CN112358820B - 与电池片具有强粘结力的封装胶膜、形成其的组合物及应用 - Google Patents
与电池片具有强粘结力的封装胶膜、形成其的组合物及应用 Download PDFInfo
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- CN112358820B CN112358820B CN202011241665.3A CN202011241665A CN112358820B CN 112358820 B CN112358820 B CN 112358820B CN 202011241665 A CN202011241665 A CN 202011241665A CN 112358820 B CN112358820 B CN 112358820B
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- adhesive film
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- battery piece
- packaging adhesive
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 85
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 57
- 239000000203 mixture Substances 0.000 title claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 38
- 239000011230 binding agent Substances 0.000 claims abstract description 29
- 239000002952 polymeric resin Substances 0.000 claims abstract description 22
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 21
- -1 rare earth fluorides Chemical class 0.000 claims description 17
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 229910052593 corundum Inorganic materials 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 11
- 239000003963 antioxidant agent Substances 0.000 claims description 9
- 230000003078 antioxidant effect Effects 0.000 claims description 9
- 238000001125 extrusion Methods 0.000 claims description 9
- 239000004611 light stabiliser Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- 229940124543 ultraviolet light absorber Drugs 0.000 claims description 8
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 8
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 6
- 229910003443 lutetium oxide Inorganic materials 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims description 4
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 229940116351 sebacate Drugs 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920001038 ethylene copolymer Polymers 0.000 claims description 3
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 claims description 3
- UKJARPDLRWBRAX-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 UKJARPDLRWBRAX-UHFFFAOYSA-N 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 229920001748 polybutylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000002318 adhesion promoter Substances 0.000 claims description 2
- 239000005340 laminated glass Substances 0.000 claims description 2
- FRVPQJVZFCJNCO-UHFFFAOYSA-N morpholine;2,4,6-trichloro-1,3,5-triazine Chemical compound C1COCCN1.ClC1=NC(Cl)=NC(Cl)=N1 FRVPQJVZFCJNCO-UHFFFAOYSA-N 0.000 claims description 2
- 239000001384 succinic acid Substances 0.000 claims description 2
- PKYCTRXXOZUHFK-UHFFFAOYSA-N tris(1,2,2,6,6-pentamethylpiperidin-4-yl) phosphite Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OP(OC1CC(C)(C)N(C)C(C)(C)C1)OC1CC(C)(C)N(C)C(C)(C)C1 PKYCTRXXOZUHFK-UHFFFAOYSA-N 0.000 claims description 2
- CSGAUKGQUCHWDP-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1O CSGAUKGQUCHWDP-UHFFFAOYSA-N 0.000 claims 1
- HMADMAFEFZHZLM-UHFFFAOYSA-N 2,4-dichloro-6-(2,4,4-trimethylpentan-2-yl)-2h-1,3,5-triazin-1-amine Chemical compound CC(C)(C)CC(C)(C)C1=NC(Cl)=NC(Cl)N1N HMADMAFEFZHZLM-UHFFFAOYSA-N 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 15
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 6
- 230000002349 favourable effect Effects 0.000 abstract description 4
- 238000002161 passivation Methods 0.000 abstract description 4
- 238000002310 reflectometry Methods 0.000 abstract description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 20
- 239000000395 magnesium oxide Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 7
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000011218 binary composite Substances 0.000 description 4
- CMIHHWBVHJVIGI-UHFFFAOYSA-N gadolinium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Gd+3].[Gd+3] CMIHHWBVHJVIGI-UHFFFAOYSA-N 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 4
- 239000011206 ternary composite Substances 0.000 description 4
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 3
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical class C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 3
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- IQQVCMQJDJSRFU-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO IQQVCMQJDJSRFU-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RSEIMSPAXMNYFJ-UHFFFAOYSA-N europium(III) oxide Inorganic materials O=[Eu]O[Eu]=O RSEIMSPAXMNYFJ-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229910052747 lanthanoid Inorganic materials 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- FIXNOXLJNSSSLJ-UHFFFAOYSA-N ytterbium(III) oxide Inorganic materials O=[Yb]O[Yb]=O FIXNOXLJNSSSLJ-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- FIDRAVVQGKNYQK-UHFFFAOYSA-N 1,2,3,4-tetrahydrotriazine Chemical compound C1NNNC=C1 FIDRAVVQGKNYQK-UHFFFAOYSA-N 0.000 description 1
- KGUHNPYZVOXLMM-UHFFFAOYSA-N 1-(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound CC1(C)CC(C(N)CCCCCN)CC(C)(C)N1 KGUHNPYZVOXLMM-UHFFFAOYSA-N 0.000 description 1
- GOAHRBQLKIZLKG-UHFFFAOYSA-N 1-tert-butylperoxybutane Chemical compound CCCCOOC(C)(C)C GOAHRBQLKIZLKG-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- SKVOYPCECYQZAI-UHFFFAOYSA-N 2-ethylhexyl 2-methylbutan-2-ylperoxy carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)CC SKVOYPCECYQZAI-UHFFFAOYSA-N 0.000 description 1
- BWOITHKYQUJGSB-UHFFFAOYSA-N 2-methylbutan-2-ylperoxycyclohexane Chemical compound CCC(C)(C)OOC1CCCCC1 BWOITHKYQUJGSB-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 1
- SFDGJDBLYNJMFI-UHFFFAOYSA-N 3,1-benzoxazin-4-one Chemical compound C1=CC=C2C(=O)OC=NC2=C1 SFDGJDBLYNJMFI-UHFFFAOYSA-N 0.000 description 1
- OXGOEZHUKDEEKS-UHFFFAOYSA-N 3-tert-butylperoxy-1,1,5-trimethylcyclohexane Chemical compound CC1CC(OOC(C)(C)C)CC(C)(C)C1 OXGOEZHUKDEEKS-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- PFRLCKFENIXNMM-UHFFFAOYSA-N 3-trimethylsilylpropan-1-amine Chemical compound C[Si](C)(C)CCCN PFRLCKFENIXNMM-UHFFFAOYSA-N 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002319 LaF3 Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229910007981 Si-Mg Inorganic materials 0.000 description 1
- 229910008316 Si—Mg Inorganic materials 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- VLVZXTNDRFWYLF-UHFFFAOYSA-N [2-ethyl-2-(prop-2-enoyloxymethyl)hexyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CC)(CCCC)COC(=O)C=C VLVZXTNDRFWYLF-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 230000021164 cell adhesion Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical group CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- MWHNJARVACPRAF-UHFFFAOYSA-N hydroxy 2-methylbutan-2-yl carbonate Chemical compound CCC(C)(C)OC(=O)OO MWHNJARVACPRAF-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- HYXGAEYDKFCVMU-UHFFFAOYSA-N scandium(III) oxide Inorganic materials O=[Sc]O[Sc]=O HYXGAEYDKFCVMU-UHFFFAOYSA-N 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- GSECCTDWEGTEBD-UHFFFAOYSA-N tert-butylperoxycyclohexane Chemical compound CC(C)(C)OOC1CCCCC1 GSECCTDWEGTEBD-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical group F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J11/06—Non-macromolecular additives organic
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- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
- C08K2003/2213—Oxides; Hydroxides of metals of rare earth metal of cerium
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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Abstract
本发明提供了一种与电池片具有强粘结力的封装胶膜、形成其的组合物及应用。按重量份计,形成封装胶膜的组合物包括:100份聚合树脂,0.01~1份交联剂,0.01~1份助交联剂和0.01~1份助粘结剂,助粘结剂在封装温度下能够与电池片表面的二氧化硅发生化学反应。交联剂能够使聚合树脂之间发生交联,形成网状结构。在封装温度下,分布在聚合树脂中的助粘结剂能够与电池片上Si3N4表面的二氧化硅发生化学反应,这不仅有利于提高其形成封装胶膜与电池片之间的粘结强度,还有利于提高电池片中作为钝化层的氮化硅层的致密性,这有利于减少电池片的反射率,从而能够提高光伏组件的光电转换性能。
Description
技术领域
本发明涉及光伏领域,具体而言,涉及一种与电池片具有强粘结力的封装胶膜、形成其的组合物及应用。
背景技术
现有光伏领域,大尺寸光伏硅片研发成为本领域的研发热点。大尺寸光伏硅片对产业链成本的降低,不仅在于自身成本能低多少,更重要的在于大尺寸光伏硅片能够降低本领域中非硅部分的成本,使得产业链中各环节的相对竞争力增强,投资收益提升。但大尺寸光伏硅片的研发也给下游厂商带来了难题。比如在封装胶膜方面,原本依靠前后层封装胶膜粘接保护其中电池片,现在硅片尺寸变大会造成电池片的间隙变小,导致胶膜与胶膜粘接处变少,这使得本领域对封装胶膜与电池片之间的粘接力有了更高的要求。
现有文献提供了一种太阳能封装材料,采用三烯丙基异氰脲酸酯作为助交联剂,且三个烯丙基中一个或两个烯丙基被烷氧基甲硅烷基取代,从而提高了对透明基板如玻璃的粘和强度。
另一篇现有文献还提供了一种添加改性耦合剂的封装胶膜,通过在常用耦合剂570中添加0.1%~0.3%的2,6-二叔丁基对甲苯酚,增强偶联剂活性,利用甲基丙烯酰氧基基团与EVA中的碳碳双键相连,甲氧基基团与玻璃相连,从而使得玻璃与EVA薄膜粘黏起来,以增强EVA封装膜与玻璃之间的粘接力。
上述两种封装胶膜能够提高封装胶膜与基板或玻璃间的粘接强度,但是无法有效提高胶膜与电池片的粘接强度。鉴于上述问题的存在,有必要提供一种与电池片粘结力更加优异的封装胶膜。
发明内容
本发明的主要目的在于提供一种与电池片具有强粘结力的封装胶膜、形成其的组合物及应用,以解决现有的封装胶膜与电池片之间的粘接强度无法满足大尺寸光伏硅片对粘度方面的要求。
为了实现上述目的,本发明一方面提供了一种形成封装胶膜的组合物,按重量份计,形成封装胶膜的组合物包括:100份聚合树脂,0.01~1份交联剂,0.01~1份助交联剂和0.01~1份助粘结剂,其中,助粘结剂在封装温度下能够与电池片表面的二氧化硅发生化学反应。
进一步地,助粘结剂选自稀土氧化物、稀土氧化物与金属氧化物形成的二元或三元复合物、稀土氟化物与金属氧化物形成的二元或三元复合物组成的组中的一种或多种。
进一步地,助粘结剂选自Y2O3、镧系稀土氧化物、稀土氧化物与Al2O3形成的二元或三元复合物、稀土氧化物与MgO形成的二元或三元复合物和稀土氟化物与MgO形成的复合物组成的组中的一种或多种。
进一步地,助粘结剂选自Y2O3、Gd2O3、Eu2O3、Yb2O3、La2O3、Lu2O3、Y2O3-Al2O3复合物、Yb2O3-MgO2复合物、LaF3-MgO复合物、CeF3-MgO复合物和YF3-MgO复合物组成的组中的一种或多种。
进一步地,聚合树脂选自乙烯共聚物、聚丙烯、聚丁烯、聚氨酯弹性体、聚乙烯醇缩丁醛和有机硅橡胶组成的组中的一种或多种。
进一步地,按重量份计,形成封装胶膜的组合物还包括0~1份抗氧剂、0~1份光稳定剂、0~1份紫外光吸收剂、0~1份增粘剂和0~1份填料。
进一步地,按重量份计,形成封装胶膜的组合物包括100份聚合树脂,0.1~1份交联剂,0.1~1份助交联剂,0.1~0.3份助粘结剂,0~0.5份抗氧剂、0.02~0.3份光稳定剂、0~0.3份紫外光吸收剂、0.05~1份增粘剂和0~1份填料。
本申请的另一方面还提供了一种与电池片具有强粘结力的封装胶膜,与电池片具有强粘结力的封装胶膜为单层膜或多层共挤胶膜,且单层膜或多层共挤胶膜中的至少一层以本申请提供的形成胶膜的组合物为原料经熔融挤出工艺制得的。
本申请的又一方面还提供了一种光伏组件,包括封装胶膜,该封装胶膜包括本申请提供的与电池片具有强粘结力的封装胶膜。
本申请的再一方面还提供了一种夹胶玻璃,包括至少两个玻璃层和设置在相邻玻璃层之间的有机聚合物中间膜,有机聚合物中间膜包括至少一层权本申请提供的与电池片具有强粘结力的封装胶膜。
应用本发明的技术方案,交联剂能够使聚合树脂之间发生交联,形成网状结构。同时在封装温度下,分布在聚合树脂中的助粘结剂能够与电池片上Si3N4表面的二氧化硅发生化学反应,从而有利于提高其形成封装胶膜与电池片之间的粘结强度;同时助粘结剂的加入还有利于提高电池片中作为钝化层的氮化硅层的致密性,这有利于减少电池片的反射率,从而能够提高光伏组件的光电转换性能。将上述各组分的用量限定在上述范围内不仅有利于大大提高其形成的封装胶膜与电池片之间的粘结性能,还有利于提高光伏组件的光电转换性能。
具体实施方式
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。下面将结合实施例来详细说明本发明。
正如背景技术所描述的,现有的封装胶膜与电池片之间的粘接强度无法满足大尺寸光伏硅片对粘度方面的要求。为了解决上述技术问题,本申请提供了一种形成封装胶膜的组合物,按重量份计,该形成封装胶膜的组合物包括:100份聚合树脂,0.01~1份交联剂,0.01~1份助交联剂和0.01~1份助粘结剂,其中,助粘结剂在封装温度下能够与电池片表面的二氧化硅发生化学反应。
交联剂能够使聚合树脂之间发生交联,形成网状结构。同时在封装温度下,分布在聚合树脂中的助粘结剂能够与电池片上Si3N4表面的二氧化硅发生化学反应,从而有利于提高其形成封装胶膜与电池片之间的粘结强度;同时助粘结剂的加入还有利于提高电池片中作为钝化层的氮化硅层的致密性,这有利于减少电池片的反射率,从而能够提高光伏组件的光电转换性能。将上述各组分的用量限定在上述范围内不仅有利于大大提高其形成的封装胶膜与电池片之间的粘结性能,还有利于提高光伏组件的光电转换性能。
上述助粘结剂在封装温度下能够与电池上Si3N4表面的二氧化硅发生化学反应,从而有利于提高封装胶膜与电池片之间的粘结强度。只要能够实现上述目的的化合物均可以作为本申请中的助粘结剂。在一种优选的实施例中,上述助粘结剂包括但不限于稀土氧化物、稀土氧化物与金属氧化物形成的二元或三元复合物、稀土氟化物与金属氧化物形成的二元或三元复合物组成的组中的一种或多种。稀土氧化物和Si3N4表面的SiO2反应形成不同形态复杂的氮化氧化物结晶相,排布于Si3N4晶界;稀土氧化物-金属氧化物复合物可形成稀土-Si-金属-O-N相;稀土氟化物-金属氧化物复合物可形成稀土-Si-金属-F-N相。通过上述化学作用提高封装胶膜与电池片的粘结强度。同时,上述助粘接剂的加入还可以进一步提高氮化硅层的致密性。
在一种优选的实施例中,上述助粘结剂包括但不限于Y2O3、镧系稀土氧化物、稀土氧化物与Al2O3形成的二元或三元复合物、稀土氧化物与MgO形成的二元或三元复合物和稀土氟化物与MgO形成的二元或三元复合物组成的组中的一种或多种。MgO和Al2O3更易与氮化硅表面的SiO2反应形成Si-Mg(Al)-O系统的玻璃相,且玻璃相越多两个界面的结合越好,也更有利于氮化硅表面致密化。更优选地,助粘结剂包括但不限于Y2O3、Gd2O3、Eu2O3、Yb2O3、La2O3、Lu2O3、Y2O3-Al2O3复合物、Yb2O3-MgO2复合物、LaF3-MgO复合物、CeF3-MgO复合物和YF3-MgO复合物组成的组中的一种或多种。
上述封装胶膜中采用的基体树脂可以采用本领域常用的树脂种类,比如乙烯共聚物、聚丙烯、聚丁烯、聚氨酯弹性体、聚乙烯醇缩丁醛和有机硅橡胶组成的组中的一种或多种。
为了进一步提升封装胶膜的综合性能,优选地,按重量份计,形成封装胶膜的组合物还包括0~1份抗氧剂、0~1份光稳定剂、0~1份紫外光吸收剂、0~1份增粘剂和0~1份填料;更优选地,按重量份计,所述形成封装胶膜的组合物包括100份聚合树脂,0.1~1份交联剂,0.1~1份助交联剂,0.1~0.3份助粘结剂,0~0.5份抗氧剂、0.02~0.3份光稳定剂、0~0.3份紫外光吸收剂、0.05~1份增粘剂和0~1份填料。
上述抗氧化剂可以选用本领域常用的种类。优选地,抗氧化剂为受阻酚系化合物。更优选地,受阻酚系化合物包括但不限于2,6-二叔丁基-4-乙基苯酚、2,2’-亚甲基-双-(4-甲基-6-叔丁基苯酚)、2,2’-亚甲基-双-(4-乙基-6-叔丁基苯酚)、4,4’-亚丁基-双-(3-甲基-6-叔丁基苯酚)、十八烷基-3-(3,5-二-叔丁基-4-羟基苯基)丙酸酯、季戊四醇-四[3-(3,5-二-叔丁基-4-羟基苯基)丙酸酯]、7-十八烷基-3-(4’-羟基-3’,5’-二-叔丁基苯基)丙酸酯、四-[亚甲基-3-(3’,5’-二-叔丁基-4’-羟基苯基)丙酸酯]甲烷组成的组中的一种或多种。
上述光稳定剂可以选用本领域常用的种类。优选地,光稳定剂包括但不限于3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯、三(1,2,2,6,6-五甲基-4-哌啶基)亚磷酸酯、癸二酸双-2,2,6,6-四甲基哌啶醇酯、双-1-癸烷氧基-2,2,6,6-四甲基哌啶-4-醇癸二酸酯、丁二酸和4-羟基-2,2,6,6-四甲基-1-哌啶醇的聚合物、N,N’-双(2,2,6,6-四甲基-4-哌啶基)-1,6-己二胺和2,4-二氯-6-(1,1,3,3-四甲基丁基)氨基-1,3,5-三嗪的聚合物、N,N’-双(2,2,6,6-四甲基-4-哌啶基)-1,6-己二胺和吗啉-2,4,6-三氯-1,3,5-三嗪的聚合物组成的组中的一种或多种。
上述紫外光吸收剂可以选用本领域常用的种类。优选地,紫外光吸收剂包括但不限于二苯甲酮类和/或苯并三唑类物质,更优选地,紫外光吸收剂包括但不限于2-羟基-4-正辛氧基二苯甲酮、2,2-四亚甲基双(3,1-苯并噁嗪-4-酮)、2-(2’-羟基-5-甲基苯基)苯并三唑、2,2’-二羟基-4,4’-二甲氧基二苯甲酮组成的组中的一种或多种。
上述增粘剂可以选用本领域常用的种类。优选地,增粘剂包括但不限于γ-氨丙基三乙氧基硅烷、γ-甲基丙烯酰氧基丙基三甲氧基硅烷、γ-(2,3-环氧丙氧)丙基三甲氧基硅烷、乙烯基三甲氧基硅烷、N-(β-氨乙基)-γ-氨丙基三甲氧基硅烷、γ-缩水甘油醚氧丙基三甲基硅烷和3-氨丙基三甲基硅烷组成的组中的一种或多种。
上述填料可以选用本领域常用的种类。优选地,填料包括但不限于碳酸钙、硫酸钡、滑石粉、钛白粉、氧化锌、炭黑、石墨烯、氧化石墨烯、铜铬黑、氢氧化镁、氢氧化铝、氧化铝、氧化镁、氮化硼、碳化硅、磷酸铵、聚磷酸铵、季戊四醇、双季戊四醇、多季戊四醇酯和聚磷酸三聚氰胺硼酸盐组成的组中的一种或多种。
上述交联剂可以选用本领域常用的种类。优选地,交联剂包括但不限于叔丁基过氧化碳酸异丙酯、2,5-二甲基-2,5-(双叔丁过氧基)己烷、叔丁基过氧化碳酸-2-乙基己酯、1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷、1,1-双(叔戊基过氧)-3,3,5-三甲基环己烷、1,1-双(叔戊基过氧)环己烷、1,1-双(叔丁基过氧)环己烷、2,2-双(叔丁基过氧)丁烷、过氧化2-乙基己基碳酸叔戊酯、2,5-二甲基2,5-二甲基2,5-二甲基2,5-双(苯甲酰过氧)-己烷、过氧化碳酸叔戊酯和过氧化3,3,5三甲基己酸叔丁酯组成的组中的一种或多种。
上述助交联剂可以选用本领域常用的种类。优选地,助交联剂包括但不限于三烯丙基异氰尿酸酯、三聚氰酸三烯丙酯、三羟甲基丙烷三丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯、季戊四醇三丙烯酸酯、三(2-羟乙基)异氰脲酸三丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、乙氧化甘油三丙烯酸酯、丙氧化甘油三丙烯酸酯、季戊四醇四丙烯酸酯、乙氧化季戊四醇四丙烯酸酯、三羟甲基丙烷四丙烯酸酯、双三羟甲基丙烷四丙烯酸酯、双三羟甲基丙烷四甲基丙烯酸酯、丙氧化季戊四醇四丙烯酸酯、2,4,6-三(2-丙烯基氧基)-1,3,5-三嗪、三环葵烷二甲醇二丙烯酸酯、丙氧化新戊二醇二丙烯酸酯、乙氧化双酚A二丙烯酸酯、乙氧化双酚A二甲基丙烯酸酯、2-丁基-2-乙基-1,3-丙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯和聚乙二醇二甲基丙烯酸酯组成的组中的一种或多种。
本申请的另一方面还提供了一种与电池片具有强粘结力的封装胶膜,与电池片具有强粘结力的封装胶膜为单层膜或多层共挤胶膜,且单层膜或多层共挤胶膜中的至少一层以本申请提供的形成胶膜的组合物为原料经熔融挤出工艺制得的。
交联剂能够使聚合树脂之间发生交联,形成网状结构。同时在封装温度下,分布在聚合树脂中的助粘结剂能够与电池片上Si3N4表面的二氧化硅发生化学反应,从而有利于提高其形成封装胶膜与电池片之间的粘结强度;同时助粘结剂的加入还有利于提高电池片中作为钝化层的氮化硅层的致密性,这有利于减少电池片的反射率,从而能够提高光伏组件的光电转换性能。具有上述各组分的组合物形成的封装胶膜与电池片之间具有较强的粘结性能,且还有利于提高光伏组件的光电转换性能。
本申请的又一方面还提供了一种光伏组件,包括封装胶膜,该封装胶膜包括本申请提供的与电池片具有强粘结力的封装胶膜。
上述封装胶膜与电池片之间具有较强的粘结性能,同时还有利于提高光伏组件的光电转换性能。因而含有上述封装胶膜的光伏组件能够满足大尺寸光伏硅片的研发要求,同时还具有较好的光电转换性能。
以下结合具体实施例对本申请作进一步详细描述,这些实施例不能理解为限制本申请所要求保护的范围。
实施例1
按重量份计,形成胶膜的组合物包括:
100份聚合树脂(乙烯辛烯共聚物,厂家为美国陶氏),1份助粘结剂Gd2O3-CaO复合物(Gd2O3与CaO的重量比为4:1),0.5份交联剂叔丁基过氧化碳酸异丙酯,0.5份助交联剂三烯丙基异氰尿酸酯。
实施例2
按重量份计,形成胶膜的组合物包括:
100份聚合树脂(聚氨酯弹性体,厂家为3M中国),0.01份助粘结剂氧化铈,0.01份交联剂2,5-二甲基-2,5-(双叔丁过氧基)己烷,1份助交联剂三聚氰酸三烯丙酯。
实施例3
与实施例1的区别是:
助交联剂为La2O3-Al2O3复合物(La2O3与Al2O3的重量比为3:1)。
实施例4
与实施例1的区别是:
助交联剂为Y2O3-Al2O3复合物(Y2O3与Al2O3的重量比为5:2)。
实施例5
与实施例1的区别是:
助交联剂为LaF3-MgO复合物(LaF3与MgO的重量比为5:3)。
实施例6
与实施例4的区别是:
按重量份计,形成胶膜的组合物包括:100份聚合树脂,0.1份助粘结剂,0.5份交联剂,0.5份助交联剂。
实施例7
与实施例4的区别是:
按重量份计,形成胶膜的组合物包括:100份聚合树脂,0.3份助粘结剂,0.1份交联剂,0.1份助交联剂。
实施例8
与实施例1的区别是助粘结剂为Y2O3。
实施例9
与实施例1的区别是助粘结剂为LaF3。
实施例10
与实施例1的区别是助粘结剂为Sc2O3。
实施例11
与实施例1的区别:
按重量份计,形成胶膜的组合物包括:100份聚合树脂(乙烯辛烯共聚物,厂家为美国陶氏),1份助粘结剂Gd2O3-CaO复合物(Gd2O3与CaO的重量比为4:1),0.5份交联剂叔丁基过氧化碳酸异丙酯,0.5份助交联剂三烯丙基异氰尿酸酯,0.2份抗氧化剂(2,6-二叔丁基-4-乙基苯酚)、0.2份光稳定剂(3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯)、0.1份紫外光吸收剂(2-羟基-4-正辛氧基二苯甲酮)。
对比例1
与实施例1的区别为:不添加助粘结剂。
对比例2
与实施例1的区别为:助粘结剂替换为氢氧化镁。
将实施例1至11和对比例1至2的组合物进行熔融挤出并经流延成膜制得胶膜,并进行与电池片粘结力、透光率、交联度测试对比。
性能测试的方法如下:
(1)与电池片粘接强度
按照200mm×200mm的玻璃/胶膜/电池片/胶膜/柔性背板依次叠好放入真空层压机中,按照150℃,18分钟的层压工艺进行层压,制作层压件。
在宽度方向上每隔5mm将柔性背板/胶膜切割成10mm±0.5mm的试样用于测试胶膜与电池片之间的粘结力。按照GB/T 2790-1995的试验方法,以100mm/min±10mm/min的拉伸速度在拉力试验机上测试胶膜与电池片之间的剥离力,取三个试验的算术平均值,精确到0.1N/cm。
(2)透光率
依据GB/T 2410-2008进行测定,用紫外-可见分光光度计测定胶膜400~700nm的透光率。
(3)交联度
采用二甲苯加热萃取的方法测试。未经二甲苯溶解的质量与初始质量的比指即为交联度。取三个样品的算术平均值,以百分数表示。各项性能参数的测试结果如表1所示。
表1
与电池片粘接强度(N/cm) | 透光率(%) | 交联度(%) | |
实施例1 | 30.7 | 85.2 | 77.3 |
实施例2 | 25.6 | 88.9 | 50.3 |
实施例3 | 35.6 | 87.6 | 79.8 |
实施例4 | 40.8 | 88.3 | 78.6 |
实施例5 | 39.1 | 89.9 | 78.1 |
实施例6 | 45.7 | 91.3 | 83.3 |
实施例7 | 46.6 | 92.2 | 82.9 |
实施例8 | 36.6 | 89.8 | 77.1 |
实施例9 | 31.3 | 90.1 | 76.5 |
实施例10 | 29.5 | 88.5 | 75.9 |
实施例11 | 33.5 | 89.2 | 80.3 |
对比例1 | 17.8 | 86.0 | 78.1 |
对比例2 | 18.5 | 85.9 | 78.3 |
从以上的描述中,可以看出,本发明上述的实施例实现了如下技术效果:
比较实施例1至11及对比例1和2可知,采用本申请提供的组合物制得的封装胶膜在与电池片的粘接力、透光性以及交联性能等方面更加优异。
比较实施例1至5及8至10可知,选用本申请优选的助粘结剂有利于进一步提升与电池片的粘接性能。
比较实施例4、6、7可知,将助粘结剂、交联剂和助交联剂的种类限定在本申请优选的范围内有利于提高封装胶膜与电池片的粘结力、透光率以及交联度。
需要说明的是,本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的术语在适当情况下可以互换,以便这里描述的本申请的实施方式例如能够以除了在这里描述的那些以外的顺序实施。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (8)
1.一种形成封装胶膜的组合物,其特征在于,按重量份计,所述形成封装胶膜的组合物包括:100份聚合树脂,0.01~1份交联剂,0.01~1份助交联剂和0.01~1份助粘结剂,其中,所述助粘结剂在封装温度下能够与电池片表面的二氧化硅发生化学反应,所述助粘结剂选自Lu2O3、稀土氧化物与Al2O3形成的二元或三元复合物、Yb2O3-MgO复合物和稀土氟化物与MgO形成的复合物组成的组中的一种或多种。
2.根据权利要求1所述的形成封装胶膜的组合物,其特征在于,所述助粘结剂选自Lu2O3、Y2O3-Al2O3复合物、Yb2O3-MgO复合物、LaF3-MgO复合物、CeF3-MgO复合物和YF3-MgO复合物组成的组中的一种或多种。
3.根据权利要求1或2所述的形成封装胶膜的组合物,其特征在于,所述聚合树脂选自乙烯共聚物、聚丙烯、聚丁烯、聚氨酯弹性体、聚乙烯醇缩丁醛和有机硅橡胶组成的组中的一种或多种。
4.根据权利要求3所述的形成封装胶膜的组合物,其特征在于,按重量份计,所述形成封装胶膜的组合物还包括0~1份抗氧剂、0~1份光稳定剂、0~1份紫外光吸收剂、0~1份增粘剂和0~1份填料,所述光稳定剂选自3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯、三(1,2,2,6,6-五甲基-4-哌啶基)亚磷酸酯、癸二酸双-2,2,6,6-四甲基哌啶醇酯、双-1-癸烷氧基-2,2,6,6-四甲基哌啶-4-醇癸二酸酯、丁二酸和4-羟基-2,2,6,6-四甲基-1-哌啶醇的聚合物、N,N’-双(2,2,6,6-四甲基-4-哌啶基)-1,6-己二胺和2,4-二氯-6-(1,1,3,3-四甲基丁基)氨基-1,3,5-三嗪的聚合物、N,N’-双(2,2,6,6-四甲基-4-哌啶基)-1,6-己二胺和吗啉-2,4,6-三氯-1,3,5-三嗪的聚合物组成的组中的一种或多种。
5.根据权利要求4所述的形成封装胶膜的组合物,其特征在于,按重量份计,所述形成封装胶膜的组合物包括100份聚合树脂,0.1~1份所述交联剂,0.1~1份所述助交联剂,0.1~0.3份所述助粘结剂,0~0.5份所述抗氧剂、0.02~0.3份所述光稳定剂、0~0.3份所述紫外光吸收剂、0.05~1份所述增粘剂和0~1份所述填料。
6.一种与电池片具有强粘结力的封装胶膜,其特征在于,所述与电池片具有强粘结力的封装胶膜为单层膜或多层共挤胶膜,且所述单层膜或所述多层共挤胶膜中的至少一层以权利要求1至5中任一项所述的形成封装胶膜的组合物为原料经熔融挤出工艺制得的。
7.一种光伏组件,包括封装胶膜,其特征在于,所述封装胶膜包括权利要求6所述的与电池片具有强粘结力的封装胶膜。
8.一种夹胶玻璃,包括至少两个玻璃层和设置在相邻所述玻璃层之间的有机聚合物中间膜,其特征在于,所述有机聚合物中间膜包括至少一层权利要求7所述的与电池片具有强粘结力的封装胶膜。
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