CN112349684B - LCP packaging substrate, manufacturing method and multi-chip system-in-package structure - Google Patents

LCP packaging substrate, manufacturing method and multi-chip system-in-package structure Download PDF

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CN112349684B
CN112349684B CN202011038726.6A CN202011038726A CN112349684B CN 112349684 B CN112349684 B CN 112349684B CN 202011038726 A CN202011038726 A CN 202011038726A CN 112349684 B CN112349684 B CN 112349684B
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layer
lcp
substrate
metal circuit
circuit layer
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CN112349684A (en
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舒攀林
戴广乾
张童童
徐诺心
易明生
赵鸣霄
罗洋
谢国平
龚小林
卢军
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CETC 29 Research Institute
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

The invention discloses an LCP packaging substrate, a manufacturing method and a multi-chip system-in-package structure, wherein the LCP packaging substrate comprises: the n patterned metal circuit layers are distributed from the surface to the bottom surface and sequentially comprise a first patterned metal circuit layer, a second patterned metal circuit layer, … and an nth patterned metal circuit layer; the insulating medium layer is positioned between the adjacent graphical metal circuit layers; the insulating medium layer is positioned between the first patterned metal circuit layer and the second patterned metal circuit layer, and the openings of the insulating medium layer face to the plurality of blind grooves of the first patterned metal circuit layer; and the plurality of blind holes penetrate through and are connected with the adjacent patterned metal circuit layers. The LCP packaging substrate with the near-airtight packaging structure can meet the system-level packaging requirements of multiple chips, high airtight requirements, high electromagnetic shielding and high reliable interconnection.

Description

LCP packaging substrate, manufacturing method and multi-chip system-in-package structure
Technical Field
The invention relates to the technical field of integrated circuits and chip packaging, in particular to an LCP packaging substrate, a manufacturing method and a multi-chip system-in-package structure, which are used for high-reliability system-in-package for high-frequency applications such as radio frequency, microwave, millimeter wave and the like.
Background
As semiconductor and integrated circuit technologies advance, system integration requirements further increase, and current electronic circuit designs and manufacturing are developed towards smaller size and higher integration density, and considerable work is being done in the field of multi-chip packaging. In an advanced package form, a plurality of Radio Frequency (RF) chips, digital Integrated Circuit (IC) chips, micro chip devices, etc. are assembled on a package substrate by the SIP technology and then integrated into one package. The multi-chip packaging form shortens the pin distance between the chips, greatly improves the packaging density and can meet the requirements of system-level packaging to a certain extent.
Depending on the material of the package substrate, the package method can be generally divided into two types: one is a multilayer ceramic package using a cavity structure, and the other is a plastic package using a multilayer PCB substrate as a chip substrate material.
The ceramic packaging substrate has the advantages of high integration density, high reliability, high air tightness, high heat conductivity, excellent corrosion resistance and the like. However, due to the thermal mismatch between the ceramic material and the PCB material, large-scale packaging is not possible, and the ceramic package has a problem of high manufacturing cost.
The plastic packaging substrate has the characteristics of low cost, relatively simple process and higher interconnection density, and can realize secondary high-density interconnection with a PCB motherboard in the forms of BGA (ball grid array) and the like. The biggest defects of the PCB are that the common PCB material has high moisture absorption rate and poor water vapor blocking performance, and cannot realize airtight packaging; meanwhile, the dielectric characteristics (dielectric constant and dielectric loss) of common resin materials are limited, and the common resin materials cannot be applied to radio frequency/microwave transmission. These deficiencies limit the use of plastic packages for highly reliable, high performance chip packaging, the main area of application of which is consumer electronics today.
The Liquid Crystal Polymer (LCP) material has the outstanding advantages of excellent dielectric transmission property, extremely low moisture absorption rate, water permeability and oxygen transmission rate, plane thermal expansion coefficient matched with copper, high heat resistance, chemical corrosion resistance and the like, conforms to the strict requirements of a radio frequency/microwave chip on a packaging substrate material, and is a new generation substrate material with high reliability, huge potential in the high-performance chip packaging application field and wide application prospect.
Chinese patent CN106486427A, CN206259334U discloses a packaging housing based on LCP substrate and a method for manufacturing the same, which uses LCP substrate as a substrate layer for chip mounting, and provides a solution for chip airtight packaging by assisting with technologies such as chip assembly, metal enclosure frame, cover plate welding, and the like. In this package form, a specific structure and a manufacturing method are not given as a package substrate; the packaging form of the packaging structure lacks an external interconnection interface, and the secondary cascade of a packaging body cannot be realized; LCP base plate does not possess the circuit subregion characteristic, can not provide the good electromagnetic shield basis for multicore piece complex system, and the circuit crosstalk problem is difficult to avoid.
Chinese patent CN102593077A discloses a liquid crystal polymer packaging structure, which combines a high-melting-point LCP composite cover plate and a low-melting-point LCP tube shell through hot melting to form a structure for hermetically packaging a chip. The packaging structure is too simple, and the specific structural characteristics and the implementation method of the substrate are not involved.
Chinese patent CN104282632B discloses a packaging shell based on LCP substrate and a method for making the same, which uses LCP multi-layer substrate as a carrier for hermetic packaging of chips. The LCP packaging substrate structure is divided according to a surface sealing layer, a chip mounting layer, a welding layer, an interconnection layer and the like, all the structural characteristics of the components are limited, and an implementation method is provided. In the substrate structure, the holes of the circuit interconnection layer are positioned at the periphery of the chip sealing area, and the periphery of the chip is non-airtight due to the existence of the through holes, so that the effective airtight packaging area of the substrate is reduced, and the circuit interconnection design of each layer is limited; the surface layer is defined as a sealing area, is separately designed with the inner bonding layer and is not electrically connected with each other or only connected with the ground, and the structure is only suitable for simple packaging of a single chip and is not suitable for complex system-level application occasions with multi-chip packaging and multi-electromagnetic shielding requirements. The disclosed realization method adopts a mode of multiple lamination and hot pressing. The LCP adhesive film material is thermoplastic in nature and theoretically cannot be laminated multiple times, so the process of making the structure is difficult and impractical.
Chinese patent CN107324273B discloses a packaging method of an MEMS device based on LCP multilayer stacking technology, a cap used for the MEMS device is prepared in a multilayer LCP stacking and laminating mode, and LCP materials are directly applied to single-chip plastic packaging. In the invention, the LCP material only plays a role of a packaging cap, and the application field does not relate to a packaging substrate and can not carry out wiring design.
Chinese patent CN102683220B discloses a method for manufacturing a multilayer organic liquid crystal polymer substrate structure, which can simultaneously embed active and passive devices into the multilayer liquid crystal polymer substrate to realize the hermetic package of chips. The active device with the salient points is connected to an LCP substrate by using a flip chip bonding technology, then an LCP bonding film is windowed and laminated, and finally, the LCP bonding film is interconnected through metallized through holes to finally form a packaging structure body. The packaging structure adopts the manufacturing route of the chip embedded substrate, mainly faces to single chip packaging, and is not applicable to multi-chip packaging with high electromagnetic shielding requirements; the interconnection holes of the substrate are manufactured through one-time drilling metallization, the interconnection function of the substrate is simple, and the complex interconnection requirement required by multi-chip packaging cannot be met.
Chinese patent CN106252339B discloses a high-density rf multi-chip package structure, which uses a multi-layer substrate and a housing as a carrier, and stacks a plurality of chips and devices in a vertical direction for three-dimensional high-density hybrid integration. The multi-chip package is essentially hybrid integration in the form of a multi-chip package body, has limited electromagnetic shielding performance, relates to selection of multiple temperature gradients and solders, and is difficult to realize the process.
Chinese patent CN103165479B discloses a method for manufacturing a multi-chip system-in-package structure, which integrates multiple chips on an interposer by vertically stacking multiple chips to form a system-in-package structure. The structure is suitable for high-density integration of IC chips, but is not suitable for electromagnetic shielding requirements of multiple radio frequency chips.
Chinese patent CN103930989B discloses a radio frequency package on package circuit, which forms a two-stage package of a radio frequency package on package (PoP) circuit by vertically stacking two radio frequency packages. The structure packaging body does not relate to the electromagnetic shielding problem of a chip in a single packaging body in detail, the function of the substrate is simple, and the structure aspect of the substrate is not specifically described.
U.S. patent US2019/0080817Al discloses a manufacturing method of an LCP resin multilayer substrate, and a special LCP paste is used as an LCP multilayer substrate bonding layer and a thickness adjusting layer, so that the flatness can be improved, and manufacturing problems such as warping caused by glue shortage can be avoided. The interconnection hole of the substrate structure is manufactured by filling conductive paste, and due to the adhesive component of the conductive paste, the substrate can volatilize at high temperature to cause the risk of layer rise, bubbling and even board explosion, and the substrate manufactured by the mode cannot bear high-temperature application occasions. And the adhesion force between the LCP paste and the LCP layer and between the LCP paste and the conductive paste is much poorer than that of the conventional LCP adhesive film laminating method theoretically. The multilayer LCP substrate manufactured by the method is not suitable for radio frequency chip packaging application occasions with high interconnection hole reliability.
In the prior art, no technical solution for realizing a package substrate and a system-in-package structure which meet the system-in-package requirements of multi-chip, high-airtightness, high-electromagnetic shielding and high-reliability interconnection by utilizing LCP is available.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in view of the above problems, an LCP package substrate, a manufacturing method thereof, and a multi-chip system-in-package structure based on the LCP package substrate are provided to meet the system-in-package requirements of multi-chip, high hermetic sealing, high electromagnetic shielding, and high reliable interconnection.
The invention provides an LCP packaging substrate, which comprises:
the n layers of graphical metal circuit layers are distributed from the surface to the bottom surface and sequentially comprise a first layer of graphical metal circuit layer, a second layer of graphical metal circuit layer, … and an nth layer of graphical metal circuit layer; the nth layer of patterned metal circuit layer is provided with a structure for welding BGA solder balls;
the insulating medium layer is positioned between the adjacent graphical metal circuit layers; the n-1 insulating medium layer between the first patterned metal circuit layer and the second patterned metal circuit layer consists of an LCP substrate and an LCP bonding film, and the melting point of the LCP bonding film is lower than that of the LCP substrate; the insulating medium layer between the second patterned metal circuit layer and the nth patterned metal circuit layer is a non-LCP material substrate, and the thermal cracking temperature of the non-LCP material substrate is higher than the melting point of the LCP bonding film;
the insulating medium layer is positioned between the first patterned metal circuit layer and the second patterned metal circuit layer, and the openings of the insulating medium layer face to the plurality of blind grooves of the first patterned metal circuit layer;
and the plurality of blind holes penetrate and are connected with the adjacent patterned metal circuit layers.
Furthermore, the first patterned metal circuit layer comprises a circle of surrounding metal layer at the outer edge and a plurality of groups of chip I/O welding and signal transmission line layers at the inner side of the surrounding metal layer, each group of chip I/O welding and signal transmission line layers is in a rectangular or special-shaped island shape, and each group of chip I/O welding and signal transmission line layers is connected with the surrounding metal layer through an electric insulation area; the electrical property of the surrounding metal layer is a grounding layer, and the process property is an airtight welding layer; the upper surface of the first graphical metal circuit layer is sequentially provided with a coating layer and an upper surface solder mask layer; the coating layer covers the surrounding metal layer and each group of chip I/O welding and signal transmission line layers; the upper surface solder mask layer comprises a first surrounding solder mask layer and a plurality of second surrounding solder mask layers, wherein each second surrounding solder mask layer correspondingly surrounds each electric insulation area, and the first surrounding solder mask layer surrounds all the second surrounding solder mask layers;
each group of chip I/O welding and signal transmission line layers comprise chip I/O bonding pads, signal transmission lines and one or more blind slots; the transmission of signals in the circuit layer for I/O welding and signal transmission of each group of chips is completed through chip I/O bonding pads and signal transmission lines in the circuit layer for I/O welding and signal transmission of the group of chips or through corresponding parts in each layer of blind holes and the lower patterned metal circuit layer; the I/O welding of two or more groups of chips and the signal transmission between the signal transmission layers are completed by the blind holes of each layer and the corresponding parts in the lower patterned metal circuit layer.
Furthermore, the insulating medium layer positioned between the second layer of graphical metal circuit layer and the third layer of graphical metal circuit layer is composed of LCP substrates; the insulating medium layers are positioned between the first graphical metal circuit layer and the second graphical metal circuit layer and between the third graphical metal circuit layer and the fourth graphical metal circuit layer and are composed of LCP substrates and LCP adhesive films; the melting point of the LCP adhesive film is 10-60 ℃ lower than that of the LCP substrate.
Furthermore, the bottom of the blind slot is a large-area metal grounding layer in the second layer of graphical metal circuit layer and is provided with a coating layer; the blind groove is a chip I/O bonding pad or a pattern around the opening of the first patterned metal circuit layer; the number and the size of the blind slots are determined according to the number and the size of the mounted chips.
Furthermore, all the blind holes can be aligned or stacked in a staggered manner in the vertical direction, so that the interconnection requirement of any layer in the n layers of graphical metal circuit layers can be met; the diameter of each blind hole is the same, the depth-diameter ratio of the blind holes is less than or equal to 1, and the blind holes are filled with solid electrolytic copper.
Further, the lower surface of the nth patterned metal circuit layer is provided with a coating layer; a welding pad or a pattern for external secondary cascade I/O welding of the LCP packaging substrate and a lower surface solder mask are arranged on the coating layer on the lower surface of the n-th patterned metal circuit layer; the windowing of the lower surface solder mask is circular and distributed in a grid array manner, and is used for welding BGA solder balls.
The invention also provides a manufacturing method of the LCP packaging substrate, which is used for manufacturing the LCP packaging substrate and comprises the following steps:
s1, manufacturing a non-LCP material arbitrary layer interconnection multilayer substrate by adopting an HDI lamination process; the multilayer substrate comprises a second layer of graphical metal circuit layer to an n-1 layer of graphical metal circuit layer, a bottom layer large-area metal copper layer for manufacturing the n layer of graphical metal circuit layer, an insulating medium layer positioned between adjacent graphical metal circuit layers and a plurality of blind holes; the insulating medium layer in the multilayer substrate is a non-LCP material substrate, and the thermal cracking temperature of the non-LCP material substrate is higher than the melting point of an LCP adhesive film;
s2, taking a single-sided copper-clad LCP substrate and an LCP adhesive film, and then aligning, laminating and laminating the single-sided copper-clad LCP substrate, the LCP adhesive film and the non-LCP material to form an LCP mixed multilayer substrate from top to bottom according to the sequence of interconnecting the multilayer substrates by any layer; wherein the copper-clad surface of the single-sided copper-clad LCP substrate faces upwards; the melting point of the LCP adhesive film is lower than that of the single-sided copper-clad LCP substrate;
s3, laser drilling blind holes on the single-sided copper-clad LCP substrate of the LCP mixed multilayer substrate, wherein the blind holes are used for connecting the first patterned metal circuit layer and the second patterned metal circuit layer;
s4, metallizing the blind holes to form the blind holes filled with the solid electroplated copper;
s5, manufacturing a first graphical metal circuit layer on the upper surface of the single-sided copper-clad LCP substrate, and manufacturing an nth graphical metal circuit layer on the bottom large-area metal copper layer; removing copper in a blind groove slotting region in the first patterned metal circuit layer;
s6, slotting the slotting region of the blind slot by adopting a laser processing means to form a blind slot for mounting the chip, and carrying out decontamination treatment on the bottom and the side wall of the blind slot;
s7, manufacturing coating layers on the first patterned metal circuit layer, the fourth patterned metal circuit layer and the bottom of the blind groove, and manufacturing an upper surface solder mask layer and a lower surface solder mask layer on the corresponding coating layers to obtain the LCP packaging substrate;
and S8, if the LCP packaging substrate is manufactured through the steps S1 to S7 in a splicing mode, milling the LCP packaging substrate manufactured in the splicing mode to form a single LCP packaging substrate.
Furthermore, the depth-diameter ratio of the blind hole is less than or equal to 1.
Furthermore, the melting point of the LCP adhesive film is 10-60 ℃ lower than that of the single-sided copper-clad LCP substrate.
The invention also provides a multi-chip system-in-package structure, comprising: the LCP packaging substrate, the BGA solder balls, the chip, the metal frame and the metal cover plate are arranged on the substrate;
the BGA solder balls are welded on the bottom surface of the LCP packaging substrate and used as an external secondary cascade I/O interface of the multi-chip system-level packaging structure;
metal spacer bars are distributed in the metal surrounding frame; the metal enclosure frame and the metal spacer ribs are welded on the upper surface of the LCP packaging substrate, and the metal cover plate is welded on the metal enclosure frame and the metal spacer ribs, so that a plurality of cavity structures with airtight packaging performance and electromagnetic shielding performance are formed between the LCP packaging substrate and the metal cover plate through the metal enclosure frame and the metal spacer ribs; each cavity structure comprises one or more blind grooves; each blind slot is used for mounting a chip, when the mounted chip has no electromagnetic shielding requirement, the mounted chip is mounted in the same cavity structure, and when the mounted chip has the electromagnetic shielding requirement, the mounted chip is mounted in different cavity structures; the chip is connected in the blind groove through the conductive adhesive and is electrically connected with the chip I/O welding and signal transmission circuit layer in the first patterned metal circuit layer in a gold wire bonding mode.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the invention utilizes the excellent high-frequency transmission characteristic, extremely low moisture absorption and water permeability and oxygen transmission rate of a Liquid Crystal Polymer (LCP) material to realize the composite packaging substrate for multi-chip near-airtight packaging.
2. On the basis of a conventional arbitrary layer of interconnected substrate, the surface layer is made of a Liquid Crystal Polymer (LCP) substrate and an LCP bonding film material system, and other insulating medium layers are made of non-LCP material substrates with thermal cracking temperature higher than the melting point of the LCP bonding film so as to bear the laminating temperature of the subsequent surface layer LCP substrate and the LCP bonding film, so that arbitrary layer interconnection wiring of a multilayer graphic circuit can be realized, and particularly arbitrary layer interconnection wiring of graphic circuits more than 6 layers can be realized.
3. The packaging substrate comprises a plurality of blind grooves for mounting the chips, and is matched with the electromagnetic compatibility and process compatibility design of the surface circuit of the substrate, so that the composite packaging substrate can meet the requirements of multi-chip, high electromagnetic shielding and high-reliability system-level packaging.
4. The multi-chip system-level packaging structure realized by the packaging substrate realizes external secondary cascade by the high-density grid array BGA solder balls, has good compatibility with a PCB (printed circuit board), and can be used for large-size and high-integration-density system-level packaging.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of an LCP package substrate of embodiment 1 of the present invention;
wherein: 1-LCP package substrate; 11-patterning a metal circuit layer; 111-a first patterned metal line layer; 112-a second patterned metal line layer; 113-a third layer to an n-1 th patterned metal circuit layer; 114-nth patterned metal circuit layer; 12-a blind groove; 1211-large area metal ground plane at bottom of blind trench; 13-a coating layer; 14-blind holes; 141-blind holes of the first type; 142-blind holes of the second type; 15-insulating dielectric layer; 151-LCP substrate; 152-LCP adhesive film; 153-a substrate of non-LCP material; 16-signal transmission paths within the substrate; 17-upper surface solder mask; and 18-lower surface solder mask.
Fig. 2 is a schematic structural diagram of a first patterned metal circuit layer in embodiment 1 of the present invention;
wherein: 21. 22, 23-circuit layer for chip I/O welding and signal transmission; 211. 221, 231-chip mounting blind slot position; 212. 222, 232-chip I/O bonding pads and signal transmission lines; 213. 223, 233-electrically insulating regions; 171. 172, 173-second circumferential solder mask layer; 24-surrounding metal layer; 174-first surrounding solder mask; 16-signal transmission path within substrate.
Fig. 3 is a schematic structural diagram of an nth patterned metal circuit layer in embodiment 1 of the present invention;
wherein: 18-lower surface solder mask; 31-grid array type resistance welding windowing; 32-package substrate external secondary cascade I/O bonding pads or patterns.
Fig. 4 is a flow chart of a method for manufacturing an LCP package substrate of embodiment 2 of the present invention.
Fig. 5a to 5h are schematic structural diagrams of steps in the flow of the LCP package substrate manufacturing method of embodiment 2 of the present invention:
FIG. 5a is a schematic structural diagram of an interconnected multi-layer substrate of any layer of non-LCP material;
FIG. 5b is a schematic diagram of the alignment stack for fabricating LCP hybrid multilayer substrate;
figure 5c is a schematic representation of the laminated structure for fabricating LCP hybrid multilayer substrate;
FIG. 5d is a schematic structural diagram of laser drilling blind holes in the LCP hybrid multilayer substrate;
FIG. 5e is a schematic structural diagram of a first type of blind via obtained by blind via metallization;
FIG. 5f is a schematic structural diagram of the first and nth patterned metal wiring layers after being fabricated; wherein: 121-blind slot grooved area.
FIG. 5g is a schematic structural diagram after the blind slot is manufactured;
fig. 5h is a schematic structural diagram of the LCP package substrate obtained after the coating layer and the solder resist layer are manufactured.
Fig. 6 is a schematic diagram of a multi-chip system-in-package structure based on an LCP package substrate according to embodiment 3 of the present invention;
wherein: 61-multi-chip system-in-package structure; 1-LCP package substrate; 2-BGA solder balls; 3-chip; 4-gold wire; 5-a metal enclosure frame; 51-metal spacer bars; 6-a metal cover plate; 7-a cavity structure; 12-a blind groove; 16-signal transmission path within substrate.
Detailed Description
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
As shown in fig. 1, an LCP package substrate of this embodiment includes:
n layers of graphical metal circuit layers distributed from the surface to the bottom surface, a first layer of graphical metal circuit layer, a second layer of graphical metal circuit layer, … and an nth layer of graphical metal circuit layer; the nth layer of patterned metal circuit layer is provided with a structure for welding BGA solder balls;
n-1 insulating medium layers positioned between adjacent graphical metal circuit layers; the insulating medium layer between the first layer of graphical metal circuit layer and the second layer of graphical metal circuit layer is composed of an LCP substrate and an LCP adhesive film, and the melting point of the LCP adhesive film is lower than that of the LCP substrate; the insulating medium layer between the second patterned metal circuit layer and the nth patterned metal circuit layer is a non-LCP material substrate, and the thermal cracking temperature of the non-LCP material substrate is higher than the melting point of the LCP bonding film;
the insulating medium layer is positioned between the first patterned metal circuit layer and the second patterned metal circuit layer, and the openings of the insulating medium layer face to the plurality of blind grooves of the first patterned metal circuit layer;
and the blind holes are positioned between the adjacent patterned metal circuit layers.
1. n layers of patterned metal circuit layers:
as shown in fig. 2, the first patterned metal circuit layer 111 includes a surrounding metal layer 24 with a circle at the outer edge and a plurality of sets of chip I/O bonding and signal transmission line layers 21, 22, 23 at the inner side of the surrounding metal layer 24, each set of chip I/O bonding and signal transmission line layers 21, 22, 23 is shaped as a rectangular or special-shaped island, and each set of chip I/O bonding and signal transmission line layers 21, 22, 23 is connected to the surrounding metal layer 24 via an electrical insulation region 213, 223, 233; the surrounding metal layer 24 is an electrical ground layer and a process layer; the upper surface of the first patterned metal circuit layer 111 is sequentially provided with a coating layer 13 and an upper surface solder mask layer 17; the coating layer 13 covers the surrounding metal layer 24 and each group of chip I/O welding and signal transmission line layers 21, 22 and 23; the upper surface solder mask layer 17 includes a first surrounding solder mask layer 174 and a plurality of second surrounding solder mask layers 171, 172, 173, wherein each second surrounding solder mask layer 171, 172, 173 correspondingly surrounds each electrically insulating region 213, 223, 233, and the first surrounding solder mask layer 174 surrounds all the second surrounding solder mask layers 171, 172, 173;
each set of chip I/O bonding and signal transmission line layers 21, 22, 23 includes chip I/O pads and signal transmission lines 212, 222, 223, and one or more blind slots 12; the transmission of signals in each set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission is completed through the chip I/O pads and the signal transmission lines 212, 222 and 223 in the set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission, or through the corresponding parts of each layer of blind holes 14 (141 and 142) and the lower patterned metal circuit layer (the second patterned metal circuit layer 112 to the nth patterned metal circuit layer 114); the signal transmission between two or more sets of chip I/O bonding and signal transmission layers is performed by the blind vias 14 (141, 142) of each layer and the corresponding portions of the lower patterned metal circuit layer (the second patterned metal circuit layer 112 to the nth patterned metal circuit layer 114), such as the transmission path 16 in fig. 2.
The second patterned metal circuit layer 112, the third patterned metal circuit layer to the (n-1) th patterned metal circuit layer 113 include a plurality of sets of chip I/O bonding and signal transmission line layers, electrical insulation regions and surrounding metal layers, which are conventional patterned metal circuit layers, and the specific structure thereof is not described herein again.
As shown in fig. 3, the lower surface of the nth patterned metal circuit layer 114 has a coating layer; the bonding pads or patterns 32 for external secondary cascade I/O welding of the LCP packaging substrate 1 and the lower surface solder mask layer 18 are arranged on the coating layer of the lower surface of the n-th patterned metal circuit layer 114; the windows 31 of the lower solder mask 18 are circular and distributed in a grid array for soldering the BGA solder balls 2.
2. Insulating medium layer
The melting point of the LCP adhesive film 152 is 10-60 ℃ lower than that of the LCP substrate 151; the LCP substrate 151 and LCP adhesive film 152 are used as a hybrid medium because a low melting point LCP adhesive film 152 is required to serve as an adhesive layer for the LCP substrate 152 during the multi-layer substrate layer press fabrication process. The non-LCP material substrate is a substrate made of a non-LCP thermosetting dielectric material, and the thermal cracking temperature of the non-LCP material substrate is higher than the melting point of the LCP adhesive film, and includes, but is not limited to, polyimide, BT resin (bismaleimide-triazine resin, PPE resin (polyphenylene ether), and other material systems.
3. Blind groove
The bottom of the blind slot 12 (211, 221, 231) is a large-area metal ground layer 1211 in the second patterned metal circuit layer 112 and has a coating layer; the blind via 12 is a chip I/O pad or pattern (i.e. a chip I/O pad or pattern in the chip I/O pad and signal transmission line 212, 222, 223) around the opening of the first patterned metal wiring layer 111; the number and size of the blind slots 12 are determined according to the number and size of the mounted chips.
4. Blind hole
The blind vias 14 can be divided into two types according to the positions in the n patterned metal circuit layers 11:
the first type of blind via 141 penetrates and connects the first patterned metal circuit layer 111 and the second patterned metal circuit layer 112;
the second type of blind via 142 penetrates and connects any adjacent layer from the second patterned metal circuit layer 112 to the nth patterned metal circuit layer 114;
all the blind holes 14 in the above two types can be aligned or stacked in staggered arrangement in the vertical direction, so as to meet the interconnection requirement of any layer in the n-layer patterned metal circuit layer 11. In addition, the diameter of each blind hole 14 is the same, the depth-diameter ratio of the blind hole is less than or equal to 1, and the blind hole 14 is filled with solid electroplated copper. The diameters of the two types of blind holes 14 are the same, on one hand, the blind holes can be uniformly manufactured for filling solid electroplated copper at the later stage; more importantly, the high-temperature packaging substrate can be uniformly deformed in the later high-temperature assembling process, so that the interconnection reliability of the whole packaging substrate is improved. And the depth-diameter ratio of the blind hole is less than or equal to 1, so that the process of filling the blind hole with solid electroplated copper can be better realized, and the occurrence of the void defect of the electroplated copper is avoided.
Example 2
As shown in fig. 4, the present embodiment provides a method for manufacturing the LCP package substrate 1 according to embodiment 1, which includes the following steps:
s1, as shown in figure 5a, manufacturing a non-LCP material arbitrary layer interconnection multilayer substrate by adopting an HDI lamination process; the multilayer substrate comprises a second patterned metal circuit layer 112 to an n-1 patterned metal circuit layer 113, a bottom large-area metal copper layer for manufacturing an nth patterned metal circuit layer 114, an insulating medium layer 15 positioned between adjacent patterned metal circuit layers and a plurality of blind holes 14; the insulating medium layer in the non-LCP material arbitrary layer interconnection multilayer substrate is a non-LCP material substrate 153; the blind holes are of a second type, and the depth-diameter ratio of the blind holes is less than or equal to 1;
s2, taking the single-sided copper-clad LCP substrate 151 and the LCP adhesive film 151, then carrying out alignment lamination as shown in figure 5b from top to bottom according to the sequence of interconnecting the single-sided copper-clad LCP substrate 151, the LCP adhesive film 152 and the multilayer substrate made of non-LCP materials, and then carrying out lamination to form the LCP mixed multilayer substrate as shown in figure 5 c; wherein the copper-clad surface of the single-sided copper-clad LCP substrate 151 faces upward; the melting point of the LCP bonding film is 10-60 ℃ lower than that of the single-sided copper-clad LCP substrate;
s3, as shown in FIG. 5d, laser drilling blind holes on the single-sided copper-clad LCP substrate 151 of the LCP mixed multilayer substrate for connecting the first patterned metal circuit layer 111 and the second patterned metal circuit layer 112, wherein the depth-diameter ratio of the blind holes is less than or equal to 1;
s4, as shown in FIG. 5e, metallizing the blind holes to form blind holes filled with solid electroplated copper, wherein the blind holes are first-class blind holes 141; before the blind hole metallization, pretreatment such as blind hole decontamination and plasma activation is required; the blind hole metallization is realized through a hole filling electro-coppering process, and after hole filling electro-coppering, a copper plating layer on the surface is thinned to form a blind hole 14 filled with solid electro-coppering;
s5, as shown in fig. 5f, a first patterned metal circuit layer 111 is fabricated on the upper surface of the single-sided copper-clad LCP substrate 151, and an nth patterned metal circuit layer 114 is fabricated on the underlying large-area copper layer by conventional processes such as film sticking → exposure → development → etching; removing copper in the blind slot slotting region 121 in the first patterned metal circuit layer 111; the blind slot slotting region 121 is a position determined according to design, the region is a non-metal region, and can be processed by adopting an etching copper process to remove a copper layer in the blind slot slotting region 121 so as to facilitate subsequent laser slotting treatment;
s6, as shown in fig. 5g, grooving the blind groove region by adopting a laser processing means to form a blind groove 12 for mounting the chip, and performing decontamination treatment on the bottom and the side wall of the blind groove 12; in the laser processing means, a laser light source is solid ultraviolet laser or gas carbon dioxide laser;
and S7, as shown in FIG. 5h, performing coating layer manufacturing on the first patterned metal circuit layer 111, the nth patterned metal circuit layer 114 and the bottom of the blind slot 12, and manufacturing an upper surface solder resist layer 17 and a lower surface solder resist layer 18 on corresponding parts of the coating layer 13 to obtain the LCP packaging substrate 1. The coating layer 13 material includes, but is not limited to, electroplated gold, electroless nickel gold, and electroless nickel palladium gold.
And S8, if the LCP packaging substrate is manufactured through the steps S1 to S7 in a splicing mode, milling the LCP packaging substrate manufactured in the splicing mode to form a single LCP packaging substrate.
That is, when a single LCP substrate is directly used to manufacture the LCP package substrate through steps S1 to S7, the obtained LCP package substrate 1 is the required structure; when the LCP package substrate is manufactured through steps S1 to S7 in a splicing manner, the obtained LCP package substrate 1 needs to be milled to have a desired structure.
Example 3
As shown in fig. 6, based on the LCP package substrate described in embodiments 1-2, this embodiment provides a multi-chip system-in-package structure 61, which includes: the LCP package substrate 1 of embodiments 1-2, as well as BGA solder balls 2, chip 3, metal enclosure frame 5, and metal lid 6;
the BGA solder balls 2 are welded on the bottom surface of the LCP packaging substrate 1 and are used as external secondary cascade I/O interfaces of the multi-chip system-in-package structure 61;
the metal surrounding frame 5 is distributed with metal spacing ribs 51; the metal enclosure frame 5 and the metal spacer ribs 51 are welded on the upper surface of the LCP packaging substrate 1, and the metal cover plate 6 is welded on the metal enclosure frame 5 and the metal spacer ribs 51, so that a plurality of cavity structures 7 with airtight packaging performance and electromagnetic shielding performance are formed between the LCP packaging substrate 1 and the metal cover plate 6 through the metal enclosure frame 5 and the metal spacer ribs 51; each cavity structure 7 comprises one or more blind grooves 12; each blind slot 12 is used for mounting one chip 3, when the mounted chip 3 has no electromagnetic shielding requirement, the mounted chip 3 can be mounted in the same cavity structure 7, and when the mounted chip 3 has the electromagnetic shielding requirement, the mounted chip 3 is mounted in different cavity structures 7; the chip 3 is adhered in the blind groove 12 through conductive glue and is electrically interconnected with the chip I/O welding and signal transmission circuit layers 21, 22 and 23 in the first patterned metal circuit layer 111 in a gold wire 4 bonding mode;
the transmission of signals in each set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission is completed through the chip I/O pads and the signal transmission lines 212, 222 and 223 in the set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission, or through the corresponding parts of each layer of blind holes 14 (141 and 142) and the lower patterned metal circuit layer (the second patterned metal circuit layer 112 to the nth patterned metal circuit layer 114); the signal transmission between two or more sets of chip I/O bonding and signal transmission layers 21, 22, 23 is completed by the blind vias 14 (141, 142) of each layer and the corresponding portions of the lower patterned metal circuit layer (the second patterned metal circuit layer 112 to the nth patterned metal circuit layer 114), such as the transmission path 16 in fig. 6.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (9)

1. An LCP package substrate, comprising:
the n layers of graphical metal circuit layers are distributed from the surface to the bottom surface and sequentially comprise a first layer of graphical metal circuit layer, a second layer of graphical metal circuit layer, … and an nth layer of graphical metal circuit layer; the nth layer of patterned metal circuit layer is provided with a structure for welding BGA solder balls;
n-1 insulating medium layers positioned between adjacent graphical metal circuit layers; the insulating dielectric layer between the first patterned metal circuit layer and the second patterned metal circuit layer consists of an LCP substrate and an LCP adhesive film, and the melting point of the LCP adhesive film is lower than that of the LCP substrate; the insulating medium layer between the second layer of graphical metal circuit layer and the nth layer of graphical metal circuit layer is a non-LCP material substrate, and the thermal cracking temperature of the non-LCP material substrate is higher than the melting point of the LCP adhesive film;
the insulating medium layer is positioned between the first patterned metal circuit layer and the second patterned metal circuit layer, and the openings of the insulating medium layer face to the plurality of blind grooves of the first patterned metal circuit layer;
a plurality of blind holes penetrating and connecting the adjacent patterned metal circuit layers;
the first layer of graphical metal circuit layer comprises a circle of surrounding metal layer at the outer edge and a plurality of groups of chip I/O welding and signal transmission line layers at the inner side of the surrounding metal layer, each group of chip I/O welding and signal transmission line layers is in a rectangular or special-shaped island shape, and each group of chip I/O welding and signal transmission line layers is connected with the surrounding metal layer through an electric insulation area; the surrounding metal layer has an electrical property of a grounding layer and a process property of an airtight welding layer; a coating layer and an upper surface solder mask layer are sequentially arranged on the upper surface of the first patterned metal circuit layer; the coating layer covers the surrounding metal layer and each group of chip I/O welding and signal transmission line layers; the upper surface solder mask layer comprises a first surrounding solder mask layer and a plurality of second surrounding solder mask layers, wherein each second surrounding solder mask layer correspondingly surrounds each electric insulation area, and the first surrounding solder mask layer surrounds all the second surrounding solder mask layers;
each group of chip I/O welding and signal transmission line layers comprise chip I/O bonding pads, signal transmission lines and one or more blind slots; the transmission of signals in the circuit layer for I/O welding and signal transmission of each group of chips is completed through the chip I/O bonding pads and the signal transmission lines in the circuit layer for I/O welding and signal transmission of the group of chips or through corresponding parts in each layer of blind holes and the lower patterned metal circuit layer; the I/O welding of two or more groups of chips and the signal transmission between the signal transmission layers are completed by the blind holes of each layer and the corresponding parts in the lower graphical metal circuit layer.
2. The LCP package substrate of claim 1, wherein the LCP adhesive film has a melting point 10-60 ℃ lower than the melting point of the LCP substrate.
3. The LCP package substrate of claim 1, wherein the bottom of the blind trench is a large area metal ground layer in the second patterned metal circuit layer and has a coating layer; the blind groove is a chip I/O bonding pad or a pattern around the opening of the first patterned metal circuit layer; the number and the size of the blind slots are determined according to the number and the size of the mounted chips.
4. The LCP package substrate of claim 1, wherein all blind vias are vertically aligned or staggered for stacking, for implementing any of the n patterned metal circuit layers; the diameter of each blind hole is the same, the depth-diameter ratio of the blind holes is less than or equal to 1, and the blind holes are filled with solid electrolytic copper.
5. The LCP package substrate of claim 1, wherein the nth patterned metal circuit layer has a coating layer on a lower surface thereof; a welding pad or a pattern for external secondary cascade I/O welding of the LCP packaging substrate and a lower surface solder mask are arranged on the coating layer on the lower surface of the n-th patterned metal circuit layer; the windowing of the lower surface solder mask is circular and distributed in a grid array manner, and is used for welding BGA solder balls.
6. A method for manufacturing an LCP package substrate, wherein the method is used for manufacturing the LCP package substrate of any one of claims 1 to 5, comprising the steps of:
s1, manufacturing a non-LCP material arbitrary layer interconnection multilayer substrate by adopting an HDI (high Density interconnection) lamination method process; the multilayer substrate comprises a second layer of graphical metal circuit layer to an n-1 layer of graphical metal circuit layer, a bottom layer large-area metal copper layer for manufacturing the n layer of graphical metal circuit layer, an insulating medium layer positioned between adjacent graphical metal circuit layers and a plurality of blind holes; the insulating medium layer in the multilayer substrate interconnected by any layers of the non-LCP material is a non-LCP material substrate, and the thermal cracking temperature of the non-LCP material substrate is higher than the melting point of the LCP adhesive film;
s2, taking a single-side copper-clad LCP substrate and an LCP adhesive film, and then aligning and laminating the single-side copper-clad LCP substrate, the LCP adhesive film and the non-LCP material arbitrary layer interconnected multilayer substrate from top to bottom to form an LCP mixed multilayer substrate; wherein the copper-clad surface of the single-sided copper-clad LCP substrate faces upwards; the melting point of the LCP adhesive film is lower than that of the single-sided copper-clad LCP substrate;
s3, laser drilling blind holes on the single-sided copper-clad LCP substrate of the LCP mixed multilayer substrate, wherein the blind holes are used for connecting the first patterned metal circuit layer and the second patterned metal circuit layer;
s4, metallizing the blind hole to form a blind hole filled with solid electroplated copper;
s5, manufacturing a first graphical metal circuit layer on the upper surface of the single-sided copper-clad LCP substrate, and manufacturing an nth graphical metal circuit layer on the bottom large-area metal copper layer; removing copper in a blind groove slotting region in the first patterned metal circuit layer;
s6, slotting the slotting region of the blind slot by adopting a laser processing means to form a blind slot for mounting the chip, and carrying out decontamination treatment on the bottom and the side wall of the blind slot;
s7, manufacturing coating layers on the first patterned metal circuit layer, the nth patterned metal circuit layer and the bottom of the blind groove, and manufacturing an upper surface solder mask layer and a lower surface solder mask layer on the corresponding coating layers to obtain the LCP packaging substrate;
and S8, if the LCP packaging substrate is manufactured through the steps S1 to S7 in a splicing mode, milling the LCP packaging substrate manufactured in the splicing mode to form a single LCP packaging substrate.
7. The method for manufacturing the LCP package substrate as claimed in claim 6, wherein the ratio of the blind hole depth to the blind hole depth is less than or equal to 1.
8. The method for manufacturing the LCP packaging substrate as claimed in claim 6, wherein the melting point of the LCP adhesive film is 10-60 ℃ lower than that of the single-sided copper-clad LCP substrate.
9. A multi-chip system-in-package structure, comprising: the LCP package substrate of any one of claims 1-5, and BGA solder balls, chips, metal enclosure frames and metal lid plates;
the BGA solder balls are welded on the bottom surface of the LCP packaging substrate and used as an external secondary cascade I/O interface of the multi-chip system-level packaging structure;
metal spacer bars are distributed in the metal surrounding frame; the metal enclosure frame and the metal spacer ribs are welded on the upper surface of the LCP packaging substrate, and the metal cover plate is welded on the metal enclosure frame and the metal spacer ribs, so that a plurality of cavity structures with near-airtight packaging performance and electromagnetic shielding performance are formed between the LCP packaging substrate and the metal cover plate through the metal enclosure frame and the metal spacer ribs; each cavity structure comprises one or more blind grooves; each blind slot is used for mounting a chip, when the mounted chip has no electromagnetic shielding requirement, the mounted chip is mounted in the same cavity structure, and when the mounted chip has the electromagnetic shielding requirement, the mounted chip is mounted in different cavity structures; the chip is adhered in the blind groove through the conductive adhesive and is electrically interconnected with the chip I/O welding and signal transmission circuit layer in the first patterned metal circuit layer in a gold wire bonding mode.
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