CN112296536A - Aluminum substrate cutting method based on carbon dioxide laser and optical fiber laser, aluminum substrate cutting device and control method thereof - Google Patents
Aluminum substrate cutting method based on carbon dioxide laser and optical fiber laser, aluminum substrate cutting device and control method thereof Download PDFInfo
- Publication number
- CN112296536A CN112296536A CN202011140022.XA CN202011140022A CN112296536A CN 112296536 A CN112296536 A CN 112296536A CN 202011140022 A CN202011140022 A CN 202011140022A CN 112296536 A CN112296536 A CN 112296536A
- Authority
- CN
- China
- Prior art keywords
- aluminum substrate
- cutting
- carbon dioxide
- plate
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the field of aluminum substrate production, in particular to an aluminum substrate cutting method based on carbon dioxide laser and optical fiber laser, an aluminum substrate cutting device based on carbon dioxide laser and optical fiber laser and a control method thereof, wherein the aluminum substrate comprises the following components: the aluminum substrate is covered with a paint layer, an insulating layer is arranged between the paint layer and the aluminum substrate, a cutting gap is formed in the paint layer, and the aluminum substrate cutting method comprises the following steps: cutting the insulating layer along the cutting gap on the paint layer by using carbon dioxide laser, wherein the width of the carbon dioxide laser is smaller than that of the cutting gap on the paint layer; and cutting the aluminum substrate along the cutting gap on the paint layer by using optical fiber laser, wherein the width of the optical fiber laser is smaller than that of the cutting gap on the insulating layer. According to the cutting effect of different lasers on different materials, the insulating layer is cut by the aid of carbon dioxide laser, and the aluminum substrate is cut by the aid of optical fiber laser, so that burrs or adhering slag can be prevented from being generated in the cutting process.
Description
Technical Field
The invention relates to the field of aluminum substrate production, in particular to an aluminum substrate cutting method based on carbon dioxide laser and optical fiber laser, an aluminum substrate cutting device and a control method of the aluminum substrate cutting device.
Background
Laser cutting means that a high-power-density laser beam is used for irradiating a material to be cut, the material is quickly heated to a vaporization temperature and is evaporated to form holes, and the holes continuously form slits with narrow widths along with the movement of the material by the light beam, so that the material is cut. Since there is no tooling cost, the laser cutting apparatus is also suitable for producing small batches of parts of various sizes that could not be machined previously. Laser cutting equipment typically employs computerized numerical control technology devices. With this device, a computer aided design workstation can be used to receive cutting data using a telephone line.
However, when the aluminum substrate is cut by laser, the aluminum substrate is not fixed in place because the aluminum substrate is placed on the operating table, so that the aluminum substrate is stressed to deviate when the aluminum substrate is cut by laser, and the cut part is bent; and when the cutting, the piece that aluminium base board produced when the cutting can splash to leave over on the operation panel, influence putting of aluminium base board, and the piece drops on the aluminium base board of not cutting, can influence the cutting of aluminium base board.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides an aluminum substrate cutting device based on carbon dioxide laser and optical fiber laser and a cutting method thereof.
The technical scheme adopted by the invention for solving the technical problems is as follows:
according to the method for cutting the aluminum substrate based on the carbon dioxide laser and the optical fiber laser, the aluminum substrate comprises the following components: the aluminum substrate is covered with a paint layer, an insulating layer is arranged between the paint layer and the aluminum substrate, a cutting gap is formed in the paint layer, and the aluminum substrate cutting method comprises the following steps: s1, cutting the insulating layer along the cutting gap on the paint layer by using carbon dioxide laser, wherein the width of the carbon dioxide laser is smaller than that of the cutting gap on the paint layer; and S2, cutting the aluminum substrate along the cutting gap on the paint layer by using the optical fiber laser, wherein the width of the optical fiber laser is smaller than that of the cutting gap on the insulating layer.
The aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser comprises a base, an operating platform, a limiting mechanism, a blocking mechanism, a cleaning mechanism and a cutting mechanism, the base for supporting is provided with the operating platform for supporting the aluminum substrate, the operating platform for supporting the aluminum substrate is provided with the limiting mechanism for fixing the aluminum substrate, the operating platform for supporting the aluminum substrate is connected with the blocking mechanism for blocking splashed scraps when the aluminum substrate is cut, the operating table for supporting the aluminum substrate is fixed with the cleaning mechanism for cleaning the debris, the blocking mechanism for blocking the debris splashed when the aluminum substrate is cut is fixed with the cleaning mechanism for cleaning the debris, the cutting mechanism for cutting the aluminum substrate is fixed on the blocking mechanism for blocking splashed scraps generated when the aluminum substrate is cut.
Specifically, stop gear includes first pneumatic cylinder, push pedal, baffle, rotation post and first motor, first pneumatic cylinder is fixed in the operation panel, first pneumatic cylinder is fixed with the push pedal, push pedal sliding connection in the operation panel, the baffle passes through rotate the post rotate connect in the operation panel is kept away from the one end of push pedal, it has cup jointed to rotate the post the baffle, it is connected with to rotate the post rotation the operation panel.
Specifically, the blocking mechanism comprises a supporting plate, a second motor, a first slide rail, a first screw rod, a first slide block, a partition plate, a pressing plate, a scraping plate, a third motor, a second screw rod, a second slide block, a second slide rail and a limiting block, wherein the supporting plate is connected to the operating platform in a sliding manner, the second motor is fixedly installed on the operating platform, the second motor is sleeved on the first screw rod, the first screw rod is in threaded connection with the supporting plate, the first slide rail is fixedly connected to the side wall of the supporting plate, the second slide rail is fixed to the side wall of the supporting plate, which is far away from the first slide rail, the third motors are respectively provided with two third motors, the two third motors are respectively and fixedly installed on the first slide rail and the second slide rail, the two third motors are both sleeved on the second screw rod, the two second screw rods are respectively and rotatably connected to the first slide rail and the second slide rail, the first sliding block is in threaded connection with the second screw rod inside the first sliding rail, the first sliding block is connected with the first sliding rail in a sliding mode, the second sliding block is connected with the second sliding rail in a threaded mode, the second sliding block is connected with the second sliding rail in a sliding mode, the second sliding block is fixed with the limiting block, the limiting block is connected with the second sliding rail in a sliding mode, the second sliding rail is of a rectangular structure with an open bottom end, the two separating plates are arranged, one end of each separating plate which is in a T shape is fixed to the first sliding block, the other end of each separating plate is fixed to the second sliding block, the bottom end of each separating plate is fixed to the top end of the pressing plate, the two separating plates are connected to the supporting plate in a sliding mode, the two separating plates are symmetrically arranged relative to the central line of the supporting plate, one side of the pressing plate, which is close to the central line of The pressing plates are provided with two pressing plates, and the scraping plates are fixed on one side, close to the push plate, of the pressing plates close to the push plate.
Specifically, cutting mechanism includes fixed plate, third screw rod, third slider, second pneumatic cylinder, cutting head and fourth motor, the fixed plate is fixed in the top of backup pad, the fourth motor install in the fixed plate, the fourth motor has cup jointed the third screw rod, the third screw rod rotate connect in the fixed plate, third slider sliding connection in the fixed plate, the third slider with threaded connection between the third screw rod, the bottom mounting of third slider has the second pneumatic cylinder, the second pneumatic cylinder deviates from the one end of third slider is installed the cutting head, the cutting head is equipped with two between the baffle.
Specifically, clearance mechanism includes electric putter, clearance board and collects the frame, electric putter is fixed in the bottom of second slider, electric putter is fixed with the clearance board, the thickness of clearance board equals the thickness of clamp plate, just the clearance board with the clamp plate is in the coplanar, collect the frame snap connect in the operation panel is close to one side of first slide rail.
According to the third aspect of the invention, the control method of the aluminum substrate cutting device based on the carbon dioxide laser and the fiber laser comprises the following steps:
s1: removing the insulating layer on the aluminum substrate in a seam width of 0.15MM reserved on the paint layer by using an aluminum substrate cutting device which is provided with a carbon dioxide laser head and is based on carbon dioxide laser and fiber laser, and requiring the precision of laser removal of the insulating layer to be controlled within 0.01MM, so that the seam width of 0.12MM is reserved on the insulating layer, the aluminum plate at the bottom layer is completely exposed, and the paint is not damaged;
s2: and then, a carbon dioxide laser head on the aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser is replaced by the optical fiber laser head, the optical fiber laser head is used for cutting the aluminum substrate on a 0.12MM bare aluminum plate without an insulating layer by using the optical fiber laser, and the laser cutting precision is required to be controlled within 0.01MM, so that the aluminum substrate can be conveniently cut with a smooth cutting surface and without burrs.
The invention has the beneficial effects that:
(1) according to the aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser and the cutting method thereof, the blocking mechanism is fixed on the operating platform, and scraps generated during the cutting of the aluminum substrate are blocked and collected through the blocking mechanism, so that the collection and the cleaning of the scraps are facilitated, and the cutting of the aluminum substrate is facilitated; namely: when the aluminum substrate cutting device is used, firstly, the position of the pressing plate is adjusted according to the thickness of an aluminum substrate to be cut, the third motor drives the second screw rod to rotate, the first sliding block and the second sliding block respectively drive the partition plates to move in the first sliding rail and the second sliding rail, so that the distance between the bottom end of the pressing plate and the top surface of the bottom end of the operating platform is equal to the thickness of the aluminum substrate, then, when the aluminum substrate is required to be cut, the second motor drives the first screw rod to rotate to drive the supporting plate to slide on the operating platform, so that the distance between the baffle plate and the middle of the supporting plate is equal to the distance between the aluminum substrate to be cut, when the supporting plate moves, the scraper on the pressing plate moves towards the direction of the pushing plate, the top end of the aluminum substrate is cleaned, so that when the cutting mechanism is used for cutting, dirt is prevented from influencing the laser cutting of, the cutting is convenient, and the aluminum substrate is prevented from being deviated during cutting; and when cutting, the splashed debris on the aluminum substrate is blocked by the partition plate, so that the collection of the debris is facilitated.
(2) According to the aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser and the cutting method thereof, the cleaning mechanism is fixed on the blocking mechanism, the cleaning mechanism is fixed on the operating platform, and the cleaning mechanism is used for cleaning and collecting the debris on the blocking mechanism and the aluminum substrate, so that the debris can be conveniently treated: namely: when the cutting machine is used, the electric push rod drives the cleaning plate to move towards the collecting frame to clean the chips on the aluminum substrate between the two partition plates and push the chips into the collecting frame, so that the chips are conveniently cleaned, then, the second motor rotates again, and the second motor drives the first screw rod to rotate, so that the supporting plate moves towards the direction away from the baffle plate again, moves to the next cutting point and then performs cutting; after the aluminum substrate is completely cut, the first motor starts to rotate, the baffle plate rotates in the direction away from the operating platform, the baffle plate is opened, the first hydraulic cylinder starts to drive the push plate to push the cut aluminum substrate, the aluminum substrate is pushed out from the operating platform, and chips falling on the operating platform are also pushed out to clean the operating platform, so that the device is beneficial to next use.
(3) According to the aluminum substrate cutting device and the cutting method based on the carbon dioxide laser and the optical fiber laser, the limiting mechanism is arranged on the operating platform, and the aluminum substrate is positioned by the limiting mechanism, so that the aluminum substrate is prevented from inclining and is convenient to cut; when using, switch on, first motor begins to rotate, first motor drives rotates the post and rotates the direction rotation of fixed baffle on the post from the operation panel to the back, then put aluminium base board on the operation panel, put the back at aluminium base board, first motor antiport, rotate the post and rotate the fixed baffle antiport on the post, make the baffle conflict operation panel, then first pneumatic cylinder begins to work, first pneumatic cylinder drives the push pedal and removes to the direction of baffle, the push pedal promotes aluminium base board until the one end conflict baffle that aluminium base board deviates from the baffle, thereby be convenient for the location of aluminium base board, make things convenient for the cutting of aluminium base board.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a flow chart of a carbon dioxide laser and fiber laser based aluminum substrate cutting method according to an embodiment of the invention;
fig. 2 is a schematic overall structural diagram of an aluminum substrate cutting device based on carbon dioxide laser and fiber laser according to a preferred embodiment of the present invention;
FIG. 3 is a schematic view of the connection between the blocking mechanism and the cutting mechanism shown in FIG. 2;
FIG. 4 is a schematic view of the connection structure of the operation table and the cleaning mechanism shown in FIG. 2;
FIG. 5 is an enlarged view of portion A of FIG. 4;
FIG. 6 is a schematic view of a connection structure between the console and the limiting mechanism shown in FIG. 2;
fig. 7 is a control method of an aluminum substrate cutting device based on a carbon dioxide laser and a fiber laser according to an embodiment of the invention.
In the figure: 1. the cutting machine comprises a base, 2, an operating platform, 3, a limiting mechanism, 31, a first hydraulic cylinder, 32, a push plate, 33, a baffle, 34, a rotating column, 35, a first motor, 4, a blocking mechanism, 41, a supporting plate, 42, a second motor, 43, a first sliding rail, 44, a first screw rod, 45, a first sliding block, 46, a baffle, 47, a pressing plate, 48, a scraping plate, 49, a third motor, 49a, a second screw rod, 49b, a second sliding block, 49c, a second sliding rail, 49d, a limiting block, 5, a cleaning mechanism, 51, an electric push rod, 52, a cleaning plate, 53, a collecting frame, 6, a cutting mechanism, 61, a fixing plate, 62, a third screw rod, 63, a third sliding block, 64, a second hydraulic cylinder, 65 and a drill bit.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1, according to an embodiment of the first aspect of the present invention, the method for cutting an aluminum substrate based on a carbon dioxide laser and a fiber laser includes: the aluminum substrate is covered with a paint layer, an insulating layer is arranged between the paint layer and the aluminum substrate, a cutting gap is formed in the paint layer, and the aluminum substrate cutting method comprises the following steps: s1, cutting the insulating layer along the cutting gap on the paint layer by using carbon dioxide laser, wherein the width of the carbon dioxide laser is smaller than that of the cutting gap on the paint layer; and S2, cutting the aluminum substrate along the cutting gap on the paint layer by using the optical fiber laser, wherein the width of the optical fiber laser is smaller than that of the cutting gap on the insulating layer.
At present, the laser cutting of aluminum substrates is carried out by adopting optical fiber laser with the wavelength of 1064NM for one-time cutting, and burrs or slag adhering can be generated no matter the aluminum substrates are cut from a paint surface or a back aluminum surface, because the optical fiber laser with the wavelength of 1064NM has a good aluminum plate cutting effect, but the effect of cutting an insulating layer adhered to an aluminum plate is poor, so that aluminum slag and the molten insulating layer (resin component) are adhered together to form the burrs or the slag adhering during cutting.
Aiming at the characteristics of the aluminum substrate, in order to achieve the cutting effect, the cutting surface is smooth and tidy. The absorption rates of the laser combined with different wave bands to different substances are different, or different substances need to be cut by different waves. Firstly, removing a paint layer on an aluminum substrate by using a carbon dioxide laser, removing 0.12MM of an insulating layer with the line width of only 0.15MM from the aluminum substrate, and completely exposing the aluminum plate at the bottom layer, but not damaging paint, wherein the precision of removing the insulating layer by using the laser is required to be controlled within 0.01MM, and then cutting the aluminum substrate on the 0.12MM bare aluminum plate without the insulating layer by using the optical fiber laser, so that the cutting surface is smooth and has no burrs, the laser cutting width of the optical fiber is controlled within 0.1MM, and the precision is controlled within 0.01 MM. Wherein, the wavelength of carbon dioxide is: 10600 nm, fiber cut wavelength: 1064 nm; aiming at different absorption rates of different wavelengths of laser to different substances, the cutting surface of the aluminum substrate can be smooth, burr-free and tidy;
as shown in fig. 2 to 7, the aluminum substrate cutting device based on carbon dioxide laser and fiber laser and the cutting method thereof according to the present invention include the following steps:
s1: firstly, the aluminum substrate comprises a three-layer structure of a paint layer, an insulating layer and an aluminum removing layer, a carbon dioxide laser head is firstly installed on an aluminum substrate cutting device based on carbon dioxide laser and optical fiber laser, and the paint layer on the aluminum substrate is removed, so that a seam width of 0.15MM is reserved on the paint layer;
s2: removing the insulating layer on the aluminum substrate in a seam width of 0.15MM reserved on the paint layer by using an aluminum substrate cutting device which is provided with a carbon dioxide laser head and is based on carbon dioxide laser and fiber laser, and requiring the precision of laser removal of the insulating layer to be controlled within 0.01MM, so that the seam width of 0.12MM is reserved on the insulating layer, the aluminum plate at the bottom layer is completely exposed, and the paint is not damaged;
s3: then, a carbon dioxide laser head on the aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser is replaced by the optical fiber laser head, the optical fiber laser head is used for cutting the aluminum substrate on a 0.12MM bare aluminum plate without an insulating layer, the laser cutting precision is required to be controlled within 0.01MM, and the aluminum substrate can be conveniently cut with a smooth cutting surface and without burrs;
wherein the aluminum substrate cutting device based on carbon dioxide laser and optical fiber laser in S1, S2 and S3 comprises a base 1, an operating platform 2, a limiting mechanism 3, a blocking mechanism 4, a cleaning mechanism 5 and a cutting mechanism 6, the base 1 for supporting is provided with the operating platform 2 for supporting the aluminum substrate, the operating platform 2 for supporting the aluminum substrate is provided with the limiting mechanism 3 for fixing the aluminum substrate, the operating platform 2 for supporting the aluminum substrate is connected with a blocking mechanism 4 for blocking splashed scraps when the aluminum substrate is cut, the operation table 2 for supporting the aluminum substrate is fixed with the cleaning mechanism 5 for cleaning the debris, the blocking mechanism 4 for blocking the splashed debris when the aluminum substrate is cut is fixed to the cleaning mechanism 5 for cleaning the debris, the cutting mechanism 6 for cutting the aluminum substrate is fixed to the blocking mechanism 4 for blocking the splashed debris when the aluminum substrate is cut.
Specifically, the limiting mechanism 3 includes a first hydraulic cylinder 31, a push plate 32, a baffle 33, a rotating column 34 and a first motor 35, the first hydraulic cylinder 31 is fixed to the operating platform 2, the push plate 32 is fixed to the first hydraulic cylinder 31, the push plate 32 is slidably connected to the operating platform 2, the baffle 33 is rotatably connected to one end of the operating platform 2, which is far away from the push plate 32, through the rotating column 34, the rotating column 34 is sleeved with the baffle 33, and the rotating column 34 is rotatably connected to the operating platform 2; when the aluminum substrate cutting machine is used, a power supply is switched on, the first motor 35 starts to rotate, the first motor 35 drives the rotating column 34 and the baffle 33 fixed on the rotating column 34 to rotate in the direction away from the operating platform 2, then an aluminum substrate is placed on the operating platform 2, after the aluminum substrate is placed, the first motor 35 rotates reversely, the rotating column 34 and the baffle 33 fixed on the rotating column 34 rotate reversely, the baffle 33 abuts against the operating platform 2, then the first hydraulic cylinder 31 starts to work, the first hydraulic cylinder 31 drives the push plate 32 to move in the direction of the baffle 33, and the push plate 32 pushes the aluminum substrate until one end of the aluminum substrate, which is far away from the baffle 33, abuts against the baffle 33, so that the positioning of the aluminum substrate is facilitated, and the cutting of the aluminum substrate is facilitated.
Specifically, the blocking mechanism 4 includes a supporting plate 41, a second motor 42, a first sliding rail 43, a first screw 44, a first slider 45, a partition 46, a pressing plate 48, a scraping plate 48, a third motor 49, a second screw 49a, a second slider 49b, a second sliding rail 49c, and a limiting block 49d, the supporting plate 41 is slidably connected to the console 2, the second motor 42 is fixedly installed on the console 2, the second motor 42 is sleeved on the first screw 44, the first screw 44 is in threaded connection with the supporting plate 41, the first sliding rail 43 is fixedly connected to a side wall of the supporting plate 41, the second sliding rail 49c is fixed to a side wall of the supporting plate 41 away from the first sliding rail 43, the third motors 49 are respectively provided with two, the two third motors 49 are respectively fixedly installed on the first sliding rail 43 and the second sliding rail 49c, the two third motors 49 are respectively sleeved with the second screw rods 49a, the two second screw rods 49a are respectively rotatably connected to the first slide rail 43 and the second slide rail 49c, the first slider 45 is in threaded connection with the second screw rods 49a inside the first slide rail 43, the first slider 45 is slidably connected to the first slide rail 43, the second slider 49b is in threaded connection with the second screw rods 49a between the second slider 49b and the second slide rail 49c, the second slider 49b is slidably connected to the second slide rail 49c, the second slider 49b is fixed with the limit block 49d, the limit block 49d is slidably connected to the second slide rail 49c, the second slide rail 49c is in a rectangular structure with an opening at the bottom end, the partition plate 46 is provided with two T-shaped partition plates 46, one end of each T-shaped partition plate 46 is fixed to the first slider 45, the other end of the partition plate 46 is fixed to the second slider 49b, the bottom end of the partition plate 46 is fixed to the top end of the pressing plate 48, the partition plate 46 is slidably connected to the supporting plate 41, the two partition plates 46 are symmetrically arranged about the center line of the supporting plate 41, one side of the side wall of the pressing plate 48 close to the center line of the supporting plate 41 and one side of the side wall of the partition plate 46 close to the center line of the supporting plate 41 are in the same straight line, two pressing plates 48 are provided, and the scraper 48 is fixed to one side of the pressing plate 48 close to the pushing plate 32, which is close to the pushing; when the aluminum base cutting machine is used, firstly, the power supply is switched on, then the position of the pressure plate 48 is adjusted according to the thickness of an aluminum base plate to be cut, the third motor 49 drives the second screw rod 49a to rotate, the first slide block 45 and the second slide block 49b respectively drive the partition plate 46 to move in the first slide rail 43 and the second slide rail 49c, so that the distance between the bottom end of the pressure plate 48 and the top surface of the bottom end of the operating platform 2 is equal to the thickness of the aluminum base plate, then when the cutting is required, the second motor 42 drives the first screw rod 44 to rotate, so that the support plate 41 is driven to slide on the operating platform 2, so that the distance between the baffle plate 33 and the middle of the support plate 41 is equal to the distance between the aluminum base plates to be cut, when the support plate 41 moves, when the scraper 48 on the pressure plate 48 moves towards the direction of the push plate 32, the top end of the aluminum substrate is cleaned, so that dirt is prevented from influencing the laser cutting of the aluminum substrate when the cutting mechanism 6 is used for cutting, parts at two ends of a cutting line of the aluminum substrate to be cut are fixed through the pressing plate 48, the cutting is convenient, and the aluminum substrate is prevented from deviating during cutting; and the splashed chips on the aluminum substrate are caught by the partition plate 46 at the time of cutting, thereby facilitating the collection of the chips.
Specifically, the cutting mechanism 6 includes a fixing plate 61, a third screw 62, a third slider 63, a second hydraulic cylinder 64, a cutting head 65 and a fourth motor 66, the fixing plate 61 is fixed to the top end of the supporting plate 41, the fourth motor 66 is mounted on the fixing plate 61, the fourth motor 66 is sleeved on the third screw 62, the third screw 62 is rotatably connected to the fixing plate 61, the third slider 63 is slidably connected to the fixing plate 61, the third slider 63 is in threaded connection with the third screw 62, the second hydraulic cylinder 64 is fixed to the bottom end of the third slider 63, the cutting head 65 is mounted at one end of the second hydraulic cylinder 64, which is away from the third slider 63, and the cutting head 65 is disposed between two partition plates 46; when the cutting machine is used, after the supporting plate 41 is fixed, the second hydraulic cylinder 64 drives the cutting head 65 to move, so that the cutting head 65 is close to the aluminum substrate, the fourth motor 66 drives the third screw 62 to rotate, so that the third slider 63 slides on the fixing plate 61, the cutting head 65 cuts the aluminum substrate, and when the cutting head 65 cuts, the generated scraps are blocked by the two partition plates 46 when splashed.
Specifically, the cleaning mechanism 5 includes an electric push rod 51, a cleaning plate 52 and a collecting frame 53, the electric push rod 51 is fixed at the bottom end of the second slider 49b, the cleaning plate 52 is fixed on the electric push rod 51, the thickness of the cleaning plate 52 is equal to that of the pressing plate 48, the cleaning plate 52 and the pressing plate 48 are in the same plane, and the collecting frame 53 is connected to one side of the operating platform 2 close to the first slide rail 43 in a clamping manner; when the cutting machine is used, the electric push rod 51 drives the cleaning plate 52 to move towards the collecting frame 53, so as to clean the chips on the aluminum substrate between the two partition plates 46 and push the chips into the collecting frame 53, so that the chips are conveniently cleaned, then the second motor 42 rotates again, the second motor 42 drives the first screw rod 44 to rotate, so that the supporting plate 41 moves towards the direction away from the baffle plate 33 again, moves to the next cutting point, and then performs cutting; after the aluminum substrate is completely cut, the first motor 35 starts to rotate, so that the baffle plate 33 rotates in a direction away from the operating platform 2, the baffle plate 33 is opened, the first hydraulic cylinder 31 starts to drive the push plate 32 to push the cut aluminum substrate, the aluminum substrate is pushed out from the operating platform 2, and the scraps falling on the operating platform 2 are also pushed out, so that the operating platform 2 is cleaned, and the next use of the device is facilitated.
When the cutting machine is used, a power supply is switched on, then the position of the pressing plate 48 is adjusted according to the thickness of an aluminum substrate to be cut, the third motor 49 drives the second screw rod 49a to rotate, the first sliding block 45 and the second sliding block 49b drive the partition plate 46 to move in the first sliding rail 43 and the second sliding rail 49c respectively, and therefore the distance between the bottom end of the pressing plate 48 and the top surface of the bottom end of the operating platform 2 is equal to the thickness of the aluminum substrate; the first motor 35 starts to rotate, the first motor 35 drives the rotating column 34 and the baffle 33 fixed on the rotating column 34 to rotate in a direction away from the operating platform 2, then an aluminum substrate is placed on the operating platform 2, after the aluminum substrate is placed, the first motor 35 rotates in a reverse direction, the rotating column 34 and the baffle 33 fixed on the rotating column 34 rotate in a reverse direction, so that the baffle 33 abuts against the operating platform 2, then the first hydraulic cylinder 31 starts to work, the first hydraulic cylinder 31 drives the push plate 32 to move in the direction of the baffle 33, and the push plate 32 pushes the aluminum substrate until one end of the aluminum substrate, which is away from the baffle 33, abuts against the baffle 33; the second motor 42 drives the first screw 44 to rotate, and drives the support plate 41 to slide on the operating table 2, so that the distance from the baffle plate 33 to the middle of the support plate 41 is equal to the distance of the aluminum substrate to be cut, when the support plate 41 moves, and when the scraper 48 on the pressure plate 48 moves towards the direction of the push plate 32, the top end of the aluminum substrate is cleaned, so that when the cutting mechanism 6 is used for cutting, dirt is prevented from affecting laser cutting of the aluminum substrate, and parts at two ends of a cutting line of the aluminum substrate to be cut are fixed through the pressure plate 48, so that cutting is facilitated, and the aluminum substrate is prevented from deviating during cutting; and when cutting, the splashed scraps on the aluminum substrate are blocked by the partition plate 46, so that the collection of the scraps is facilitated; after the supporting plate 41 is fixed, the second hydraulic cylinder 64 drives the cutting head 65 to move, so that the cutting head 65 approaches the aluminum substrate, the fourth motor 66 drives the third screw 62 to rotate, so that the third slider 63 slides on the fixing plate 61, and the cutting head 65 cuts the aluminum substrate, and when the cutting head 65 cuts, the generated scraps are blocked by the two partition plates 46 when splashed; after the cutting is completed, the electric push rod 51 drives the cleaning plate 52 to move towards the collecting frame 53, so as to clean the chips on the aluminum substrate between the two partition plates 46, and push the chips into the collecting frame 53, so as to facilitate the cleaning of the chips, then, the second motor 42 rotates again, the second motor 42 drives the first screw 44 to rotate, so that the supporting plate 41 moves towards the direction away from the baffle 33 again, moves to the next cutting point, and then performs the cutting; after the aluminum substrate is completely cut, the first motor 35 starts to rotate, so that the baffle plate 33 rotates in a direction away from the operating platform 2, the baffle plate 33 is opened, the first hydraulic cylinder 31 starts to drive the push plate 32 to push the cut aluminum substrate, the aluminum substrate is pushed out from the operating platform 2, and the scraps falling on the operating platform 2 are also pushed out, so that the operating platform 2 is cleaned, and the next use of the device is facilitated.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the embodiments and descriptions given above are only illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. A method for cutting an aluminum substrate based on carbon dioxide laser and fiber laser is characterized in that the aluminum substrate comprises: the aluminum substrate is covered with a paint layer, an insulating layer is arranged between the paint layer and the aluminum substrate, a cutting gap is formed in the paint layer, and the aluminum substrate cutting method comprises the following steps:
s1, cutting the insulating layer along the cutting gap on the paint layer by using carbon dioxide laser, wherein the width of the carbon dioxide laser is smaller than that of the cutting gap on the paint layer;
and S2, cutting the aluminum substrate along the cutting gap on the paint layer by using the optical fiber laser, wherein the width of the optical fiber laser is smaller than that of the cutting gap on the insulating layer.
2. The method for cutting the aluminum substrate based on the carbon dioxide laser and the fiber laser as claimed in claim 1, wherein: the cutting gap on the paint layer is 0.15mm, the width of the carbon dioxide laser is 0.13mm, and the width of the optical fiber laser is 0.11 mm.
3. The utility model provides an aluminium base board cutting device based on carbon dioxide laser and fiber laser, characterized in that, including base (1), operation panel (2), stop gear (3), stop gear (4), clearance mechanism (5) and cutting mechanism (6), be used for supporting install on base (1) and be used for supporting aluminium base board operation panel (2) are installed and are used for fixed aluminium base board stop gear (3), are used for supporting aluminium base board operation panel (2) sliding connection have be used for separating the piece that spatters when aluminium base board cuts stop gear (4), be used for supporting aluminium base board operation panel (2) are fixed with be used for cleaning the piece clearance mechanism (5), be used for separating the piece that aluminium base board cuts the piece that spatters stop gear (4) and be fixed in be used for cleaning the piece clearance mechanism (5), the cutting mechanism (6) for cutting the aluminum substrate is fixed to the blocking mechanism (4) for blocking the splashed debris when the aluminum substrate is cut.
4. The aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser as claimed in claim 3, wherein: stop gear (3) include first pneumatic cylinder (31), push pedal (32), baffle (33), rotate post (34) and first motor (35), first pneumatic cylinder (31) are fixed in operation panel (2), first pneumatic cylinder (31) are fixed with push pedal (32), push pedal (32) sliding connection in operation panel (2), baffle (33) pass through rotate post (34) rotate connect in operation panel (2) are kept away from the one end of push pedal (32), it has cup jointed to rotate post (34) baffle (33), it is connected with to rotate post (34) rotation operation panel (2).
5. The aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser as claimed in claim 4, wherein: the blocking mechanism (4) comprises a supporting plate (41), a second motor (42), a first sliding rail (43), a first screw rod (44), a first sliding block (45), a partition plate (46), a pressing plate (48), a scraping plate (48), a third motor (49), a second screw rod (49a), a second sliding block (49b), a second sliding rail (49c) and a limiting block (49d), the supporting plate (41) is connected to the operating platform (2) in a sliding mode, the second motor (42) is fixedly installed on the operating platform (2), the second motor (42) is sleeved on the first screw rod (44), the first screw rod (44) is in threaded connection with the supporting plate (41), the first sliding rail (43) is fixedly connected to the side wall of the supporting plate (41), and the second sliding rail (49c) is fixed to the side wall of the supporting plate (41) deviating from the first sliding rail (43), the number of the third motors (49) is two, the two third motors (49) are fixedly mounted on the first sliding rail (43) and the second sliding rail (49c) respectively, the two third motors (49) are sleeved with the second screw rods (49a), the two second screw rods (49a) are rotatably connected to the first sliding rail (43) and the second sliding rail (49c) respectively, the first sliding block (45) is in threaded connection with the second screw rods (49a) inside the first sliding rail (43), the first sliding block (45) is in sliding connection with the first sliding rail (43), the second sliding block (49b) is in threaded connection with the second screw rods (49a) between the second sliding rail (49c), the second sliding block (49b) is in sliding connection with the second sliding rail (49c), and the second sliding block (49b) is fixed with the limit blocks (49d), stopper (49d) sliding connection in second slide rail (49c), second slide rail (49c) are bottom open-ended rectangle structure, baffle (46) are equipped with two, are the T shape the one end of baffle (46) is fixed in first slider (45), the other end of baffle (46) is fixed in second slider (49b), the bottom mounting of baffle (46) is in the top of clamp plate (48), baffle (46) sliding connection in backup pad (41), two baffle (46) about the central line symmetry setting of backup pad (41), the lateral wall of clamp plate (48) is close to one side of backup pad (41) central line with the lateral wall of baffle (46) is close to one side of backup pad (41) central line is in same straight line, clamp plate (48) are equipped with two, scraper blade (48) are fixed in and are close to push pedal (32) clamp plate (48) are close to the push pedal (32) of push plate (48) is close to the rectangle structure of push pedal (32) One side.
6. The aluminum substrate cutting device based on the carbon dioxide laser and the fiber laser as claimed in claim 5, wherein: the cutting mechanism (6) comprises a fixing plate (61), a third screw rod (62), a third sliding block (63), a second hydraulic cylinder (64), a cutting head (65) and a fourth motor (66), the fixing plate (61) is fixed at the top end of the supporting plate (41), the fourth motor (66) is installed on the fixing plate (61), the third screw rod (62) is sleeved on the fourth motor (66), the third screw rod (62) is rotatably connected to the fixing plate (61), the third sliding block (63) is slidably connected to the fixing plate (61), the third sliding block (63) is in threaded connection with the third screw rod (62), the second hydraulic cylinder (64) is fixed at the bottom end of the third sliding block (63), and the cutting head (65) is installed at one end, deviating from the third sliding block (63), of the second hydraulic cylinder (64), the cutting head (65) is arranged between the two partition plates (46).
7. The aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser as claimed in claim 6, wherein: clearance mechanism (5) are including electric putter (51), clearance board (52) and collection frame (53), electric putter (51) are fixed in the bottom of second slider (49b), electric putter (51) are fixed with clearance board (52), the thickness of clearance board (52) equals the thickness of clamp plate (48), just clearance board (52) with clamp plate (48) are in the coplanar, collect frame (53) block connect in operation panel (2) are close to one side of first slide rail (43).
8. The method for controlling the aluminum substrate cutting device based on the carbon dioxide laser and the fiber laser as claimed in claims 2 to 7, wherein the method comprises the following steps:
s1: removing the insulating layer on the aluminum substrate in a seam width of 0.15MM reserved on the paint layer by using an aluminum substrate cutting device which is provided with a carbon dioxide laser head and is based on carbon dioxide laser and optical fiber laser, wherein the precision of removing the insulating layer by using the laser is controlled within 0.01MM, so that the seam width of 0.12MM is reserved on the insulating layer, the aluminum plate at the bottom layer is completely exposed, and the paint is not damaged;
s2: the carbon dioxide laser head on the aluminum substrate cutting device based on the carbon dioxide laser and the optical fiber laser is replaced by the optical fiber laser head, the optical fiber laser head is used for cutting the aluminum substrate on a 0.12MM bare aluminum plate without an insulating layer by using the optical fiber laser, the laser cutting precision is required to be controlled within 0.01MM, and the smooth and burr-free cutting of the aluminum substrate is facilitated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010572585 | 2020-06-22 | ||
| CN202010572585X | 2020-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112296536A true CN112296536A (en) | 2021-02-02 |
Family
ID=74327097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011140022.XA Pending CN112296536A (en) | 2020-06-22 | 2020-10-22 | Aluminum substrate cutting method based on carbon dioxide laser and optical fiber laser, aluminum substrate cutting device and control method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112296536A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114101929A (en) * | 2021-12-08 | 2022-03-01 | 广东洛克智能科技设备有限公司 | Laser cutting process and device for aluminum-based circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961588A (en) * | 1982-09-01 | 1984-04-07 | ウエスチングハウス エレクトリック コ−ポレ−ション | Laser processing aparatus |
| DE3714504A1 (en) * | 1987-04-30 | 1988-11-10 | Lambda Physik Gmbh | Method of working materials with laser beams |
| JP2014011358A (en) * | 2012-06-29 | 2014-01-20 | Toshiba Mach Co Ltd | Laser dicing method |
| CN105473273A (en) * | 2014-02-28 | 2016-04-06 | 三菱重工业株式会社 | Laser processing method and laser processing apparatus |
| CN207495639U (en) * | 2017-12-01 | 2018-06-15 | 奥卡冷却系统（天津）有限公司 | A kind of cutting machine with dust-proof dust discharge |
| CN208450842U (en) * | 2018-05-18 | 2019-02-01 | 沈阳天达航空科技有限公司 | A kind of laser cutting device that protective performance is good |
| CN110560923A (en) * | 2019-08-23 | 2019-12-13 | 福建华清电子材料科技有限公司 | Aluminum nitride ceramic laser processing technology |
-
2020
- 2020-10-22 CN CN202011140022.XA patent/CN112296536A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961588A (en) * | 1982-09-01 | 1984-04-07 | ウエスチングハウス エレクトリック コ−ポレ−ション | Laser processing aparatus |
| DE3714504A1 (en) * | 1987-04-30 | 1988-11-10 | Lambda Physik Gmbh | Method of working materials with laser beams |
| JP2014011358A (en) * | 2012-06-29 | 2014-01-20 | Toshiba Mach Co Ltd | Laser dicing method |
| CN105473273A (en) * | 2014-02-28 | 2016-04-06 | 三菱重工业株式会社 | Laser processing method and laser processing apparatus |
| CN207495639U (en) * | 2017-12-01 | 2018-06-15 | 奥卡冷却系统（天津）有限公司 | A kind of cutting machine with dust-proof dust discharge |
| CN208450842U (en) * | 2018-05-18 | 2019-02-01 | 沈阳天达航空科技有限公司 | A kind of laser cutting device that protective performance is good |
| CN110560923A (en) * | 2019-08-23 | 2019-12-13 | 福建华清电子材料科技有限公司 | Aluminum nitride ceramic laser processing technology |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114101929A (en) * | 2021-12-08 | 2022-03-01 | 广东洛克智能科技设备有限公司 | Laser cutting process and device for aluminum-based circuit board |
| CN114101929B (en) * | 2021-12-08 | 2024-02-27 | 广东洛克智能科技设备有限公司 | Aluminum-based circuit board laser cutting equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210937701U (en) | Elbow laser cutting equipment | |
| KR0137185B1 (en) | Laser machining apparatus and method thereof | |
| CN112296536A (en) | Aluminum substrate cutting method based on carbon dioxide laser and optical fiber laser, aluminum substrate cutting device and control method thereof | |
| CN116652410A (en) | Industrial laser cutting machine | |
| CN113106441B (en) | Gantry type cladding robot | |
| CN220347504U (en) | Laser cutting equipment | |
| CN115816254A (en) | Mutual inductor spare part processing equipment | |
| CN214815834U (en) | Laser cutting device for metal piece | |
| CN114633292A (en) | Substrate pretreatment device for integrated circuit manufacturing | |
| CN213202827U (en) | Cutting knife rest of glass cutting machine | |
| CN218903679U (en) | Punching equipment for processing die steel plate | |
| CN218362775U (en) | Laser cutting machine tool capable of cutting different shapes | |
| CN115056070B (en) | Miniature hardware component burring equipment | |
| CN217071191U (en) | Laser cutting machine of quick location | |
| CN115871040B (en) | Energy-saving electric construction auxiliary device | |
| CN118386065B (en) | Special-shaped metal processing device and processing method thereof | |
| CN220408967U (en) | Die-cut paper products rim charge clearing device | |
| CN221473902U (en) | Laser cutting device with sweeps collection function | |
| CN218799563U (en) | Sawing machine for cutter machining | |
| CN218799947U (en) | Adjustable laser cutting table | |
| CN112536258B (en) | Integrated circuit board recycling and cleaning equipment | |
| CN215034114U (en) | Band sawing machine with self-cleaning function | |
| CN221516270U (en) | Edge cutter is used in new energy automobile gearbox production | |
| CN117177472B (en) | Solder stripping equipment for PCB production | |
| CN221159420U (en) | Positioning jig for cutting plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20221206 |