CN112289734A - 一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺 - Google Patents
一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺 Download PDFInfo
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Abstract
本发明公开一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,包括如下步骤:改质、键合、减薄、解键合、浸泡溶解、清洗。本发明采用有孔洞的玻璃载板配合复合式胶膜,可提供强度高的基础配合超薄晶圆背面研磨减薄的工艺,成本低量产性佳;解离释放层后,玻璃载板可解脱黏性,已无附着力,解离键合的效果好,避免因移除时外加应力,对超薄晶圆造成破片的风险。解决了现有技术中超薄晶圆解键合时玻璃载板与黏着剂之间的释放层可解构,但黏着剂本身从晶圆表面剥离所产生的应力变化对超薄晶圆的制作风险仍高,采用纯浸泡的方式,达成完全溶解剥离所须时间较长,产生效率及可行性不佳的问题。
Description
技术领域
本发明属于晶圆加工领域,具体涉及一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺。
背景技术
现有技术中超薄晶圆(35-100um)厚度的挑战在解键合时是最难克服的问题,虽然解键合时玻璃载板与黏着剂之间的释放层可解构。但黏着剂本身从晶圆表面剥离所产生的应力变化对超薄晶圆的制作风险仍高,因此比较好的方式是采用化学溶剂溶解的方式剥离黏着剂,但是若是采用纯浸泡的方式,达成完全溶解剥离所须时间较长,产生效率及可行性不佳。
本专利采用复合式胶膜结合均匀打开孔洞的玻璃载板做贴附式键合,由于不是使用涂布式的黏着剂,因此可先将玻璃载板以机械穿孔式,喷砂或飞秒激光结合选择性蚀刻的方式均匀的打开孔洞,以不影响玻璃基板整体强度为准则,开孔面积不超过总玻璃载板面积的百分之十。键合时复合式胶膜可紧密贴附于均匀开孔的玻璃载板上,经真空或照光加热后的形成紧密的键合。
接着完成背面减薄及背面元件工艺后,可进行超薄晶圆与玻璃载板的解键合工艺,此时不论是使用镭射或紫外线照射方式,可释放玻璃载板与黏着剂之间的键合,但黏着剂本身与超薄晶圆表面应力的不均及变化,破片的风险非常高。
若采用剥离去除黏着剂的方式,由于复合式胶带需使用极性高且加热的溶剂长时间才能完全去除干净,生产成本高且设备难度很高,因此比较理想的去除黏着剂解键合的方式是将有机溶剂渗透至晶圆与有机溶剂和黏着剂的界面,利用表面张力的作用加上复合胶膜本身的重力,使复合胶膜在无外加应力的状态下自然剥离晶圆的表面,如此可确保超薄晶圆不会有任何破片的风险。
发明内容
针对现有技术的不足,本发明的目的在于提供一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,解决了现有技术中保持超薄晶圆厚度在35-100um时虽然解键合时玻璃载板与黏着剂之间的释放层可解构,但黏着剂本身从晶圆表面剥离所产生的应力变化对超薄晶圆的制作风险仍高,若是采用纯浸泡的方式,达成完全溶解剥离所须时间较长,产生效率及可行性不佳的问题。
本发明的目的可以通过以下技术方案实现:
一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,包括如下步骤:
S1、改质
通过镭射照射的方式对需要蚀刻的玻璃载板部分进行改质;
S2、键合
对玻璃载板蚀刻后,将晶圆的背面向上,其正面贴附键合在复合式胶膜上,复合式胶膜贴附键合在均匀孔洞分布的玻璃载板上;
S3、减薄
对晶圆进行打磨,使其厚度减薄;
S4、解键合
在对晶圆背面加工之后,以镭射或者紫外线照射释放解键合分离玻璃载板;
S5、浸泡溶解
将晶圆背面向上,浸泡于溶解黏着剂的有机溶剂中,利用有机溶剂逐渐通过玻璃载板的孔洞渗透至玻璃载板与复合式胶膜的界面,由于表面张力及重力的交互作用,玻璃载板及复合式胶膜将逐步从晶圆正面向下剥离脱落,且复合式胶膜逐步溶解在有机溶剂中,晶圆被支撑结构支撑避免沉底;
S6、清洗
将晶圆从有机溶剂中取出清洗。
进一步的,所述S4中控制镭射时间为30—45min,控制紫外线照射时间为90—110min。
进一步的,所述S5中控制有机溶剂的浓度为22.8—27.6%,浸泡时间为2.5—4h。
本发明的有益效果:
1、本发明提出的超薄晶圆解离玻璃载板的工艺采用有孔洞的玻璃载板配合复合式胶膜,可提供强度高的基础配合超薄晶圆背面研磨减薄的工艺,成本低量产性佳;
2、本发明提出的超薄晶圆解离玻璃载板的工艺解离释放层后,玻璃载板可解脱黏性,已无附着力,解离键合的效果好,避免因移除时外加应力,对超薄晶圆造成破片的风险;
3、本发明提出的超薄晶圆解离玻璃载板的工艺开孔式玻璃载板加上复合式胶膜及溶剂浸泡法解离键合的工艺可达到最薄晶圆的生产工艺要求,最低可至35um厚度的晶圆。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明实施例的玻璃载板改质结构示意图;
图2是本发明实施例的晶圆、复合式胶膜与玻璃载板键合结构示意图;
图3是本发明实施例的晶圆减薄结构示意图;
图4是本发明实施例的玻璃载板和复合式胶膜浸泡溶解的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
在本发明的描述中,需要理解的是,术语“开孔”、“上”、“下”、“厚度”、“顶”、“中”、“长度”、“内”、“四周”等指示方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的组件或元件必须具有特定的方位,以特定的方位构造和操作,因此不能理解为对本发明的限制。
实施例1
一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,包括如下步骤:
S1、改质
通过镭射照射的方式对需要蚀刻的玻璃载板1部分进行改质,如图1所示;
S2、键合
对玻璃载板1蚀刻后,将晶圆3的背面向上,其正面贴附键合在复合式胶膜2上,复合式胶膜2贴附键合在均匀孔洞分布的玻璃载板1上,如图2所示;
S3、减薄
对晶圆3进行打磨,使其厚度减薄如图3所示;
S4、解键合
在对晶圆3背面加工之后,以镭射释放解键合分离玻璃载板1,控制镭射时间为30min;
S5、浸泡溶解
将晶圆3背面向上,浸泡于溶解黏着剂的有机溶剂4中,如图4所示,利用有机溶剂4逐渐通过玻璃载板1的孔洞渗透至玻璃载板1与复合式胶膜2的界面,由于表面张力及重力的交互作用,玻璃载板1及复合式胶膜2将逐步从晶圆3正面向下剥离脱落,且复合式胶膜2逐步溶解在有机溶剂4中,晶圆3被支撑结构5支撑避免沉底,控制有机溶剂4的浓度为27.6%,浸泡时间为2.5h;
S6、清洗
将晶圆3从有机溶剂4中取出清洗。
实施例2
一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,包括如下步骤:
S1、改质
通过镭射照射的方式对需要蚀刻的玻璃载板1部分进行改质,如图1所示;
S2、键合
对玻璃载板1蚀刻后,将晶圆3的背面向上,其正面贴附键合在复合式胶膜2上,复合式胶膜2贴附键合在均匀孔洞分布的玻璃载板1上,如图2所示;
S3、减薄
对晶圆3进行打磨,使其厚度减薄如图3所示;
S4、解键合
在对晶圆3背面加工之后,以镭射释放解键合分离玻璃载板1,控制镭射时间为45min;
S5、浸泡溶解
将晶圆3背面向上,浸泡于溶解黏着剂的有机溶剂4中,如图4所示,利用有机溶剂4逐渐通过玻璃载板1的孔洞渗透至玻璃载板1与复合式胶膜2的界面,由于表面张力及重力的交互作用,玻璃载板1及复合式胶膜2将逐步从晶圆3正面向下剥离脱落,且复合式胶膜2逐步溶解在有机溶剂4中,晶圆3被支撑结构5支撑避免沉底,控制有机溶剂4的浓度为22.8%,浸泡时间为4h;
S6、清洗
将晶圆3从有机溶剂4中取出清洗。
实施例3
一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,包括如下步骤:
S1、改质
通过镭射照射的方式对需要蚀刻的玻璃载板1部分进行改质,如图1所示;
S2、键合
对玻璃载板1蚀刻后,将晶圆3的背面向上,其正面贴附键合在复合式胶膜2上,复合式胶膜2贴附键合在均匀孔洞分布的玻璃载板1上,如图2所示;
S3、减薄
对晶圆3进行打磨,使其厚度减薄如图3所示;
S4、解键合
在对晶圆3背面加工之后,以紫外线照射释放解键合分离玻璃载板1,控制紫外线照射时间为90min;
S5、浸泡溶解
将晶圆3背面向上,浸泡于溶解黏着剂的有机溶剂4中,如图4所示,利用有机溶剂4逐渐通过玻璃载板1的孔洞渗透至玻璃载板1与复合式胶膜2的界面,由于表面张力及重力的交互作用,玻璃载板1及复合式胶膜2将逐步从晶圆3正面向下剥离脱落,且复合式胶膜2逐步溶解在有机溶剂4中,晶圆3被支撑结构5支撑避免沉底,控制有机溶剂4的浓度为25.8%,浸泡时间为3h;
S6、清洗
将晶圆3从有机溶剂4中取出清洗。
实施例4
一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,包括如下步骤:
S1、改质
通过镭射照射的方式对需要蚀刻的玻璃载板1部分进行改质,如图1所示;
S2、键合
对玻璃载板1蚀刻后,将晶圆3的背面向上,其正面贴附键合在复合式胶膜2上,复合式胶膜2贴附键合在均匀孔洞分布的玻璃载板1上,如图2所示;
S3、减薄
对晶圆3进行打磨,使其厚度减薄如图3所示;
S4、解键合
在对晶圆3背面加工之后,以紫外线照射释放解键合分离玻璃载板1,控制紫外线照射时间为110min;
S5、浸泡溶解
将晶圆3背面向上,浸泡于溶解黏着剂的有机溶剂4中,如图4所示,利用有机溶剂4逐渐通过玻璃载板1的孔洞渗透至玻璃载板1与复合式胶膜2的界面,由于表面张力及重力的交互作用,玻璃载板1及复合式胶膜2将逐步从晶圆3正面向下剥离脱落,且复合式胶膜2逐步溶解在有机溶剂4中,晶圆3被支撑结构5支撑避免沉底,控制有机溶剂4的浓度为24.0%,浸泡时间为3.5h;
S6、清洗
将晶圆3从有机溶剂4中取出清洗。
在本说明书的描述中,参考术语“一个实施例”、“示例”、“具体示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。
Claims (3)
1.一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,其特征在于,包括如下步骤:
S1、改质
通过镭射照射的方式对需要蚀刻的玻璃载板(1)部分进行改质;
S2、键合
对玻璃载板(1)蚀刻后,将晶圆(3)的背面向上,其正面贴附键合在复合式胶膜(2)上,复合式胶膜(2)贴附键合在均匀孔洞分布的玻璃载板(1)上;
S3、减薄
对晶圆(3)进行打磨,使其厚度减薄;
S4、解键合
在对晶圆(3)背面加工之后,以镭射或者紫外线照射释放解键合分离玻璃载板(1);
S5、浸泡溶解
将晶圆(3)背面向上,浸泡于溶解黏着剂的有机溶剂(4)中,利用有机溶剂(4)逐渐通过玻璃载板(1)的孔洞渗透至玻璃载板(1)与复合式胶膜(2)的界面,由于表面张力及重力的交互作用,玻璃载板(1)及复合式胶膜(2)将逐步从晶圆(3)正面向下剥离脱落,且复合式胶膜(2)逐步溶解在有机溶剂(4)中,晶圆(3)被支撑结构(5)支撑避免沉底;
S6、清洗
将晶圆(3)从有机溶剂(4)中取出清洗。
2.根据权利要求1所述的一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,其特征在于,所述S4中控制镭射时间为30—45min,控制紫外线照射时间为90—110min。
3.根据权利要求1所述的一种有机溶剂渗透解键合超薄晶圆解离玻璃载板的工艺,其特征在于,所述S5中控制有机溶剂(4)的浓度为22.8—27.6%,浸泡时间为2.5—4h。
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