CN112345906A - Multi-path parallel aging testing device - Google Patents

Multi-path parallel aging testing device Download PDF

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Publication number
CN112345906A
CN112345906A CN202011044173.5A CN202011044173A CN112345906A CN 112345906 A CN112345906 A CN 112345906A CN 202011044173 A CN202011044173 A CN 202011044173A CN 112345906 A CN112345906 A CN 112345906A
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China
Prior art keywords
heat dissipation
shell
pressing
testing device
spring
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Pending
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CN202011044173.5A
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Chinese (zh)
Inventor
曾扬扬
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Hangzhou Dahe Thermo Magnetics Co Ltd
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Hangzhou Dahe Thermo Magnetics Co Ltd
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Priority to CN202011044173.5A priority Critical patent/CN112345906A/en
Publication of CN112345906A publication Critical patent/CN112345906A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2642Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a multipath parallel aging test device which comprises a shell, wherein a plurality of spring pressing limiting structures (2) are arranged on the upper surface of the shell side by side, a switch, a timer and a buzzer are arranged on the side surface of the shell, and a controller is arranged in the shell. Above-mentioned technical scheme is through being equipped with time-recorder, bee calling organ and directly perceivedly in time judging the refrigeration piece that awaits measuring and whether reach life, realizes that many pieces of semiconductor refrigeration pieces are ageing simultaneously and detect, and detection efficiency is high, and uses semiconductor refrigeration piece spring to compress tightly limit structure and test, and test reliability is high.

Description

Multi-path parallel aging testing device
Technical Field
The invention relates to the technical field of semiconductor refrigeration sheet production, in particular to a multi-path parallel aging test device.
Background
The semiconductor refrigerating sheet is a cooling device composed of semiconductors, and by utilizing the characteristics of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat is absorbed and released at two ends of the couple respectively, so that the aim of refrigeration is fulfilled. The semiconductor refrigerating sheet consists of a ceramic sheet and a plurality of crystal grains welded on the ceramic sheet. The semiconductor refrigerating sheet has small volume and high reliability, and is generally applied to places with limited space.
Data shows that in the production and processing process of the semiconductor refrigerating sheet, in order to ensure the stable performance of the semiconductor refrigerating sheet after the semiconductor refrigerating sheet leaves a factory, the aging test is carried out on the semiconductor refrigerating sheet according to the process requirement so as to judge whether the semiconductor refrigerating sheet meets the factory leaving condition. In prior art, semiconductor refrigeration piece aging device is mostly single piece of one piece to age, and spacing fixed effect is poor, leads to ageing inefficiency and measuring accuracy subalternation problem.
Chinese patent document CN210720611U discloses a "semiconductor refrigeration sheet aging test fixture based on a constant temperature platform". The method comprises the following steps: constant temperature platform, power, temperature monitoring record appearance and electrically controlled device, the semiconductor refrigeration piece sets up on the constant temperature platform, electrically controlled device linear connection carries out the intermittent type nature power supply of semiconductor refrigeration piece between power and the semiconductor refrigeration piece, the probe of temperature monitoring record appearance is connected with the surface of semiconductor refrigeration piece and carries out temperature monitoring. Above-mentioned technical scheme ages semiconductor refrigeration piece to single piece, and spacing fixed effect is poor, leads to ageing inefficiency and measuring accuracy subalternation problem.
Disclosure of Invention
The invention mainly solves the technical problems that the original test device can only carry out aging test on a single semiconductor refrigerating sheet, and has low aging efficiency and poor test precision, and provides a multipath parallel aging test device which can intuitively and timely judge whether the refrigerating sheet to be tested reaches the service life through a timer and a buzzer, realizes the aging test of a plurality of semiconductor refrigerating sheets at the same time, has high detection efficiency, and has high test reliability by using a spring compression limit structure of the semiconductor refrigerating sheet for testing.
The technical problem of the invention is mainly solved by the following technical scheme: the spring pressing limiting structure comprises a shell, wherein a plurality of spring pressing limiting structures (2) are arranged on the upper surface of the shell side by side, a switch, a timer and a buzzer are arranged on the side surface of the shell, and a controller is arranged in the shell.
Preferably, the controller is respectively connected with a switch, a timer, a buzzer, a relay and a sensor, and the switch is connected with the refrigerating sheet through the relay. The timer is used for the controller to record the service life duration of the semiconductor refrigerating piece to be detected, the buzzer is used for reminding whether the detection is completed, and the relay is used for controlling the switching power supply and the current of the refrigerating piece to be detected.
Preferably, the spring pressing limiting structure comprises a radiator, a pressing plate and a pressing rod perpendicular to the radiator, one end of the pressing plate is fixedly connected with the pressing rod, the other end of the pressing plate is provided with a pressing head, and a spring is arranged between the pressing head and the pressing plate.
Preferably, the spring compresses tightly inside the limit structure and is equipped with the refrigeration piece that is used for the test, the refrigeration piece is located between pressure head and the radiator. The pressure head compresses tightly the refrigeration piece and avoids rocking to make the refrigeration piece hug closely the radiator, ensure the radiator and effectively work, reduce the refrigeration piece temperature.
Preferably, a heat dissipation fan is arranged below the heat sink, and heat dissipation holes are formed in the lower surface and the side surface of the shell corresponding to the heat dissipation fan. A large amount of heat is generated in the aging test process of the refrigerating sheet, and the radiator, the radiating fan and the radiating holes are matched to realize rapid heat radiation.
Preferably, the sensor comprises a temperature sensor and a current sensor, and the temperature sensor and the current sensor are connected with the refrigerating sheet. The control loop is internally provided with a temperature sensor and a current sensor, the temperature sensor is used for detecting the temperature of the semiconductor refrigerating sheet and feeding back temperature information to the controller, and the current sensor is used for detecting the current value of the semiconductor refrigerating sheet and feeding back current information to the controller.
Preferably, the heat dissipation holes include round hole heat dissipation holes on the lower surface of the housing corresponding to the heat dissipation fan and grid heat dissipation holes on the side surfaces of the housing.
Preferably, a wire holder is arranged beside each spring pressing and limiting structure. During operation, the other wire holder intercommunication of spring that will carry out the ageing degree detection compresses tightly limit structure avoids idle spring to compress tightly limit structure electrically conductive, the wasting of resources.
The invention has the beneficial effects that:
1. the device can visually and timely judge whether the refrigerating sheet to be detected reaches the service life or not by arranging the timer and the buzzer, realizes the aging detection of a plurality of semiconductor refrigerating sheets at the same time, has high detection efficiency,
2. the semiconductor refrigeration sheet spring is used for compressing the limiting structure for testing, and the testing reliability is high.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention.
Fig. 2 is a schematic circuit diagram of the present invention.
Fig. 3 is a schematic structural diagram of the spring pressing and limiting structure of the invention.
In the figure, 1 shell, 2 spring compress limit structure, 2.1 depression bar, 2.2 clamp plates, 2.3 radiators, 2.4 pressure heads, 2.5 springs, 3 refrigeration pieces, 4 wire holders, 5 switches, 6 timers, 7 buzzers, 8 controllers, 9 relays and 10 sensors.
Detailed Description
The technical scheme of the invention is further specifically described by the following embodiments and the accompanying drawings.
Example (b): the parallel aging testing device of multichannel of this embodiment, as shown in fig. 1, including shell 1, 1 upper surface of shell is equipped with a plurality of springs side by side and compresses tightly limit structure 2, and every spring compresses tightly the other wire holder 4 that is equipped with of limit structure 2, and the during operation will need carry out the spring that the ageing degree detected and compress tightly the other wire holder intercommunication of limit structure, and it is electrically conductive to avoid idle spring to compress tightly limit structure, the wasting of resources. As shown in fig. 3, the spring pressing limiting structure 2 includes a heat sink 2.3, a pressing plate 2.2 and a pressing rod 2.1 perpendicular to the heat sink 2.3, one end of the pressing plate 2.2 is fixedly connected with the pressing rod 2.1, the other end of the pressing plate 2.2 is provided with a pressing head 2.4, a spring 2.5 is arranged between the pressing head 2.4 and the pressing plate 2.2, and the refrigerating sheet 3 is arranged between the pressing head 2.4 and the heat sink 2.3.
A heat dissipation fan is arranged below the heat sink 2.3, a round hole heat dissipation hole is arranged on the lower surface of the shell 1 corresponding to the heat dissipation fan, and a grid heat dissipation hole is arranged on the side surface of the shell 1 corresponding to the heat dissipation fan. A large amount of heat is generated in the aging test process of the refrigerating sheet, and the radiator, the radiating fan and the radiating holes are matched to realize rapid heat radiation.
As shown in fig. 2, a switch 5, a timer 6 and a buzzer 7 are arranged on the side surface of the shell 1, a controller 8 is arranged in the shell, the controller 8 is respectively connected with the switch 5, the timer 6, the buzzer 7, a relay 9 and a sensor 10, and the switch 5 is connected with the refrigerating sheet 3 through the relay 9. The timer 6 is used for the controller to record the service life duration of the semiconductor refrigerating sheet to be detected, the buzzer 7 is used for reminding whether the detection is completed, and the relay 8 is used for controlling the switching power supply and the current of the refrigerating sheet to be detected. The sensor 10 comprises a temperature sensor and a current sensor, and the temperature sensor and the current sensor are connected with the refrigerating sheet 3. The temperature sensor and the current sensor are arranged in a control loop of the controller 8, the temperature sensor is used for detecting the temperature of the semiconductor refrigerating sheet and feeding back temperature information to the controller, and the current sensor is used for detecting the current value of the semiconductor refrigerating sheet and feeding back current information to the controller.
During the use, place a plurality of refrigeration pieces 3 respectively between pressure head 2.4 and radiator 2.3 of spring pressure limit structure 2 side by side, will need to carry out the other wire holder intercommunication of spring pressure limit structure that the ageing degree detected. The cooling plate 3 is fixed by means of a pressure bar 2.1, a pressure plate 2.2, a pressure head 2.4 and a spring 2.5. And the switch 5 is turned on, the relay 9 controls the power supply of the switch 5 and the current of the refrigerating sheet 3 to be tested, the aging test of the refrigerating sheet 3 is carried out, and the timer 6 starts to time. In the test process, the temperature sensor detects the temperature of the semiconductor chilling plate and feeds temperature information back to the controller 8, and the current sensor detects the current value of the semiconductor chilling plate and feeds current information back to the controller 8. After the test is finished, the controller 8 records the service life duration of the semiconductor refrigerating sheet to be tested through the timer 6, and the buzzer 7 reminds whether the test is finished.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Although terms like spring compression stop, controller, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

Claims (8)

1. The utility model provides a parallel aging testing device of multichannel, its characterized in that, includes shell (1), shell (1) upper surface is equipped with a plurality of springs side by side and compresses tightly limit structure (2), shell (1) side is equipped with switch (5), time-recorder (6) and bee calling organ (7), and the inside controller (8) that is equipped with of shell.
2. The multi-path parallel aging testing device according to claim 1, wherein the controller (8) is respectively connected with a switch (5), a timer (6), a buzzer (7), a relay (9) and a sensor (10), and the switch (5) is connected with the refrigerating sheet (3) through the relay (9).
3. The multi-path parallel aging testing device according to claim 1, wherein the spring compression limiting structure (2) comprises a radiator (2.3), a pressing plate (2.2) and a pressing rod (2.1) perpendicular to the radiator (2.3), one end of the pressing plate (2.2) is fixedly connected with the pressing rod (2.1), the other end of the pressing plate (2.2) is provided with a pressing head (2.4), and a spring (2.5) is arranged between the pressing head (2.4) and the pressing plate (2.2).
4. A multi-path parallel aging testing device according to claim 3, characterized in that a refrigerating sheet (3) for testing is arranged inside the spring pressing and limiting structure (2), and the refrigerating sheet (3) is arranged between the pressure head (2.4) and the heat sink (2.3).
5. The multi-path parallel aging testing device according to claim 3, wherein a heat dissipation fan is arranged below the heat sink (2.3), and heat dissipation holes are arranged on the lower surface and the side surface of the housing (1) corresponding to the heat dissipation fan.
6. A multi-way parallel weathering test device according to claim 2, characterized in that the sensors (10) comprise temperature sensors and current sensors, which are connected to the cooling fins (3).
7. The device for the multi-path parallel aging test according to claim 3, wherein the heat dissipation holes comprise round hole heat dissipation holes on the lower surface of the housing (1) and grid heat dissipation holes on the side surface of the housing (1) corresponding to the heat dissipation fan.
8. A multi-path parallel aging testing device according to claim 1, characterized in that a wire holder (4) is provided beside each spring pressing and limiting structure (2).
CN202011044173.5A 2020-09-28 2020-09-28 Multi-path parallel aging testing device Pending CN112345906A (en)

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Application Number Priority Date Filing Date Title
CN202011044173.5A CN112345906A (en) 2020-09-28 2020-09-28 Multi-path parallel aging testing device

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CN112345906A true CN112345906A (en) 2021-02-09

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CN207867007U (en) * 2017-12-27 2018-09-14 中国电子产品可靠性与环境试验研究所 LED test device
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