CN210222189U - Semiconductor refrigerating sheet aging testing device - Google Patents
Semiconductor refrigerating sheet aging testing device Download PDFInfo
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- CN210222189U CN210222189U CN201921083818.9U CN201921083818U CN210222189U CN 210222189 U CN210222189 U CN 210222189U CN 201921083818 U CN201921083818 U CN 201921083818U CN 210222189 U CN210222189 U CN 210222189U
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- 238000012360 testing method Methods 0.000 title claims abstract description 102
- 230000032683 aging Effects 0.000 title claims abstract description 47
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000005057 refrigeration Methods 0.000 claims abstract description 38
- 230000008859 change Effects 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims description 22
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 238000009423 ventilation Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 claims 1
- 238000006731 degradation reaction Methods 0.000 claims 1
- 238000013022 venting Methods 0.000 claims 1
- 238000013522 software testing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 1
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Abstract
The utility model provides a semiconductor refrigeration piece aging testing device relates to semiconductor refrigeration piece technical field. Semiconductor refrigeration piece aging testing device includes testboard, spacing subassembly, first heat-conducting plate, second heat-conducting plate and test controller, and the bottom surface of first heat-conducting plate is laminated with the cold side of the refrigeration piece that awaits measuring, and test controller includes treater, power supply, change switch, determine module and timing counter, change switch locate power supply with between the refrigeration piece that awaits measuring, determine module includes temperature sensor and current sensor, current sensor's input and refrigeration piece electric connection. The utility model discloses a test controller's design to adopt automatic mode to carry out aging testing to the piece that awaits measuring refrigeration, prevented because adopt the phenomenon that efficiency of software testing is low, the test precision is low that artifical manual test leads to.
Description
Technical Field
The utility model relates to a semiconductor refrigeration piece technical field particularly, relates to a semiconductor refrigeration piece aging testing device.
Background
The semiconductor refrigerating sheet consists of a ceramic plate and a plurality of crystal grains welded on the ceramic plate, the crystal grains are arranged in the middle of the refrigerating sheet at equal intervals, and the ceramic plates are arranged at two sides of the refrigerating sheet. The semiconductor refrigerator operates with DC current, which can cool and heat, and the polarity of the DC current is changed to realize cooling or heating in the same refrigerator. The semiconductor refrigerator is made by using the peltier effect of semiconductor materials, which is a phenomenon that when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. In the use process of the existing semiconductor refrigerating sheet, in order to ensure the stable performance of the semiconductor refrigerating sheet after the semiconductor refrigerating sheet leaves a factory, the aging test of the semiconductor refrigerating sheet is required to judge whether the semiconductor refrigerating sheet meets the factory leaving conditions.
In the existing aging test process of the semiconductor refrigerating sheet, the aging test is carried out in a manual test mode, so that the operation of workers is complex, the test efficiency is low, and the test accuracy is low.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor refrigeration piece aging testing device aims at improving the technical problem that current semiconductor refrigeration piece aging testing efficiency is low and the test precision is low.
The utility model provides a semiconductor refrigerating fin aging testing device, includes the testboard, locate spacing subassembly on the testboard, with the first heat-conducting plate that spacing subassembly is connected, locate the second heat-conducting plate of testboard bottom and with the testing controller of the refrigerating fin electric connection that awaits measuring, the bottom surface of first heat-conducting plate and the top surface laminating of the refrigerating fin that awaits measuring, the testing controller includes the treater and respectively with treater electric connection's power supply, change switch, detection component and timing counter, change switch locates between power supply and the refrigerating fin that awaits measuring, change switch is used for controlling the current attribute that power supply orientation the refrigerating fin that awaits measuring carried, detection component include respectively with treater electric connection's temperature sensor and current sensor, temperature sensor is used for detecting the temperature of first heat-conducting plate with the upper end of refrigerating fin that awaits measuring, and will detect the result send to the treater, current sensor's input with the refrigeration piece electric connection that awaits measuring, current sensor is used for detecting the current value of refrigeration piece that awaits measuring to with detect the result send to the treater, the timing counter is used for taking notes under the control of treater the length of life time of refrigeration piece that awaits measuring.
Further, in the preferred embodiment of the present invention, the limiting component includes a positioning block abutting against and contacting with the side wall of the cooling fin to be tested, a penetrating through the fixing rod of the positioning block, a pressing spring piece connected to the top end of the fixing rod and a penetrating through the pressure spring screw at the end of the pressing spring piece, and the end of the pressure spring screw is connected with the thread of the first heat conducting plate.
Further, in the preferred embodiment of the present invention, the semiconductor cooling device further includes a heat conducting component, the heat conducting component includes a plurality of heat conducting greases, and the heat conducting greases are attached to the surface of the cooling device to be tested.
Further, in the preferred embodiment of the present invention, one side of the second heat conducting plate, which faces away from the test board, is provided with a ventilation heat dissipation seat, and a heat dissipation fan is disposed in the ventilation heat dissipation seat, and the heat dissipation fan is used for improving the heat conduction efficiency of the second heat conducting plate.
Further, in the preferred embodiment of the present invention, the bottom of the heat dissipation seat is provided with a plurality of supporting legs, and the ends of the supporting legs are provided with rubber pads.
Further, in the preferred embodiment of the present invention, the first heat conducting plate is provided with a temperature sensing hole, and the temperature sensor is disposed in the temperature sensing hole.
Further, in a preferred embodiment of the present invention, the conversion switch is made of a rectifier or an inverter.
Further, in the preferred embodiment of the present invention, the first heat conducting plate and the second heat conducting plate are both provided with a plurality of heat conducting holes, and the heat conducting holes are made of a cylindrical through hole structure.
Further, in the preferred embodiment of the present invention, the first heat conducting plate and the second heat conducting plate are made of aluminum plate.
Further, in a preferred embodiment of the present invention, the processor is made of a single chip or a PLC.
The utility model has the advantages that: through the design of the test controller, the aging test is carried out on the refrigerating sheet to be tested in an automatic mode, the phenomena of low test efficiency and low test accuracy caused by adopting manual test are prevented, through the design of the change-over switch, the output current of the power supply is effectively subjected to attribute change under the control of the processor, the test effect of the aging test on the refrigerating sheet to be tested is ensured, through the design of the current sensor and the timing counter, whether the refrigerating sheet to be tested reaches the service life or not can be judged in time, through the design of the limiting component, the structural stability in the test process of the refrigerating sheet to be tested is effectively improved, the test failure caused by the position movement of the refrigerating sheet to be tested is prevented, through the design of the first heat-conducting plate and the temperature sensor, so that the heat conduction and the detection are carried out on the upper end temperature of the refrigerating sheet to be tested, and the testing efficiency of the semiconductor refrigerating sheet aging testing device to be tested is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a semiconductor cooling sheet aging test apparatus according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a test controller according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a semiconductor cooling sheet aging test apparatus according to a second embodiment of the present invention;
description of the symbols of the main elements:
| first |
1 | |
2 |
| Refrigerating sheet to be tested | 3 | |
4 |
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5 | |
6 |
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7 | |
8 |
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9 | |
10 |
| Second |
11 | Ventilation |
12 |
| Supporting |
13 | Processor with a memory having a plurality of |
20 |
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21 | Change-over |
22 |
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23 | |
24 |
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25 | |
211 |
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Embodiment 1, please refer to fig. 1 to 2, a first embodiment of the present invention provides an aging testing apparatus for semiconductor refrigerating sheet, comprising a testing table 5, a limiting component disposed on the testing table 5, a first heat conducting plate 1 connected to the limiting component, a second heat conducting plate 11 disposed at the bottom of the testing table 5, and a testing controller electrically connected to the refrigerating sheet 3 to be tested, wherein the bottom surface of the first heat conducting plate 1 is attached to the top surface of the refrigerating sheet 3 to be tested, the testing table 5 is used for fixing the limiting component, the first heat conducting plate 1, the second heat conducting plate 11 and the testing controller, so as to improve the stability of the overall structure of the aging testing apparatus for semiconductor refrigerating sheet, the limiting component is used for preventing the position of the refrigerating sheet 3 to be tested from moving during the aging testing process, thereby effectively improving the testing efficiency of the aging testing apparatus for semiconductor refrigerating sheet, first heat-conducting plate 1 with second heat-conducting plate 11 is used for right the refrigeration piece 3 that awaits measuring carries out the heat conduction, test controller is used for adopting automatic mode to carry out aging testing to the refrigeration piece 3 that awaits measuring, has prevented owing to adopt the phenomenon that efficiency of software testing is low, the test precision is low that artifical manual test leads to.
Specifically, the test controller include treater 20 and respectively with treater 20 electric connection's power supply 21, change over switch 22, detection subassembly 23 and timing counter 211, change over switch 22 locates power supply 21 with between the freezer section 3 that awaits measuring, change over switch 22 is used for control power supply 21 orientation the electric current attribute that the freezer section 3 that awaits measuring carried, power supply 21 be used for in the ageing test process to the freezer section 3 that awaits measuring carries out electric current, so that the freezer section 3 that awaits measuring carries out refrigeration and heating effect, change over switch 22 is used for under the control of treater 20, the effectual right the output current of power supply 21 carries out the attribute conversion, has ensured the test effect to the freezer section 3 that awaits measuring ageing tests.
In this embodiment, the detecting component 23 with it connects to await measuring between the refrigeration film 3 through wire 4, the detecting component 23 include respectively with processor 20 electric connection's temperature sensor 24 and current sensor 25, temperature sensor 24 is used for detecting first heat-conducting plate 1 with the temperature of the refrigeration film 3 upper end that awaits measuring to send the testing result to processor 20, current sensor 25's input with the refrigeration film 3 electric connection that awaits measuring, current sensor 25 is used for detecting the current value of the refrigeration film 3 that awaits measuring, and send the testing result to processor 20, time counting counter 211 is used for the record under the control of processor 20 the life duration of the refrigeration film 3 that awaits measuring.
Spacing subassembly include with 3 lateral walls of the refrigeration piece that awaits measuring conflict contact locating piece 10, run through the dead lever 9 of locating piece 10, with the pressure spring 8 that dead lever 9 top is connected with run through the terminal pressure spring screw 6 of pressure spring 8, just the end of pressure spring screw 6 with 1 threaded connection of first heat-conducting plate, locating piece 10 with the refrigeration piece 3 conflict contact that awaits measuring, locating piece 10 is arranged in preventing the test procedure 3 upward position removal about awaiting measuring refrigeration piece, in order to improve semiconductor refrigeration piece aging testing device's efficiency of software testing, through pressure spring 8 with the design of pressure spring screw 6, in order to make the test procedure wait to cool piece 3 upward and downward direction's position removal, and further improve semiconductor refrigeration piece aging testing device's efficiency.
In addition, in this embodiment semiconductor refrigeration piece aging testing device still includes heat conduction subassembly, heat conduction subassembly includes a plurality of heat conduction fat 7, heat conduction fat 7 pastes and locates the surface of refrigeration piece 3 awaits measuring, through heat conduction fat 7's design, effectual improvement first heat-conducting plate 1 with second heat-conducting plate 11 is right the heat conduction effect of refrigeration piece 3 awaits measuring has improved aging testing efficiency. Be equipped with temperature sensing hole 2 on the first heat-conducting plate 1, temperature sensor 24 locates in temperature sensing hole 2, change over switch 22 adopts rectifier or inverter to make, specifically, works as when power supply 21 is alternating current power supply, change over switch 22 is the rectifier, and this rectifier is used for converting the alternating current into the direct current, works as when power supply 21 is direct current power supply, change over switch 22 is the inverter, and this rectifier is used for converting the alternating current into the alternating current.
Further, first heat-conducting plate 1 with all be equipped with a plurality of heat conduction holes on the second heat-conducting plate 11, the heat conduction hole adopts cylindrical through-hole structure to make, first heat-conducting plate 1 with second heat-conducting plate 11 all adopts the aluminum plate material to make, processor 20 adopts singlechip or PLC to make.
Specifically, the working principle in this embodiment is as follows:
1. heat conducting grease 7 is smeared on the upper surface and the lower surface of the refrigerating sheet 3 to be tested, the refrigerating sheet 3 to be tested is placed in the middle of the test board 5, and the positioning block 10 is in contact with the left side of the refrigerating sheet 3 to be tested so as to prevent the refrigerating sheet 3 to be tested from moving left and right. After a temperature sensor 24 is placed in a temperature sensing hole 2 in a first heat conduction plate 1, the first heat conduction plate 1 is covered on the upper end of a refrigerating sheet 3 to be tested, and the left side of the first heat conduction plate 1 is abutted against a positioning block 10;
2. the pressure spring 8 plays a role in fixing through the pressure spring cold piece 3 so as to prevent the position of the cold piece 3 to be detected from moving; the screw 6 presses down the first heat-conducting plate 1 and the refrigerating sheet 3 to be tested, and the first heat-conducting plate 1 and the refrigerating sheet to be tested are pressed down
3. When the aging test is carried out, the processor 20 controls the power supply 21 to supply power, and controls the timing counter 211 to carry out timing, and by utilizing the Peltier effect, after the to-be-tested cooling slice 3 is connected with current, the lower end of the to-be-tested cooling slice 3 is cooled, and the upper end of the to-be-tested cooling slice is released heat, the temperature sensor 24 in the temperature sensing hole 2 can monitor the upper end temperature of the to-be-tested cooling slice 3 in the test process and transmit temperature data to the processor 20 in real time;
4. when the processor 20 judges that the temperature of the upper end of the to-be-detected refrigerating sheet 3 reaches 65 ℃, the processor 20 changes the direction of the current transmitted by the power supply 21 through the change switch 22, so that the upper end of the to-be-detected refrigerating sheet 3 is controlled to refrigerate, and the lower end releases heat; after a period of time, when the temperature of the upper end of the refrigerating sheet 3 to be tested is cooled to 15 ℃, the polarity of the current is changed by closing the change switch 22 again, so that the upper end of the refrigerating sheet 3 to be tested releases heat, the lower end of the refrigerating sheet is cooled, and the operation is repeated, so that the temperature of the upper end of the refrigerating sheet 3 to be tested is repeatedly operated between 15 ℃ and 65 ℃ and 15 ℃.
5. When the detection value of the current sensor 25 is zero, namely the to-be-tested refrigerating sheet 3 is not conductive, the to-be-tested refrigerating sheet 3 reaches the service life, the service life of the to-be-tested refrigerating sheet 3 is represented by inquiring the timing time of the timing counter 211 and the cycle number of refrigeration and heat release, and one aging test is completed;
6. in the whole aging test process, the second heat conduction plate 11 can conduct the high temperature or the low temperature of the refrigerating sheet 3 to be tested downwards so as to diffuse the temperature, prevent the interference on the detection value of the temperature sensor 24 and improve the test accuracy of the semiconductor refrigerating sheet aging test device;
7. furthermore, the testing temperature range can be correspondingly adjusted according to the model of the refrigerating sheet 3 to be tested, and the testing temperature adjusting range comprises 15-65-15 ℃ and 10-80-10 ℃.
In this embodiment, through the design of the test controller, the aging test is performed on the cooling film 3 to be tested in an automated manner, thereby preventing the phenomena of low test efficiency and low test accuracy caused by manual test, through the design of the change-over switch 22, the output current of the power supply 21 is effectively subjected to attribute change under the control of the processor 20, thereby ensuring the test effect of the aging test on the cooling film 3 to be tested, through the design of the current sensor 25 and the timing counter 211, whether the service life of the cooling film 3 to be tested is reached can be timely judged, through the design of the limit component, the structural stability in the test process of the cooling film 3 to be tested is effectively improved, and the test failure caused by the position movement of the cooling film 3 to be tested is prevented, through first heat-conducting plate 1 with temperature sensor 24's design to the messenger is effectual right the upper end temperature of the refrigeration piece 3 that awaits measuring conducts heat and detects, has ensured semiconductor refrigeration piece aging testing device is right the efficiency of software testing of the refrigeration piece 3 that awaits measuring.
The embodiment of the utility model provides a semiconductor refrigeration piece aging testing device, its realization principle and the technological effect who produces are the same with embodiment 1, for brief description, and the corresponding content in embodiment 1 can be referred to the nothing of this embodiment.
The device obtained through the design can basically meet the effect of effectively improving the testing efficiency and the testing accuracy of the aging test of the refrigerating sheet, but the designer further improves the device with the aim of further improving the functions of the device.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a semiconductor refrigerating piece aging testing device, its characterized in that, including the testboard, locate spacing subassembly on the testboard, with the first heat-conducting plate that spacing subassembly is connected, locate the second heat-conducting plate of testboard bottom and with the testing controller of the refrigerating piece electric connection that awaits measuring, the bottom surface of first heat-conducting plate and the top surface laminating of the refrigerating piece that awaits measuring, testing controller include the treater with respectively with treater electric connection's power supply, change switch, detection component and timing counter, change switch locates between power supply and the refrigerating piece that awaits measuring, change switch is used for controlling the power supply is towards the electric current attribute that the refrigerating piece that awaits measuring carried, detection component include respectively with treater electric connection's temperature sensor and current sensor, temperature sensor is used for detecting first heat-conducting plate with the temperature of the upper end of the refrigerating piece that awaits measuring, and will detect the result send to the treater, current sensor's input with the refrigeration piece electric connection that awaits measuring, current sensor is used for detecting the current value of refrigeration piece that awaits measuring to with detect the result send to the treater, the timing counter is used for taking notes under the control of treater the length of life time of refrigeration piece that awaits measuring.
2. The semiconductor chilling plate aging testing device according to claim 1, wherein the limiting component includes a positioning block abutting against the side wall of the chilling plate to be tested, a fixing rod penetrating through the positioning block, a pressure spring plate connected to the top end of the fixing rod, and a pressure spring screw penetrating through the end of the pressure spring plate, and the end of the pressure spring screw is in threaded connection with the first heat conducting plate.
3. The semiconductor cooling fin aging test device according to claim 1, further comprising a heat conduction assembly, wherein the heat conduction assembly comprises a plurality of heat conduction greases, and the heat conduction greases are attached to the surface of the cooling fin to be tested.
4. A semiconductor cooling fin aging testing apparatus as claimed in claim 1, wherein a side of the second heat conducting plate facing away from the testing table is provided with a ventilation and heat dissipation seat, and a heat dissipation fan is provided in the ventilation and heat dissipation seat, wherein the heat dissipation fan is used for improving heat conduction efficiency of the second heat conducting plate.
5. The semiconductor cooling sheet aging testing device of claim 4, wherein a plurality of supporting legs are provided at the bottom of the venting heat sink, and rubber pads are provided at the ends of the supporting legs.
6. The apparatus of claim 1, wherein the first heat conducting plate has a temperature sensing hole, and the temperature sensor is disposed in the temperature sensing hole.
7. The semiconductor cooling sheet degradation testing device of claim 1, wherein the conversion switch is made of a rectifier or an inverter.
8. A semiconductor chilling block aging testing apparatus according to claim 1, wherein the first and second heat conduction plates are each provided with a plurality of heat conduction holes, and the heat conduction holes are formed in a cylindrical through hole structure.
9. The semiconductor chilling plate aging test device of claim 1, wherein the first heat conducting plate and the second heat conducting plate are both made of aluminum plate.
10. The semiconductor chilling plate aging testing device of claim 1, wherein the processor is made of a single chip microcomputer or a PLC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921083818.9U CN210222189U (en) | 2019-07-11 | 2019-07-11 | Semiconductor refrigerating sheet aging testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921083818.9U CN210222189U (en) | 2019-07-11 | 2019-07-11 | Semiconductor refrigerating sheet aging testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210222189U true CN210222189U (en) | 2020-03-31 |
Family
ID=69937106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921083818.9U Expired - Fee Related CN210222189U (en) | 2019-07-11 | 2019-07-11 | Semiconductor refrigerating sheet aging testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210222189U (en) |
-
2019
- 2019-07-11 CN CN201921083818.9U patent/CN210222189U/en not_active Expired - Fee Related
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