CN112271168A - 线路结构 - Google Patents

线路结构 Download PDF

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Publication number
CN112271168A
CN112271168A CN202011173690.2A CN202011173690A CN112271168A CN 112271168 A CN112271168 A CN 112271168A CN 202011173690 A CN202011173690 A CN 202011173690A CN 112271168 A CN112271168 A CN 112271168A
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CN
China
Prior art keywords
pad
wire bond
routing
circuit structure
wire
Prior art date
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Pending
Application number
CN202011173690.2A
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English (en)
Inventor
周安都
骆冰峰
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Luxvisions Innovation Ltd
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Luxvisions Innovation Ltd
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Publication date
Application filed by Luxvisions Innovation Ltd filed Critical Luxvisions Innovation Ltd
Priority to CN202011173690.2A priority Critical patent/CN112271168A/zh
Publication of CN112271168A publication Critical patent/CN112271168A/zh
Priority to US17/498,761 priority patent/US20220132662A1/en
Pending legal-status Critical Current

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    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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Abstract

本发明提供一种线路结构，包括接垫组件、连接垫组件以及连接组件。接垫组件包括彼此分离的第一接垫、第二接垫以及第三接垫。连接垫组件位于接垫组件的一侧且包括第一连接垫。连接组件包括第一打线、第二打线以及多个连接件。第一打线连接第一连接垫与第一接垫。第二打线连接第一连接垫与第三接垫。连接件连接于第一接垫、第二接垫及第三接垫之间。本发明的线路结构可提高打线效率及接线点排布密度，且可减少打线的用量。

Description

线路结构
技术领域
本发明涉及一种线路结构，尤其涉及一种可提高打线效率的线路结构。
背景技术
一般来说，目前集成电路的接线方法是以打线连接的方式连接芯片端的每一个接垫与电路板上的一个共同连接垫。也就是说，每一条打线连接一个接垫与一个共同连接垫。上述的作法，不但需要使用较多的打线用量，且也会因为打线距离较长而影响打线效率。此外，因为每一接垫都需要通过打线直接连接至共同连接垫，因此单位空间内打线数排布较多，使得集成电路的接线点的空间排布利用率不足，进而影响了集成电路模块的小型化。
发明内容
本发明是针对一种线路结构，可提高打线效率及接线点排布密度，且可减少打线的用量。
根据本发明的实施例，线路结构包括接垫组件、连接垫组件以及连接组件。接垫组件包括彼此分离的第一接垫、第二接垫以及第三接垫。连接垫组件位于接垫组件的一侧且包括第一连接垫。连接组件包括第一打线、第二打线以及多个连接件。第一打线连接第一连接垫与第一接垫。第二打线连接第一连接垫与第三接垫。连接件连接于第一接垫、第二接垫及第三接垫之间。
在根据本发明的实施例的线路结构中，芯片包括接垫组件，而电路板包括连接垫组件。
在根据本发明的实施例的线路结构中，第一接垫与第二接垫之间的间距以及第二接垫与第三接垫之间的间距皆大于100微米。
在根据本发明的实施例的线路结构中，连接件包括第三打线与第四打线。第三打线连接位于第一接垫上的第一打线与第二接垫。第四打线连接位于第二接垫上的第三打线与位于第三接垫上的第二打线。
在根据本发明的实施例的线路结构中，接垫组件还包括第四接垫，位于第二接垫与第三接垫之间，且第二接垫与第四接垫之间的间距小于100微米。
在根据本发明的实施例的线路结构中，连接件包括第三打线、第四打线及金属球。第三打线连接位于第一接垫上的第一打线与第二接垫。金属球连接位于第二接垫上的第三打线与第四接垫。第四打线连接位于第四接垫上的金属球与位于第三接垫上的第二打线。
在根据本发明的实施例的线路结构中，金属球包括金球或铜球。
在根据本发明的实施例的线路结构中，接垫组件还包括第五接垫，位于第一接垫与第二接垫之间。连接件还包括第五打线，而连接垫组件还包括第二连接垫，第五打线连接第五接垫与第二连接垫。
在根据本发明的实施例的线路结构中，第三打线于第五接垫上的正投影不重叠于第五接垫。
在根据本发明的实施例的线路结构中，第一连接垫的尺寸大于第二连接垫的尺寸。
基于上述，在本发明的线路结构中，连接组件的连接件可连接于第一接垫、第二接垫及第三接垫之间。因此，相较于现有技术需要将打线从每一个接垫直接连接至连接垫上而言，本发明的线路结构的设计通过连接件的设置可提高打线效率及接线点排布密度，并可减少打线的用量。
附图说明
图1是依照本发明的一实施例的一种线路结构的示意图；
图2是依照本发明的另一实施例的一种线路结构的示意图；
图3是依照本发明的另一实施例的一种线路结构的示意图；
图4是依照本发明的另一实施例的一种线路结构的示意图。
附图标记说明
100a、100b、100c、100d：线路结构；
110a、110b、110c、110d：接垫组件；
112：第一接垫；
114：第二接垫；
116：第三接垫；
118：第四接垫；
119：第五接垫；
120a、120b、120d：连接垫组件；
122：第一连接垫；
124：第二连接垫；
130a、130b、130c、130d：连接组件；
132：第一打线；
134：第二打线；
135d：第五打线；
136a、136c、136d：连接件；
137、137c、137d：第三打线；
138、138c、138d：第四打线；
139c、139d：金属球；
D1、D2、D3：间距。
具体实施方式
现将详细地参考本发明的示范性实施例，示范性实施例的实例说明于附图中。只要有可能，相同元件符号在附图和描述中用来表示相同或相似部分。
图1是依照本发明的一实施例的一种线路结构的示意图。请参考图1，在本实施例中，线路结构100a包括接垫组件110a、连接垫组件120a以及连接组件130a。接垫组件110a包括彼此分离的第一接垫112、第二接垫114以及第三接垫116。连接垫组件120a位于接垫组件110a的一侧且包括第一连接垫122。连接组件130a包括第一打线132、第二打线134以及多个连接件136a。第一打线132连接第一连接垫122与第一接垫112。第二打线134连接第一连接垫122与第三接垫116。连接件136a连接于第一接垫112、第二接垫114及第三接垫116之间。
详细来说，接垫组件110a例如是位于芯片的周围表面上，连接组件130a例如是位于外部电路，如电路板上，但并不以此为限。再者，本实施例的第一接垫112与第二接垫114之间的间距D1以及第二接垫114与第三接垫116之间的间距D2皆大于100微米，其中间距D1与间距D2可相同或不同，于此并不加以限制。如图1所示，本实施例的连接件136a包括第三打线137与第四打线138。第三打线137连接位于第一接垫112上的第一打线132与第二接垫114。第四打线138连接位于第二接垫114上的第三打线137与位于第三接垫116上的第二打线134。意即，第一接垫112、第二接垫114及第三接垫116之间通过连接件136a而形成电性串联。也就是说，本实施例的第二接垫114是通过连接件136a与第一打线132或者是连接件136a与第二打线134而电性连接至连接垫组件120a的第一连接垫122。此处，第一打线132、第二打线134、第三打线137及第四打线138的材质皆例如是金或铜。
在制程上，请再参考图1，可先提供接垫组件110a及连接垫组件120a。接着，于需要打线的第一接垫112、第二接垫114、第三接垫116以及第一连接垫122上植上一颗金球或铜球，进行第一次打线接合程序，以使第一打线132从第一连接垫122连接至第一接垫112。紧接着，于进行第一打线接合程序之后，进行连接程序，以使连接件136a连接于第一接垫112、第二接垫114及第三接垫116之间。进一步来说，进行连接程序包括进行第三次打线接合程序及第四打线接合程序。于进行第一打线接合程序之后，进行第三打线接合程序，以使第三打线137连接位于第一接垫112上的第一打线132与第二接垫114。于进行第三打线接合程序之后，进行第四打接合程序，以使第四打线138连接位于第二接垫116上的第三打线137及第三接垫116。最后，于进行连接程序之后，进行第二次打线接合程序，以使第二打线134从第一连接垫122连接至位于第三接垫116上的第四打线138。至此，已完成线路结构100a的制作。
简言之，相较于现有技术需要将打线从每一个接垫直接连接至连接垫上而言，本实施例可通过连接件136a的设置来串接接垫组件110a的第一接垫112、第二接垫114以及第三接垫116，借此因减少了打线距离，故可提高打线效率及减少打线的用量。此外，因为不需要每一个接垫都直接通过打线连接至第一连接垫，因此单位空间内打线数排布较少，可提高接线点排布密度，有利于小型化。较佳地，本实施例的线路结构100a可应用在芯片直接封装(Chip on Board,COB)的封装形式的摄像头模组或需要用到键合制成的集成电路产品上。
在此必须说明的是，下述实施例沿用前述实施例的元件标号与部分内容，其中采用相同的标号来表示相同或近似的元件，并且省略了相同技术内容的说明。关于省略部分的说明可参考前述实施例，下述实施例不再重复赘述。
图2是依照本发明的另一实施例的一种线路结构的示意图。请同时参考图1与图2，本实施例的线路结构100b与图1的线路结构100a相似，两者的差异在于：在本实施例的线路结构100b中，芯片10包括接垫组件110b，而电路板20包括连接垫组件120b，其中接垫组件110b通过连接组件130b而与连接垫组件120b电性联接。
图3是依照本发明的另一实施例的一种线路结构的示意图。请同时参考图1与图3，本实施例的线路结构100c与图1的线路结构100a相似，两者的差异在于：在本实施例的线路结构100c的接垫组件110c还包括第四接垫118，位于第二接垫114与第三接垫116之间，其中第二接垫114与第四接垫118之间的间距D3小于100微米。也就是说，本实施例的第一接垫112与第二接垫114之间的间距D1大于第二接垫114与第四接垫118之间的间距D3。
请再参考图3，在本实施例中，连接组件130c的连接件136c包括第三打线137c、第四打线138c及金属球139c。第三打线137c连接位于第一接垫112上的第一打线132与第二接垫114。金属球139c连接位于第二接垫114上的第三打线137c与第四接垫118。第四打线138c连接位于第四接垫118上的金属球139c与位于第三接垫116上的第二打线134。此处，金属球139c例如是金球或铜球。
在制程上，请再参考图3，可先提供接垫组件110c及连接垫组件120a。接着，于需要打线的第一接垫112、第二接垫114、第三接垫116、第四接垫118以及第一连接垫122上植上一颗金球或铜球，进行第一次打线接合程序，以使第一打线132从第一连接垫122连接至第一接垫112。紧接着，于进行第一打线接合程序之后，进行连接程序，以使连接件136c连接于第一接垫112、第二接垫114第三接垫116、及第四接垫118之间。进一步来说，进行连接程序包括进行第三次打线接合程序、植球程序以及第四打线接合程序。进行第一打线接合程序之后，首先，进行第三打线接合程序，以使第三打线137c连接位于第一接垫112上的第一打线132与第二接垫114。接着，进行植球程序，以使金属球139c连接位于第二接垫114上的第三打线137c与第四接垫118。之后，进行第四打线接合程序，以使第四打线138c连接位于第四接垫118上的金属球139c及第三接垫116。最后，于进行连接程序之后，进行第二次打线接合程序，以使第二打线134从第一连接垫122连接至位于第三接垫116上的第四打线138c。至此，已完成线路结构100c的制作。
简言之，由于本实施例的第二接垫114与第四接垫118之间的间距D3小于100微米，因此以金属球139c来取代打线作为第二接垫114与第四接垫118之间的连接件136c。意即，第二接垫114与第四接垫118通过金属球139c直接电性连接。借此，可减少打线的用量及提高打线效率。此外，因为不需要每一个接垫都直接通过打线连接至第一连接垫122，因此单位空间内打线数排布较少，可提高接线点排布密度，有利于小型化。
图4是依照本发明的另一实施例的一种线路结构的示意图。为了方便说明起见，图4的线路结构以正视图的方式进行绘示。请同时参考图3与图4，本实施例的线路结构100d与图3的线路结构100c相似，两者的差异在于：在本实施例中，接垫组件110d还包括第五接垫119，其中第五接垫119位于第一接垫112与第二接垫114之间。再者，本实施例的连接组件130d的连接件136d还包括第五打线135d，而连接垫组件120d还包括第二连接垫124，其中第五打线135d连接第五接垫119与第二连接垫124。
详细来说，本实施例的连接件136d包括第三打线137d、第四打线138d、金属球139d及第五打线135d。第三打线137d连接位于第一接垫112上的第一打线132与第二接垫114。特别是，第三打线137d于第五接垫119上的正投影不重叠于第五接垫119。也就是说，第三打线137d不从第五接垫119的正上方经过，而是以绕过第五接垫119的一侧边缘的方式连接至第二接垫114，借此来避免与位于第五接垫119上的第五打线135d相交产生短路的风险。金属球139c连接位于第二接垫114上的第三打线137d与第四接垫118。第四打线138d连接位于第四接垫118上的金属球139d与位于第三接垫116上的第二打线134。此处，金属球139c例如是金球或铜球，而第一连接垫122的尺寸大于第二连接垫124的尺寸。
综上所述，在本发明的线路结构中，连接组件的连接件可连接于第一接垫、第二接垫及第三接垫之间。因此，相较于现有技术需要将打线从每一个接垫直接连接至连接垫上而言，本发明的线路结构的设计通过连接件的设置可提高打线效率及接线点排布密度，并可减少打线的用量。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (10)

1.一种线路结构，其特征在于，包括：
接垫组件，包括彼此分离的第一接垫、第二接垫以及第三接垫；
连接垫组件，位于所述接垫组件的一侧，且包括第一连接垫；以及
连接组件，包括第一打线、第二打线以及多个连接件，其中所述第一打线连接所述第一连接垫与所述第一接垫，所述第二打线连接所述第一连接垫与所述第三接垫，而所述多个连接件连接于所述第一接垫、所述第二接垫及所述第三接垫之间。
2.根据权利要求1所述的线路结构，其特征在于，芯片包括所述接垫组件，而电路板包括所述连接垫组件。
3.根据权利要求1所述的线路结构，其特征在于，其中所述第一接垫与所述第二接垫之间的间距以及所述第二接垫与所述第三接垫之间的间距皆大于100微米。
4.根据权利要求3所述的线路结构，其特征在于，所述多个连接件包括第三打线与第四打线，所述第三打线连接位于所述第一接垫上的所述第一打线与所述第二接垫，所述第四打线连接位于所述第二接垫上的所述第三打线与位于所述第三接垫上的所述第二打线。
5.根据权利要求1所述的线路结构，其特征在于，所述接垫组件还包括第四接垫，位于所述第二接垫与所述第三接垫之间，且所述第二接垫与所述第四接垫之间的间距小于100微米。
6.根据权利要求5所述的线路结构，其特征在于，其中所述多个连接件包括第三打线、第四打线及金属球，所述第三打线连接位于所述第一接垫上的所述第一打线与所述第二接垫，所述金属球连接位于所述第二接垫上的所述第三打线与所述第四接垫，所述第四打线连接位于所述第四接垫上的所述金属球与位于所述第三接垫上的所述第二打线。
7.根据权利要求6所述的线路结构，其特征在于，所述金属球包括金球或铜球。
8.根据权利要求6所述的线路结构，其特征在于，所述接垫组件还包括第五接垫，位于所述第一接垫与所述第二接垫之间，所述多个连接件还包括第五打线，而所述连接垫组件还包括第二连接垫，所述第五打线连接所述第五接垫与所述第二连接垫。
9.根据权利要求8所述的线路结构，其特征在于，所述第三打线于所述第五接垫上的正投影不重叠于所述第五接垫。
10.根据权利要求8所述的线路结构，其特征在于，所述第一连接垫的尺寸大于所述第二连接垫的尺寸。
CN202011173690.2A 2020-10-28 2020-10-28 线路结构 Pending CN112271168A (zh)

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