CN112259954A - Packaged antenna module and preparation method thereof - Google Patents
Packaged antenna module and preparation method thereof Download PDFInfo
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- CN112259954A CN112259954A CN201910661882.9A CN201910661882A CN112259954A CN 112259954 A CN112259954 A CN 112259954A CN 201910661882 A CN201910661882 A CN 201910661882A CN 112259954 A CN112259954 A CN 112259954A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
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Abstract
The invention provides a packaged antenna module and a preparation method thereof, wherein the packaged antenna module comprises a rewiring layer, an antenna structure, a semiconductor chip, a metal bump, a third packaging layer and a packaged antenna connector, wherein the antenna structure comprises a connector window and a first antenna structure and a second antenna structure which are at least stacked on a second surface of the rewiring layer, and the packaged antenna connector is positioned in the connector window and is electrically connected with the rewiring layer. The invention can reduce signal loss by conducting electrical leading through the packaging antenna connector positioned in the connector window, and further improves the overall competitive advantage of WLP AiP.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and relates to a packaged antenna module and a preparation method thereof.
Background
With the popularization of high-tech electronic products, especially in order to meet the mobile requirement, most of the high-tech electronic products have increased wireless communication functions.
A Package Antenna (Antenna in Package, AiP for short) is a technology for integrating an Antenna and a chip in a Package based on a Package material and a process to realize a system-level wireless function, and has the advantages of: the system design is simplified, the product is miniaturized, and the cost is low. AiP technology is in line with the trend of increasing integration of silicon-based semiconductor processes, providing a good antenna and packaging solution for system-level wireless chips, and with the rapid development of communication information, AiP technology has become a technology essential for 5G (5th Generation) communication and automotive radar chips, so AiP technology has received wide attention.
In a conventional AiP module, an antenna is usually fabricated directly on a circuit board, and the antenna is interconnected with the outside through a connector, one side of the circuit board is used as an antenna radiation surface, and the other side is connected to an encapsulated chip and a motherboard. The method has low realization degree of partially encapsulating the chip, is not suitable for modularization and connection of a connector, and causes the antenna to occupy extra circuit board area, thus having poor integration. For various high-tech electronic products, if the antenna is directly fabricated on the surface of the circuit board, a circuit board with a larger volume is required, so that the high-tech electronic products also occupy a larger volume, which is contrary to the requirements of people for miniaturization and convenience of the high-tech electronic products.
Wafer level package antennas (WLP AiP) are widely used because they operate on a single wafer and are fabricated on a molding layer with higher precision and smaller size than conventional AiP modules. However, in the WLP AiP of the prior art, since the WLP AiP has no core layer (core) support and the redistribution layer (RDL) is thin, it is difficult to directly interconnect with other devices by using both sides of the RDL, and therefore the WLP AiP still needs to be interconnected with the outside through the motherboard, which results in high signal loss of the packaged antenna.
Therefore, a novel packaged antenna module and a manufacturing method thereof are designed, so that the WLP AiP can be directly interconnected with the outside without a main board, thereby reducing the signal loss of the packaged antenna and further improving the overall competitive advantage of the WLP AiP, which is really necessary.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a packaged antenna module and a method for manufacturing the same, which are used to solve the problem of signal loss of a packaged antenna caused by interconnection between a main board and an external device in the prior art.
To achieve the above and other related objects, the present invention provides a method for manufacturing a packaged antenna module, comprising the steps of:
providing a packaged antenna structure, the packaged antenna structure comprising: the rewiring layer comprises a first surface and a second surface which are oppositely arranged; the antenna structure at least comprises a first antenna structure and a second antenna structure which are stacked and arranged on the second surface of the rewiring layer; the first antenna structure comprises a first antenna feed line, a first antenna metal layer and a first encapsulation layer, wherein a first end of the first antenna feed line is electrically connected with the redistribution layer, the first encapsulation layer covers a second side of the redistribution layer and the first antenna feed line and exposes a second end of the first antenna feed line, and the first antenna metal layer is positioned on the first encapsulation layer and is electrically connected with the second end of the first antenna feed line; the second antenna structure comprises a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer and the first packaging layer, and the second antenna metal layer is positioned on the second packaging layer; a semiconductor chip located on a first face of the rewiring layer and electrically connected to the rewiring layer; a metal bump on a first face of the rewiring layer and electrically connected to the rewiring layer; a third encapsulation layer covering the semiconductor chip and the first surface of the rewiring layer and exposing the metal bump;
forming a connector window in the antenna structure;
and forming a packaged antenna connector in the connector window, wherein the packaged antenna connector is electrically connected with the redistribution layer.
Optionally, the package antenna connector is matched with a circuit board connector on a circuit board, and the circuit board connector is electrically connected through the package antenna connector; the circuit board comprises one or a combination of a flexible circuit board and a rigid circuit board.
Optionally, the first antenna structure further includes a metal pillar and a metal connector, a first end of the metal pillar is electrically connected to the redistribution layer, the first encapsulation layer covers the metal pillar and exposes a second end of the metal pillar, and the metal connector is located on the first encapsulation layer and electrically connected to the second end of the metal pillar; the metal connecting piece is exposed at the bottom of the connector window, and the packaging antenna connector is electrically connected with the metal connecting piece so as to be electrically connected with the rewiring layer through the metal connecting piece and the metal column.
Optionally, the bottom of the connector window exposes the metal wires of the rewiring layer, and the package antenna connector is electrically connected to the metal wires.
Optionally, a dielectric layer is further included between the first antenna structure and the second antenna structure.
Optionally, the second antenna structure further comprises a second antenna feed line between the second antenna metal layer and the first antenna metal layer, the second antenna metal layer and the first antenna metal layer being connected by the second antenna feed line.
Optionally, the method of forming the packaged antenna connector in the connector window includes one or a combination of reflow soldering and laser welding.
Optionally, the method of forming the first antenna feed line includes one or a combination of a wire bonding method, electroplating, and electroless plating, and the material of the first antenna feed line includes one or a combination of copper, gold, silver, and aluminum.
Optionally, the method of forming the connector window includes one or a combination of dry etching and wet etching.
Optionally, the semiconductor chip includes one or a combination of an active component and a passive component; the active component can comprise one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor, and an inductor.
The invention also provides a packaged antenna module, which comprises:
the rewiring layer comprises a first surface and a second surface which are oppositely arranged;
an antenna structure including a connector window and first and second antenna structures at least stacked on a second side of the redistribution layer, wherein the first antenna structure includes a first antenna feed line, a first antenna metal layer, and a first encapsulation layer, a first end of the first antenna feed line is electrically connected with the redistribution layer, the first encapsulation layer covers the first antenna feed line and exposes a second end of the first antenna feed line, and the first antenna metal layer is on the first encapsulation layer and is electrically connected with the second end of the first antenna feed line; the second antenna structure comprises a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer, and the second antenna metal layer is positioned on the second packaging layer;
a semiconductor chip located on a first face of the rewiring layer and electrically connected to the rewiring layer;
a metal bump on a first face of the rewiring layer and electrically connected to the rewiring layer;
a third encapsulation layer covering the semiconductor chip and the first surface of the rewiring layer and exposing the metal bump;
a package antenna connector located in the connector window and electrically connected to the redistribution layer.
Optionally, the package antenna connector is matched with a circuit board connector on a circuit board, and the circuit board connector is electrically connected through the package antenna connector; the circuit board comprises one or a combination of a flexible circuit board and a rigid circuit board.
Optionally, the first antenna structure further includes a metal pillar and a metal connector, a first end of the metal pillar is electrically connected to the redistribution layer, the first encapsulation layer covers the second surface of the redistribution layer and the metal pillar and exposes a second end of the metal pillar, and the metal connector is located on the first encapsulation layer and electrically connected to the second end of the metal pillar; the metal connecting piece is exposed at the bottom of the connector window, and the packaging antenna connector is electrically connected with the metal connecting piece so as to be electrically connected with the rewiring layer through the metal connecting piece and the metal column.
Optionally, the bottom of the connector window exposes the metal wires of the rewiring layer, and the package antenna connector is electrically connected to the metal wires.
Optionally, a dielectric layer is further included between the first antenna structure and the second antenna structure.
Optionally, the second antenna structure further comprises a second antenna feed line between the second antenna metal layer and the first antenna metal layer, the second antenna metal layer and the first antenna metal layer being connected by the second antenna feed line.
Optionally, the first antenna feed line comprises one or a combination of a copper feed line, a gold feed line, a silver feed line, and an aluminum feed line.
Optionally, the semiconductor chip includes one or a combination of an active component and a passive component; the active component can comprise one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor, and an inductor.
As described above, according to the packaged antenna module and the manufacturing method thereof of the present invention, the packaged antenna connector located in the connector window is electrically connected to the rewiring layer through the connector window, and the packaged antenna connector is electrically led out, so that the packaged antenna module can be directly interconnected with the outside, thereby reducing signal loss and further improving the overall competitive advantage of WLP AiP.
Drawings
Fig. 1 is a flow chart illustrating a process for manufacturing a packaged antenna module according to the present invention.
Fig. 2 to 8 are schematic structural diagrams of steps of preparing a packaged antenna module according to the first embodiment, wherein fig. 8 is a schematic structural diagram of the packaged antenna module according to the first embodiment.
Fig. 9 is a schematic structural diagram illustrating the packaged antenna module and the circuit board according to the first embodiment of the invention.
Fig. 10 and fig. 11 are schematic structural diagrams of a packaged antenna module according to a second embodiment of the present invention, wherein fig. 11 is a schematic structural diagram of a packaged antenna module according to the second embodiment of the present invention.
Fig. 12 is a schematic structural diagram illustrating the packaged antenna module and the circuit board according to the second embodiment of the disclosure.
Description of the element reference numerals
101 supporting substrate
102 separating layers
103. 203 rewiring layer
113. 213 Wiring Medium
123. 223 metal wiring
104. 204 first antenna structure
1141. 214 first antenna feed line
1142 Metal post
124. 224 first encapsulation layer
1341. 234 first antenna metal layer
1342 Metal connecting piece
105. 205 dielectric layer
106. 206 second antenna structure
116. 216 second encapsulation layer
126. 226 second antenna metal layer
107. 207 semiconductor chip
108. 208 third encapsulation layer
109. 209 metal bump
110. 210 connector
111. 211 encapsulated antenna connector
112. 212 circuit board connector
120. 220 circuit board
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the drawings provided in the embodiments are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in the actual implementation, and the type, number and proportion of the components in the actual implementation can be changed freely, and the layout of the components can be more complicated.
Example one
As shown in fig. 8, the present embodiment provides a packaged antenna module, which includes a redistribution layer 103, an antenna structure, a semiconductor chip 107, a third packaging layer 108, a metal bump 109, and a packaged antenna connector 111. Wherein the redistribution layer 103 includes a first surface and a second surface that are disposed opposite to each other; the antenna structure comprises a connector window and at least a first antenna structure 104 and a second antenna structure 106 stacked and disposed on a second side of the redistribution layer 103, the first antenna structure 104 comprises a first antenna feed 1141, a first antenna metal layer 1341 and a first encapsulation layer 124, a first end of the first antenna feed 1141 is electrically connected with the redistribution layer 103, the first encapsulation layer 124 covers the first antenna feed 1141 and exposes a second end of the first antenna feed 1141, the first antenna metal layer 1341 is located on the first encapsulation layer 124 and is electrically connected with the second end of the first antenna feed 1141; the second antenna structure 106 includes a second package layer 116 and a second antenna metal layer 126, the second package layer 116 covers the first antenna metal layer 1341, and the second antenna metal layer 126 is located on the second package layer 116; the semiconductor chip 107 is located on a first side of the rewiring layer 103 and electrically connected to the rewiring layer 103; the metal bump 109 is located on a first side of the redistribution layer 103 and electrically connected to the redistribution layer 103; the third packaging layer 108 covers the semiconductor chip 107 and the first surface of the redistribution layer 103 and exposes the metal bump 109; the package antenna connector 111 is located in the connector window and electrically connected to the redistribution layer 103.
The packaged antenna module of this embodiment, through the connector window, will be located the packaged antenna connector in the connector window and rewiring layer electricity is connected, carries out the electrical property through packaged antenna connector and draws forth for packaged antenna module can directly realize interconnecting with the external world, thereby reducible signal loss, further improvement WLP AiP's whole competitive advantage.
Referring to fig. 1, the present embodiment provides a method for manufacturing the packaged antenna module, but the method for manufacturing the packaged antenna module is not limited thereto.
Specifically, as shown in fig. 2 to 8, schematic structural diagrams of steps of preparing the packaged antenna module in this embodiment are shown.
First, a package antenna structure is provided, wherein fig. 2 to 6 show schematic structural diagrams of steps of manufacturing the package antenna structure in this embodiment, but the manufacturing method of the package antenna structure is not limited thereto.
As shown in fig. 2, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101.
Specifically, the supporting substrate 101 may include one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate; the separation layer 102 may include a polymer layer having a reduced viscosity under heating or light irradiation, and the polymer layer may include a LTHC light-to-heat conversion layer. Since the glass substrate has a low cost, the separation layer 102 is easily formed on the surface of the glass substrate, and the difficulty of the subsequent peeling process can be reduced, in this embodiment, the support substrate 101 is preferably a glass substrate; the separation layer 102 is preferably applied to the surface of the supporting substrate 101 by a spin coating process, and is cured by a uv curing or thermal curing process to form the LTHC light-to-heat conversion layer, so that the LTHC light-to-heat conversion layer may be heated based on laser in a subsequent peeling process to separate the supporting substrate 101 from the LTHC light-to-heat conversion layer.
As shown in fig. 3, the redistribution layer 103 is formed on the separation layer 102, and the redistribution layer 103 includes a first surface in contact with the separation layer 102 and an opposite second surface.
Specifically, the redistribution layer 103 includes a wiring medium 113 and a metal wiring 123, and the material of the wiring medium 113 may include one or a combination of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass; the material of the metal wiring 123 may include one or a combination of copper, aluminum, nickel, gold, silver, and titanium. The method for fabricating the wiring medium 113 may include one or a combination of physical vapor deposition and chemical vapor deposition, and the method for fabricating the metal wiring 123 may include one or a combination of physical vapor deposition, chemical vapor deposition, electroplating process, or electroless plating process. The specific material, layer number and distribution morphology of the wiring medium 113 and the metal wiring 123 may be selected according to specific needs, and are not limited herein.
As shown in fig. 4, the first antenna structure 104 is formed on the second side of the redistribution layer 103.
As an example, the first antenna structure 104 may further include a metal pillar 1142 and a metal connector 1342, a first end of the metal pillar 1142 is electrically connected to the redistribution layer 103, the first encapsulation layer 124 covers a second surface of the redistribution layer 103 and the metal pillar 1142 and exposes a second end of the metal pillar 1142, and the metal connector 1342 is located on the first encapsulation layer 124 and is electrically connected to the second end of the metal pillar 1142.
Specifically, in this embodiment, the metal connector 1342 is exposed at the bottom of the connector window, and the package antenna connector 111 is electrically connected to the metal connector 1342, so as to be electrically connected to the redistribution layer 103 through the metal connector 1342 and the metal pillar 1142.
The step of forming the first antenna structure 104 may include:
forming the first antenna feed line 1141 and the metal pillar 1142 on the second surface of the redistribution layer 103, wherein a first end of the first antenna feed line 1141 and a first end of the metal pillar 1142 are electrically connected to the redistribution layer 103;
forming a first encapsulation layer 124 on a second side of the redistribution layer 103, the first encapsulation layer 124 covering the second side of the redistribution layer 103, the first antenna feed 1141 and the metal pillar 1142 and exposing a second end of the first antenna feed 1141 and a second end of the metal pillar 1142;
the first antenna metal layer 1341 and a metal connector 1342 are formed on the first package layer 124, the first antenna metal layer 1341 is electrically connected to the second end of the first antenna feed line 1141, and the metal connector 1342 is electrically connected to the second end of the metal pillar 1142.
As an example, the method of forming the first antenna feed line 1141 may include one or a combination of a wire bonding method, electroplating, and electroless plating, and the material of the first antenna feed line 1141 may include one or a combination of copper, gold, silver, and aluminum; the method for forming the metal pillar 1142 may include one or a combination of wire bonding, electroplating and electroless plating, and the material of the metal pillar 1142 may include one or a combination of copper, gold, silver and aluminum.
Specifically, the first antenna feed line 1141 and the metal post 1142 are preferably made of the same material; the first antenna metal layer 1341 and the metal connector 1342 are made of the same material, so that the first antenna feed line 1141 and the metal pillar 1142 can be formed in the same process, and the first antenna metal layer 1341 and the metal connector 1342 can be formed in the same process, thereby improving the production efficiency and reducing the production cost.
As an example, the material of the first encapsulation layer 124 may include one of polyimide, silicone, and epoxy. The method of forming the first encapsulation layer 124 may include one of compression molding, transfer molding, liquid encapsulation molding, vacuum lamination, and spin coating. After the first encapsulation layer 124 is formed, a chemical mechanical polishing method may be further used to act on the upper surface of the first encapsulation layer 124, so as to provide a flat first encapsulation layer 124, and further improve the product quality.
As an example, the method of forming the first antenna metal layer 1341 and the metal connector 1342 may include one or a combination of physical vapor deposition, chemical vapor deposition, electroplating process, or chemical plating process.
Specifically, a metal layer may be formed on the surface of the first package layer 124 by using physical vapor deposition or chemical vapor deposition, and then the first antenna metal layer 1341 and the metal connector 1342 with desired patterns are formed by using an etching process. Of course, the first antenna metal layer 1341 and the metal connector 1342 may also be formed by an electroplating process or a chemical plating process, for example, a metal seed layer may be formed on the surface of the first package layer 124, then a patterned photoresist may be formed, the first antenna metal layer 1341 and the metal connector 1342 may be formed by an electroplating process, and finally the photoresist and the excess metal seed layer may be removed.
As an example, a dielectric layer 105 may be further included between the first antenna structure 104 and the second antenna structure 106 formed subsequently.
As shown in fig. 4, the dielectric layer 105 covers the first package layer 124, the first antenna metal layer 1341 and the metal connector 1342, and the bonding force between the first package layer 124 and the second package layer 116 can be further improved by the dielectric layer 105, so as to improve the stability of the package antenna structure. The dielectric layer 105 may be formed by using the same material and preparation method as the first package layer 124 and the second package layer 116, so as to reduce the process complexity and improve the bonding performance between the first package layer 124 and the second package layer 116.
As shown in fig. 5, the second antenna structure 106 is formed.
Specifically, the second antenna structure 106 includes the second package layer 116 and a second antenna metal layer 126, the second package layer 116 covers the dielectric layer 105, and the second antenna metal layer 126 is located on the second package layer 116. The preparation method and material selection of the second antenna structure 106 may be the same as those of the first antenna structure 104, which is not described herein again, and preferably, the second encapsulation layer 116, the dielectric layer 105 and the first encapsulation layer 124 are made of the same material, so as to improve the structural stability.
For example, the second antenna metal layer 126 has a window in a vertical region of the metal connector 1342, so as to avoid the second antenna metal layer 126 from shielding the metal connector 1342, and further reduce the process difficulty and cost when the metal connector 1342 is exposed by removing the second package layer 116.
As an example, the second antenna structure 106 may further include a second antenna feed line (not shown) between the second antenna metal layer 126 and the first antenna metal layer 1341 for connecting the second antenna metal layer 126 and the first antenna metal layer 1341, so as to further reduce the signal loss of the packaged antenna structure.
As an example, the second side of the redistribution layer 103 may include N antenna structures stacked on each other, where N ≧ 2, so as to further improve the integration level and the integration performance of the packaged antenna structure.
Specifically, in this embodiment, N is 2, that is, the first antenna structure 104 and the second antenna structure 106 are stacked, and in another embodiment, N may also be 3, 4, 5, and the like, so as to further improve the integration level and the integration performance of the packaged antenna structure, and a specific value of N is not limited herein.
As shown in fig. 6, the separation layer 102 and the supporting substrate 101 are removed to expose the first surface of the redistribution layer 103; the semiconductor chip 107, the third packaging layer 108 and the metal bump 109 are formed on the first surface of the redistribution layer 103.
Specifically, the third encapsulation layer 108 may protect the redistribution layer 103 and the semiconductor chip 107, and the third encapsulation layer 108 may also serve as a support layer, so as to improve structural stability, and the material and the preparation method of the third encapsulation layer 108 may be the same as those of the first encapsulation layer 124, which is not described herein again. The material of the metal bump 109 may include one or a combination of copper, nickel, tin and silver; the manufacturing method may form a through hole exposing the first surface of the redistribution layer 103 in the third encapsulation layer 108 by etching the third encapsulation layer 108, and then form the metal bump 109 in the through hole by one or a combination of reflow soldering and laser welding, but the method for forming the metal bump 109 is not limited thereto.
As an example, the semiconductor chip 107 may include one or a combination of active and passive components; the active component can comprise one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor, and an inductor.
Next, as shown in fig. 7, the connector window is formed in the antenna structure.
Specifically, in this embodiment, the metal connector 1342 is exposed by removing a portion of the second encapsulation layer 116 and the dielectric layer 105. The method for removing the second package layer 116 and the dielectric layer 105 may include one or a combination of dry etching and wet etching.
Then, as shown in fig. 8, the package antenna connector 111 is formed in the connector window, and the package antenna connector 111 is electrically connected to the redistribution layer 103 through the metal connector 1342 and the metal post 1142 to prepare the package antenna module, wherein an electrical terminal of the package antenna module includes the metal bump 109 and the package antenna connector 111, so that the package antenna module can be interconnected with the outside through the package antenna connector 111, thereby reducing signal loss and further improving the overall competitive advantage of the WLP AiP.
As an example, the method of forming the packaged antenna connector 111 in the connector window may include one or a combination of reflow soldering and laser welding.
Specifically, the type and type of the packaged antenna connector 111 are not limited herein, in this embodiment, a reflow soldering manner is adopted to electrically connect the packaged antenna connector 111 and the metal connector 1342, and the packaged antenna connector 111 is electrically connected to the redistribution layer 103 through the metal connector 1342 and the metal post 1142. Wherein, after the packaged antenna connector 111 is formed, a cleaning step can be performed to improve the cleanliness.
As an example, the package antenna connector 111 is matched with a circuit board connector 112 located on a circuit board 120, and the electrical connection of the package antenna structure and the circuit board 120 is realized through the electrical connection of the package antenna connector 111 and the circuit board connector 112; the circuit board 120 includes one or a combination of a flexible circuit board and a rigid circuit board.
Specifically, as shown in fig. 9, the circuit board 120 and the circuit board connector 112 are provided, wherein the circuit board 120 may include one or a combination of a flexible circuit board and a rigid circuit board, the circuit board connector 112 is electrically connected to the circuit board 120, and the circuit board connector 112 is matched with the package antenna connector 111 to form a connector 110 capable of being electrically connected well, so as to implement interconnection through the connector 110. The first encapsulation layer 124 may serve as a core layer for providing support.
Example two
As shown in fig. 11, the present embodiment provides a schematic structural diagram of a packaged antenna module, which is mainly different from the first embodiment in that the position of the connector window in the packaged antenna module is different, so as to expand the selection range of the packaged antenna connector.
The packaged antenna module includes a redistribution layer 203, an antenna structure, a semiconductor chip 207, a third packaging layer 208, a metal bump 209, and a packaged antenna connector 211. Wherein the redistribution layer 203 includes a first surface and a second surface which are oppositely arranged; the antenna structure comprises a connector window and at least a first antenna structure 204 and a second antenna structure 206 stacked and disposed on a second side of the redistribution layer 203, the first antenna structure 204 comprises a first antenna feed line 214, a first antenna metal layer 234 and a first encapsulation layer 224, a first end of the first antenna feed line 214 is electrically connected with the redistribution layer 203, the first encapsulation layer 224 covers the first antenna feed line 214 and exposes a second end of the first antenna feed line 214, the first antenna metal layer 234 is located on the first encapsulation layer 224 and is electrically connected with the second end of the first antenna feed line 214; the second antenna structure 206 includes a second encapsulation layer 216 and a second antenna metal layer 226, the second encapsulation layer 216 covers the first antenna metal layer 234, and the second antenna metal layer 226 is located on the second encapsulation layer 216; the semiconductor chip 207 is located on a first side of the re-wiring layer 203 and electrically connected to the re-wiring layer 203; the metal bump 209 is located on a first surface of the redistribution layer 203 and electrically connected to the redistribution layer 203; the third packaging layer 208 covers the semiconductor chip 207 and the first side of the redistribution layer 203 and exposes the metal bump 209; the package antenna connector 211 is located in the connector window and electrically connected to the redistribution layer 203.
As an example, the bottom of the connector window exposes the metal wires 223 of the redistribution layer 203, and the package antenna connector 211 is electrically connected to the metal wires 223.
Specifically, the redistribution layer 203 includes a wiring medium 213 and the metal wiring 223. In this embodiment, the metal wires 223 of the redistribution layer 203 are directly exposed at the bottom of the connector window, and the package antenna connector 211 is electrically connected to the metal wires 223 so as to be electrically led out through the package antenna connector 211, thereby expanding the selection range of the package antenna connector 211. The electrical leading-out end of the packaged antenna module comprises the metal bump 209 and the packaged antenna connector 211, so that the packaged antenna module can be interconnected with the outside through the packaged antenna connector 211, signal loss is reduced, and the overall competitive advantage of WLP AiP is further improved.
Referring to fig. 10 and fig. 11, schematic structural diagrams of the packaged antenna module according to the present embodiment are shown, wherein a dielectric layer 205 may be further included between the first antenna structure 204 and the second antenna structure 206. The specific structure and the manufacturing method of the packaged antenna module can refer to the first embodiment, and are not described herein again.
Referring to fig. 12, a circuit board 220 and a circuit board connector 212 are provided, wherein the circuit board 220 may include one or a combination of a flexible circuit board and a rigid circuit board, the circuit board connector 212 is electrically connected to the circuit board 220, and the circuit board connector 212 is matched with the package antenna connector 211 to form an electrically connectable connector 210, so that the interconnection is realized through the connector 210, and the third package layer 208 may serve as a core layer for providing a supporting function.
In summary, according to the packaged antenna module and the manufacturing method thereof of the present invention, the packaged antenna connector located in the connector window is electrically connected to the redistribution layer through the connector window, and the packaged antenna connector is electrically led out, so that the packaged antenna module can be directly interconnected with the outside, thereby reducing signal loss and further improving the overall competitive advantage of WLP AiP.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (18)
1. A method for manufacturing a packaged antenna module is characterized by comprising the following steps:
providing a packaged antenna structure, the packaged antenna structure comprising: the rewiring layer comprises a first surface and a second surface which are oppositely arranged; the antenna structure at least comprises a first antenna structure and a second antenna structure which are stacked and arranged on the second surface of the rewiring layer; the first antenna structure comprises a first antenna feed line, a first antenna metal layer and a first encapsulation layer, wherein a first end of the first antenna feed line is electrically connected with the redistribution layer, the first encapsulation layer covers a second side of the redistribution layer and the first antenna feed line and exposes a second end of the first antenna feed line, and the first antenna metal layer is positioned on the first encapsulation layer and is electrically connected with the second end of the first antenna feed line; the second antenna structure comprises a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer and the first packaging layer, and the second antenna metal layer is positioned on the second packaging layer; a semiconductor chip located on a first face of the rewiring layer and electrically connected to the rewiring layer; a metal bump on a first face of the rewiring layer and electrically connected to the rewiring layer; a third encapsulation layer covering the semiconductor chip and the first surface of the rewiring layer and exposing the metal bump;
forming a connector window in the antenna structure;
and forming a packaged antenna connector in the connector window, wherein the packaged antenna connector is electrically connected with the redistribution layer.
2. The method of manufacturing a packaged antenna module according to claim 1, wherein: the packaging antenna connector is matched with a circuit board connector on a circuit board and is electrically connected with the circuit board connector through the packaging antenna connector; the circuit board comprises one or a combination of a flexible circuit board and a rigid circuit board.
3. The method of manufacturing a packaged antenna module according to claim 1, wherein: the first antenna structure further comprises a metal pillar and a metal connecting piece, wherein a first end of the metal pillar is electrically connected with the rewiring layer, the first packaging layer covers the metal pillar and exposes a second end of the metal pillar, and the metal connecting piece is located on the first packaging layer and is electrically connected with the second end of the metal pillar; the metal connecting piece is exposed at the bottom of the connector window, and the packaging antenna connector is electrically connected with the metal connecting piece so as to be electrically connected with the rewiring layer through the metal connecting piece and the metal column.
4. The method of manufacturing a packaged antenna module according to claim 1, wherein: and the bottom of the connector window exposes the metal wiring of the rewiring layer, and the packaging antenna connector is electrically connected with the metal wiring.
5. The method of manufacturing a packaged antenna module according to claim 1, wherein: a dielectric layer is further arranged between the first antenna structure and the second antenna structure.
6. The method of manufacturing a packaged antenna module according to claim 1, wherein: the second antenna structure further includes a second antenna feed line between the second antenna metal layer and the first antenna metal layer, the second antenna metal layer and the first antenna metal layer being connected by the second antenna feed line.
7. The method of manufacturing a packaged antenna module according to claim 1, wherein: the method of forming the packaged antenna connector in the connector window includes one or a combination of reflow soldering and laser welding.
8. The method of manufacturing a packaged antenna module according to claim 1, wherein: the method for forming the first antenna feed line comprises one or a combination of a wire bonding method, electroplating and chemical plating, and the material of the first antenna feed line comprises one or a combination of copper, gold, silver and aluminum.
9. The method of manufacturing a packaged antenna module according to claim 1, wherein: the method of forming the connector window includes one or a combination of dry etching and wet etching.
10. The method of manufacturing a packaged antenna module according to claim 1, wherein: the semiconductor chip comprises one or a combination of an active component and a passive component; the active component can comprise one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor, and an inductor.
11. A packaged antenna module, comprising:
the rewiring layer comprises a first surface and a second surface which are oppositely arranged;
an antenna structure including a connector window and first and second antenna structures at least stacked on a second side of the redistribution layer, wherein the first antenna structure includes a first antenna feed line, a first antenna metal layer, and a first encapsulation layer, a first end of the first antenna feed line is electrically connected with the redistribution layer, the first encapsulation layer covers the first antenna feed line and exposes a second end of the first antenna feed line, and the first antenna metal layer is on the first encapsulation layer and is electrically connected with the second end of the first antenna feed line; the second antenna structure comprises a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer, and the second antenna metal layer is positioned on the second packaging layer;
a semiconductor chip located on a first face of the rewiring layer and electrically connected to the rewiring layer;
a metal bump on a first face of the rewiring layer and electrically connected to the rewiring layer;
a third encapsulation layer covering the semiconductor chip and the first surface of the rewiring layer and exposing the metal bump;
a package antenna connector located in the connector window and electrically connected to the redistribution layer.
12. The packaged antenna module of claim 11, wherein: the packaging antenna connector is matched with a circuit board connector on a circuit board and is electrically connected with the circuit board connector through the packaging antenna connector; the circuit board comprises one or a combination of a flexible circuit board and a rigid circuit board.
13. The packaged antenna module of claim 11, wherein: the first antenna structure further comprises a metal pillar and a metal connecting piece, wherein a first end of the metal pillar is electrically connected with the rewiring layer, the first packaging layer covers a second surface of the rewiring layer and the metal pillar and exposes a second end of the metal pillar, and the metal connecting piece is located on the first packaging layer and is electrically connected with the second end of the metal pillar; the metal connecting piece is exposed at the bottom of the connector window, and the packaging antenna connector is electrically connected with the metal connecting piece so as to be electrically connected with the rewiring layer through the metal connecting piece and the metal column.
14. The packaged antenna module of claim 11, wherein: and the bottom of the connector window exposes the metal wiring of the rewiring layer, and the packaging antenna connector is electrically connected with the metal wiring.
15. The packaged antenna module of claim 11, wherein: a dielectric layer is further arranged between the first antenna structure and the second antenna structure.
16. The packaged antenna module of claim 11, wherein: the second antenna structure further includes a second antenna feed line between the second antenna metal layer and the first antenna metal layer, the second antenna metal layer and the first antenna metal layer being connected by the second antenna feed line.
17. The packaged antenna module of claim 11, wherein: the first antenna feed line comprises one or a combination of a copper feed line, a gold feed line, a silver feed line, and an aluminum feed line.
18. The packaged antenna module of claim 11, wherein: the semiconductor chip comprises one or a combination of an active component and a passive component; the active component can comprise one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor, and an inductor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910661882.9A CN112259954A (en) | 2019-07-22 | 2019-07-22 | Packaged antenna module and preparation method thereof |
| US16/935,550 US11228089B2 (en) | 2019-07-22 | 2020-07-22 | Antenna packaging module and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910661882.9A CN112259954A (en) | 2019-07-22 | 2019-07-22 | Packaged antenna module and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112259954A true CN112259954A (en) | 2021-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910661882.9A Pending CN112259954A (en) | 2019-07-22 | 2019-07-22 | Packaged antenna module and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114551251A (en) * | 2022-02-23 | 2022-05-27 | 威海艾迪科电子科技股份有限公司 | Multi-chip package with antenna structure and preparation method thereof |
-
2019
- 2019-07-22 CN CN201910661882.9A patent/CN112259954A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114551251A (en) * | 2022-02-23 | 2022-05-27 | 威海艾迪科电子科技股份有限公司 | Multi-chip package with antenna structure and preparation method thereof |
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Address after: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province (place of business: No.9 Dongsheng West Road, Jiangyin City) Applicant after: Shenghejing micro semiconductor (Jiangyin) Co.,Ltd. Applicant after: HUAWEI DEVICE Co.,Ltd. Address before: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province Applicant before: SJ Semiconductor (Jiangyin) Corp. Applicant before: HUAWEI DEVICE Co.,Ltd. |