CN112375526A - Rapid curing method of moisture curing glue - Google Patents
Rapid curing method of moisture curing glue Download PDFInfo
- Publication number
- CN112375526A CN112375526A CN202011290838.0A CN202011290838A CN112375526A CN 112375526 A CN112375526 A CN 112375526A CN 202011290838 A CN202011290838 A CN 202011290838A CN 112375526 A CN112375526 A CN 112375526A
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- CN
- China
- Prior art keywords
- curing
- temperature
- humidity
- glue
- moisture
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/02—Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/302—Water
- C08G18/307—Atmospheric humidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the field of adhesives based on polyurea or polyurethane or based on polymer derivatives, in particular to a rapid curing method of moisture curing glue. A rapid curing method of moisture curing glue is characterized in that: the method is implemented in sequence according to the following steps: setting an environment; curing; and testing. The invention has short curing time and high production efficiency.
Description
Technical Field
The invention relates to the field of adhesives based on polyurea or polyurethane or based on polymer derivatives, in particular to a rapid curing method of moisture curing glue.
Background
Moisture curing glue is generally used for sealing and fixing electronic equipment, but the existing moisture curing glue has long curing time which can reach over 70 hours, and the improvement of production efficiency is influenced.
Disclosure of Invention
The invention discloses a rapid curing method of moisture curing glue, aiming at overcoming the defects of the prior art and providing an adhesive with short curing time and high production efficiency.
The invention achieves the purpose by the following technical scheme:
a rapid curing method of moisture curing glue is characterized in that: the method is implemented in sequence according to the following steps:
setting an environment: putting the workpiece coated with the moisture curing glue into a curing chamber, wherein the curing chamber is internally provided with a temperature sensor, a humidity sensor, a heater and a humidifier, the temperature sensor is connected with the heater through a signal wire, the humidity sensor is connected with the humidifier through a signal wire, and the temperature and the humidity in the curing chamber are controlled to be 35-55 ℃ and 35-55% respectively;
curing: the moisture curing glue is cured by 8 hours in a curing chamber, the temperature in the curing chamber is controlled to be 35-55 ℃, and the humidity is controlled to be 35-55%.
Testing: and (3) carrying out airtight test on the solidified workpiece by using an airtight leakage detection instrument, wherein the test requirement is as follows: inflating the curing workpiece for 200kPa, 15sec for inflation and 60sec for pressure stabilization; and detecting the leakage for 10sec, and if the test standard value is lower than 40pa, the test is qualified and the curing is finished. The inflation of the measured object is a complex thermodynamic process, the gas pressure in the measured object is changed greatly due to the temperature change, and the impact generated by the action of the control valve, at the moment of stopping inflation, the gas pressure in the measured object has a process of rapid decrease or increase, so a pressure stabilizing process is needed;
the rapid curing method of the moisture curing glue is characterized by comprising the following steps: when the temperature sensor detects that the temperature in the curing chamber is lower than the lower limit of the temperature and is lower than the temperature of +5 ℃, the heater starts heating, the temperature in the curing chamber is heated to the upper limit of the temperature and is stopped heating, when the humidity sensor detects that the humidity in the curing chamber is lower than 110% of the lower limit of the humidity, the humidifier starts humidifying, and the humidification is stopped when the temperature in the curing chamber is increased to 90% of the upper limit of the humidity.
According to the invention, a large number of experiments prove the curing characteristic of the moisture curing glue, and compared with the curing in a normal-temperature and normal-humidity environment, the curing time of the moisture curing glue needs to be shortened by over 60 hours, so that the production efficiency is greatly improved.
Detailed Description
The invention is further illustrated by the following specific examples.
Example 1
A rapid curing method of moisture curing glue is implemented according to the following steps in sequence:
setting an environment: the method comprises the following steps of putting a workpiece coated with moisture curing glue into a curing chamber, wherein the moisture curing glue is silicone sealant such as Loctite Si 5970 glue, a temperature sensor, a humidity sensor, a heater and a humidifier are arranged in the curing chamber, the temperature sensor is connected with the heater through a signal wire, the humidity sensor is connected with the humidifier through a signal wire, the temperature in the curing chamber is controlled to be 35-55 ℃, the humidity is controlled to be 35-55%, and the control method comprises the following steps: when the temperature sensor detects that the temperature in the curing chamber is lower than the lower temperature limit plus 5 ℃, the heater starts heating, the heating is stopped when the temperature in the curing chamber is heated to the upper temperature limit minus 5 ℃, and when the humidity sensor detects that the humidity in the curing chamber is lower than 110% of the lower humidity limit, the humidifier starts humidifying, and the humidifying is stopped when the temperature in the curing chamber is increased to 90% of the upper humidity limit;
curing: the moisture curing glue is continuously cured by 8 hours in the curing chamber, the temperature in the curing chamber is controlled to be 35-55 ℃, and the humidity is controlled to be 35-55%.
Testing: and (3) carrying out airtight test on the solidified workpiece by using an airtight leakage detection instrument, wherein the test requirement is as follows: inflating the curing workpiece for 200kPa, 15sec for inflation and 60sec for pressure stabilization; and detecting the leakage for 10sec, and if the test standard value is lower than 40pa, the test is qualified and the curing is finished. The inflation of the object to be measured is a complex thermodynamic process, the gas pressure in the object to be measured is changed greatly due to the temperature change, and the impact generated by the action of the control valve, at the moment of stopping inflation, the gas pressure in the object to be measured has a rapid descending or ascending process, so that a pressure stabilizing process is needed.
Claims (2)
1. A rapid curing method of moisture curing glue is characterized in that: the method is implemented in sequence according to the following steps:
setting an environment: putting the workpiece coated with the moisture curing glue into a curing chamber, wherein the curing chamber is internally provided with a temperature sensor, a humidity sensor, a heater and a humidifier, the temperature sensor is connected with the heater through a signal wire, the humidity sensor is connected with the humidifier through a signal wire, and the temperature and the humidity in the curing chamber are controlled to be 35-55 ℃ and 35-55% respectively;
curing: the moisture curing glue is cured by 8 hours in a curing chamber, the temperature in the curing chamber is controlled to be 35-55 ℃, and the humidity is controlled to be 35-55%.
Testing: and (3) carrying out airtight test on the solidified workpiece by using an airtight leakage detection instrument, wherein the test requirement is as follows: inflating the curing workpiece for 200kPa, 15sec for inflation and 60sec for pressure stabilization; and detecting the leakage for 10sec, and if the test standard value is lower than 40pa, the test is qualified and the curing is finished.
2. The method for rapidly curing moisture-curable glue according to claim 1, wherein: when the temperature sensor detects that the temperature in the curing chamber is lower than the lower limit of the temperature and is lower than the temperature of +5 ℃, the heater starts heating, the temperature in the curing chamber is heated to the upper limit of the temperature and is stopped heating, when the humidity sensor detects that the humidity in the curing chamber is lower than 110% of the lower limit of the humidity, the humidifier starts humidifying, and the humidification is stopped when the temperature in the curing chamber is increased to 90% of the upper limit of the humidity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011290838.0A CN112375526A (en) | 2020-11-17 | 2020-11-17 | Rapid curing method of moisture curing glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011290838.0A CN112375526A (en) | 2020-11-17 | 2020-11-17 | Rapid curing method of moisture curing glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112375526A true CN112375526A (en) | 2021-02-19 |
Family
ID=74584109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011290838.0A Pending CN112375526A (en) | 2020-11-17 | 2020-11-17 | Rapid curing method of moisture curing glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112375526A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4659798A (en) * | 1985-06-24 | 1987-04-21 | Union Carbide Corporation | Novel room temperature vulcanizable polydiorganosiloxane compositions |
| CN202093411U (en) * | 2011-06-14 | 2011-12-28 | 常州天华新能源科技有限公司 | Constant temperature and humidity system of curing chamber |
| WO2014006083A1 (en) * | 2012-07-03 | 2014-01-09 | Airbus Operations Gmbh | System and method for curing a sealant |
| CN103582674A (en) * | 2011-03-31 | 2014-02-12 | 莫门蒂夫性能材料股份有限公司 | Moisture curable silylated polymer compositions with improved adhesion to concrete |
| CN103861790A (en) * | 2012-12-11 | 2014-06-18 | 广东三竹新能源有限公司 | Infrared high-temperature high-humidity rapid liquid silica gel curing device |
| CN206966060U (en) * | 2017-07-12 | 2018-02-06 | 河南环宇玻璃科技股份有限公司 | A kind of circulating constant temperature and humidity cure system |
| CN207732000U (en) * | 2017-12-25 | 2018-08-14 | 天能电池(芜湖)有限公司 | Curing room with humidity sensor |
| CN208050303U (en) * | 2018-02-01 | 2018-11-06 | 南昌易美光电科技有限公司 | Rapid solidification device is surveyed before a kind of dispensing |
| CN110898712A (en) * | 2019-11-15 | 2020-03-24 | 交通运输部公路科学研究所 | Curing chamber for polyurethane mixture mixing plant and polyurethane pre-curing method |
| CN210365139U (en) * | 2019-07-25 | 2020-04-21 | 北京玻名堂玻璃有限公司 | Novel maintenance of monocomponent silica gel coating device |
| CN111152390A (en) * | 2019-12-26 | 2020-05-15 | 江苏道融电子科技有限公司 | Metal piece dispensing and silica gel bonding process for mobile phone |
-
2020
- 2020-11-17 CN CN202011290838.0A patent/CN112375526A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4659798A (en) * | 1985-06-24 | 1987-04-21 | Union Carbide Corporation | Novel room temperature vulcanizable polydiorganosiloxane compositions |
| CN103582674A (en) * | 2011-03-31 | 2014-02-12 | 莫门蒂夫性能材料股份有限公司 | Moisture curable silylated polymer compositions with improved adhesion to concrete |
| CN202093411U (en) * | 2011-06-14 | 2011-12-28 | 常州天华新能源科技有限公司 | Constant temperature and humidity system of curing chamber |
| WO2014006083A1 (en) * | 2012-07-03 | 2014-01-09 | Airbus Operations Gmbh | System and method for curing a sealant |
| CN103861790A (en) * | 2012-12-11 | 2014-06-18 | 广东三竹新能源有限公司 | Infrared high-temperature high-humidity rapid liquid silica gel curing device |
| CN206966060U (en) * | 2017-07-12 | 2018-02-06 | 河南环宇玻璃科技股份有限公司 | A kind of circulating constant temperature and humidity cure system |
| CN207732000U (en) * | 2017-12-25 | 2018-08-14 | 天能电池(芜湖)有限公司 | Curing room with humidity sensor |
| CN208050303U (en) * | 2018-02-01 | 2018-11-06 | 南昌易美光电科技有限公司 | Rapid solidification device is surveyed before a kind of dispensing |
| CN210365139U (en) * | 2019-07-25 | 2020-04-21 | 北京玻名堂玻璃有限公司 | Novel maintenance of monocomponent silica gel coating device |
| CN110898712A (en) * | 2019-11-15 | 2020-03-24 | 交通运输部公路科学研究所 | Curing chamber for polyurethane mixture mixing plant and polyurethane pre-curing method |
| CN111152390A (en) * | 2019-12-26 | 2020-05-15 | 江苏道融电子科技有限公司 | Metal piece dispensing and silica gel bonding process for mobile phone |
Non-Patent Citations (3)
| Title |
|---|
| 国科学院管理干部学院编: "《学器材试用教材 高分子材料 材料部分 第4分册》", 31 December 1984 * |
| 张连坤等: "热熔胶膜复合面料固化牢度工艺的研究", 《山东纺织科技》 * |
| 陈家荣等: "胶粘剂固化智能温控系统", 《内燃机与配件》 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20210219 |