CN1123218A - Injection mold apparatus having changeable sub-molds - Google Patents
Injection mold apparatus having changeable sub-molds Download PDFInfo
- Publication number
- CN1123218A CN1123218A CN95116641A CN95116641A CN1123218A CN 1123218 A CN1123218 A CN 1123218A CN 95116641 A CN95116641 A CN 95116641A CN 95116641 A CN95116641 A CN 95116641A CN 1123218 A CN1123218 A CN 1123218A
- Authority
- CN
- China
- Prior art keywords
- ejecting mechanism
- light
- removable frame
- submodule
- optical pickocff
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 title claims abstract description 12
- 239000007924 injection Substances 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 5
- 230000001737 promoting effect Effects 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/7626—Measuring, controlling or regulating the ejection or removal of moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/84—Safety devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to an injection mould device, consisting of a movable structure and a fixing structure. When the movable structure joints with the fixing structure, a changeable sub-mould is positioned between the two moulds. The movable structure consists of a first pushing-out mechanism which is suitable to be pushed by a driving device arranged on a shaped machine and a second pushing-out mechanism which is suitable to be pushed by the first pushing-out mechanism to push a shaped product out from a sub-mould cavity. An optical sensor is arranged on the movable structure to detect the second pushing-out structure extending out from a position. The sensor is provided with a movable structure and a sub-mould through which light beams are threaded, or is provided with a path extending along an interface between the movable structure and the fixing structure to detect one part of the second pushing-out mechanism which shuts off light beams.
Description
The present invention relates to a kind of injection mold apparatus with changeable sub-molds
Known a kind of injection mold apparatus with changeable sub-molds, the replaceable one-tenth of its submodule are used for other submodule of the qualification difformity die cavity of molded difformity product.This device is easy to change and is extensive use of owing to saving the cost that is used to prepare independent injection mould and submodule.This device is characterised in that and comprises two mechanisms that are used to release moulded product.First ejecting mechanism that they are provided in a side of in the moveable part of device and are suitable for being promoted by the push-off pin on the make-up machine, and second ejecting mechanism that can promote be used for the product of injection moulding is released die cavity by first ejecting mechanism.
First ejecting mechanism comprises first head board that can move forward and backward and first knockout pin that stretches out from first head board in cushion block.Second ejecting mechanism comprises second head board that can move forward and backward and second knockout pin that stretches out from second head board between a pair of dividing plate.The rear portion contact that first knockout pin extends through Kong Bingyu second head board in the bearing plate moves forward to promote second head board.Second knockout pin extends through Kong Bingke in the template and is pushed into and is used for therefrom releasing moulded product in its die cavity.After releasing moulded product, first ejecting mechanism returns its initial position being fixed to be parallel under the effect that first of first knockout pin returns the return spring on the pin, and second ejecting mechanism also is parallel to second of second knockout pin and returns the return spring effect on the pin and return its initial position by being fixed to.
Can guarantee that preferably second ejecting mechanism returns its initial position before submodule is closed, therefore second release and return pin and can not stretch out the interface of submodule and damage it.Usually use machinery or survey first head board near switch and return its initial position, and consider that second ejecting mechanism has returned its initial position when first head board has returned its initial position.When first head board leaves its initial position, close swap switch, and when it returns its initial position, open switch and the control device on forming machine sends a signal with the pass closed submodule.
Yet it is incorrect drawing returning of first head board conclusion that second head board returns its initial position that invariably accompanies.Even first head board withdrawal probably, second ejecting mechanism may since certain or other former thereby can not return its initial position, and second release and return pin and still keep stretching out interface.Yet although the not withdrawal of second ejecting mechanism, the switch of surveying first head board sends a signal that closes closed submodule, and what its result, submodule may still be stretched out second releases and return pin and damage.
In this case, the purpose of this invention is to provide a kind of injection mold apparatus of improved the above-mentioned type, it can prevent any owing to second release or return pin and stretch out the infringement that interface brings.
For achieving the above object, the invention provides a kind of device, comprise a removable frame and a fixed structure, when engaging, they limit at least one changeable sub-molds betwixt, removable frame comprises that one is suitable for promoting first ejecting mechanism advance by being installed in drive unit on the forming machine, with one be suitable for promoting second ejecting mechanism from the die cavity of submodule so that formed product is released by first ejecting mechanism, removable frame comprises that also one is used to survey the optical pickocff of second ejecting mechanism that is positioned at extended position.
This optical pickocff can correctly be surveyed second ejecting mechanism and whether return its initial position, and needn't rely on any device that is used to survey the position of first ejecting mechanism.Thereby, if can guarantee to protect second ejecting mechanism or submodule not to be subjected to any infringement of closing and taking place of before second ejecting mechanism returns its initial position, closing in submodule.
According to an aspect of the present invention, the substrate of removable frame has a through hole that is substantially perpendicular to second ejecting mechanism, and optical pickocff has makes probing light pass the path in this hole, and second ejecting mechanism comprise one when second ejecting mechanism is positioned at its extended position the removable and head board that blocks this hole and interdict light.
According to a further aspect in the invention, optical pickocff has the path that supplies probing light to pass through of extending along the interface of removable frame and fixed structure, thereby and second ejecting mechanism comprises that one stretches out the pin that returns of interface blocking light when second ejecting mechanism is positioned at its extended position.In this case, need in the substrate of removable frame, not make the hole, thereby can reduce manufacturing cost.
In either case, optical pickocff preferably includes a laser aid that is used to launch light, and one is used for being used to receive along the suitable fiber device and of route guidance light the device of light.Use has been guaranteed the high accuracy of surveying by the light of laser and fiber device emission and guiding.
Describe embodiments of the invention in detail below in conjunction with accompanying drawing, in the accompanying drawing:
Fig. 1 is the cross-sectional view of one embodiment of the present of invention;
The guide wire of alternative shape of Fig. 2 for installing shown in Fig. 1 illustrates second ejecting mechanism that is in extended position;
Fig. 3 is and the similar view of Fig. 1, but a kind of multi-form of apparatus of the present invention is shown.
Injection mold device of the present invention has one or more changeable sub-molds, can pull down and be replaced by other submodule of the die cavity of the different shape that is used to be molded into the difformity product.
Fig. 1 illustrates and embodies a kind of device of the present invention, and it comprises a fixed structure P and a removable frame Q, when they are assembled together, limits four removable submodules between them.Fixed structure P comprises that an installing plate 1, is positioned at the running channel stripper 3 that the bearing plate 2, of (left side) side before the installing plate 1 is positioned at bearing plate 2 front sides, and a substrate 4 that is positioned at running channel stripper 3 front sides.Substrate 4 has four groove 4a (only illustrating two among Fig. 1), and a submodule stopper 5 is housed among each groove 4a.Each submodule stopper 5 in the face of the front end of removable frame Q have one with the bead 5a of the preceding side engagement of substrate 4 so that part 5 displacement in groove 4a again.The rear end 5b of submodule stopper 5 remains on its opposite side by retainingf key 6, so that part 5 can not shift out groove 4a.
Installing plate 1 has a central opening, and bearing plate 2 also has a central opening.One sprue bush 7 is installed in these openings, and has a front end that flushes with the front side of bearing plate 2.Sprue bush 7 is fixed on the installing plate 1 by locating ring 8, and its front end is cast gate 7a, and cast gate 7a is tapered to the rear end from its front end.
Running channel stripper 3 has central channel 3a, wherein is provided with one and is fixed to and waters guidance tape 9 in the rear center of substrate 4.The middle part of watering guidance tape 9 has groove 9a, and cast gate 7a meets with groove 9a in the middle, thereby cast gate 7a and groove 9a can form a T shape structure, and groove 9a extends along two relative directions from cast gate 7a.Form a chute 5c among the rear end surface 5b of submodule stopper 5, cast gate 7a links to each other with chute 5c by the passage 3a that is defined in running channel stripper 3 and water between the guidance tape 9.The end away from cast gate 7a of chute 5c links to each other with the rear end of taper splitter box 5d, and the front end of splitter box 5b has an ingate 5e.The far-end 10a of one running channel lock pin 10 is arranged in chute 5c and aligns with splitter box 5d, and it has a bossing, so that resin divides running channel to isolate from submodule stopper 5 when opening submodule.
Installing plate 1 is provided with four and is used for supporting bearing plate 2, and the bolster 11 of running channel stripper 3 and substrate 4 only illustrates a this axle among the figure.Substrate 4 is provided with four and is used to guide removable frame Q to make its horizontally-guided axle 12 that suitably moves towards and away from fixed structure P, and a this axle only is shown among the figure.Removable frame Q comprises the installing plate 13 on the cylinder block that is fixed on the not shown injection (mo(u)lding) machine, the substrate 16 that one cushion block 14, that is positioned at preceding (right side) side of installing plate 13 is positioned at the bearing plate 15 of cushion block 14 front sides and is positioned at bearing plate 15 front sides.Substrate 16 has four groove 16a (only illustrating two among Fig. 1), and a submodule stopper 17 is installed among each groove 16a and by retainingf key 18 and is fixed on the substrate 16.Cushion block 14 limits a space, and first head board 20 that forms the part of first ejecting mechanism 19 can move forward and backward in this space.A plurality of first knockout pins 21 and not shown first return pin and stretch out and extend through hole the bearing plate 15 from first head board 20.
Each submodule stopper 17 is provided with second ejecting mechanism 22, second ejecting mechanism comprises one second head board 23, a plurality of second knockout pins 24 that stretch out from second head board 23 and a plurality of not shown second return pin, and second returns pin also stretches out from second head board.Each submodule stopper 17 comprises a die cavity limiting plate 17a, and a die cavity 17b and a pair of dividing plate 17c, dividing plate 17c limit a space that supplies second head board 23 to move forward and backward therein.Second knockout pin 24 and second returns pin and can stretch among the die cavity 17b and exceed interface between submodule stopper 5 and 17 by the hole among the die cavity limiting plate 17a.If first ejecting mechanism 19 is promoted to advance by the push-off pin on the not shown injection (mo(u)lding) machine, then second ejecting mechanism 22 advances to its extended position.If the bar withdrawal is then returned its initial position under the unshowned in the drawings return spring effect of first ejecting mechanism 19, and is returned its initial position under the also unshowned in the drawings return spring effect of second ejecting mechanism 22.
Displaceable member structure Q is provided with one and is used to survey the optical pickocff 25 that second ejecting mechanism 22 is positioned at its extended position.Optical pickocff 25 is by the pair of sensors mounting blocks 26 and a pair of sensor installing plate 27 supportings that are respectively fixed on the sensor mounting blocks 26 of the opposite side that is respectively fixed to removable frame Q.
In operating process, if any second ejecting mechanism 22 is in its extended position, the passage that its head board 23 obstructs the light, as shown in Figure 2, then light receiving system 29 does not receive any light that sends from light launcher 28, therefore export a negative signal to not shown control device, and if second ejecting mechanism 22 or its head board 23 are in its initial position, then export positive signal because of receiving the light that passes hole 16b.When the positive signal that receives from sensor 25, control device allows forming machine to continue its injection moulding operation by the time of cutting out injection mold apparatus and controlling the shaping resinous principle.
With reference to the accompanying drawings 3, this illustrates an alternative embodiment of the invention.The structure of the device of this embodiment structure with the device shown in Fig. 1 and 2 basically is identical.Therefore, identical parts have used identical label among the figure, and common feature just no longer has been repeated in this description.
According to the notable feature of device shown in Figure 3, it comprises an optical pickocff 25, and this sensor 25 has the passage that is passed to opposite side for light L along the interface between submodule stopper 5 and 17 from the side of removable frame Q.The same among 25 body structures of optical pickocff and Fig. 1 comprises by pair of sensors mounting blocks 26 and pair of sensors installing plate 27 being bearing in light launcher 28 and light receiving system 29 on the opposite side of removable frame Q.If any second ejecting mechanism 22 remains on its release location, then the light L that is sent by light launcher 28 is stretched out interfacial second and returns the pin blocking by not shown.If second ejecting mechanism 22 is in its initial position, then light L is received by light receiving system 29 not by blocking, and return pin and be parked in after the interface this moment second.
Although light L also can be by the blocking of second knockout pin 24, because the position of each second knockout pin may have nothing in common with each other according to the shape of formed product in the different submodules, therefore can not rely on second knockout pin 24 interdicts light.
Although the optical pickocff 25 in the device shown in Figure 3 need be mounted to make light can by thickness less second return pin blocking, but its installation is easier and cheap than the installation of the sensor shown in Fig. 1, and this is because its installation need not form any passage that supplies light to pass through in substrate 16 or submodule stopper 17.
Although above-mentioned optical pickocff comprises a laser, a fiber device and a phototransistor as the light receiving system also can use light emitting diode (LED) as light launcher, and photodiode are as the light receiving systems.
Claims (4)
1. injection mold apparatus, comprise a removable frame and a fixed structure, when engaging, they limit at least one changeable sub-molds betwixt, described removable frame comprises that one is suitable for promoting first ejecting mechanism advance by being installed in drive unit on the forming machine, with one be suitable for promoting second ejecting mechanism from the die cavity of submodule so that formed product is released by described first ejecting mechanism, it is characterized in that one is installed in and is used to survey the described optical pickocff that is positioned at second ejecting mechanism of extended position on the described removable frame.
2. according to the device of claim 1, it is characterized in that, having one in the substrate of described removable frame is substantially perpendicular to second ejecting mechanism and crosses the through hole of described submodule, and described optical pickocff has makes probing light pass the path in described hole, and described second ejecting mechanism comprise one when second ejecting mechanism is positioned at its extended position the removable and head board that blocks described hole and interdict described light.
3. according to the device of claim 1, it is characterized in that, described optical pickocff has the path that supplies probing light to pass through of extending along the interface of described removable frame and described fixed structure, thereby and described second ejecting mechanism comprises that one stretches out the pin that returns that described interface interdicts described light when described second ejecting mechanism is positioned at described extended position.
4. according to the device of claim 1, it is characterized in that described optical pickocff comprises that one is used to launch the laser aid of described light, one is used for the fiber device and that described light guides to a precalculated position is used to receive the device of described light.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6198352A JPH0857914A (en) | 1994-08-23 | 1994-08-23 | Cassett type injection molding mold assembly |
| JP198352/94 | 1994-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1123218A true CN1123218A (en) | 1996-05-29 |
Family
ID=16389687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95116641A Pending CN1123218A (en) | 1994-08-23 | 1995-08-22 | Injection mold apparatus having changeable sub-molds |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH0857914A (en) |
| KR (1) | KR960007139A (en) |
| CN (1) | CN1123218A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10340379A1 (en) * | 2003-08-29 | 2005-03-24 | Klöckner Desma Elastomertechnik GmbH | Injection molding machine with vertically movable clamping unit |
| KR101036759B1 (en) * | 2010-05-20 | 2011-05-26 | 한국기계연구원 | Injection mold |
| KR101053889B1 (en) * | 2010-12-10 | 2011-08-04 | 이호형 | Camera lens molding device |
| KR102171537B1 (en) | 2018-06-21 | 2020-10-29 | 지오네이션 주식회사 | Resin transfer molding method using the mold capable of rapid heating and cooling |
| JP2020049807A (en) * | 2018-09-27 | 2020-04-02 | 日本電産株式会社 | Mold device |
-
1994
- 1994-08-23 JP JP6198352A patent/JPH0857914A/en active Pending
-
1995
- 1995-08-22 CN CN95116641A patent/CN1123218A/en active Pending
- 1995-08-22 KR KR1019950025827A patent/KR960007139A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960007139A (en) | 1996-03-22 |
| JPH0857914A (en) | 1996-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Applicant after: Seiko Precision Inc. Applicant before: Seikosha Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SEIKOSHA CO., LTD. TO: SEIKO PRECISION KK |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |