CN112351669A - Chip intelligence processing is with automatic subsides dress equipment - Google Patents

Chip intelligence processing is with automatic subsides dress equipment Download PDF

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Publication number
CN112351669A
CN112351669A CN202011171851.4A CN202011171851A CN112351669A CN 112351669 A CN112351669 A CN 112351669A CN 202011171851 A CN202011171851 A CN 202011171851A CN 112351669 A CN112351669 A CN 112351669A
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CN
China
Prior art keywords
rod
chip
mounting
rotatably connected
bin
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Granted
Application number
CN202011171851.4A
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Chinese (zh)
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CN112351669B (en
Inventor
王鹤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN WINNER AUTOMATION EQUIPMENT Co.,Ltd.
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Ranyue Wenzhou Trading Co ltd
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Priority to CN202011171851.4A priority Critical patent/CN112351669B/en
Publication of CN112351669A publication Critical patent/CN112351669A/en
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Publication of CN112351669B publication Critical patent/CN112351669B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069Holders for printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0076Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manipulator (AREA)

Abstract

The invention relates to the technical field of chips and discloses automatic mounting equipment for intelligent chip processing, which comprises a working bin, wherein a pneumatic telescopic rod is rotatably connected with a special-shaped rotating rod, the special-shaped rotating rod is rotatably connected with a clamping rod, the clamping rod is connected with a clamping block, a mounting rod is rotatably connected with a rotating seat, a vacuum chuck is installed at the bottom end of a buffer rod, a sliding plate is slidably connected with a chip bin, a spring II is installed inside the mounting rod, an air bag is installed at the top end of the chip bin, and a horn is installed at the outer side end of the air bag. According to the automatic mounting equipment for intelligent chip processing, the special-shaped rotating rod is driven to rotate through the pneumatic telescopic rod, then the clamping rod is driven to rotate, and the clamping rod drives the clamping block to slide; the rotating seat is driven to rotate by the mounting rod, the chip is adsorbed and released by matching with the vacuum chuck, mounting is realized, and meanwhile, the accuracy of the mounting position is ensured by separating and powering off the metal blocks; after the chip is used up, the sliding plate is driven to extrude the air bag under the action of the elastic force of the spring, and the loudspeaker makes a sound, so that the effects of automatic fixing, intelligent mounting and supplementary prompting are achieved.

Description

Chip intelligence processing is with automatic subsides dress equipment
Technical Field
The invention relates to the technical field of chips, in particular to automatic mounting equipment for intelligent chip processing.
Background
A chip, a general term for semiconductor component products, is a silicon chip containing an integrated circuit therein, and is used as an important component of electronic devices such as computers due to its small volume and good functional effect.
Although there are many kinds of mounting apparatuses, there are some problems such as that fixing of a circuit board is cumbersome and automatic fixing cannot be achieved; for example, the mounting accuracy is low, errors are easy to generate, and the product quality is influenced; for example, partial abrasion easily occurs during mounting; in addition, after the chip is about to use up, fail in time to remind the staff to fill, influence production efficiency, these problems have highlighted that current chip pastes dress equipment intelligent degree is lower, and still need to be perfect.
Disclosure of the invention technical problem (1)
Aiming at the defects of the prior art, the invention provides automatic mounting equipment for intelligent chip processing, which has the advantages of automatic fixing, intelligent mounting, abrasion resistance, supplement prompting and the like, and solves the problems that the existing equipment cannot be automatically fixed, intelligently mounted, abraded and supplemented prompting.
(II) technical scheme
In order to realize the purposes of automatic fixing, intelligent mounting, abrasion resistance and supplement prompting, the invention provides the following technical scheme: an automatic mounting device for intelligent chip processing comprises a working bin, wherein a driving wheel is fixedly mounted on the right side of the working bin, a driven wheel is arranged on the left side of the working bin, a conveying belt is in transmission connection between the driven wheel and the driving wheel, a fixing mechanism is fixedly connected to the upper surface of the conveying belt, a fixed slide bar is fixedly connected to the inner wall of the top of the fixing mechanism, a slide ring is slidably connected to the outer side of the fixed slide bar, rotating rods are respectively and rotatably connected to the left side and the right side of the slide ring, a special-shaped rotating rod is rotatably connected to the bottom end of each rotating rod, a pneumatic telescopic rod is rotatably connected to the inner side end of the bottom of each special-shaped rotating rod, a clamping rod is rotatably connected to the top end of each rotating rod, a clamping block is rotatably connected to the inner side end of each clamping rod, the front end of motor is rotated and is connected with the top of subsides dress pole and is rotated and be connected with and rotate the seat, the bottom fixedly connected with backup pad of rotating the seat, the right-hand member of backup pad and the right side inner wall of subsides dress device fixed mounting respectively have the metal block, and the bottom fixedly connected with buffer cylinder of backup pad, the inside sliding connection of buffer cylinder has the buffer beam, fixedly connected with spring one between the top of buffer beam and the top inner wall of buffer cylinder, and the bottom fixed mounting of buffer beam has vacuum chuck, the last fixed surface of fixing base is connected with the chip storehouse, the inside sliding connection in chip storehouse has the sliding plate, fixedly connected with spring two between the lower surface of sliding plate and the bottom inner wall in chip storehouse, and the top left and right sides inner wall fixed mounting in chip storehouse has the gasbag, the.
Preferably, the driven wheel is rotatably connected to the left side of the working bin through a fixing support, and through holes corresponding to the conveying belt and the fixing mechanism are formed in the left side and the right side of the working bin.
Preferably, the bottom of fixed slide bar is connected with the stopper, prevents that the sliding ring from sliding away from fixed slide bar, and the middle part of dysmorphism bull stick is rotated through the fixed bolster and is connected in fixed establishment's the left and right sides inner wall.
Preferably, the upper wall of the fixing mechanism is provided with a through hole and a sliding groove which respectively correspond to the special-shaped rotating rod and the clamping block, the sliding groove limits the clamping block to only slide left and right, the clamping block cannot slip, the clamping block is designed to be made of elastic materials, and abrasion to the circuit board is avoided.
Preferably, the air pump is connected with the pneumatic telescopic rod and the vacuum chuck through air ducts respectively, so that the stretching and the contraction of the pneumatic telescopic rod and the suction and release functions of the vacuum chuck are facilitated.
Preferably, an auxiliary rod parallel to the mounting rod is rotatably connected between the fixed seat and the rotating seat, so that the rotating seat is always opposite to the lower side, namely, the rotating seat is opposite to the circuit board to realize a mounting process, and a through hole corresponding to a related structure of the fixed seat is formed in the left wall of the mounting device.
Preferably, the inner walls of the left side and the right side of the chip bin are provided with sliding grooves corresponding to the sliding plates, the air bags are arranged at the top ends of the sliding grooves, the upper surfaces of the sliding plates are movably connected with the chips, and after the chips are used up, the sliding plates can extrude the air bags, so that the loudspeakers can make sounds to remind workers of filling.
(III) advantageous effects
Compared with the prior art, the invention provides automatic mounting equipment for intelligent chip processing, which has the following beneficial effects:
1. this chip intelligent processing is with automatic subsides dress equipment inflates pneumatic telescopic handle through the air pump, and pneumatic telescopic handle extends, because sliding ring sliding connection is in fixed slide bar, and the sliding ring rotates and connects the bull stick, and the bull stick rotates and connects special-shaped bull stick, so drives special-shaped bull stick and rotates, and special-shaped bull stick drives the tight pole rotation of clamp, and the tight piece of clamp drives to press from both sides tight slip and press from both sides the circuit board tightly to automatic fixed effect has been reached.
2. The automatic mounting equipment for intelligent chip processing is transported to a mounting position through a circuit board, a motor drives a mounting rod to rotate, the mounting rod is matched with an auxiliary rod to drive a rotating seat to rotate, namely a supporting plate is driven to move, and a vacuum chuck is matched with an air pump to adsorb and release a chip, so that mounting is realized; the metal block separation outage when the backup pad moves, the conveyer belt stops the transmission, and circuit board motion when avoiding pasting the dress causes the subsides dress offset to the effect of intelligence dress has been reached.
3. According to the automatic mounting equipment for intelligent chip processing, the first spring, the buffer rod and the buffer cylinder are matched, the mounting process has a buffer effect, the chips are prevented from being abraded to a certain extent, and therefore the anti-abrasion effect is achieved; through the cooperation of the second spring, the sliding plate drives the chip to be always positioned at the top end of the chip bin, and after the chip is used up, the sliding plate extrudes the air bag to drive the loudspeaker to make a sound prompt, so that the effect of supplementing the prompt is achieved.
Drawings
FIG. 1 is a front sectional view of the present invention;
FIG. 2 is an enlarged partial view of the portion A shown in FIG. 1;
FIG. 3 is an enlarged partial view of the portion B shown in FIG. 2 according to the present invention;
FIG. 4 is a cross-sectional view of the securing mechanism of the present invention;
FIG. 5 is a diagram of the FIG. 4 operating condition of the present invention;
FIG. 6 is a diagram illustrating the operation of the vacuum chuck according to the present invention;
fig. 7 is a working state diagram of the sliding plate related structure of the invention.
In the figure: 1. a working bin; 2. a drive wheel; 3. a driven wheel; 4. a conveyor belt; 5. a fixing mechanism; 501. fixing the sliding rod; 502. a slip ring; 503. a rotating rod; 504. a special-shaped rotating rod; 505. a pneumatic telescopic rod; 506. a clamping lever; 507. a clamping block; 6. an air pump; 7. a mounting device; 8. a fixed seat; 9. a motor; 10. mounting a rod; 11. a rotating seat; 12. a support plate; 13. a metal block; 14. a buffer cylinder; 15. a buffer rod; 16. a first spring; 17. a vacuum chuck; 18. a chip bin; 19. a sliding plate; 20. a second spring; 21. an air bag; 22. a horn.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, an automatic mounting device for intelligent chip processing comprises a working bin 1, wherein a driving wheel 2 is fixedly mounted on the right side of the working bin 1, a driven wheel 3 is arranged on the left side of the working bin, a conveying belt 4 is connected between the driven wheel 3 and the driving wheel 2 in a transmission manner, a fixing mechanism 5 is fixedly connected to the upper surface of the conveying belt 4, the driven wheel 3 is rotatably connected to the left side of the working bin 1 through a fixing support, and through holes corresponding to the conveying belt 4 and the fixing mechanism 5 are formed in the left side and the right side of the working bin 1; fixed slide bar 501 of fixed establishment 5's top inner wall fixedly connected with, fixed slide bar 501's outside sliding connection has sliding ring 502, sliding ring 502's the left and right sides rotates respectively and is connected with bull stick 503, bull stick 503's bottom is rotated and is connected with special-shaped bull stick 504, fixed slide bar 501's bottom is connected with the stopper, prevent that sliding ring 502 from sliding from fixed slide bar 501, the middle part of special-shaped bull stick 504 is passed through the fixed bolster and is rotated and connect in fixed establishment 5's the left and right sides inner wall.
The inner side end of the bottom of the special-shaped rotating rod 504 is rotatably connected with a pneumatic telescopic rod 505, the top end of the special-shaped rotating rod is rotatably connected with a clamping rod 506, the inner side end of the clamping rod 506 is rotatably connected with a clamping block 507, the upper wall of the fixing mechanism 5 is provided with a through hole and a sliding groove which respectively correspond to the special-shaped rotating rod 504 and the clamping block 507, the sliding groove limits the clamping block 507 to only slide left and right and cannot slide, and the clamping block 507 is designed to be made of elastic material, so that the circuit board is prevented from being; air pump 6 is fixedly installed on the right side surface of working bin 1, and its top inner wall fixed mounting has subsides dress device 7, is connected through the air duct between air pump 6 and pneumatic telescopic rod 505, the vacuum chuck 17 respectively, is convenient for realize the extension and the shrink of pneumatic telescopic rod 505, vacuum chuck 17's absorption and release function.
The inner wall of the bottom of the mounting device 7 is fixedly connected with a fixed seat 8, the inside of the fixed seat 8 is fixedly provided with a motor 9, the front end of the motor 9 is rotatably connected with the top end of a mounting rod 10 and is rotatably connected with a rotating seat 11, the bottom of the rotating seat 11 is fixedly connected with a supporting plate 12, the right end of the supporting plate 12 and the inner wall of the right side of the mounting device 7 are respectively and fixedly provided with a metal block 13, the bottom of the supporting plate 12 is fixedly connected with a buffer cylinder 14, the inside of the buffer cylinder 14 is slidably connected with a buffer rod 15, a first spring 16 is fixedly connected between the top end of the buffer rod 15 and the inner wall of the top of the buffer cylinder 14, the bottom end of the buffer rod 15 is fixedly provided with a vacuum chuck 17, the upper surface of the fixed seat 8 is fixedly connected with a chip bin 18, an auxiliary rod, namely, the mounting process is realized by facing the circuit board, and the left wall of the mounting device 7 is provided with a through hole corresponding to the structure related to the fixed seat 8.
The inside sliding connection of chip storehouse 18 has sliding plate 19, fixedly connected with spring two 20 between the lower surface of sliding plate 19 and the bottom inner wall of chip storehouse 18, and the top left and right sides inner wall fixed mounting of chip storehouse 18 has gasbag 21, the outside end fixed mounting of gasbag 21 has loudspeaker 22, the spout that corresponds with sliding plate 19 has been seted up to the left and right sides inner wall of chip storehouse 18, and gasbag 21 installs the top in the spout, the upper surface swing joint of sliding plate 19 has the chip, the chip uses up the back, gasbag 21 can be crowded to sliding plate 19, make loudspeaker 22 send sound and remind the staff to fill.
The working principle is as follows: this chip intelligent processing is with automatic subsides dress equipment, put the circuit board on fixed establishment 5 through the right side in working bin 1, start air pump 6 and aerify pneumatic telescopic rod 505, pneumatic telescopic rod 505 extends to the outside, because sliding ring 502 sliding connection is in fixed slide bar 501, and the left and right sides of sliding ring 502 rotates and connects bull stick 503, special-shaped bull stick 504 is connected in the bottom rotation of bull stick 503, so pneumatic telescopic rod 505 extends and drives special-shaped bull stick 504 and rotate, special-shaped bull stick 504 rotates and drives clamping bar 506 and rotate, clamping bar 506 rotates and drives clamping block 507 and slide to the inboard and press from both sides the circuit board tightly, because clamping block 507 is elastic material, the event can not make the circuit board produce the damage, thereby automatic fixed effect has been reached.
The driving wheel 2 is matched with the driven wheel 3 to drive the conveying belt 4 to transmit to the left side, when the conveying belt 4 is matched with the fixing mechanism 5 to convey the circuit board to a mounting position, the motor 9 is started to rotate, the motor 9 rotates to drive the mounting rod 10 to rotate, the mounting rod 10 is matched with the auxiliary rod to drive the lower surface of the rotating seat 11 to rotate right below, namely, the supporting plate 12 is driven to move to the mounting position, the air pump 6 is matched to suck air into the vacuum sucker 17 to enable the chip to be adsorbed, the chip is mounted on the circuit board at the mounting position, and then the air pump 6 inflates the vacuum sucker 17 to release the chip; simultaneously, the backup pad 12 drives the metal block 13 of its right-hand member installation during the motion and pastes the metal block 13 separation of dress device 7 right side inner wall installation, then drive wheel 2 outage stops to drive the transmission of conveyer belt 4, avoids the circuit board still to be in by the drive condition when pasting the dress, causes and pastes dress offset, two metal block 13 contact circular telegrams once more after reseing, and relevant structure continues the transportation left to the circuit board after the chip pastes dress completion to the effect that intelligent subsides dress has been reached.
By matching with the use of the first spring 16, in the chip mounting process, the buffer rod 15 slowly slides towards the interior of the buffer cylinder 14, so that a certain buffer effect is achieved, the situation that the mounting process is relatively stiff and the chip is abraded to a certain extent is avoided, and the anti-abrasion effect is achieved; after the chip on the top end of the chip bin 18 is used, the elastic force of the second spring 20 is matched with the sliding plate 19 to drive the sliding plate 19 to slide upwards for a certain distance, so that the uppermost chip in the chip bin 18 is always positioned on the top end of the chip bin 18, when the sliding plate 19 drives the last chip to slide to the top end of the chip bin 18, the sliding plate 19 extrudes the air bag 20, air in the air bag 20 is filled into the horn 22, and the horn 22 gives out sound to prompt a worker to fill the chip, so that the effect of supplement prompt is achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a chip intelligence processing is with automatic subsides dress equipment, includes working bin (1), its characterized in that: the right side of the working bin (1) is fixedly provided with a driving wheel (2), the left side of the working bin is provided with a driven wheel (3), a conveying belt (4) is connected between the driven wheel (3) and the driving wheel (2) in a transmission manner, the upper surface of the conveying belt (4) is fixedly connected with a fixing mechanism (5), the inner wall of the top of the fixing mechanism (5) is fixedly connected with a fixing slide rod (501), the outer side of the fixing slide rod (501) is connected with a slide ring (502) in a sliding manner, the left side and the right side of the slide ring (502) are respectively and rotatably connected with rotating rods (503), the bottom end of each rotating rod (503) is rotatably connected with a special-shaped rotating rod (504), the inner side end of the bottom of the special-shaped rotating rod (504) is rotatably connected with a pneumatic telescopic rod (505), the top end of the special-shaped rotating, and the inner wall of the top of the device is fixedly provided with a mounting device (7), the inner wall of the bottom of the mounting device (7) is fixedly connected with a fixed seat (8), the inside of the fixed seat (8) is fixedly provided with a motor (9), the front end of the motor (9) is rotatably connected with a mounting rod (10), the top end of the mounting rod (10) is rotatably connected with a rotating seat (11), the bottom of the rotating seat (11) is fixedly connected with a supporting plate (12), the right end of the supporting plate (12) and the inner wall of the right side of the mounting device (7) are respectively and fixedly provided with a metal block (13), the bottom of the supporting plate (12) is fixedly connected with a buffer cylinder (14), the inside of the buffer cylinder (14) is slidably connected with a buffer rod (15), a spring I (16) is fixedly connected between the top end of the buffer rod (15) and the inner wall of, the upper surface of the fixed seat (8) is fixedly connected with a chip bin (18), the inner part of the chip bin (18) is slidably connected with a sliding plate (19), a spring II (20) is fixedly connected between the lower surface of the sliding plate (19) and the inner wall of the bottom of the chip bin (18), air bags (21) are fixedly installed on the inner walls of the left side and the right side of the top of the chip bin (18), and a horn (22) is fixedly installed at the outer side end of each air bag (21).
2. The automatic surface mounting equipment for chip intelligent processing according to claim 1, wherein: the driven wheel (3) is rotatably connected to the left side of the working bin (1) through a fixing support, and through holes corresponding to the conveyor belt (4) and the fixing mechanism (5) are formed in the left side and the right side of the working bin (1).
3. The automatic surface mounting equipment for chip intelligent processing according to claim 1, wherein: the bottom end of the fixed sliding rod (501) is connected with a limiting block, and the middle part of the special-shaped rotating rod (504) is rotatably connected to the inner walls of the left side and the right side of the fixing mechanism (5) through a fixing support.
4. The automatic surface mounting equipment for chip intelligent processing according to claim 1, wherein: the upper wall of the fixing mechanism (5) is provided with a through hole and a sliding groove which respectively correspond to the special-shaped rotating rod (504) and the clamping block (507), and the clamping block (507) is designed to be made of elastic material.
5. The automatic surface mounting equipment for chip intelligent processing according to claim 1, wherein: the air pump (6) is connected with the pneumatic telescopic rod (505) and the vacuum sucker (17) through air ducts respectively.
6. The automatic surface mounting equipment for chip intelligent processing according to claim 1, wherein: an auxiliary rod parallel to the mounting rod (10) is rotatably connected between the fixed seat (8) and the rotating seat (11), and a through hole corresponding to a structure related to the fixed seat (8) is formed in the left wall of the mounting device (7).
7. The automatic surface mounting equipment for chip intelligent processing according to claim 1, wherein: the inner walls of the left side and the right side of the chip bin (18) are provided with sliding grooves corresponding to the sliding plates (19), the air bags (21) are installed at the top ends of the sliding grooves, and the upper surfaces of the sliding plates (19) are movably connected with chips.
CN202011171851.4A 2020-10-28 2020-10-28 Chip intelligence processing is with automatic subsides dress equipment Active CN112351669B (en)

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Application Number Priority Date Filing Date Title
CN202011171851.4A CN112351669B (en) 2020-10-28 2020-10-28 Chip intelligence processing is with automatic subsides dress equipment

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Application Number Priority Date Filing Date Title
CN202011171851.4A CN112351669B (en) 2020-10-28 2020-10-28 Chip intelligence processing is with automatic subsides dress equipment

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CN112351669A true CN112351669A (en) 2021-02-09
CN112351669B CN112351669B (en) 2021-09-21

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113438889A (en) * 2021-07-19 2021-09-24 深圳市森孚科技有限公司 Multistation electronic chip absorbs processing production facility
CN113543626A (en) * 2021-07-19 2021-10-22 深圳尚海轩科技有限公司 Surface mounting equipment for semiconductor chip processing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191097A (en) * 1991-10-11 1993-07-30 Sanyo Electric Co Ltd Pressure control device of component mounting device
KR100839254B1 (en) * 2006-12-29 2008-06-17 거산산업주식회사 Linup device of pcb for laser direct imaging
CN102845144A (en) * 2010-04-22 2012-12-26 Hephaist精工株式会社 Microcomponent alignment unit
CN205726703U (en) * 2016-04-01 2016-11-23 深圳市凌志锐科技有限公司 The on-line maintenance machine of automatic optics inspection and remote console thereof
CN110267463A (en) * 2019-07-18 2019-09-20 安徽天通精电新科技有限公司 Automatic chip mounter for mounting and processing electronic components and operation method thereof
CN111052890A (en) * 2017-09-15 2020-04-21 株式会社富士 Component supply system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191097A (en) * 1991-10-11 1993-07-30 Sanyo Electric Co Ltd Pressure control device of component mounting device
KR100839254B1 (en) * 2006-12-29 2008-06-17 거산산업주식회사 Linup device of pcb for laser direct imaging
CN102845144A (en) * 2010-04-22 2012-12-26 Hephaist精工株式会社 Microcomponent alignment unit
CN205726703U (en) * 2016-04-01 2016-11-23 深圳市凌志锐科技有限公司 The on-line maintenance machine of automatic optics inspection and remote console thereof
CN111052890A (en) * 2017-09-15 2020-04-21 株式会社富士 Component supply system
CN110267463A (en) * 2019-07-18 2019-09-20 安徽天通精电新科技有限公司 Automatic chip mounter for mounting and processing electronic components and operation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113438889A (en) * 2021-07-19 2021-09-24 深圳市森孚科技有限公司 Multistation electronic chip absorbs processing production facility
CN113543626A (en) * 2021-07-19 2021-10-22 深圳尚海轩科技有限公司 Surface mounting equipment for semiconductor chip processing

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