CN112242340A

CN112242340A - Substrate supporting device

Info

Publication number: CN112242340A
Application number: CN202010322025.9A
Authority: CN
Inventors: 朴天英; 金盛珍; 赵源锡
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2019-07-17
Filing date: 2020-04-22
Publication date: 2021-01-19
Also published as: KR20210010704A

Abstract

The substrate supporting apparatus according to an embodiment of the present invention includes: the supporting frame comprises a first supporting part and a second supporting part, and at least one part of the second supporting part is separated from the first supporting part; a pin member for supporting a lower surface of the substrate and including a plurality of first support pins coupled to the first support part and a plurality of second support pins coupled to the second support part; and a driving module selectively moving the first support part and the second support part along a normal direction of the lower surface of the substrate. Therefore, the present invention can be applied to different kinds of substrates without replacing the apparatus.

Description

Substrate supporting device

Technical Field

The present invention relates to a substrate supporting device and a substrate processing apparatus including the same, and more particularly, to a substrate supporting device and a substrate processing apparatus capable of supporting different kinds of substrates.

Background

The variety of substrates used in the manufacturing process of display substrates is wide. In recent years, different kinds of substrates (work substrates) are often used. In this case, when the type of the substrate to be manufactured is changed, the equipment operation rate is lowered due to the time and cost required for equipment replacement, and there is a loss in the work cost and work time associated therewith.

Disclosure of Invention

The invention provides a substrate supporting device and a substrate processing apparatus including the same, which can manufacture various electronic substrates by using different types of (operation) substrates without replacing the apparatus.

The substrate supporting apparatus includes: the supporting frame comprises a first supporting part and a second supporting part, and at least one part of the second supporting part is separated from the first supporting part; a pin member for supporting a lower surface of the substrate and including a plurality of first support pins coupled with the first support part and a plurality of second support pins coupled with the second support part; and a driving module selectively moving the first support part and the second support part along a normal direction of the lower surface of the substrate.

The substrate may include a first substrate and a second substrate respectively including a plurality of active areas and a boundary area between the plurality of active areas, the boundary area of the first substrate and the boundary area of the second substrate having different shapes from each other.

The first support part may be raised or lowered corresponding to the boundary region of the first substrate, and the second support part may be raised or lowered corresponding to the boundary region of the second substrate.

The first support pin may support the boundary region of the first substrate, and the second support pin may support the boundary region of the second substrate.

The second support portion may include a first portion and a second portion separated from the first portion.

The first portion and the second portion may be spaced apart from each other with the first support.

The driving module may include a first driving module and a second driving module respectively connected to the first supporting portion and the second supporting portion.

The support frame may further include a third support part, and the pin member may further include a plurality of third support pins combined with the third support part, the third support part being formed in a closed shape and surrounding the first support part and the second support part in a plan view.

The third support portion may be raised or lowered simultaneously with the first support portion or the second support portion.

The third supporting portion may be spaced apart from the first supporting portion and the second supporting portion.

In various embodiments, a substrate support apparatus may include: a carrier; a support pin disposed at a lower side of the carrier and movable in a vertical direction; and a driving module controlling positions of the support pins according to kinds of substrates to be seated on the carrier, the support pins protruding at least partially to an upper side of an upper surface of the carrier to support the substrates in a first mode, and moving to a lower side of the carrier to seat the substrates on the upper surface of the carrier in a second mode, the substrates including first and second substrates having boundary regions different in shape from each other, a first group of the support pins as a part of the support pins being available to support the boundary region of the first substrate, and a second group of the support pins as a part of the support pins being available to support the boundary region of the second substrate.

The substrate supporting apparatus may further include a support frame coupled with the support pins, the support frame overlapping the boundary region of the substrate.

The support frame may include a plurality of support parts spaced apart from each other, and the driving module controls the position of the support pin by moving the plurality of support parts.

The driving module may move the support pins of the first group and the second group corresponding to the first substrate and the second substrate, respectively.

The support pins may be moved toward an upper side of the carrier in a third mode, thereby separating the substrate seated on the upper surface of the carrier from the upper surface of the carrier.

The support pins corresponding to the boundary region of the substrate may penetrate the carrier.

When the first group of the support pins support the first substrate in the first mode, another portion of the support pins may be spaced apart from the first substrate.

The first set of support pins may comprise a portion of the second set of support pins.

The support pins may be coupled with a support frame, and the support pins ascend from the support frame in the first mode and descend toward the support frame in the second mode.

The substrate processing apparatus may include a chamber, a substrate supporting device, and a substrate transfer device, the substrate supporting device including: a carrier disposed inside the chamber; a support pin disposed at a lower side of the carrier and movable in a vertical direction; and a driving module controlling operations of the support pins according to a kind of a substrate, the substrate transfer device transferring the substrate from an outside of the chamber to an inside of the chamber, the support pins protruding at least partially to an upper side of an upper surface of the carrier to support the substrate in a first mode, and moving to a lower side of the carrier to place the substrate on the upper surface of the carrier in a second mode, the substrate including first and second substrates having boundary regions different in shape from each other, a first group of the support pins operable to support the boundary region of the first substrate, and a second group of the support pins operable to support the boundary region of the second substrate.

The substrate supporting device and the substrate processing apparatus including the same according to an embodiment of the present invention do not require replacement of the apparatus when manufacturing different types of substrates, and thus can reduce the loss in manufacturing time and manufacturing cost of electronic substrates.

Drawings

Fig. 1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention.

Fig. 2a is a diagram illustrating a raised state of the substrate supporting apparatus according to the embodiment of the present invention.

Fig. 2b is a view showing a descending state of the substrate supporting apparatus according to the embodiment of the present invention.

Fig. 3a to 3c are views showing a substrate according to an embodiment of the present invention.

Fig. 4a and 4b are plan views illustrating a substrate supporting apparatus according to an embodiment of the present invention.

Fig. 5a to 5c are plan views illustrating a raised and lowered state of the substrate supporting apparatus according to the embodiment shown in fig. 4 a.

Fig. 6a to 6c are sectional views showing a pattern of the substrate supporting apparatus of the embodiment shown in fig. 4b, taken along the direction of line I-I'.

Detailed Description

In the specification, when a certain structural element (or a region, a layer, a portion, or the like) is referred to as being "located on", "connected to", or "coupled to" another structural element, this means that the structural element may be directly arranged/connected/coupled to the other structural element or a third structural element may be arranged therebetween.

Like reference numerals refer to like structural elements. In the drawings, the thickness, ratio, and size of the constituent elements are exaggerated for effective explanation of technical contents.

"and/or" includes all combinations of more than one which the associated structure can define.

Although the terms first, second, etc. may be used to describe various elements, these elements should not be limited by these terms. The terms may be used only for the purpose of distinguishing one structural element from other structural elements. For example, a first structural element may be termed a second structural element, and similarly, a second structural element may be termed a first structural element, without departing from the scope of the present invention. With respect to a singular expression, the singular expression includes a plural expression as long as other meanings are not explicitly expressed in the context.

Terms such as "below", "on the lower side", "above", and "on the upper side" are used to describe the relationship of the structures shown in the drawings. The terms are relative concepts, and are described with reference to directions shown in the drawings.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Further, terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with those in the related art. Unless interpreted in the ideal or excessive form, it is expressly defined herein.

It will be understood that the terms "comprises" or "comprising," or the like, are used for specifying the presence of the stated features, integers, steps, operations, elements, components, or groups thereof, and are not intended to preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Referring to fig. 1, the substrate processing apparatus 1 includes a chamber 10, a substrate supporting device 100, a substrate transfer device 20, and a gate GN.

The substrate processing apparatus 1 may be a device that performs various processes such as patterning, etching, or cutting on the substrate G. Here, the substrate G may refer to a display module. The display module may include at least one of a display panel for displaying an image and an input sensing unit for sensing an external input. In addition, the substrate G may refer to a single base substrate included in the display module.

The chamber 10 provides an inner space INP. The substrate support apparatus 100 may be disposed in the internal space INP. In addition to the substrate support apparatus 100, a substrate moving apparatus, a processing apparatus, and the like (not shown) may be disposed in the internal space INP of the chamber 10. The exterior of the chamber 10 may be defined as an exterior space.

An entrance/exit opening OP through which the substrate G can enter and exit is defined in one side surface of the chamber 10. The shutter GN is disposed on the outer wall of the chamber 10 so as to cover the entrance/exit opening OP. The substrate G may be transferred to the inside or outside of the chamber 10 by controlling the opening and closing operations of the shutter GN. In another embodiment, the chamber 10 may further define an opening for accessing other components.

Further, as shown in fig. 1, it is illustrated that the chamber 10 is defined in a quadrangular shape, but is not limited thereto, and the shape of the chamber 10 may be modified into various shapes according to embodiments. In addition, the inner space INP of the chamber 10 may be divided into a plurality of moving spaces or a plurality of processing spaces according to embodiments, and an additional space required for a process may be further divided.

The substrate transfer device 20 is disposed in an outer space of the chamber 10, and can transfer the substrate G to an inner space of the chamber 10 through the entrance/exit opening OP. In one embodiment, the substrate transfer device 20 may transfer different types of substrates G to the inner space of the chamber 10.

The substrate supporting apparatus 100 according to an embodiment of the present invention may support the substrate G transferred into the inner space of the chamber 10. For example, the substrate supporting device 100 may mount the substrate G on the carrier CR or detach the substrate G from the carrier CR in a process of the substrate processing apparatus 1. More specifically, the substrate support apparatus 100 can prevent a defect in the process of placing the substrate G on the carrier CR or detaching the substrate G from the carrier CR.

The substrate G may be one substrate selected from different kinds of substrates. For example, the substrate G includes a first substrate and a second substrate. The first substrate and the second substrate include boundary regions and active regions different from each other. Different kinds of substrates can be sequentially dropped to the substrate processing apparatus 1.

Fig. 2a is a diagram illustrating a raised state of the substrate supporting apparatus according to the embodiment of the present invention. Fig. 2b is a view showing a descending state of the substrate supporting apparatus according to the embodiment of the present invention.

Referring to fig. 2a and 2b, the substrate supporting apparatus 100 includes a plurality of support pins SP, a support frame SF, and a driving module MM.

A plurality of support pins SP may be combined with the support frame SF. The plurality of support pins may support the lower surface of the substrate G.

The driving module MM may control the positions of the support pins SP according to the kind of the substrate G. The driving module MM may move the support frame SF corresponding to the kinds of substrates G different from each other. The driving module MM may include first to third modes according to the moving direction of the support pin SP.

In one embodiment, the substrate support apparatus 100 may further include a carrier CR. The carrier CR may transport the substrate G in the inner space INP of the chamber 1. The carrier CR may include a plurality of through holes CH through which the support pins SP pass.

In fig. 2a, the substrate supporting device 100 may support the lower surface of the substrate G in a state where the substrate G is transferred to the inner space INP of the chamber 10 by the substrate transfer device 20. In the first mode, at least a part of the support pins SP may penetrate the plurality of through holes CH of the carrier CR and protrude above the upper surface of the carrier CR to support the substrate G.

In fig. 2b, the substrate support apparatus 100 may lower the support frame SF in order to mount the supported substrate G on the carrier CR. In the second mode, the support pins SP may move toward the lower side of the carrier CR to be separated from the lower surface of the substrate G and mount the substrate G on the upper surface of the carrier CR.

In one embodiment, the support pins SP may be moved toward the upper side of the carrier CR in the third mode, thereby separating the substrate G seated on the upper surface of the carrier CR from the upper surface of the carrier CR. During the raising, the support pins SP support the lower surface of the substrate G1.

In fig. 2a and 2b, the support pin SP is described to be raised/lowered by the support frame SF, but the present invention is not limited thereto. For example, the support frame SF may be omitted and the plurality of support pins SP themselves ascend/descend. This is illustrated in detail in fig. 6a to 6 c.

Fig. 3a is a diagram showing a substrate according to an embodiment of the present invention. Fig. 3b is a diagram showing a substrate according to another embodiment of the present invention. Fig. 3c is a diagram showing a substrate according to still another embodiment of the present invention.

As described with reference to fig. 1, the first substrate and the second substrate having different boundary regions and effective regions means that the effective regions and the boundary regions of the first substrate and the effective regions and the boundary regions of the second substrate have different shapes from each other. Here, the effective region corresponds to a Display region of a Liquid Crystal Display (LCD) or the like, and the boundary region is a non-Display region other than the Display region and may correspond to a Dead Space (D/S).

The substrate G according to an embodiment of the present invention may be determined as different kinds of substrates G according to a production schedule. Based on the kinds of different substrates G exemplified below, the substrate supporting apparatus 100 may support the substrate G by selectively driving the support frame SF and the support pins SP coupled to the support frame SF.

In fig. 3a to 3c, the substrate G may include a plurality of substrates G of different kinds from each other. Referring to fig. 3a to 3c, the substrate G includes an active region and a boundary region. For example, fig. 3a may represent a first substrate G1, fig. 3b may represent a second substrate G2, and fig. 3c may represent a third substrate G3. The first to third substrates may include a plurality of first to third active regions and a plurality of first to third boundary regions, respectively. The first to third effective regions may have different shapes from each other, and the first to third boundary regions may also have different shapes from each other.

In fig. 3a, the first substrate G1 of the embodiment may have a plurality of first effective areas AA1 and a plurality of second effective areas AA 2. Here, the first effective area AA1 may correspond to a display area of 78 inches, and the second effective area AA2 may correspond to a display area of 30 inches. The first boundary area BA1 may correspond to a dead space at an edge of the first substrate G1, the first substrate G1 being supported by the third support pins SP3 combined with the third support part SF3 in fig. 4 a. The second boundary area BA2 may correspond to a dead space supported by the first support pin SP1 combined with the first support part SF 1. The second boundary area BA2 may correspond to a boundary that divides the first effective area AA1 and the second effective area AA 2.

In fig. 3b, the second substrate G2 may have a plurality of first effective areas AA1 and a plurality of second effective areas AA 2. Here, the first effective area AA1 may correspond to a 65-inch display area, and the second effective area AA2 may correspond to a 55-inch display area. The first boundary area BA1 may correspond to a dead space at an edge of the second substrate G2, the second substrate G2 being supported by the third support pins SP3 coupled to the third support part SF3 in fig. 4 a. The second boundary area BA2 may correspond to a dead space supported by the second support pin SP 2. The second boundary area BA2 may correspond to a boundary that divides the first effective area AA1 and the second effective area AA 2.

In fig. 3c, the third substrate G3 may have a plurality of first effective regions AA 1. Here, the first effective area AA1 may correspond to a display area of 153 inches. The first boundary area BA1 may correspond to a dead space at an edge of the third substrate G3, the third substrate G3 being supported by the third support pins SP3 coupled to the third support part SF3 in fig. 4 a. The second boundary area BA2 may correspond to a dead space supporting the fourth support pin SP4 coupled to the fourth support part SF 4. The second boundary area BA2 may correspond to a boundary dividing the plurality of first effective areas AA 1.

FIG. 4a is a top view of a substrate support apparatus according to an embodiment of the invention. Fig. 4b is a top view of a substrate support apparatus according to another embodiment of the present invention.

In fig. 4a and 4b, the substrate supporting apparatus 100 includes a support frame SF including first to fourth support portions and first to fourth support pins. Therefore, the substrate supporting apparatus 100 can efficiently support the first to third substrates without a loss of the operation rate due to the replacement of the support frame SF.

Referring to fig. 4a, the support frame SF may include a plurality of support portions spaced apart from each other. More specifically, the support frame SF may include a first support part SF1, a second support part SF2, a third support part SF3 and a fourth support part SF 4. The pin member may include a plurality of support pins SP. The pin member includes a plurality of first support pins SP1, second support pins SP2, third support pins SP3, and fourth support pins SP 4. The first to fourth support pins are coupled with the first to fourth support parts, respectively.

For example, the support frame SF may include a first support part SF1 and a second support part SF2, at least a portion of the second support part SF2 being spaced apart from the first support part SF 1. The plurality of support pins SP can support the lower surface of the substrate G. In one embodiment, the pin member may include a plurality of first support pins SP1 combined with the first support part SF1 and a plurality of second support pins SP2 combined with the second support part SF 2.

In one embodiment, the support frame SF may further include a third support portion SF3, the third support portion SF3 being spaced apart from the first support portion SF1 and the second support portion SF 2. The pin member may further include a plurality of third support pins SP3 combined with the third support part SF 3. Third support part SF3 may be formed in a closed shape and surround first and second support parts SF1 and SF2 in a plan view. That is, the third support part SF3 may be an edge portion of the support frame SF. The support frame SF may correspond to the shape of the boundary region of the substrate G, and particularly, the third support part SF3 may correspond to the shape of the boundary region at the edges of the first to third substrates.

In the present embodiment, the substrate supporting apparatus 100 is not limited to the above-described embodiments, and may further include a fourth supporting portion SF4 and a fifth supporting portion (not shown) and a fourth supporting pin SP4 and a fifth supporting pin (not shown), as will be apparent.

The first, second and fourth supporting parts SF1, SF2 and SF4 may include a first portion P1 and a second portion P2 separated from the first portion P1, respectively. The first and second portions P1 and P2 of the second support SF2 may be spaced apart from each other by a first support SF 1. That is, a plurality of portions constituting a specific support portion may be separately arranged by other support portions. In one embodiment, the first portion P1 and the second portion P2 may include driving modules, respectively. In one embodiment, the second support SF2 may move the first and second portions P1 and P2 corresponding to a boundary region of the second substrate G2. Although only the second support SF2 including the first portion P1 and the second portion P2 is illustrated, other supports may include a plurality of portions.

The fourth support part SF4 may be coupled with the fourth support pin SP4 and correspond to a boundary region of the third substrate G3. For example, the fourth support pin SP4 supports the lower surface of the boundary region of the third substrate G3. Fourth support part SF4 is surrounded by third support part SF3 and can be raised or lowered together with third support part SF 3. Although only the first to fourth supporting portions are illustrated, it is not limited thereto, and the substrate supporting apparatus 100 may include a plurality of supporting portions according to the number of kinds of the substrates G.

The driving module MM can selectively move the first and second supporting parts SF1 and SF2 in a direction normal to the lower surface of the substrate G. That is, the driving module MM may move the first support SF1 corresponding to the first substrate G1 and move the second support SF2 corresponding to the second substrate G2. The driving module MM may include a first mode to ascend the support frame SF and a second mode to descend the support frame SF. In one embodiment, the driving module MM may include a first driving module MM1 and a second driving module MM2 connected to the first supporting portion SF1 and the second supporting portion SF2, respectively. The first driving module MM1 may raise and lower the first support SF1 corresponding to the boundary region of the first substrate G1, and the second driving module MM2 may raise and lower the second support SF2 corresponding to the boundary region of the second substrate G2. Similarly, the third driving module MM3 may raise and lower the third supporting portion SF3, and the fourth driving module MM4 may raise and lower the fourth supporting portion SF 4.

Referring to fig. 4b, the substrate supporting apparatus 100 includes a support frame SF and a plurality of support pins SP. The plurality of support pins SP may include a first group supporting the boundary region of the first substrate G1 and a second group supporting the boundary region of the second substrate G2. The plurality of support pins SP are not limited thereto, and may include a plurality of groups that support different kinds of substrates G, respectively.

In one embodiment, the plurality of support pins SP may include a third set that supports an edge region of the substrate G. The third group is capable of rising and falling simultaneously with either the first group or the second group. In an embodiment, the first set of support pins may comprise a portion of the second set of support pins. Accordingly, a portion of the second group may rise corresponding to the boundary region of the first substrate G1 and the boundary region of the second substrate G2. In this case, the support pins commonly included in the first and second groups correspond to overlapping portions in the boundary area of the first substrate G1 and the boundary area of the second substrate G2.

FIG. 5a is a plan view illustrating a raised and lowered state of an embodiment of the substrate support apparatus shown in FIG. 4 a. FIG. 5b is a plan view showing a raised and lowered state of another embodiment of the substrate supporting apparatus shown in FIG. 4 a. FIG. 5c is a plan view showing a raised and lowered state of another embodiment of the substrate supporting apparatus shown in FIG. 4 a.

The first support pins SP1 can support the lower surface of the boundary region of the first substrate G1 while the first substrate G1 is transferred to the inner space INP of the chamber 10. The second support pins SP2 can support the lower surface of the boundary area of the second substrate G2 in the state where the second substrate G2 is transferred to the inner space INP of the chamber 10. The first support pins SP1 may ascend and support the boundary region of the first substrate G1 through the first driving module MM1 in the first mode. The second support pin SP2 may ascend and support a boundary region of the second substrate G2 by the second driving module MM2 in the first mode. In an embodiment, the third support pin SP3 may move together with the first support pin SP1 or the second support pin SP 2.

In fig. 5a to 5b, O and X denote support pins SP. More specifically, X may correspond to a support pin SP supporting the lower surface of the substrate G, and O may correspond to a support pin SP spaced apart from the substrate G. That is, X may correspond to the support pin SP in the state shown in fig. 2a, and O may correspond to the support pin SP in the state shown in fig. 2 b. For example, X may correspond to the first support pin SP1 coupled to the first support part SF1 and the third support pin SP3 coupled to the third support part SF3 overlapping the boundary region of the first substrate G1. In this case, O may correspond to the second support pin SP2 coupled to the second support part SF 2.

In fig. 5a, X denotes a first support pin SP1 and a third support pin SP3, and O denotes a second support pin SP2 and a fourth support pin SP 4. The first support SF1 corresponds to the first substrate G1 and ascends together with the third support SF 3. Accordingly, the first and third support pins SP1 and SP3 can support the boundary region of the first substrate G1. The second and fourth supporting parts SF2 and SF4 may not be lifted and may be located at a position spaced apart from the first and third supporting parts SF1 and SF 3. In the driving module MM, the first and third driving modules AMM1 and AMM3 are shown to be operable in the first mode and to raise the first and third supporting parts SF1 and SF 3. At this time, the second and fourth driving modules MM2 and MM4, which are not shown, do not operate.

In fig. 5b, X denotes a second support pin SP2 and a third support pin SP3, and O denotes a first support pin SP1 and a fourth support pin SP 4. The second supporting part SF2 corresponds to the second substrate G2 and ascends together with the third supporting part SF 3. Accordingly, the second and third support pins SP2 and SP3 can support the boundary region of the second substrate G2. The first and fourth supporting parts SF1 and SF4 may not be raised and may be located at a position spaced apart from the second and third supporting parts SF2 and SF 3. However, the overlapping portion PP of fourth support part SF4 overlapping with second support part SF2 is included in second support part SF2 and rises. An overlapping portion PP of the second support part SF2 overlapping with the fourth support part SF4 may correspond to an overlapping boundary region of the boundary regions of the second and third substrates G2 and G3. That is, the overlapping portion PP can support the overlapped boundary area of the second and third substrates G2 and G3. Among the driving modules MM, the second and third driving modules AMM2 and AMM3 are shown to operate in the first mode, and the first and fourth driving modules MM1 and MM4, which are not shown, do not operate.

In fig. 5c, X denotes a fourth support pin SP4 and a third support pin SP3, and O denotes a first support pin SP1 and a second support pin SP 2. The fourth supporting part SF4 corresponds to the third substrate G3 and ascends together with the third supporting part SF 3. Accordingly, the fourth support pin SP4 and the third support pin SP3 can support the boundary region of the third substrate G3. The first and second support parts SF1 and SF2 may not be raised and may be located at a position spaced apart from the fourth and third support parts SF4 and SF 3. However, in second support part SF2 of fig. 5c, an overlapping portion PP overlapping with fourth support part SF4 is included in fourth support part SF4 and rises. In the driving module MM, the fourth driving module AMM4 and the third driving module AMM3 are shown to be able to lift the fourth supporting part SF4 and the third supporting part SF3, respectively, in the first mode.

Fig. 6a is a sectional view taken along line I-I' showing a pattern of the substrate supporting apparatus shown in fig. 4b supporting a first substrate in a first mode. Fig. 6b is a sectional view taken along line I-I' showing a pattern in which the substrate supporting apparatus shown in fig. 4b supports a second substrate. FIG. 6c is a sectional view taken along line I-I' showing a pattern in which the substrate supporting apparatus shown in FIG. 4b supports a third substrate.

The support pins SP are coupled with the support frame SF, and may independently ascend from the support frame SF to support the substrate G in the first mode and descend toward the support frame SF to mount the substrate G on the carrier CR in the second mode. More specifically, the support pins of the first to third groups are able to rise in the substrate direction from the support frame SF corresponding to the first to third substrates, respectively, in the first mode. At this time, the support pin SP that is not lifted maintains a state of being coupled to the support frame SF. The support pins of the first to third groups that are raised may be lowered again in the second mode to return to a state of being coupled with the support frame SF.

In fig. 6a, a first group of support pins, which are a part of the plurality of support pins SP, ascends and supports a boundary region of the first substrate G1 corresponding to the first substrate G1 in the first mode. Here, the support pins of the first group may correspond to the first support pins SP1 of fig. 5 a. While the first group of support pins supports the first substrate G1, the other portions of the support pins may not be raised and spaced apart from the first substrate G1. The driving module MM may raise only the first group of support pins corresponding to the boundary region where the first substrate G1 supports the first substrate G1. In an embodiment, the first set of support pins may comprise a portion of the second set of support pins. A portion of the support pins commonly included in the first and second groups may each support the first and second substrates G1 and G2 corresponding to the overlapped boundary regions in the first and second substrates G1 and G2.

In fig. 6b, the support pins of the second group among the plurality of support pins SP ascend and support the boundary area of the second substrate G2 corresponding to the second substrate G2 in the first mode. Here, the support pin of the second group may correspond to the second support pin SP2 of fig. 5 b. While the second group of support pins supports the second substrate G2, the other portions of the support pins may not be raised and spaced apart from the second substrate G2. The second set of support pins may comprise a portion of the first set of support pins. A portion of the support pins commonly included in the first and second groups may each support the first and second substrates G1 and G2 corresponding to the overlapped boundary regions in the first and second substrates G1 and G2.

In fig. 6c, the support pins of the third group of the plurality of support pins SP ascend and support the boundary region of the third substrate G3 corresponding to the third substrate G3 in the first mode. Here, the support pins of the third group may correspond to the fourth support pin SP4 of fig. 5 c. While the third group of support pins supports the third substrate G3, the support pins of the other portions may not rise and be spaced apart from the third substrate G3.

While the present invention has been described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art or those having ordinary knowledge in the art that the present invention may be modified and changed in various ways without departing from the spirit and scope of the present invention as set forth in the appended claims.

Therefore, the technical scope of the present invention is not limited by the contents described in the detailed description of the specification, but is defined by the scope of the claims.

Description of the reference numerals

1: substrate processing apparatus

10: chamber

100: substrate supporting device

SF: supporting frame

SP: support pin

CR: carrier

MM: drive module

G: substrate

Claims

1. A substrate support apparatus, comprising:

the supporting frame comprises a first supporting part and a second supporting part, and at least one part of the second supporting part is separated from the first supporting part;

a pin member for supporting a lower surface of the substrate and including a plurality of first support pins coupled with the first support part and a plurality of second support pins coupled with the second support part; and

and a driving module selectively moving the first support part and the second support part along a normal direction of the lower surface of the substrate.

2. The substrate support apparatus of claim 1,

the substrate comprises a first substrate and a second substrate,

the first substrate and the second substrate respectively include a plurality of effective regions and boundary regions between the plurality of effective regions, the boundary regions of the first substrate and the second substrate having different shapes from each other.

3. The substrate support apparatus of claim 2,

the first support part ascends or descends corresponding to the boundary region of the first substrate, and the second support part ascends or descends corresponding to the boundary region of the second substrate.

4. The substrate support apparatus of claim 2,

the first support pins support the boundary region of the first substrate, and the second support pins support the boundary region of the second substrate.

5. The substrate support apparatus of claim 1,

the second support portion includes a first portion and a second portion separated from the first portion.

6. The substrate support apparatus of claim 5,

the first portion and the second portion are spaced apart from each other with the first support portion therebetween.

7. The substrate support apparatus of claim 1,

the driving module comprises a first driving module and a second driving module which are respectively connected with the first supporting part and the second supporting part.

8. The substrate support apparatus of claim 1,

the support frame further comprises a third support part,

the pin member further includes a plurality of third support pins coupled with the third support part,

the third support portion is formed in a closed shape and surrounds the first support portion and the second support portion in a plan view.

9. The substrate support apparatus of claim 8,

the third support part ascends or descends simultaneously with the first support part or the second support part.

10. The substrate support apparatus of claim 8,

the third support portion is spaced apart from the first support portion and the second support portion.