CN112278597A

CN112278597A - Packaging film and silicon wafer transport box packaging method

Info

Publication number: CN112278597A
Application number: CN202011587515.8A
Authority: CN
Inventors: 韩嘉豪
Original assignee: Xian Eswin Silicon Wafer Technology Co Ltd
Current assignee: Xian Eswin Silicon Wafer Technology Co Ltd; Xian Eswin Material Technology Co Ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-01-29

Abstract

The embodiment of the disclosure provides a packaging film and a packaging method of a silicon wafer transport box, wherein the packaging film comprises a packaging film body used for wrapping a packaged object, and an alarm circuit capable of sending an alarm signal when the packaging film is damaged is arranged on the packaging film body. The packaging film and the silicon wafer transport box packaging method provided by the embodiment of the disclosure can find the damage condition of the packaging film in time, protect the packaged object and avoid the problems of damage or pollution of the packaged object and the like caused by the damage condition.

Description

Packaging film and silicon wafer transport box packaging method

Technical Field

The invention relates to the technical field of semiconductor production and manufacturing, in particular to a packaging film and a silicon wafer transport box packaging method.

Background

The Front Opening transporting Box (FOSB for short) is a fully transparent silicon wafer transporting Box, can protect, transport and store wafers in the silicon wafer transporting process, prevents collision and friction of the wafers, and provides safety protection in the transporting and storing processes. When the silicon chip product is confirmed to need to be shipped, the silicon chip is conveyed into a clean FOSB for primary vacuum packaging, then secondary vacuum packaging is carried out by utilizing an aluminum film, and a drying agent is placed in the two packaging films. In the transportation FOSB, when FOSB encapsulation membrane broke, FOSB and outside air contact, inside silicon chip easily receives the influence of environmental factor, like metal ion and granule in the environment. Because the gas tightness of the FOSB is limited, the silicon chip in the FOSB is easy to be polluted. During the conventional storage and transportation process, the breakage of the packaging film is difficult to find in time, and the longer the packaging film is exposed to the air, the more serious the pollution is.

Disclosure of Invention

The embodiment of the disclosure provides a packaging film and a silicon wafer transport box packaging film, which can find out the damage condition of the packaging film in time, protect the packaged object, and avoid the problems of damage or pollution of the packaged object caused by the damage or the pollution.

The technical scheme provided by the embodiment of the disclosure is as follows:

the packaging film comprises a packaging film body used for wrapping the packaged object, and an alarm circuit capable of sending an alarm signal when the packaging film is damaged is arranged on the packaging film body.

Illustratively, the alarm circuit includes:

a power source;

the travel switch is arranged between the packaging film body and the object to be packaged, and is triggered to be closed when the vacuum degree of a gap between the packaging film body and the object to be packaged is a first threshold value; when the vacuum degree of a gap between the packaging film body and the packaged object is a second threshold value, the travel switch is triggered to be switched off, and the first threshold value is larger than the second threshold value;

the alarm is connected with the travel switch in parallel, wherein the travel switch is closed, and the alarm device is closed; and the travel switch is switched off, and the alarm is started.

Illustratively, be equipped with solitary deposit bag on the packaging film body, the power and the alarm is all placed in deposit the bag.

Illustratively, the alarm comprises a buzzer.

Illustratively, the alarm comprises a signal light.

Illustratively, the alarm circuit further comprises a protection resistor, the alarm and the travel switch form a parallel circuit, and the protection resistor is connected with the parallel circuit in series.

Illustratively, the packaging film is a silicon wafer transport box packaging film.

The embodiment of the disclosure also provides a silicon wafer transport box packaging method, which adopts the packaging film to package the silicon wafer transport box, and the method comprises the following steps:

and placing the silicon wafer transport box in the packaging film, vacuumizing the packaging film to compress and wrap the packaging film outside the silicon wafer transport box, wherein the vacuum degree of a gap between the packaging film body and the object to be packaged is a first threshold value.

The beneficial effects brought by the embodiment of the disclosure are as follows:

the packaging film and the silicon wafer transport box packaging method provided by the embodiment of the disclosure can alarm when the packaging film is damaged by arranging the alarm circuit on the packaging film, and can find the damaged condition of the packaging film in time to protect the packaged object, thereby avoiding the problems of damage or pollution of the packaged object caused by the damage or the pollution.

Drawings

FIG. 1 shows a schematic structural view of a packaging film provided in one embodiment of the present disclosure;

fig. 2 shows a schematic circuit diagram of an alarm circuit in a packaging film provided in an embodiment of the present disclosure.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

In order to solve the above problems, embodiments of the present disclosure provide a packaging film and a method for packaging a silicon wafer transportation box, which can find the damage condition of the packaging film in time, protect a packaged object, and avoid the problems of damage or pollution of the packaged object caused by the damage or the pollution.

As shown in fig. 1, a packaging film according to an embodiment of the present disclosure includes a packaging film body 100 for wrapping an object to be packaged, and an alarm circuit 200 capable of sending an alarm signal when the packaging film is broken is disposed on the packaging film body 100.

The packaging film provided by the embodiment of the disclosure can give an alarm when the packaging film is damaged by arranging the alarm circuit 200 on the packaging film, and the damage condition of the packaging film can be found timely, the packaged object can be protected, and the problems of damage or pollution of the packaged object caused by the damage or the pollution can be avoided.

The packaging film provided by the embodiment of the present disclosure may be applied to packaging of silicon wafer transport boxes, and may also be applied to packaging of other packaged objects.

The following description will discuss embodiments of the present disclosure, taking as an example the use of the packaging film in a silicon wafer shipping box packaging film.

In some exemplary embodiments of the present disclosure, as shown in fig. 2, the alarm circuit 200 includes:

a power supply 210;

a travel switch 220, wherein the travel switch 220 is arranged between the packaging film body 100 and the object to be packaged, and when the vacuum degree of the gap between the packaging film body 100 and the object to be packaged is a first threshold value, the travel switch 220 is triggered to be closed; when the vacuum degree of the gap between the packaging film body 100 and the object to be packaged is a second threshold value, the travel switch 220 is triggered to be switched off, wherein the first threshold value is greater than the second threshold value;

the alarm 230 is connected with the travel switch 220 in parallel, and when the travel switch 220 is closed, the alarm 230 is closed; when the travel switch 220 is turned off, the alarm 230 is activated.

In the above scheme, the alarm circuit 200 controls the alarm 230 to alarm by using the travel switch 220, specifically, in the FOSB packaging process, the alarm circuit 200 controlled by using the travel switch 220 is arranged between FOSB and the packaging bag, when the packaging is vacuumized, the packaging film is compressed and adsorbed on the FOSB surface, so as to generate pressure, under the action of the pressure, the travel switch 220 is closed, and because the travel switch 220 is connected with the alarm 230 in parallel, the loop of the alarm 230 is short-circuited and is not started;

when the packaging film takes place the damage, get into the air between packaging film and the FOSB, vacuum between packaging film and the FOSB reduces, and the packaging film is to travel switch 220 pressure sudden reduction to make travel switch 220 break off, alarm 230 forms the return circuit with power 210 this moment, reports to the police, reminds the FOSB packaging film damage.

It should be noted that the above is only an example, and in practical applications, the specific structure of the alarm circuit 200 is not limited thereto.

In addition, in some embodiments of the present disclosure, as shown in fig. 1, a separate storage pocket 110 is provided on the packaging film body 100, and the power source 210 and the alarm 230 are both disposed in the storage pocket 110.

In the above solution, the alarm circuit 200 is enclosed in the storage bag 110 of the packaging film without being in direct contact with the FOSB, thereby avoiding the generation of pollution due to the introduction of the alarm circuit 200.

Further, in some embodiments of the present disclosure, the alarm 230 includes at least one of a buzzer 231 and a signal light 232. It will be appreciated, of course, that the alarm 230 may be other types of alarms 230.

In addition, in some embodiments of the present disclosure, as shown in fig. 2, the alarm circuit 200 further includes a protection resistor 240, the alarm 230 and the travel switch 220 form a parallel circuit, and the protection resistor 240 is connected in series with the parallel circuit.

In the above solution, when the travel switch 220 is closed, the alarm 230 connected in parallel with the travel switch is short-circuited, so that a protection resistor 240 needs to be connected in series to the parallel circuit to protect the whole alarm circuit 200.

In addition, as shown in fig. 1, at least two alarm circuits 200 may be disposed at different positions on one of the packaging films to detect a damaged state of the packaging film at a plurality of detection points, thereby increasing reliability.

and placing the silicon wafer transport box in the packaging film, vacuumizing the packaging film to compress and wrap the packaging film outside the silicon wafer transport box, wherein the vacuum degree of a gap between the packaging film body 100 and the object to be packaged is a first threshold value.

The following points need to be explained: (1) the drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design. (2) For purposes of clarity, the thickness of layers or regions in the figures used to describe embodiments of the present disclosure are exaggerated or reduced, i.e., the figures are not drawn on a true scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present. (3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.

The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be determined by the scope of the claims.

Claims

1. The packaging film is characterized by comprising a packaging film body used for wrapping the object to be packaged, wherein an alarm circuit capable of sending an alarm signal when the packaging film is damaged is arranged on the packaging film body.

2. The packaging film of claim 1, wherein the alarm circuit comprises:

a power source;

3. The packaging film of claim 2, wherein a separate storage bag is arranged on the packaging film body, and the power supply and the alarm are both placed in the storage bag.

4. The packaging film of claim 2, wherein the alarm comprises a buzzer.

5. The packaging film of claim 2, wherein the alarm comprises a signal light.

6. The packaging film of claim 2, wherein the alarm circuit further comprises a protection resistor, the alarm and the travel switch form a parallel circuit, and the protection resistor is connected in series with the parallel circuit.

7. The packaging film according to any one of claims 1 to 6, wherein the packaging film is a silicon wafer shipping box packaging film.

8. A method for packaging a silicon wafer shipping box, wherein the silicon wafer shipping box is packaged by using the packaging film according to any one of claims 1 to 7, the method comprising: