CN112334835A - 确定描述设备的操作的参数之间的显著关系 - Google Patents

确定描述设备的操作的参数之间的显著关系 Download PDF

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Publication number
CN112334835A
CN112334835A CN201980040054.1A CN201980040054A CN112334835A CN 112334835 A CN112334835 A CN 112334835A CN 201980040054 A CN201980040054 A CN 201980040054A CN 112334835 A CN112334835 A CN 112334835A
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CN
China
Prior art keywords
data
parameters
semiconductor manufacturing
relationship
relationships
Prior art date
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Pending
Application number
CN201980040054.1A
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English (en)
Chinese (zh)
Inventor
D·E·S·K·西格特尔曼斯
M·R·A·布伦特
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ASML Netherlands BV
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ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of CN112334835A publication Critical patent/CN112334835A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Mathematical Physics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing And Monitoring For Control Systems (AREA)
CN201980040054.1A 2018-06-15 2019-05-15 确定描述设备的操作的参数之间的显著关系 Pending CN112334835A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18177970.3 2018-06-15
EP18177970.3A EP3582007A1 (en) 2018-06-15 2018-06-15 Determining significant relationships between parameters describing operation of an apparatus
PCT/EP2019/062512 WO2019238348A1 (en) 2018-06-15 2019-05-15 Determining significant relationships between parameters describing operation of an apparatus

Publications (1)

Publication Number Publication Date
CN112334835A true CN112334835A (zh) 2021-02-05

Family

ID=62684681

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980040054.1A Pending CN112334835A (zh) 2018-06-15 2019-05-15 确定描述设备的操作的参数之间的显著关系

Country Status (6)

Country Link
US (1) US11526084B2 (https=)
EP (1) EP3582007A1 (https=)
JP (1) JP7177183B2 (https=)
CN (1) CN112334835A (https=)
NL (1) NL2021804A (https=)
WO (1) WO2019238348A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12189303B2 (en) 2020-05-08 2025-01-07 Asml Netherlands B.V. Methods and apparatus for diagnosing unobserved operational parameters
JP7643422B2 (ja) * 2022-09-14 2025-03-11 トヨタ自動車株式会社 作業状況監視システム、作業状況監視方法、及び、作業状況監視プログラム
KR20250117398A (ko) * 2022-11-29 2025-08-04 도쿄엘렉트론가부시키가이샤 컴퓨터 프로그램, 정보 처리 장치 및 정보 처리 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6458610B1 (en) * 2001-05-31 2002-10-01 Advanced Micro Devices, Inc. Method and apparatus for optical film stack fault detection
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7650200B2 (en) * 2007-03-30 2010-01-19 Tokyo Electron Limited Method and apparatus for creating a site-dependent evaluation library
US7460237B1 (en) 2007-08-02 2008-12-02 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
NL2009345A (en) 2011-09-28 2013-04-02 Asml Netherlands Bv Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods.
EP2952964A1 (en) 2014-06-03 2015-12-09 Aselta Nanographics Method for determining the parameters of an ic manufacturing process by a differential procedure
WO2017055073A1 (en) 2015-09-29 2017-04-06 Asml Netherlands B.V. Methods of modelling systems or performing predictive maintenance of lithographic systems
KR102189686B1 (ko) 2016-04-20 2020-12-14 에이에스엠엘 네델란즈 비.브이. 레코드 매칭 방법, 유지보수 스케줄링 방법, 및 장치

Also Published As

Publication number Publication date
US20210325789A1 (en) 2021-10-21
JP2021527953A (ja) 2021-10-14
NL2021804A (en) 2018-11-06
JP7177183B2 (ja) 2022-11-22
US11526084B2 (en) 2022-12-13
EP3582007A1 (en) 2019-12-18
WO2019238348A1 (en) 2019-12-19

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