CN112261841A - Electronic equipment cooling liquid supply system and method based on phase change capsule heat storage and temperature control - Google Patents
Electronic equipment cooling liquid supply system and method based on phase change capsule heat storage and temperature control Download PDFInfo
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- CN112261841A CN112261841A CN202011142662.4A CN202011142662A CN112261841A CN 112261841 A CN112261841 A CN 112261841A CN 202011142662 A CN202011142662 A CN 202011142662A CN 112261841 A CN112261841 A CN 112261841A
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- phase change
- liquid
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
Abstract
The invention discloses a phase change capsule heat storage and temperature control based electronic equipment cooling liquid supply system and a phase change capsule heat storage and temperature control based electronic equipment cooling liquid supply method. The phase change device is internally provided with a phase change capsule in a sealing way, and when the temperature of the cooling liquid rises to the phase change temperature of the phase change capsule, the phase change capsule absorbs heat and is changed from a solid state to a liquid state to cool the cooling liquid; when the temperature of the cooling liquid is lower than the phase change temperature of the phase change capsule, the phase change capsule releases heat and changes from a liquid state to a solid state. The liquid supply system can provide environment-controlled liquid supply capacity and can regulate the temperature of the liquid supply when the temperature of the cooling air is too high or no cooling air exists.
Description
Technical Field
The invention relates to the technical field of electronic equipment cooling, in particular to an electronic equipment cooling liquid supply system and method based on phase change capsule heat storage and temperature control.
Background
The cooling liquid supply system is widely applied to the civil and military fields, in particular to the field of cooling of avionic equipment. The avionic device cooling liquid supply system needs to meet the requirements of severe environment resistance, high-power heat dissipation, system maintenance-free performance, high heat exchange performance and the like, and the adaptability of the cooling system to a complex use environment is a factor which needs to be considered emphatically in system design.
Generally, avionics cooling systems rely on ram air provided during flight of the aircraft as a heat sink. The use environment scenes are faced with: 1. short-time high-temperature environment caused by complex flight conditions; 2. the ground works for a short time; 3. and (4) self-checking at regular short time periods. Aiming at the characteristics of the use environment scene, the traditional electronic equipment cooling and liquid supply system has the following problems: 1. when the cooling air has short-time high temperature under the complex flight condition, the cooling system can not provide cooling liquid meeting the requirements, and the electronic equipment is subjected to temperature impact caused by short-time high-temperature liquid supply, so that the service life of the equipment is influenced; 2. during ground short-time work, the aircraft can not provide cooling air meeting requirements, a cooling system is difficult to work normally, special ground guarantee equipment needs to be externally connected to dissipate heat of electronic equipment, and maintenance procedures are complicated and high in cost. Therefore, there is a real need to design a heat-storage temperature-control cooling liquid supply system for avionic devices.
The application of the phase change capsule is precedent, and the phase change capsule is mainly applied to the heat preservation of a fuel cell in a patent CN106654318A and cannot realize quick heat dissipation in a high-power heat dissipation scene; the CN106143048B is used for a bus radiation air-conditioning system, phase-change capsule functional fluid needs to be replaced regularly, and the use mode and the scene are limited; CN106089264B is used in the tunnel of concrete field of keeping warm that prevents frostbite, is not suitable for the electronic equipment heat dissipation.
Disclosure of Invention
In order to solve the problems, the invention provides an electronic equipment cooling liquid supply system and method based on phase change capsule heat storage and temperature control, wherein the temperature control capability is realized by mainly utilizing the principle that a phase change capsule can absorb or release a large amount of latent heat when in phase change, the liquid supply system can provide environment-controlled liquid supply capability, and can adjust the liquid supply temperature when the temperature of cooling air is too high or no cooling air exists.
The invention relates to an electronic equipment cooling liquid supply system based on phase change capsule heat storage and temperature control, which comprises:
the phase change device is used for storing heat and controlling the temperature of the cooling liquid; the phase change device is internally provided with a phase change capsule in a sealing way, and when the temperature of the cooling liquid rises to the phase change temperature of the phase change capsule, the phase change capsule absorbs heat and is changed from a solid state to a liquid state to cool the cooling liquid; when the temperature of the cooling liquid is lower than the phase change temperature of the phase change capsule, the phase change capsule releases heat and changes from a liquid state to a solid state;
the heat exchanger is used for realizing heat exchange between the cooling liquid and the cooling air;
the liquid pump is used for providing power for the circulating flow of the cooling liquid;
and the liquid pipeline is used for communicating the liquid pump, the heat exchanger and the phase change device to form a liquid flow loop.
Furthermore, the phase change device mainly comprises a phase change capsule, a filtering device and a shell, and is provided with a liquid inlet and a liquid outlet; the phase change capsule is mainly formed by phase change material encapsulation, filter equipment is used for filtering the phase change capsule, the shell is used for encapsulating the phase change capsule with filter equipment forms the enclosure space, inlet and liquid outlet provide exit for the coolant liquid.
Further, the size of the filter mesh of the filter device is smaller than the particle size of the phase change capsule, so that the phase change capsule is prevented from flowing out along with the cooling liquid.
Furthermore, the phase change device is filled with phase change capsules with different weights and different phase change temperatures so as to control different liquid supply temperatures.
Further, the fluid conduit includes, but is not limited to, a metal braided polytetrafluoroethylene hose.
Further, the cooling liquid includes, but is not limited to, No. 65 cooling liquid, fluorocarbon or deionized water.
Further, the heat exchanger is of a plate-fin structure.
The invention relates to a phase change capsule heat storage and temperature control-based electronic equipment cooling liquid supply method, which comprises the steps of pumping cooling liquid out of a liquid pump, supplying heat to electronic equipment through a liquid pipeline, heating the electronic equipment to raise the temperature, cooling the electronic equipment by cooling air after passing through a heat exchanger, refluxing the electronic equipment to the liquid pump through a phase change device, and performing reciprocating circulation in the way;
when the heat exchanger is not supplied with cooling air or the temperature of the cooling air is too high, the temperature of the cooling air can be gradually increased to be higher than the phase change temperature of the phase change capsule, the phase change capsule absorbs heat at the moment, the phase change capsule is changed from a solid state to a liquid state to form a heat sink, and the temperature of the cooling air is controlled within a set range;
when the cooling air is returned, the temperature of the cooling liquid gradually drops below the phase change temperature of the phase change capsule, and the phase change capsule releases heat, the liquid state is changed into the solid state, and the heat is transferred to the cooling liquid and is taken away by the cooling air supplied by the heat exchanger.
The invention has the beneficial effects that: the liquid supply system can provide environment-controlled liquid supply capacity and can regulate the liquid supply temperature when the cooling air temperature is too high or no cooling air exists. The liquid supply system of the invention has the following characteristics:
1) the structure forms of the liquid supply system and the phase change device can be individually designed according to requirements so as to meet different appearance requirements;
2) under special environmental conditions, when the heat exchanger cannot effectively cool the cooling liquid, the temperature of the cooling liquid can be controlled by phase change heat absorption of the phase change device, so that the electronic equipment is protected from high-temperature impact;
3) the temperature of the cooling liquid can be automatically controlled during short-time work, external special guarantee equipment is not needed, maintenance procedures are simplified, and cost is reduced.
Drawings
FIG. 1 is a schematic view of a liquid supply system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating a phase change device according to an embodiment of the present invention;
FIG. 3 is a simplified schematic of a liquid supply system (including electronics) according to an embodiment of the present invention;
FIG. 4 is an exploded view of a phase change device and heat exchanger assembly according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a temperature control effect of the liquid supply system according to the embodiment of the invention.
Reference numerals: 10-heat exchanger, 20-phase change device, 201-phase change capsule, 202-filtering device, 203-shell, 204-liquid inlet, 205-liquid outlet, 30-liquid pump, 40-liquid pipeline and 50-electronic equipment.
Detailed Description
In order to more clearly understand the technical features, objects, and effects of the present invention, specific embodiments of the present invention will now be described. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a phase-change capsule heat storage and temperature control-based electronic equipment cooling liquid supply system, which comprises a heat exchanger 10, a phase-change device 20, a liquid pump 30 and a liquid pipeline 40, wherein the heat exchanger 10 is used for realizing heat exchange between cooling liquid and cooling air, the phase-change device 20 is used for storing heat and controlling temperature of the cooling liquid, the liquid pump 30 is used for providing power for circulating flow of the cooling liquid, and the liquid pipeline 40 is used for communicating the liquid pump 30, the heat exchanger 10 and the phase-change device 20 to form a liquid flow loop. The phase change device 20 is internally provided with a phase change capsule 201, when the temperature of the cooling liquid rises to the phase change temperature of the phase change capsule 201, the phase change capsule 201 absorbs heat, changes from a solid state to a liquid state and cools the cooling liquid; when the temperature of the cooling liquid is lower than the phase transition temperature of the phase change capsule 201, the phase change capsule 201 releases heat and changes from a liquid state to a solid state. Specifically, the structural form of the liquid supply system can be individually designed according to specific requirements so as to meet different appearance requirements.
Correspondingly, the invention provides a cooling liquid supply method for electronic equipment based on phase change capsule heat storage and temperature control, which comprises the steps of pumping cooling liquid from a liquid pump 30, supplying heat to the electronic equipment 50 through a liquid pipeline 40, heating by the electronic equipment 50, cooling by cooling air after passing through a heat exchanger 10, returning to the liquid pump 30 through a phase change device 20, and circulating in a reciprocating manner. The working process mainly comprises two processes of phase change temperature control and temperature control capacity regeneration:
phase change temperature control process: when the heat exchanger 10 is not supplied with cooling air or the temperature of the cooling air is too high, the temperature of the cooling air is gradually increased to be higher than the phase change temperature of the phase change capsule 201, at this time, the phase change capsule 201 absorbs heat, the solid state is changed into the liquid state, a heat sink is formed, the temperature of the cooling air is controlled within a set range, and the electronic device 50 can normally work within a certain time;
temperature control capacity regeneration process: when the cooling air is supplied again, the temperature of the cooling liquid gradually drops below the phase change temperature of the phase change capsule 201, at this time, the phase change capsule 201 releases heat, the liquid state is changed into the solid state, the heat is transferred to the cooling liquid, and the cooling air supplied by the heat exchanger 10 is taken away, so that the regeneration of the temperature control capability of the phase change capsule 201 is completed.
In a preferred embodiment of the present invention, as shown in fig. 2 and 4, phase change device 20 is comprised of phase change capsule 201, filter device 202 and housing 203, and is provided with liquid inlet 204 and liquid outlet 205. The phase change capsule 201 is mainly formed by encapsulating a phase change material, the filtering device 202 is used for filtering the phase change capsule 201, the shell 203 is used for encapsulating the phase change capsule 201 and the filtering device 202 to form a closed space, and the liquid inlet 204 and the liquid outlet 205 provide inlets and outlets for cooling liquid. Specifically, the size of the filter mesh of the filter 202 is smaller than the particle size of the phase change capsule 201 to prevent the phase change capsule 201 from flowing out with the cooling liquid. Optionally, the phase change device 20 is filled with phase change capsules 201 with different weights and different phase change temperatures to control different liquid supply temperatures. In addition, the phase change device 20 may be disposed at different links of the flow path of the liquid supply system, may be composed of one or more independent components, and may be integrated with other components of the liquid supply system.
In a preferred embodiment of the present invention, the cooling liquid may be 65 # cooling liquid, fluorocarbon or deionized water.
In a preferred embodiment of the present invention, the heat exchanger 10 is a plate-fin structure for exchanging heat between the cooling fluid and the cooling air, and the heat exchange amount is 1 kW. 2kg of phase change capsules 201 with the particle size of 3-4 mm are packaged in the phase change device 20 to provide phase change enthalpy of 400kJ, and the phase change capsules are integrated with the heat exchanger 10, and the liquid inlet 204 and the liquid outlet 205 are integrated with the filtering device 202 and packaged by the shell 203. The liquid pump 30 is designed as an integrated liquid supply assembly integrating a pump, a motor, a liquid storage tank, a sensor and a controller, the liquid supply flow is 5L/min, and the liquid pump is used for pressurizing cooling liquid and providing circulating flow power. The liquid pipeline 40 is a teflon (polytetrafluoroethylene) hose woven by metal and used for communicating a liquid flow path, and the cooling liquid is fluorocarbon. The maximum heat consumption of the electronic equipment 5050 needing heat dissipation is 1kW, and the short-time working heat consumption is 400W. The liquid supply system composed of the heat exchanger 10, the phase change device 20, the liquid pump 30 and the liquid pipeline 40 has the phase change heat storage temperature control function, and can stably control the liquid supply temperature to about 60 ℃ and keep the temperature for 15 minutes under the condition that no cooling air is supplied or the cooling air temperature is too high to refrigerate, so that the normal work of the electronic equipment 50 can be ensured, and the temperature control effect is shown in fig. 5.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally placed when the present invention is used, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either a wired or wireless connection.
Claims (8)
1. An electronic equipment cooling liquid supply system based on phase change capsule heat storage accuse temperature, its characterized in that includes:
the phase change device is used for storing heat and controlling the temperature of the cooling liquid; the phase change device is internally provided with a phase change capsule in a sealing way, and when the temperature of the cooling liquid rises to the phase change temperature of the phase change capsule, the phase change capsule absorbs heat and is changed from a solid state to a liquid state to cool the cooling liquid; when the temperature of the cooling liquid is lower than the phase change temperature of the phase change capsule, the phase change capsule releases heat and changes from a liquid state to a solid state;
the heat exchanger is used for realizing heat exchange between the cooling liquid and the cooling air;
the liquid pump is used for providing power for the circulating flow of the cooling liquid;
and the liquid pipeline is used for communicating the liquid pump, the heat exchanger and the phase change device to form a liquid flow loop.
2. The phase change capsule heat storage and temperature control-based electronic equipment cooling liquid supply system of claim 1, wherein the phase change device mainly comprises a phase change capsule, a filtering device and a shell, and is provided with a liquid inlet and a liquid outlet; the phase change capsule is mainly formed by phase change material encapsulation, filter equipment is used for filtering the phase change capsule, the shell is used for encapsulating the phase change capsule with filter equipment forms the enclosure space, inlet and liquid outlet provide exit for the coolant liquid.
3. The system of claim 2, wherein the size of the filter mesh of the filter device is smaller than the particle size of the phase change capsule to prevent the phase change capsule from flowing out with the cooling liquid.
4. The system of claim 1, wherein the phase change device is filled with phase change capsules of different weight and different phase change temperature to control different liquid supply temperatures.
5. The phase change capsule heat storage and temperature control-based electronic equipment cooling and liquid supply system of claim 1, wherein the liquid pipe comprises but is not limited to a metal-braided polytetrafluoroethylene hose.
6. The phase change capsule heat storage and temperature control-based electronic equipment cooling liquid supply system of claim 1, wherein the cooling liquid comprises but is not limited to 65 # cooling liquid, fluorocarbon or deionized water.
7. The phase change capsule heat storage and temperature control-based electronic equipment cooling and liquid supply system of claim 1, wherein the heat exchanger is configured as a plate-fin structure.
8. A cooling liquid supply method for electronic equipment based on phase change capsule heat storage and temperature control is characterized in that cooling liquid is pumped out from a liquid pump, is supplied for the electronic equipment to dissipate heat through a liquid pipeline, is heated by the electronic equipment, is cooled by cooling air after passing through a heat exchanger, then flows back to the liquid pump through a phase change device, and is circulated in a reciprocating way;
when the heat exchanger is not supplied with cooling air or the temperature of the cooling air is too high, the temperature of the cooling air can be gradually increased to be higher than the phase change temperature of the phase change capsule, the phase change capsule absorbs heat at the moment, the phase change capsule is changed from a solid state to a liquid state to form a heat sink, and the temperature of the cooling air is controlled within a set range;
when the cooling air is returned, the temperature of the cooling liquid gradually drops below the phase change temperature of the phase change capsule, and the phase change capsule releases heat, the liquid state is changed into the solid state, and the heat is transferred to the cooling liquid and is taken away by the cooling air supplied by the heat exchanger.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011142662.4A CN112261841A (en) | 2020-10-23 | 2020-10-23 | Electronic equipment cooling liquid supply system and method based on phase change capsule heat storage and temperature control |
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| CN202011142662.4A CN112261841A (en) | 2020-10-23 | 2020-10-23 | Electronic equipment cooling liquid supply system and method based on phase change capsule heat storage and temperature control |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112944203A (en) * | 2021-03-22 | 2021-06-11 | 中海石油气电集团有限责任公司 | Heat preservation cold insulation circulation system based on phase change heat insulation material |
| CN116581093A (en) * | 2023-05-08 | 2023-08-11 | 东南大学 | Cooling device for heat storage type high-power device |
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Application publication date: 20210122 |