CN112259473A - Method and device for generating small substrate with attached DAF, storage medium and electronic device - Google Patents
Method and device for generating small substrate with attached DAF, storage medium and electronic device Download PDFInfo
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- CN112259473A CN112259473A CN202011107786.9A CN202011107786A CN112259473A CN 112259473 A CN112259473 A CN 112259473A CN 202011107786 A CN202011107786 A CN 202011107786A CN 112259473 A CN112259473 A CN 112259473A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/002—Materials or surface treatments therefor, e.g. composite materials
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Abstract
The invention discloses a method and a device for generating a small substrate attached with a DAF (digital addressable array), a storage medium and electronic equipment, wherein the method for generating the small substrate attached with the DAF comprises the following steps: attaching the DAF to the reverse side of the initial packaging substrate without the circuit to obtain a packaging substrate to be cut; and cutting the front surface of the packaging substrate to be cut by using a soft cutter blade to obtain the DAF-attached small substrate, wherein the soft cutter blade is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60. In the invention, after the DAF is attached to the reverse side of the initial packaging substrate without the circuit, the soft cutter blade made of the artificial diamond with the particle size of 800-1200 and the particle density of 40-60 is adopted for cutting, so that the problem of wire drawing can be effectively reduced, and meanwhile, the two times of cutting are not needed as in the prior art, the process complexity is reduced, the labor cost and the substrate cost are saved, and the manufacturing cost is saved.
Description
Technical Field
The invention relates to the technical field of manufacturing of memory chips, in particular to a method and a device for generating a small substrate attached with DAF (digital addressable array), a storage medium and electronic equipment.
Background
DAF (die Attach film) is a chip bonding film, and is used for cutting and separating chips together during laser cutting, and stripping (film expansion) is carried out, so that the chips after cutting can be adhered to the film, and the chips cannot be scattered and arranged due to cutting.
In the conventional manufacturing process, as shown in fig. 2, the wafer 6 is attached to the large substrate 7 by DAF, integrated with the large substrate 7 by the adhesion of DAF, and subsequent routing is performed. Because of different customer requirements, wafer PAD (wafer 6 pin) locations are different, and a small substrate is required to perform bridging 8, so that several wafers 6 with different models can be manufactured on a large substrate 7, and the large substrate 7 can be suitable for different wafers 6.
In the prior art, a package substrate (on which a plurality of independent small substrates are designed) is cut to obtain small substrates, the small substrates are attached to a DAF, the DAF is cut, and the small substrates with the DAF are attached to a large substrate 7. In the production process, the package substrate is cut into small substrates, then the small substrates are attached to the DAF, the small substrates are attached to the large substrate 7 after being cut, the process is complex, time and labor are consumed, and if the package substrate is directly attached to the DAF to be cut, the problem of wire drawing occurs.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provided are a method and a device for generating a small substrate to which a DAF is attached, a storage medium, and an electronic apparatus, which can reduce the process complexity and reduce the occurrence of a wire drawing problem.
In order to solve the technical problems, the invention adopts the technical scheme that:
a method for generating a small substrate attached with DAF comprises the following steps:
attaching the DAF to the reverse side of the initial packaging substrate without the circuit to obtain a packaging substrate to be cut;
and cutting the front surface of the packaging substrate to be cut by using a soft cutter blade to obtain the DAF-attached small substrate, wherein the soft cutter blade is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
a small substrate generating apparatus to which a DAF is attached, comprising:
the attaching module is used for attaching the DAF to the reverse side of the initial packaging substrate on which the circuit is not arranged to obtain a packaging substrate to be cut;
and the cutting module is used for cutting the front surface of the packaging substrate to be cut by using a soft cutter blade to obtain a small substrate attached with the DAF, wherein the soft cutter blade is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
a computer-readable storage medium having stored thereon a computer program storing the above-described attached DAF small substrate generating method.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
an electronic device comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor executes the computer program to realize the small substrate generation method for attaching DAF.
The invention has the beneficial effects that: after the DAF is attached to the reverse side of an initial packaging substrate without a circuit, a soft cutter blade made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60 is used for cutting, the problem of wire drawing can be effectively reduced, meanwhile, two times of cutting are not needed as in the prior art, the process complexity is reduced, the labor cost and the substrate cost are saved, and the manufacturing cost is saved.
Drawings
FIG. 1 is a schematic flow chart of a method for forming a small substrate with a DAF attached thereon according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a small substrate required for bridging in the background art of the present invention;
FIG. 3 is a schematic illustration of the problem of stringing in the background of the invention;
FIG. 4 is a schematic structural view of a soft-tipped blade according to an embodiment of the present invention;
FIG. 5 is a schematic view of a soft-knife blade according to an embodiment of the present invention during cutting;
FIG. 6 is a schematic illustration of a depth of cut according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of module connection of a DAF-attached small substrate generation apparatus according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Description of reference numerals:
1. a small substrate generating device for attaching the DAF; 2. an electronic device; 11. attaching a module; 12. a cutting module; 21. a processor; 22. a memory; 3. initially packaging a substrate; 4. DAF; 41. a mucosal membrane; 42. a substrate; 5. a soft cutter blade;
6. a wafer; 7. a large substrate; 8. and (4) bridging.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 6, an embodiment of the invention provides a method for generating a small substrate to which a DAF is attached, including:
attaching the DAF4 to the reverse side of the initial packaging substrate 3 without the circuit to obtain a packaging substrate to be cut;
and cutting the front surface of the packaging substrate to be cut by using a soft cutter blade 5 to obtain a small substrate attached with DAF4, wherein the soft cutter blade 5 is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60.
From the above description, the beneficial effects of the present invention are: after the DAF4 is attached to the reverse side of the original packaging substrate 3 without the circuit, the soft cutter blade 5 made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60 is used for cutting, the problem of wire drawing can be effectively reduced, and meanwhile, the prior art does not need to cut twice, so that the process complexity is reduced, the labor cost and the substrate cost are saved, and the manufacturing cost is saved.
Further, the cutting parameters for cutting the front surface of the package substrate to be cut by using the soft cutter blade 5 are specifically as follows: the rotating speed of the cutter shaft is 35000-40000r/min, the cutting speed is 5-7mm/s, and the water flow is 1.2-1.4L/min.
From the above description, the rotation speed of the cutter shaft is adjusted from the original 30000r/min to 35000-40000r/min, the cutting speed is adjusted from 20mm/s to 5-7mm/s, and the water flow is adjusted from 1.0L/min to 1.2-1.4L/min, so that the cutter shaft is adapted to the soft cutter blade 5 to complete cutting, and the occurrence of the wire drawing problem can be further reduced.
Further, the soft-knife blade 5 has an outer diameter of 56mm to 60mm, a thickness of 0.30mm to 0.34mm, an inner diameter of 38mm to 42mm and a length of 300m to 450 m.
From the above description, it can be understood that the occurrence of the stringing problem can be further reduced by further defining the size of the soft-blade 5 as described above.
Further, before the cutting from the front side of the package substrate to be cut by using the soft cutter blade 5, the method further comprises the following steps:
determining a substrate thickness of the initial package substrate 3, and determining a cutting depth according to the substrate thickness of the initial package substrate 3, wherein the cutting depth is greater than the thickness of the initial package substrate 3 plus the adhesive film 41 of the DAF4 and less than the thickness of the initial package substrate 3 plus the DAF 4.
As is apparent from the above description, the cutting depth is determined according to the substrate thickness of the initial package substrate 3, thereby ensuring that the adhesive film 41 can be cut without cutting the base material 42 of the DAF4, so that the small substrate can be attached to the target position later.
Further, the cutting from the front surface of the package substrate to be cut by using the soft cutter blade 5 specifically includes the following steps:
acquiring a target image of an initial packaging substrate 3 attached with DAF4 in internal storage and an actual image of the packaging substrate to be cut placed on a cutting table, and judging whether the target image is consistent with the actual image;
if the packaging substrates to be cut are consistent, judging whether the packaging substrates to be cut placed on the cutting table are placed correctly, if not, adjusting the packaging substrates to be cut to a correct position or adjusting the soft cutter blade 5 to a preset cutting starting position, and then cutting the packaging substrates to be cut from the front side of the packaging substrates to be cut by using the soft cutter blade 5.
From the above description, the package substrate to be cut placed on the cutting table is confirmed and the placement position of the package substrate to be cut is secondarily confirmed, so that the accuracy of cutting is ensured.
Further, the step of attaching the DAF4 to the reverse side of the original package substrate 3 without the circuit includes the following steps:
the reverse side of the initial package substrate 3 without the circuit is faced upwards, the DAF4 is attached to the reverse side of the initial package substrate 3, and a roller is used to roll the side of the DAF4 away from the initial package substrate 3, so that the DAF4 is completely attached to the initial package substrate 3.
As can be seen from the above description, the rolling is performed by a roller to ensure that the DAF4 is completely attached to the initial package substrate 3.
Further, the method for obtaining the small substrate with the attached DAF4 further comprises the following steps:
the small substrate to which the DAF4 is attached is adsorbed using a moving mechanism so that the adhesive film 41 on the DAF4 is separated from the base material 42, and the small substrate to which the adhesive film 41 is attached at a target position.
As can be seen from the above description, at the above cutting depth, the small substrate is adsorbed, the adhesive film 41 is detached from the base material 42, and then adhered to the target site through the adhesive film 41.
Referring to fig. 7, another embodiment of the invention provides a small substrate generating apparatus 1 for attaching DAF4, including:
the attaching module 11 attaches the DAF4 to the reverse side of the initial packaging substrate 3, on which no circuit is arranged, to obtain a packaging substrate to be cut;
and the cutting module 12 is used for cutting the front surface of the packaging substrate to be cut by using a soft cutter blade 5 to obtain a small substrate attached with DAF4, wherein the soft cutter blade 5 is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60.
With regard to the specific processes and the corresponding effects achieved by the attaching module 11 and the cutting module 12, reference may be made to the related descriptions in the small substrate generating method of attaching a DAF of the above-described embodiment.
Another embodiment of the present invention provides a computer-readable storage medium having stored thereon a computer program that stores the above-described attached DAF small substrate generating method.
With regard to the specific implementation procedure and the corresponding effect of the small substrate generation method for attaching a DAF included in the computer program in the present embodiment, reference may be made to the description related to the small substrate generation method for attaching a DAF in the above-described embodiment.
Referring to fig. 8, another embodiment of the present invention provides an electronic device 2, which includes a memory 22, a processor 21, and a computer program stored in the memory 22 and executable on the processor 21, wherein the processor 21 executes the computer program to implement the method for generating a small substrate with attached DAF according to the above-mentioned embodiment.
With regard to the specific implementation procedure and the corresponding effect of the small substrate generation method for attaching a DAF implemented by the processor 21 in the present embodiment, reference may be made to the related description in the small substrate generation method for attaching a DAF of the above-described embodiment.
The method for generating the small substrate attached with the DAF, the corresponding device, the storage medium and the electronic device are mainly applied to application scenarios where the small substrate attached with the DAF4 needs to be manufactured, and the following description is given with reference to specific application scenarios:
according to the above, and with reference to fig. 1 to 6, the first embodiment of the present invention is:
a method for generating a small substrate attached with DAF comprises the following steps:
s1, attaching the DAF4 to the reverse side of the original packaging substrate 3, on which no circuit is arranged, to obtain a packaging substrate to be cut;
in this embodiment, the front and back surfaces of the initial package substrate 3 are distinguished according to whether the circuit is arranged, wherein the circuit arranged surface is the front surface, and the circuit not arranged surface is the back surface, so that when cutting is performed, the back surface of the initial package substrate 3 on which the circuit is not arranged is turned up, the DAF4 is attached to the back surface of the initial package substrate 3, and the side of the DAF4 away from the initial package substrate 3 is rolled by using a roller, so that the DAF4 is completely attached to the initial package substrate 3.
S2, determining the substrate thickness of the initial package substrate 3, and determining the cutting depth according to the substrate thickness of the initial package substrate 3, wherein the cutting depth is greater than the thickness of the initial package substrate 3 plus the adhesive film 41 of the DAF4 and less than the thickness of the initial package substrate 3 plus the DAF 4.
In this embodiment, before the cutting operation is performed, an operator performs a selection operation of an initial package substrate 3 to be cut through an operation console, the small substrate generation device determines a model of the initial package substrate selected in the selection operation according to the selection operation of the operator, acquires a substrate thickness of the initial package substrate from an internal storage according to the model, and determines a cutting depth of the cutting operation this time according to the substrate thickness and a thickness of the current DAF 4. The optional cutting depth is the thickness of the initial package substrate 3 plus the thickness of the adhesive film 41 of DAF4 plus one-half the thickness of the base material 42. In this embodiment, the thickness of the DAF4 is a fixed thickness, and in practical applications, when the used DAF4 has different thicknesses, an operator can perform the selection operation of the DAF4 through the operation console, and the small substrate generating apparatus will determine the thickness of the DAF4 according to the selection operation of the operator, so as to determine the cutting thickness in the subsequent steps.
S3, cutting the front surface of the packaging substrate to be cut by using a soft cutter blade 5 to obtain a small substrate attached with DAF4,
in this embodiment, the soft blade 5 is model number SD1000N50M42, where SD is synthetic diamond, 1000 is the diamond particle size, 50 is the diamond particle density, also known as concentration or bonding, and M42 is the binder. In other embodiments, the synthetic diamond may have a particle size of 800 to 1200 and a particle density of 40 to 60, such as 800 for the synthetic diamond and 40 for the synthetic diamond, 1200 for the synthetic diamond and 60 for the synthetic diamond, and so on.
In this embodiment, the cutting parameters for cutting the package substrate to be cut from the front surface by using the soft cutter blade 5 are specifically: the rotating speed of the cutter shaft is 35000r/min, the cutting speed is 5mm/s, the water flow is 1.2L/min, and the height between the outer circle of the soft cutter blade 5 and the worktable is 0.058 mm.
As shown in fig. 4, the soft-knife blade 5 has an outer diameter of between 56mm and 60mm, a thickness of between 0.30mm and 0.34mm, an inner diameter of between 38mm and 42mm and a length of between 300m and 450m, and in this embodiment, the outer diameter, the thickness and the inner diameter of the soft-knife blade 5 are 58mm and 0.31mm and 40 mm.
In this embodiment, step S3 specifically includes the following steps:
s31, acquiring a target image of the initial packaging substrate 3 attached with the DAF4 in the internal storage and an actual image of the packaging substrate to be cut placed on a cutting table, and judging whether the target image is consistent with the actual image;
in this embodiment, the internal storage stores target images of different initial package substrates 3, the target images correspond to one initial package substrate 3, before the operator performs the cutting operation, the operator calls the target image of the initial package substrate 3 to be cut from the internal storage through the operation platform, and after the operator performs the cutting operation through the operation platform, the related image device automatically acquires an actual image of the package substrate to be cut placed on the cutting platform, and the small substrate generating device compares the target image with the actual image for consistency.
S32, if the package substrates to be cut are consistent, judging whether the package substrates to be cut placed on the cutting table are placed correctly, if the package substrates to be cut are placed incorrectly, adjusting the package substrates to be cut to a correct position or adjusting the soft cutter blade 5 to a preset cutting starting position, and cutting the package substrates to be cut from the front side of the package substrates to be cut by using the soft cutter blade 5 to obtain small substrates attached with DAF 4;
in this step, if the target image is consistent with the actual image, the subsequent operation is performed according to the predetermined step, if the target image is not consistent with the actual image, a prompt message is sent, the prompt message is used for prompting that the current target image is not consistent with the actual image of the relevant operator, and the relevant operator is determined to be prompted, wherein the prompt message may be related information displayed on an operation platform or related operator is prompted at a preset position of a relevant operation platform or operation equipment in an audible and visual alarm manner. Further, if the target image is consistent with the actual image, the related image is collected through the image device, whether the packaging substrate to be cut which is currently placed on the cutting table is placed at the preset placing position is judged, if the packaging substrate to be cut is not placed at the preset placing position, the packaging substrate to be cut is judged not to be placed correctly, at this moment, the small substrate generating device performs corresponding operation according to the working condition of the current manipulator or the soft cutter blade 5, when the current manipulator is in an idle state, the small substrate generating device controls the manipulator, the packaging substrate to be cut is adjusted to the correct preset placing position through the manipulator, or the small substrate generating device adjusts the soft cutter blade 5 according to the current placing position of the packaging substrate to be cut, so that the soft cutter blade 5 determines the lower cutter position according to the current placing position of the packaging substrate to be cut, to ensure that the softknife blade 5 can start working from a preset cut-off position.
And S33, judging whether the small substrate attached with the DAF4 has the wire drawing phenomenon through image recognition, and if so, alarming according to a preset alarm mechanism.
In this case, fig. 5 may be referred to for cutting from the front surface of the package substrate to be cut by using the soft cutter blade 5, and fig. 3 may be referred to for a wire drawing phenomenon.
If the soft cutter blade 5 can only start cutting from a fixed position, the package substrate to be cut is adjusted to a correct position and then cut, and if the soft cutter blade 5 can start cutting from a random position, the soft cutter blade 5 is adjusted to a preset start cutting position and then cut.
The preset alarm mechanism also comprises no alarm, namely the wire drawing phenomenon is displayed, but the alarm is not necessarily carried out, and the alarm can be selected according to the requirements of users.
S4, the small substrate to which the DAF4 is attached is adsorbed using a moving mechanism so that the adhesive film 41 on the DAF4 is separated from the base material 42, and the small substrate to which the adhesive film 41 is attached at a target position.
In this embodiment, the moving mechanism is a robot hand.
Referring to fig. 7, when the adhesive film 41 of the DAF4 is cut and the base material 42 is not cut, the small substrate to which the DAF4 is attached is sucked by a robot, the adhesive film 41 on the DAF4 is cut away from the adhesive film 41 at another position and is allowed to follow the DAF4, and the base material 42 is still connected to the base material 42 at another position and is not allowed to follow the DAF4, so that the adhesive film 41 on the DAF4 is separated from the base material 42.
According to the above, and with reference to fig. 1 to 6, the second embodiment of the present invention is:
on the basis of the first embodiment, the cutting parameters of the present embodiment specifically include: the rotating speed of the cutter shaft is 37500r/min, the cutting speed is 6mm/s, the water flow is 1.3L/min, and the height between the outer circle of the soft cutter blade 5 and the worktable is 0.065 mm.
According to the above, and with reference to fig. 1 to 6, the third embodiment of the present invention is:
on the basis of the first embodiment, the cutting parameters of the present embodiment specifically include: the rotating speed of the cutter shaft is 40000r/min, the cutting speed is 7mm/s, the water flow is 1.4L/min, and the height between the outer circle of the soft cutter blade 5 and the workbench is 0.072 mm.
Therefore, in other embodiments, the rotating speed of the cutter shaft is 35000-40000r/min, the cutting speed is 5-7mm/s, the water flow is 1.2-1.4L/min, and the height between the outer circle of the soft cutter blade 5 and the workbench is 0.058-0.072 mm.
Referring to fig. 7, a fourth embodiment of the present invention is a small substrate generating apparatus 1 attached with DAF4 corresponding to the small substrate generating method attached with DAF in the first, second or third embodiment, including:
the attaching module 11 attaches the DAF4 to the reverse side of the initial packaging substrate 3, on which no circuit is arranged, to obtain a packaging substrate to be cut;
and the cutting module 12 is used for cutting the front surface of the packaging substrate to be cut by using a soft cutter blade 5 to obtain a small substrate attached with DAF4, wherein the soft cutter blade 5 is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60.
An embodiment five of the present invention is a computer-readable storage medium corresponding to the small substrate generating method of attaching a DAF in the above embodiment one or two or three, on which a computer program is stored, the computer program storing the small substrate generating method of attaching a DAF as in the above embodiment one or two or three.
Referring to fig. 8, a sixth embodiment of the invention is an electronic device 2 corresponding to the method for generating a small substrate with a DAF attached in the first, second or third embodiment, and includes a memory 22, a processor 21, and a computer program stored in the memory 22 and capable of running on the processor 21, wherein the processor 21 implements the method for generating a small substrate with a DAF attached in the first, second or third embodiment when executing the computer program.
In the six embodiments provided in the present application, it should be understood that the disclosed method, apparatus, storage medium, and electronic device may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is only one logical division, and other divisions may be realized in practice, for example, a plurality of modules may be combined or integrated into another apparatus, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or modules, and may be in an electrical, mechanical or other form.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, functional modules in the embodiments of the present invention may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.
The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
It should be noted that, for the sake of simplicity, the above-mentioned method embodiments are described as a series of acts or combinations, but those skilled in the art should understand that the present invention is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no acts or modules are necessarily required of the invention.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In summary, according to the method, the device, the storage medium and the electronic device for generating the small substrate to which the DAF is attached, after the DAF is attached to the reverse side of the initial packaging substrate on which the circuit is not arranged, the soft-blade made of the artificial diamond with the particle size of 800 to 1200 and the particle density of 40 to 60 is used for cutting, the size and the cutting parameters of the soft-blade are further limited, the wire drawing problem can be effectively reduced, two times of cutting are not needed as in the prior art, the process complexity is reduced, the labor cost and the substrate cost are saved, and the manufacturing cost is saved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method for generating a small substrate attached with DAF is characterized by comprising the following steps:
attaching the DAF to the reverse side of the initial packaging substrate without the circuit to obtain a packaging substrate to be cut;
and cutting the front surface of the packaging substrate to be cut by using a soft cutter blade to obtain the DAF-attached small substrate, wherein the soft cutter blade is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60.
2. The method for generating a small substrate with a DAF attached thereon according to claim 1, wherein the cutting parameters for cutting the packaging substrate to be cut from the front surface thereof by using a soft-blade are as follows: the rotating speed of the cutter shaft is 35000-40000r/min, the cutting speed is 5-7mm/s, and the water flow is 1.2-1.4L/min.
3. The method of claim 1, wherein the soft-blade has an outer diameter of 56mm to 60mm, a thickness of 0.30mm to 0.34mm, an inner diameter of 38mm to 42mm, and a length of 300m to 450 m.
4. The method for generating a small substrate with attached DAF as claimed in claim 1, further comprising before said cutting from the front surface of the package substrate to be cut with a soft-blade:
determining the thickness of the initial packaging substrate, and determining the cutting depth according to the thickness of the initial packaging substrate, wherein the cutting depth is larger than the thickness of the initial packaging substrate plus the adhesive film of the DAF and smaller than the thickness of the initial packaging substrate plus the DAF.
5. The method for generating a small substrate with attached DAF as claimed in any of claims 1 to 4, wherein the step of cutting the front surface of the package substrate to be cut by using a soft-blade specifically comprises the following steps:
acquiring a target image of an initial packaging substrate attached with DAF in internal storage and an actual image of the packaging substrate to be cut placed on a cutting table, and judging whether the target image is consistent with the actual image;
if the packaging substrates to be cut are consistent, judging whether the packaging substrates to be cut placed on the cutting table are placed correctly, if not, adjusting the packaging substrates to be cut to a correct position or adjusting the soft cutter blade to a preset cutting starting position, and then cutting the packaging substrates to be cut from the front side of the packaging substrates to be cut by using the soft cutter blade.
6. The method as claimed in any one of claims 1 to 4, wherein the step of attaching the DAF to the reverse side of the original packaging substrate without the wiring comprises the following steps:
and the back surface of the initial packaging substrate, which is not provided with the circuit, faces upwards, the DAF is attached to the back surface of the initial packaging substrate, and a roller is used for rolling the side, far away from the initial packaging substrate, of the DAF, so that the DAF is completely attached to the initial packaging substrate.
7. The method as claimed in any one of claims 1 to 4, further comprising the following steps after obtaining the DAF-attached small substrate:
and adsorbing the small substrate attached with the DAF by using a moving mechanism, so that the mucous membrane on the DAF is separated from the base material, and attaching the small substrate attached with the mucous membrane to a target position.
8. A small substrate generation device to which a DAF is attached, comprising:
the attaching module is used for attaching the DAF to the reverse side of the initial packaging substrate on which the circuit is not arranged to obtain a packaging substrate to be cut;
and the cutting module is used for cutting the front surface of the packaging substrate to be cut by using a soft cutter blade to obtain a small substrate attached with the DAF, wherein the soft cutter blade is made of artificial diamond with the particle size of 800-1200 and the particle density of 40-60.
9. A computer-readable storage medium having stored thereon a computer program, characterized in that: the computer program stores a method of generating a small substrate to which a DAF is attached as set forth in any one of claims 1 to 7.
10. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the method for generating a small substrate with attached DAF according to any one of claims 1 to 7 when executing the computer program.
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