to a standard position (which can be prestored in an industrial personal computer); then, an angular offset among the offset amounts is compensated for by rotating the substrate stage 210. In an embodiment, the offset of the substrate to be packaged with respect to the standard position further includes a translation amount in the X direction or the Y direction, and for the translation amount, the translation amount may be adjusted by moving the substrate stage 210, or may not be adjusted, but the translation amount may be compensated in the subsequent calculation of the starting position when the TDI linear array scanning module 110 performs line scanning or the laser system performs laser packaging.

Data about the distribution range of the frame sealing materials in the two-dimensional plane of the substrate to be packaged can be prestored in the industrial personal computer. For example, the distribution range of the frame sealing material in the two-dimensional plane of the substrate to be packaged can be obtained by the design path of the coating frame sealing material.

And then executing a second step, executing at least one line scanning in a two-dimensional plane where the substrate to be packaged is located, outputting line image information corresponding to each line scanning, processing the line image information to generate an overall image of a frame sealing material distribution range, and further obtaining distribution information of the frame sealing material in the overall image.

Specifically, the second step may include the following process.

First, a first substep is performed, and scanning parameters of the TDI linear array scanning module 111 are set according to information of the packaging unit on the substrate to be packaged, where the scanning parameters include the number of line scans, the start and end positions of each line scan, and the line interval.

Referring to fig. 5, as an example, the center O of the packaging unit 20 is set as the origin (0, 0) of an orthogonal coordinate system, the packaging unit 20 is coated within a range of 50mm long and 40mm wide, that is, the length of the packaging unit 20 is set to 50mm and the width thereof is set to 40mm, the size of the light-emitting surface of the line scanning lens 111 of the TDI line scanning module 110 is 30mm × 1.5um, the sampling frequency of the TDI line image sensor 112 of the TDI line scanning module 110 is set to 115KHz, and a scan margin is set to 0.4mm (which may be set according to the maximum printing deviation of the packaging unit 20). According to the path planning, the TDI line scan module 110 performs two line scans to scan and photograph the packaging units 20, wherein the two line scans are arranged from top to bottom and the scanning directions (as indicated by the dashed arrows in fig. 5) are opposite to each other for improving the efficiency. The calculated scan parameters are as follows:

the starting position in the X direction of the first line scan-the encapsulation unit length/2-the scan margin-50/2-0.4-25.4 (mm);

the X-direction end position of the first line scan is equal to the package unit length/2 + scan margin is equal to 50/2+0.4 is equal to 25.4 (mm);

the position of the center line in the X direction of the first line scan is 40/2+0.4-30/2 is 5.4(mm), i.e., the width of the packaging unit/2 + the scan margin-the length of the line scan lens/2;

the X-direction starting position of the second line scan is equal to the packing unit length/2 + scan margin is equal to 50/2+0.4 is equal to 25.4 (mm);

the X-direction end position of the second line scan-package unit size length/2-scan margin-50/2-0.4-25.4 (mm);

the position of the center line in the X direction of the second line scan is equal to the width of the package unit/2 + the scan margin-the length of the line scan lens/2 + the length of the line scan lens is equal to 40/2+0.4-30/2 + 30-35.4 (mm);

the distance between the two line scans in the Y direction is 5.4-35.4-30 (mm) from the center line position in the X direction of the first line scan to the center line position in the X direction of the second line scan

The scanning speed of the TDI linear array scanning module in the X direction is equal to the width of a camera and the sampling frequency is equal to 1.5um and 115K and equal to 187.5 mm/s;

in the TDI line scan module, the number of times N that a TDI line image sensor takes a picture in one line scan is (the end position in the X direction-the start position in the X direction)/the width of the line scan lens is 50.8/1.5um is 33867.

Then, a second sub-step is performed, in which at least one line scan is performed in the two-dimensional plane of the packaging unit 20 by using the TDI line scan module 111 in the image scanning apparatus, and line image data corresponding to each line scan is obtained. The specific scanning process may refer to the description of the image scanning apparatus.

And then, executing a third substep, processing the line of image data to generate a whole image comprising the packaging units on the substrate to be packaged, and obtaining the distribution information of the frame sealing material in the two-dimensional plane of the substrate to be packaged according to the whole image. The whole image preferably further comprises information of alignment marks on the substrate to be packaged, so that the position of the packaging unit on the substrate table can be determined, and the packaging path can be determined.

In the second sub-step, two line scans in opposite directions may be set for the encapsulating unit 20 shown in fig. 5, and the two line scans may cover the entire range of the encapsulating unit, so that the TDI linear array scanning module 110 may obtain two sets of line image information respectively corresponding to the two line scans. Further, the image processing module processes the two sets of line image information to obtain the whole image of the packaging unit 20. The frame sealing material has a specific color and track in the whole image, and the real distribution condition of the frame sealing material in the packaging unit can be obtained from the whole image by a known image processing means, including the specific positions and widths of the straight line segment and the bent line segment formed by the frame sealing material in the packaging unit 20, and the like. Subsequently, when laser packaging is carried out, the design of laser parameters (such as laser path, laser intensity and the like) is carried out by referring to the real position information of the frame sealing material, so that the design accuracy is improved, and when more accurate laser parameters are used for packaging, the irradiation area ratio is improved.

Fig. 6 is a schematic diagram of a plurality of packaging units according to an embodiment of the invention. Referring to fig. 6, in an embodiment, a substrate to be packaged (the diagonal filling area in fig. 6) includes a plurality of packaging units 20 that need to be packaged in the same packaging process. The plurality of encapsulation units 20 are each closed with a space. As an example, for the case of a plurality of relatively independent encapsulation units, the line scanning may be performed per encapsulation unit 20, i.e. at least one line image may be obtained for each encapsulation unit 20. But not limited thereto, for the packing units arranged in rows, it is also possible to cover a plurality of packing units 20 with each row scan, thereby obtaining row image information extending over a plurality of packing units. The following description will be given by taking the scanning method as an example.

In order to improve the image processing efficiency, during the scanning process (the TDI line scan module and the substrate to be packaged still perform the set relative motion), the TDI control module 140 may control whether the TDI line scan module 110 takes a picture. Referring to fig. 6, as an example, during one line scan, the TDI control module 140 triggers photographing when the timing control trigger signal is set to high level, and triggers photographing to stop when the timing control trigger signal is set to low level. Taking the first line scanning as an example, at a time point t1, when the timing control trigger signal is at a high level, the TDI linear array scanning module 110 starts to take a picture; at a time point t2, the time sequence control trigger signal changes to a low level, and the TDI linear array scanning module 110 pauses to take a picture; at a time point t3, the time sequence control trigger signal changes to a high level, and the TDI linear array scanning module 110 resumes photographing; at a time point t4, the time sequence control trigger signal changes to a low level, and the TDI linear array scanning module 110 pauses to take a picture; at a time point t5, the time sequence control trigger signal changes to a high level, and the TDI linear array scanning module 110 resumes photographing; at time t6, the timing control trigger signal goes low, the TDI linear array scanning module 110 stops taking pictures, and the line scanning is completed. In the switching process of two adjacent line scans and the switching process of a plurality of scanning areas, the time sequence control trigger signal can be used for suspending photographing so as to reduce the processing amount of photocurrent signals and improve the image processing efficiency. It should be noted that, during the pause of photographing, the motion of the TDI line scan module or the substrate table is still moved according to the set start point, end point and line spacing of each line scan, and when the image processing module 130 processes the line image information to generate a whole image, the size of the region passed by the non-photographing time period is also counted to obtain an accurate whole image.

After the distribution information of the frame sealing material in the distribution range is obtained, a third step is executed, and the packaging parameters of the laser beam are set according to the distribution information of the frame sealing material in the distribution range. The packaging parameters of the laser beam can comprise a packaging path, a scanning speed, laser intensity and the like, and the calculation process can be completed through a processor of an industrial personal computer. The packaging path of the laser beam may be set to coincide with the printing track of the framing material obtained by the second step, and in addition, as for the intensity of the laser beam and the scanning speed, it may also be specifically set by considering whether the framing material of different areas to be laser-packaged is a straight-line section or a bent section and the width of the framing material.

After obtaining the package parameters, the fourth step may be performed, and the substrate to be packaged is subjected to laser package according to the package parameters. For example, the industrial personal computer may transmit the package parameters to the galvanometer module 220 to perform laser packaging.

The laser packaging equipment comprises the image scanning device, the characteristic that the image scanning device can obtain the distribution information of the target object in the two-dimensional plane is utilized, and the distribution information of the frame sealing material in the substrate to be packaged in the two-dimensional plane is obtained by utilizing the image scanning device. The TDI linear array scanning module packaging unit is adopted to shoot the area, the sampling time and the scanning movement speed are synchronous, the obtained overall image is a line-by-line scanning and splicing result, and the method has the advantages in the comprehensive effect of efficiency and resolution compared with an area array shooting mode. The frame sealing material may be regularly distributed or irregularly distributed, for example, when the substrate to be packaged is used as an OLED bang screen, the frame sealing material has an irregular printing pattern, but the actual distribution of the frame sealing material can still be obtained efficiently and with high resolution by the image scanning device, which is further beneficial to obtaining an accurate packaging path.

In the laser packaging method in this embodiment, the laser packaging device is used to obtain the distribution information of the frame sealing material in the two-dimensional plane to set the packaging path of the laser beam, and laser packaging is performed on the substrate to be packaged along the packaging path.

EXAMPLE III

The present embodiment mainly introduces a mask plate measuring apparatus and a mask plate measuring method.

The mask plate is typically provided with fine openings (or holes) for exposure or thermal evaporation processes. In this embodiment, a metal mask plate used in an OLED thermal evaporation process is taken as an example. Fig. 7 is a schematic diagram of a pixel hole on a metal mask according to an embodiment of the invention. Referring to fig. 7, in the process of manufacturing the metal mask plate, a plurality of pixel holes 30 arranged in an array are formed on the metal mask plate, and a shielding area is formed between the pixel holes 30. The pixel apertures 30 typically range in the range of several hundred microns.

In the OLED panel manufacturing process, organic materials are heated and evaporated and are deposited on corresponding pixel areas on the OLED substrate through the pixel holes in the metal mask plate. Before the mask plate is mounted on the vacuum thermal evaporation apparatus, in order to avoid deformation due to gravity, a certain pulling force is generally applied to an end portion of the mask plate by a stretching device, and the mask plate is welded to a mask frame (mask frame). In order to inspect the quality of the metal mask plate or the quality of the expanded mesh, it is necessary to detect distribution information such as the positions and sizes of the pixel holes in the mask plate. In the prior art, an area-array camera is generally adopted to carry out photographing measurement on a block-by-block basis, and the method is time-consuming and low in efficiency. In order to improve the detection efficiency and take the detection quality into consideration, the invention provides the mask plate measuring equipment.

The mask plate measuring device of the embodiment is used for acquiring distribution information of the openings in the mask plate plane. The mask plate measuring equipment comprises the image scanning device. Because the image scanning device has the advantages of high scanning speed block and high resolution, compared with the prior art, the mask plate measuring equipment can quickly and accurately obtain the distribution information of the openings by adopting an area-array camera to photograph the mask plate one by one, and is favorable for judging the quality of the mask plate or the quality of the screening in time.

The mask plate measuring method in the embodiment utilizes the mask plate measuring equipment. Specifically, the mask plate measuring method comprises the following steps.

The first step is as follows: and providing a mask plate, and arranging a TDI linear array scanning module of the image scanning device above the mask plate for alignment.

Still taking a metal mask plate for thermal evaporation of the OLED as an example, the mask plate may be a metal mask plate welded on a mask plate frame. As an example, the mask plate may be arranged on a pedestal and horizontally placed, and the TDI line scan module of the image scanning apparatus may be arranged on a gantry above it (see fig. 4, in which the substrate to be packaged on the substrate table is replaced with the mask plate). The mask plate and the TDI linear array scanning module can move relatively, so that line scanning can cover the range of pixel holes to be measured. According to the size of the mask plate and the predicted pixel design data, the distribution range of the pixel holes on the mask plate in the plane of the mask plate can be obtained.

In this step, the image scanning device may be used to perform pre-scanning to obtain the position of the alignment mark on the mask plate, and perform alignment to obtain the reference position.

The second step is as follows: and carrying out image scanning on the mask plate by using the image scanning device to obtain an overall image of the mask plate, and further obtaining distribution information of the openings in the plane of the mask plate.

In the second step, the parameter setting module 120 in the image scanning apparatus may be used to set scanning parameters of the TDI linear array scanning module, and perform at least one line scan on the plane where the mask plate is located through the TDI linear array scanning module 110, and output line image information corresponding to each line scan. Then, the line image information can be processed by an image processing module to generate an overall image of the mask plate, and distribution information of the openings on the mask plate on a plane where the mask plate is located is obtained according to the overall image. Taking a metal mask plate for thermal evaporation of the OLED as an example, through the above steps, distribution information of pixel holes on the metal mask plate on a plane where the mask plate is located can be obtained, and specifically, information such as a distance between each pixel hole and a reference position, a size of the pixel hole, and a distance between adjacent pixel holes can be included.

Therefore, the distribution information of the openings on the mask plate can be obtained by using the mask plate measuring method, so that the information about the quality of the mask plate or the quality of the expanded mesh can be known in time. Compared with the method that an area-array camera can only photograph a smaller area (about 300 μm × 200 μm) at a time to obtain opening information, the mask plate measuring method of the present embodiment utilizes the image scanning device, wherein the width of the range covered by each line scanning of the TDI line scanning module can be set to a millimeter level (e.g., 10mm), and the length of the line scanning range can be larger, and the method can be specifically set according to the performance of the adopted TDI line scanning module, the size of the mask plate, and other conditions, so that an overall image of a high-resolution mask plate can be quickly obtained, and information on the quality of the mask plate or the quality of a stretched net can be timely obtained.

The mask plate measuring device and the mask plate measuring method of the present embodiment belong to a general concept with the image scanning device described in the first embodiment and the laser packaging apparatus and the laser packaging method described in the second embodiment, and the relevant points can be understood with reference to the drawings.

The above description is only for the purpose of describing the preferred embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, and any person skilled in the art can make possible the variations and modifications of the technical solutions of the present invention using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention, and therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention belong to the protection scope of the technical solutions of the present invention.

Claims

1. A laser packaging device is used for irradiating a frame sealing material in a substrate to be packaged through laser beams for packaging, and is characterized by comprising an image scanning device, wherein the image scanning device is configured to acquire distribution information of the frame sealing material in a two-dimensional plane of the substrate to be packaged; the image scanning device comprises a TDI linear array scanning module and an image processing module, wherein the TDI linear array scanning module is configured to execute at least one line scanning in a two-dimensional plane where a target object, namely a frame sealing material, is located, and output line image information corresponding to each line scanning, and the TDI linear array scanning module comprises a linear array scanning lens and a corresponding TDI line image sensor; the image processing module is configured to process the line image information to generate an entire image covering the two-dimensional plane, and obtain distribution information of the target object in the two-dimensional plane according to the entire image; and the laser packaging equipment sets the packaging parameters of the laser beam according to the distribution information of the frame sealing material in the distribution range, and carries out laser packaging on the substrate to be packaged according to the packaging parameters.

2. The laser packaging apparatus of claim 1, wherein the laser packaging apparatus further comprises:

a substrate stage configured to place the substrate to be packaged;

3. The laser packaging apparatus of claim 2, further comprising:

4. The laser packaging apparatus of claim 3, wherein the laser system comprises at least one galvanometer stage and a corresponding galvanometer module disposed on the gantry.

5. The laser packaging apparatus of claim 1, wherein the image scanning device further comprises at least one of:

a parameter setting module configured to set scanning parameters according to the information of the two-dimensional plane, wherein the scanning parameters comprise line scanning times, and a starting point and an end point position of each line scanning;

a motion control module configured to control the TDI linear array scanning module to move in the two-dimensional plane according to the scanning parameters set by the parameter setting module so as to execute each line scanning; and

6. The laser packaging apparatus of claim 1, wherein the TDI line scan module further comprises:

7. The laser packaging apparatus of claim 6, wherein the illumination module comprises a light source and an illumination light guide, the light source being an LED and the illumination light guide being a linear light guide.

8. The laser packaging apparatus of claim 1, wherein the scanning directions of the respective line scans are parallel; the scanning ranges of the line scans are arranged in at least one row in the vertical direction of the scanning direction.

9. The laser packaging apparatus of claim 8, wherein the scanning directions of two adjacent row scans in the same column are opposite.

10. The laser packaging apparatus of claim 8, wherein the fields of view of two adjacent row scans in the same column in a vertical direction of the row scan direction at least partially overlap.

11. The laser packaging apparatus of any one of claims 1 to 10, wherein the magnification of the linear scanning lens is 2X, 3.5X, 5X, 7X, and 10X.

12. The laser packaging apparatus of any one of claims 1 to 10, wherein the TDI linear array scanning module performs each line scan with a uniform motion at a rate of the product of the sampling frequency of the TDI linear array scanning module and the width of the field of view of the linear scanning lens perpendicular to the scanning direction.

13. A laser packaging method using the laser packaging apparatus according to any one of claims 1 to 12, comprising:

aligning a substrate to be packaged;

executing at least one line scanning in a two-dimensional plane where the substrate to be packaged is located, outputting line image information corresponding to each line scanning, and processing the line image information to generate an overall image of a frame sealing material distribution range so as to obtain distribution information of the frame sealing material in the overall image;

setting the packaging parameters of the laser beam according to the distribution information of the frame sealing material in the distribution range; and

and carrying out laser packaging on the substrate to be packaged according to the packaging parameters.

14. The laser packaging method of claim 13, wherein the method of aligning the substrate to be packaged comprises:

performing at least one line scanning in a two-dimensional plane where the substrate to be packaged is located and performing image processing to obtain position information of an alignment mark on the substrate to be packaged;

obtaining the offset of the substrate to be packaged according to the position information of the alignment mark; and

compensating for an angular offset in the offset amount by rotating the substrate table.