CN112241650A

CN112241650A - Light emitting module, manufacturing method of light emitting module and electronic equipment

Info

Publication number: CN112241650A
Application number: CN201910641831.XA
Authority: CN
Inventors: 严抗珍; 陈楠
Original assignee: Nanchang OFilm Biometric Identification Technology Co Ltd
Current assignee: Nanchang OFilm Biometric Identification Technology Co Ltd
Priority date: 2019-07-16
Filing date: 2019-07-16
Publication date: 2021-01-19

Abstract

The invention discloses a light emitting module, a manufacturing method of the light emitting module and electronic equipment, wherein the light emitting module comprises a circuit board, a light source, a support and an optical device, the circuit board is provided with a light source fixing area and a support welding area surrounding the light source fixing area, the light source is fixed in the light source fixing area, the bottom end of the support is plated with a metal layer, the metal layer is welded in the support welding area through welding flux so as to enable the support to be connected with the circuit board in a sealing mode, and the optical device is fixed on the support and opposite to the light source and used for transmitting light of the light source and forming light beams. Utilize the metal level to weld through the solder in the leg joint region of circuit board realizes the support and stabilizes in the circuit board, and the support with sealing connection is realized to the circuit board, makes the light emission module is high temperature resistant, and structural stability improves.

Description

Light emitting module, manufacturing method of light emitting module and electronic equipment

Technical Field

The present invention relates to the field of optoelectronic devices, and in particular, to a light emitting module, a method for manufacturing the light emitting module, and an electronic apparatus.

Background

At present, a support of the light emitting module is bonded on a circuit board through glue dispensing, and sealing is realized through the glue dispensing. However, in such a structure, the heat generated by the light emitting module is large, so that the dispensing is prone to aging due to heating, and the high temperature resistance stability of the light emitting module is reduced.

Disclosure of Invention

The invention aims to provide a light emitting module capable of improving high-temperature resistance stability and a manufacturing method of the light emitting module.

In order to solve the above technical problem, the present invention provides a light emitting module, wherein the light emitting module includes a circuit board, a light source, a bracket, and an optical device, the circuit board has a light source fixing area and a bracket welding area surrounding the light source fixing area, the light source is fixed to the light source fixing area, a metal layer is plated at a bottom end of the bracket, the metal layer is welded to the bracket welding area through a solder so as to hermetically connect the bracket and the circuit board, and the optical device is fixed to the bracket opposite to the light source and configured to transmit light of the light source and form a light beam.

The invention also provides a manufacturing method of the light emitting module, wherein the manufacturing method of the light emitting module comprises the following steps:

providing a bracket, a circuit board, a light source and an optical device, wherein the circuit board is provided with a light source fixing area and a bracket welding area;

fixing the light source to the light source fixing area;

a metal layer is plated at the bottom end of the bracket;

welding the metal layer to the bracket welding area through welding materials so as to enable the bracket to be connected with the circuit board in a sealing mode;

and fixing the optical device on the bracket and arranging the optical device opposite to the light source.

The invention further provides electronic equipment, wherein the electronic equipment comprises the light emitting module.

According to the light emitting module, the electronic equipment and the manufacturing method of the light emitting module, the metal layer is plated at the bottom end of the support, the metal layer is welded to the support welding area of the circuit board through the solder, the support is firmly fixed on the circuit board, and the support is in sealed connection with the circuit board, so that the light emitting module is high temperature resistant, and the structural stability is improved.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a light emitting module according to an embodiment of the present disclosure;

fig. 2 is a schematic top view of a circuit board of a light emitting module according to an embodiment of the present disclosure;

fig. 3 is a schematic top-down view of a bracket of a light emitting module according to an embodiment of the present disclosure;

fig. 4 is a schematic top-down view of a support of a light emitting module according to another embodiment of the present disclosure;

fig. 5 is another schematic cross-sectional view of a light emitting module according to an embodiment of the present disclosure;

fig. 6 is another schematic cross-sectional view of a light emitting module according to an embodiment of the present disclosure;

fig. 7 is another schematic cross-sectional view of a light emitting module according to an embodiment of the present disclosure;

fig. 8 is a schematic bottom view of a bracket of a light emitting module according to an embodiment of the present disclosure;

fig. 9 is another schematic cross-sectional view of a light emitting module according to an embodiment of the present disclosure;

fig. 10 is a schematic cross-sectional view of a light emitting module according to another embodiment of the present application;

fig. 11 is a schematic cross-sectional view of a light emitting module according to another embodiment of the present application;

fig. 12 is a schematic bottom view of a bracket of a light emitting module according to another embodiment of the present disclosure;

fig. 13 is a schematic flowchart illustrating a method for manufacturing a light emitting module according to an embodiment of the present disclosure;

fig. 14 is a schematic diagram of an electronic device provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1 and 2, the light emitting module 100 provided by the present invention includes a circuit board 10, a light source 20, a bracket 30 and an optical device 40, wherein the circuit board 10 is provided with a light source fixing area 11 and a bracket soldering area 12 surrounding the light source fixing area 11, the light source 20 is fixed to the light source fixing area 11, a metal layer 50 is plated on a bottom end of the bracket 30, the metal layer 50 is soldered to the bracket soldering area 12 through a solder, so that the bracket 30 is hermetically connected to the circuit board 10, and the optical device 40 is fixed to the bracket 30 opposite to the light source 20, so as to transmit light of the light source 20 and form a light beam.

It can be understood that the light emitting module 100 can be applied to an electronic device, the electronic device can be a terminal device such as a mobile phone, a notebook computer, a tablet computer, or the like, and the electronic device can also be an optoelectronic communication device, an optoelectronic display device, or a light illuminating device. The light emitting module 100 may be a TOF (Time of flight ranging) sensing module, or a floodlight module, or a binocular structure light module, or a light communication module, or an LED light module, or a laser emitting module 100.

The metal layer 50 is plated at the bottom end of the support 30, the metal layer 50 is welded to the support welding area 12 of the circuit board 10 through solder, so that the support 30 is fixed to the circuit board 10, and the support 30 is hermetically connected with the circuit board 10, so that the light emitting module 100 is high temperature resistant and has improved structural stability.

In this embodiment, the circuit board 10 has a first surface 101 and a second surface 102 disposed opposite to the first surface 101. The light source fixing area 11 and the bracket welding area 12 are both disposed on the first surface 101. The circuit board 10 is provided with a light source conductive pin 111 in the light source fixing region 11, which is in conduction with the light source 20. The circuit board 10 is provided with a conductive trace 13 which is electrically connected to the light source conductive pin 111, so as to transmit an electrical signal to the light source 20. The bracket welding area 12 is a substantially annular area surrounding the light source fixing area 11. The second surface 102 of the circuit board 10 may be provided with a backside conductive pin 14, and the backside conductive pin 14 may be electrically connected to the light source conductive pin 111 through a conductive trace 13. The back conductive pins 14 can be electrically connected to an external device, so that the optical transmission module 100 can transmit electrical signals to the external device. The circuit board 10 may be a flexible circuit board 10, a printed circuit board 10, or a rigid-flexible circuit board 10. It is to be understood that, in the schematic diagram of the present embodiment, the number of the light source conductive pins 111, the number of the conductive traces 13, and the number of the back conductive pins 14 are not specifically limited, and the arrangement form of the light source conductive pins 111, the conductive traces 13, and the back conductive pins 14 is also not specifically limited, the number of the light source conductive pins 111, the number of the conductive traces 13, and the number of the back conductive pins 14 of the optical emission module 100 may be different from the illustrated number, and the arrangement form of the light source conductive pins 111, the conductive traces 13, and the back conductive pins 14 may also be different from the illustrated arrangement form.

Specifically, the circuit board 10 includes a ceramic substrate 15, a first insulating layer 16 and a second insulating layer 17, and the first insulating layer 16 and the second insulating layer 17 cover the upper and lower surfaces of the ceramic substrate 15, respectively. The first surface 101 is formed on the first insulating layer 16, and the second surface 102 is formed on the second insulating layer 17. The conductive trace 13 is bound between the first insulating layer 16 and the ceramic substrate 15. The backside conductive leads 14 pass through the second insulating layer 17. The backside conductive pins 14 can be electrically connected to the conductive traces 13 via conductors passing through the ceramic substrate 15. The light source conductive pin 111 passes through the first insulating layer 16. Both the first insulating layer 16 and the second insulating layer 17 may be made of a resin material. The first insulating layer 16 is provided with a hollow area 161 in the bracket soldering area 12, so that the bracket 30 can conduct heat with the ceramic substrate 15 through solder, so as to increase the heat absorption performance of the ceramic substrate 15 to the bracket 30.

In this embodiment, the light source 20 may be a VCSEL (Vertical Cavity Emitting Laser) chip. The light source 20 may be fixed in the light source fixing region 11 via a conductive portion 21. The conductive part 21 may be formed by curing conductive silver paste. The conductive portion 21 may be formed by solidifying a molten copper paste or aluminum paste. The conductive portion 21 passes through the first insulating layer 16 and contacts the ceramic substrate 15 to dissipate heat of the light source 20 using the ceramic substrate 15. The light source 20 may be electrically connected to the light source conductive pin 111 through the conductive portion 21. The side of the light source 20 away from the circuit board 10 may further be provided with a conductive cable 22 to be electrically connected to the conductive trace 13 on the circuit board 10. The first insulating layer 16 is provided with a copper exposing area corresponding to the pad position of the conductive trace 13, so that the conductive cable 22 can be conveniently conducted with the pad of the conductive trace 13. The light source 20 may emit an array of light spots or an array of structured light. The light source 20 may be used for detecting three-dimensional information of an object, or for distance detection, or for biometric identification (including face recognition, fingerprint recognition, etc.). Of course, in other embodiments, the Light source 20 may also be an EEL (Edge Emitting Laser) chip, or an LED (Light Emitting Diode) lamp, or an infrared Light Emitting source.

In this embodiment, the support 30 is a ring frame. A cavity is formed inside the bracket 30 to facilitate the light source 20 and the light source 20 device to be accommodated inside the bracket 30. The bracket 30 may be a plastic member. The bracket 30 is injection molded so that the bracket 30 can be diversified in structure and the weight and manufacturing cost of the light emitting module 100 can be reduced. The support 30 comprises a bottom end 31 and a top end 32 arranged opposite to the bottom end 31. The end surface of the bottom end 31 is plated with the metal layer 50. The metal layer 50 may extend in a continuous ring shape along the circumference of the stent 30 (as shown in fig. 3). The metal layer 50 may also be arranged in discontinuous multi-segment lines along the circumferential direction of the stent 30 (as shown in fig. 4). The metal layer 50 may be a copper-plated layer, a gold-plated layer, or a silver-plated layer to facilitate the soldering of the metal layer 50 to the circuit board 10 via solder. The top end 32 of the bracket 30 is provided with a groove 321, and the groove 321 is communicated with the cavity inside the bracket 30. The periphery of the optical device 40 is fixed in the groove 321 to secure the optical device 40 to the bracket 30. Of course, in other embodiments, the bracket 30 may be a plastic and metal integrated product. The bracket 30 may also be a metal product.

Specifically, in the process of assembling the bracket 30 and the circuit board 10, the circuit board 10 is provided first, and the light source 20 is assembled on the circuit board 10; in the process of assembling the light source 20 to the circuit board 10, the bracket 30 may be molded as required; after the support 30 is molded, the metal layer 50 is plated on the end face of the bottom end 31 of the support 30; providing a welding part 60 in the hollow area 161 of the circuit board 10; the welding portion 60 may be formed by soldering and curing a high temperature-resistant solder paste; the metal layer 50 of the bracket 30 is soldered to the circuit board 10 by a soldering portion 60 using an SMT process, so that the bracket 30 is engaged with the circuit board 10, thereby increasing the stability of the light emitting module 100. The bracket 30 is welded with the circuit board 10 through the metal layer 50 and the welding part 60, so that the heat absorption performance of the connection structure of the bracket 30 and the circuit board 10 is improved, and the heat inside the bracket 30 is conveniently led out.

In the present embodiment, the optical device 40 is a light diffusion sheet. The optical device 40 includes a lens substrate 41 and a light diffusion layer 42 disposed on the lens substrate 41, where the light diffusion layer 42 may be a light diffusion microstructure integrally formed on the lens substrate 41, or a light diffusion coating layer covering the light incident surface of the lens substrate 41. The optical device 40 diffuses the point-like light spot of the light source 20 to form a planar light spot and emits the planar light spot.

Further, referring to fig. 5, the bracket 30 is provided with a non-metal main body 33, a bottom end 31 of the non-metal main body 33 is provided with a first metal portion 34, the first metal portion 34 is formed by laser direct forming, and the metal layer 50 is plated on the first metal portion 34.

In this embodiment, the plastic part of the bracket 30 constitutes the non-metal body 33. The non-metallic body 33 is formed by an injection molding process. In the process of molding the non-metal body 33, metal particles are mixed into a plastic material so that the non-metal body 33 is mixed with the metal particles. The first metal portion 34 is formed by Laser-Direct-structuring (LDS) process. Specifically, the end surface of the bottom end 31 of the non-metal body 33 is irradiated with laser light to activate metal particles along a predetermined trajectory, so that the metal particles of the bottom end 31 in a predetermined region form the first metal portion 34. Since the metal particles of the non-metal body 33 are activated to form the first metal part 34, the bottom end 31 of the non-metal body 33 exhibits metal characteristics, that is, the non-metal body 33 of the bracket 30 and the first metal part 34 are integrally arranged, the bracket 30 is welded to the circuit board 10 through the first metal part 34, and the bracket 30 and the circuit board 10 have more stable structures. The first metal part 34 may extend in a continuous ring shape along the circumferential direction of the stent 30. The first metal part 34 may also be arranged in discontinuous multiple segments along the circumference of the stent 30. The metal layer 50 is plated on the first metal part 34 to make the first metal part 34 resistant to high temperature and make the first metal part 34 better solderable to the circuit board 10. The first metal part 34 is formed in the bracket 30, so that the first metal part 34 can directly conduct heat of the bracket 30 to the ceramic substrate 15, and the heat dissipation performance of the light emitting module 100 is increased. The first metal part 34 is soldered to the circuit board 10 through solder, so that the light emitting module 100 can maintain a stable structure at a high temperature, and the connection stability of the bracket 30 and the circuit board 10 is enhanced. Besides the first metal part 34 enhances the structural stability of the bracket 30 and the circuit board 10, the first metal part 34 can also be electrically connected to the conductive trace 13 on the circuit board 10. That is, the conductive trace 13 of the circuit board 10 may extend into the bracket soldering area 12, the conductive trace 13 may be electrically connected to the soldering portion 60, and the soldering portion 60 is electrically connected to the first metal portion 34 through the metal layer 50, so that the conductive trace 13 of the circuit board 10 is electrically connected to the first metal portion 34 of the bracket 30. Under the structure that the conductive trace 13 of the circuit board 10 is conducted with the first metal portion 34 of the bracket 30, the bracket 30 can transmit the electrical signal of the circuit board 10 by arranging the conductive structure and the device conducted with the conductive structure on the bracket 30, so as to simplify the structure of the light emitting module 100 and increase various electrical signal transmission modes of the light emitting module 100.

Further, referring to fig. 6, the non-metal body 33 is provided with a second metal portion 35 opposite to the bottom end 31, the second metal portion 35 is formed by molding processing of the laser bracket 30, the second metal portion 35 is electrically connected to the first metal portion 34, and the optical device 40 is in contact with the second metal portion 35 and is electrically connected to the circuit board 10 through the second metal portion 35 and the first metal portion 34.

In this embodiment, the second metal part 35 is formed at the bottom of the concave groove 321. The second metal portion 35 is formed by processing through an LDS (Laser-Direct-structuring) process. Specifically, the metal particles are irradiated and activated on the bottom surface of the groove 321 by using laser according to a preset track, so that the metal particles on the bottom surface of the groove 321 in a preset area form the second metal part 35. Since the metal particles of the non-metal body 33 are activated to form the second metal part 35, so that the non-metal body 33 exhibits metal characteristics at the bottom of the groove 321, that is, the non-metal body 33 of the bracket 30 is integrally disposed with the second metal part 35, and the bracket 30 can be integrally welded with the optical device 40 through the second metal part 35, thereby realizing a stable connection between the bracket 30 and the optical device 40. The second metal portion 35 is electrically connected to the first metal portion 34, so that the electrical signal of the circuit board 10 can be transmitted to the optical device 40 through the bracket 30. The optical device 40 may be provided with an electronic structure electrically connected to the second metal portion 35, so that the optical device 40 can utilize the electronic structure to assist in diffusing light, or detecting a light propagation path, or controlling to change the focus of the lens substrate 41.

Specifically, a detection line 43 is disposed on a surface of the optical device 40, the detection line 43 is electrically connected to the circuit board 10 through the second metal part 35, and the detection line 43 is used to detect whether the optical device 40 guides light normally. The detection circuit 43 may be located only at the periphery of the optical device 40, or may completely cover the surface of the optical device 40. The detection line 43 is a metal coil. The light diffusion layer 42 is attached to the lens substrate 41 on the side facing the light source 20. The detection line 43 is attached to a surface of the light diffusion layer 42 facing the bottom of the groove 321. The detection line 43 is electrically connected to the second metal part 35. The detection circuit 43 is used to detect whether the light diffusion layer 42 is damaged, and when the light diffusion layer 42 is damaged, the detection circuit 43 is disconnected along with the damage of the light diffusion layer 42, so that the detection circuit 43 is disconnected from the conductive loop formed by the second metal part 35 and the circuit board 10, and a fracture signal can be formed and transmitted to the outside through the circuit board 10, so as to detect the damage of the light diffusion layer 42. Of course, the detection circuit 43 may also detect whether the lens substrate 41 is damaged. By fixing the detection circuit 43 and the second metal part 35, the optical device 40 can be fixed to the bracket 30, and can also transmit an electrical signal to the circuit board 10 through the bracket 30, so that the light emitting module 100 has a stable structure, a simple structure, and a reduced cost, and the redundant conductive cable 22 is omitted.

Further, referring to fig. 7 and 8, a carrying platform capable of carrying the optical device 40 is formed at the bottom of the groove 321, the second metal portion 35 is formed at the bottom of the groove 321, the non-metal body 33 is further provided with an inner sidewall 36 connecting the bottom surface of the groove 321 and the end surface of the bottom end 31, and the second metal portion 35 extends from the bottom surface of the groove 321 to the bottom end 31 through the inner sidewall 36.

In the present embodiment, the second metal portion 35 is formed by activating non-metal particles by laser irradiation according to a predetermined trajectory. The predetermined molding trace of the second metal portion 35 may be pre-disposed on the bottom surface of the groove 321, extend to the end surface of the bottom end 31 through the inner sidewall 36, and connect with the first metal portion 34, so that the second metal portion 35 may be directly connected with the first metal portion 34. The second metal portion 35 is arranged from the first metal portion 34 to the groove 321 through the inner sidewall 36, so that the optical device 40 is electrically connected to the circuit board 10 through the second metal portion 35. The second metal part 35 may be formed by a plurality of wires, so that the optical device 40 can access electrical signals through the plurality of wires. The first metal part 34 includes a first conductive line 341 annularly surrounding the light source fixing region 11 and a second conductive line 342 isolated from the first conductive line 341. The metal layer 50 and the first conductive line 341 are in a metal ring structure. The metal layer 50 is hermetically connected to the circuit board 10 via a soldering portion 60, so that the connection structure of the bracket 30 and the circuit board 10 forms a sealing structure, which ensures the functional safety of the light source 20 inside the bracket 30. The second conductive line 342 is located inside the first conductive line 341, and the second conductive line 342 is connected to the conductive trace 13 of the circuit board 10 through the soldering portion 60. The second metal portion 35 is connected to the second conductive line 342, so that the second metal portion 35 can be connected to the circuit structure of the circuit board 10 as required to satisfy multiple functionalities of the optical device 40. The first conductive wire 341 serves to seal the inside of the stent 30, the second conductive wire 342 serves to transmit electrical signals, and the first conductive wire 341 is isolated from the second conductive wire 342 to prevent short circuit of the second conductive wire 342, thereby ensuring functional safety. Of course, in another embodiment, the second lead 342 of the first metal part 34 may extend from the end surface of the bottom end 31 of the bracket 30 to the end surface of the top end 32 through the inner sidewall 36, and be connected to the second metal part 35.

Further, referring to fig. 9, the circuit board 10 is further provided with a sealing region 18 surrounding the bracket welding region 12, the light emitting module 100 includes a sealant 70 fixed to the sealing region 18, and the sealant 70 is hermetically connected to the periphery of the bracket 30.

In this embodiment, a boss 151 is provided on a surface of the ceramic substrate 15 facing the holder 30, and both the light source fixing region 11 and the holder welding region 12 are provided on the boss 151. The seal region 18 is provided on the circumferential side of the boss 151. The peripheral side wall of the boss 151 is approximately aligned with the peripheral side wall of the bracket 30, so that the sealant 70 can seal the butt joint position of the peripheral side wall of the bracket 30 and the peripheral side wall of the boss 151, and the sealing of the connecting structure of the bracket 30 and the ceramic substrate 15 by the sealant 70 is realized. The pair of the sealant 70 is arranged on the side surface of the support 30 and the periphery of the boss 151, so that the sealant 70 is prevented from absorbing heat on the inner side of the support 30, the sealant 70 is prevented from being aged due to heating, and the sealing performance of the sealant 70 is ensured. The periphery of the ceramic substrate 15 protrudes relative to the sealant 70 to increase the contact area between the ceramic substrate 15 and the air, so that the heat dissipation performance of the ceramic substrate 15 is increased. Specifically, the sealant 70 is adhered to the first insulating layer 16. The first insulating layer 16 is provided with a vacant region 162 on the outer peripheral side of the sealant 70 so that the portion of the ceramic substrate 15 protruding from the sealant 70 is in contact with air, thereby increasing the heat dissipation of the ceramic substrate 15.

In another embodiment, please refer to fig. 10, which is substantially the same as the embodiment shown in fig. 9, except that a conductor 331 is embedded in the non-metal body 33, and the conductor 331 connects the first metal portion 34 and the second metal portion 35. The conductor 331 is a copper pillar. The conductor 331 and the non-metal body 33 are integrally formed, in the process of injection molding of the non-metal body 33, the conductor 331 is placed into an injection mold as an insert, the non-metal body 33 is formed, so that the non-metal body 33 and the conductor 331 are integrated, and the non-metal body 33 covers the periphery of the conductor 331, so that two ends of the conductor 331 are respectively exposed out of the top end 32 and the bottom end 31 of the non-metal body 33. The second wire 342 of the first metal portion 34 is connected to an end of the conductor 331, and the metal layer 50 connected to the second wire 342 is further plated on an end surface of the conductor 331, that is, the conductor 331 is electrically connected to the circuit board 10 through the second wire 342. The second metal portion 35 is connected to the conductor 331 so that the second metal portion 35 is electrically connected to the first metal portion 34 via the conductor 331. The conductor 331 is embedded in the bracket 30, so that the conductivity between the optical device 40 and the circuit board 10 is improved, and the bracket 30 is conveniently molded.

In another embodiment, please refer to fig. 11 and 12, which is substantially the same as the embodiment shown in fig. 9, except that the light emitting module 100 further includes a functional device 80, and the functional device 80 is fixed to the non-metal main body 33 and is electrically connected to the circuit board 10 through the first metal part 34. The functional device 80 is fixed on the top end 32 of the non-metal body 33, the non-metal body 33 has an outer sidewall connecting the bottom end 31 and the top end 32, and the first metal part 34 extends from the bottom end 31 of the non-metal body 33 to the top end 32 through the outer sidewall, so that the functional device 80 is connected with the first metal part 34. The end surface of the top end 32 of the non-metal body 33 is parallel to the circuit board 10. The top end 32 of the non-metallic body 33 carries the functional device 80. The first metal portion 34 is formed by laser direct forming according to a predetermined track, and the predetermined track extends from the end surface of the bottom end 31 to the end surface of the top end 32 through the outer sidewall, so that the first metal portion 34 can directly connect the circuit board 10 and the functional device 80.

Specifically, the first metal part 34 further includes a third conducting wire 343, one end of the third conducting wire 343 is disposed on the end surface of the bottom end 31, and the other end of the third conducting wire 343 is disposed on the end surface of the top end 32. A middle portion of the third conductive line 343 is disposed on the outer sidewall. The third conductive line 343 is isolated from the first conductive line 341. The end of the third lead 343 is plated with the metal layer 50, and is soldered to the circuit board 10 through the metal layer 50 and the solder-resistant portion 60. The third conductive line 343 transmits an electrical signal. A conducting pad opposite to the end of the third lead 343 is disposed on one surface of the ceramic substrate 15 facing the support 30. The side of the ceramic substrate 15 away from the support 30 is provided with a back conductive trace conducted with the conducting pad, and the back conductive trace can be connected with the conducting pad through a conductor embedded in the ceramic substrate 15. The backside conductive trace is covered by the second insulating layer 17. The first insulating layer 16 is disposed with a hollow area 161 corresponding to the conducting pad 112, so that the third wire 343 is connected to the conducting pad through the metal layer 50 and the solder-resistant portion 60, and the back side conductive trace is prevented from being shorted. The functional device 80 may be an ambient light sensor, the functional device 80 may be an infrared light sensor, and the functional device 80 may be the LED light source 20.

Referring to fig. 9 and 13, the present application further provides a method for manufacturing a light emitting module 100, which is used to manufacture the light emitting module 100. The manufacturing method of the light emitting module 100 includes the steps of:

101: a support 30, a circuit board 10, a light source 20 and an optical device 40 are provided, wherein the circuit board 10 has a light source fixing area 11 and a support soldering area 12.

In the present embodiment, the bracket 30 is formed by injection molding. Namely, the non-metal body 33 of the bracket 30 is made of plastic. In the process of forming the non-metal body 33 of the bracket 30, metal particles are added to the plastic particles, so that the metal particles are contained in the non-metal body 33, and the metal particles can be activated at any position on the surface of the non-metal body 33 through a laser direct forming process, so that a metal structure with metal characteristics can be processed on the surface of the non-metal body 33 according to a preset track. The circuit board 10 may be a flexible circuit board 10, a printed circuit board 10, or a combination of hard and soft boards. The light source 20 is a VCSEL (Vertical Cavity Surface Emitting Laser) chip. The optical device 40 is a light diffusion sheet. The holder 30, the circuit board 10, the light source 20 and the light device may be separately and independently manufactured. Of course, in other embodiments, the support 30 may be made of a metal or a mixture of metals.

102: the light source 20 is fixed to the light source fixing region 11.

In this embodiment, the light source 20 may be fixed to the light source fixing region 11 through a conductive portion 21 so as to conduct heat to the circuit board 10 by using the conductive pins. The light source 20 and the circuit board 10 may be assembled together through a Surface Mounting Technology (SMT) process.

103: the first metal part 34 is formed on the bottom end 31 of the non-metal body 33 by laser direct structuring.

In this embodiment, the first metal part 34 is formed on the end surface of the bottom end 31 by laser forming according to a predetermined track, so that the partial area of the bottom end 31 of the non-metal body 33 can exhibit metal characteristics. The step of forming the first metal part 34 on the non-metal body 33 may be performed before the step of fixing the light source 20 to the circuit board 10, or may be performed separately from and simultaneously with the step of fixing the light source 20 to the circuit board 10.

104: the bottom end 31 of the support 30 is plated with a metal layer 50.

In the present embodiment, the metal layer 50 is plated on the first metal part 34, and the metal layer 50 corresponds to the first metal part 34. The metal layer 50 may be a copper-plated layer, a gold-plated layer, or a silver-plated layer to facilitate the soldering of the metal layer 50 to the circuit board 10 via solder.

105: the metal layer 50 is soldered to the bracket soldering area 12 to hermetically connect the bracket 30 and the circuit board 10.

In the present embodiment, the metal layer 50 is soldered to the circuit board 10 via a solder-resistant portion 60. The assembly of the bracket 30 and the circuit board 10 may be assembled together by using a Surface Mounting Technology (SMT) process. Of course, the step of assembling the holder 30 and the circuit board 10 may be performed together with the step of assembling the light source 20 and the circuit board 10, that is, the holder 30 and the light source 20 are assembled together on the circuit board 10.

106: and forming a second metal part 35 by performing laser direct forming processing on the opposite bottom end 31 of the non-metal main body 33, wherein the second metal part 35 is electrically connected with the first metal part 34.

In the present embodiment, the second metal part 35 is formed on the end surface of the distal end 32 of the non-metal body 33. The second metal part 35 is connected to the first metal part 34 to facilitate the conduction between the bracket 30 and the circuit board 10. After the second metal part 35 is formed at the top end 32 of the non-metal body 33, a metal layer 50 is plated on the second metal part 35 to facilitate the welding of the second metal part 35 and the optical device 40.

107: the optical device 40 is fixed to the bracket 30 and disposed opposite to the light source 20.

In this embodiment, the optical device 40 is fixed to the distal end 32 of the holder 30. The surface of the optical device 40 is provided with a detection line 43, and the detection line 43 is electrically connected to the second metal part 35. The optical device 40 is welded to the second metal part 35 via a welding part 60. The optical device 40 is fixed to the bracket 30, and the optical device 40 can be electrically connected to the circuit board 10 through the bracket 30, so that the optical device 40 can receive electrical signals.

108: sealant 70 is formed in the sealing region 18, and the sealant 70 is also sealingly attached to the peripheral side of the stent 30.

In this embodiment, the sealant 70 may be formed on the periphery of the circuit board 10 and the bracket 30 through a dispensing process. The sealant 70 seals the connection structure between the circuit board 10 and the bracket 30.

Referring to fig. 14, the present application further provides an electronic device 1000, where the electronic device 1000 includes the light emitting module 100, the light sensing module 200, a main board 300, and a housing 400. The light sensing module 200 is a structured light sensor, and is configured to sense structured light emitted by the light emitting module 100, so as to collect dot matrix three-dimensional detection light emitted by the light emitting module 100, and collect three-dimensional image information of an object. The light emitting module 100 and the light sensing module 200 can be used for detecting human face three-dimensional image information to realize human face identification unlocking, and can also be used for detecting fingerprint information by a user to realize fingerprint unlocking. The light emitting module 100 and the light sensing module 200 are fixed to the main board 300 or fixed inside the housing 400. The side of the circuit board 10 facing away from the bracket 30 may be electrically connected to the motherboard 300 via the flexible circuit board 10. The housing 400 includes a front cover and a rear case covering the front cover. The main board 300, the light emitting module 100 and the light sensing module 200 are fixed between the front cover and the rear housing. The front cover may be a light-transmissive glass cover plate. The light of the light emitting module 100 may pass through the front cover. The electronic device 1000 may be a mobile phone, a tablet computer, or a notebook computer.

According to the light emitting module 100, the electronic device 1000 and the manufacturing method of the light emitting module 100, the metal layer 50 is plated at the bottom end 31 of the support 30, the metal layer 50 is welded to the support welding area 12 of the circuit board 10 through the solder, so that the support 30 is firmly fixed to the circuit board 10, and the support 30 is hermetically connected with the circuit board 10, so that the light emitting module 100 is high-temperature resistant, and the structural stability is improved.

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a light emission module, its characterized in that, light emission module includes circuit board, light source, support and optical device, the circuit board be equipped with light source fixed area with enclose close in the leg joint region of light source fixed area week side, the light source is fixed in light source fixed area, the bottom of support is plated and is equipped with the metal level, the metal level through the solder weld in leg joint region, so that the support with circuit board sealing connection, optical device is fixed in on the support with the light source is relative, be used for seeing through the light of light source to form the light beam.

2. The light emitting module of claim 1, wherein the bracket is provided with a non-metal body, a first metal part is arranged at the bottom end of the non-metal body, the first metal part is formed by laser direct structuring, and the metal layer is plated on the first metal part.

3. The optical transmit module of claim 2, further comprising a functional device fixed to the non-metallic body and electrically connected to the circuit board via the first metal portion.

4. The light emission module of claim 3, wherein the functional device is fixed to a top end of a non-metallic body, the non-metallic body having an outer sidewall connecting the bottom end and the top end, the first metal portion extending from the bottom end of the non-metallic body to the top end through the outer sidewall such that the functional device is connected to the first metal portion.

5. The optical transmitter module as claimed in claim 2, wherein the non-metal body has a second metal portion opposite to the bottom end, the second metal portion is formed by laser direct structuring, the second metal portion is electrically connected to the first metal portion, and the optical device is electrically connected to the circuit board through the second metal portion and the first metal portion.

6. The optical transmitter module as claimed in claim 5, wherein a detection circuit is disposed on a surface of the optical device, the detection circuit is electrically connected to the circuit board via the second metal portion and the first metal portion, and the detection circuit is configured to detect whether the optical device conducts light normally.

7. The optical transmit module of claim 5, wherein a conductor is embedded in the non-metal body, and the conductor connects the first metal portion and the second metal portion.

8. The light emitting module of claim 5, wherein the second metal portion extends to the first metal portion.

9. The optical transmit module of claim 8, wherein the non-metallic body has a platform opposite to the end surface of the bottom end, the second metal portion is formed on the platform, the non-metallic body further has an inner sidewall connecting the platform and the bottom end, and the second metal portion extends from the platform to the bottom end through the inner sidewall.

10. The optical transmit module of any of claims 1-7, wherein the circuit board further comprises a sealing region surrounding the periphery of the soldering region of the bracket, and the optical transmit module comprises a sealant fixed to the sealing region, and the sealant is hermetically connected to the periphery of the bracket.

11. The manufacturing method of the light emitting module is characterized by comprising the following steps:

fixing the light source to the light source fixing area;

a metal layer is plated at the bottom end of the bracket;

12. The method of fabricating a light emitting module according to claim 11, wherein in the step of providing a support, a circuit board, a light source and an optical device, the support is provided with a non-metallic body; before the step of plating the metal layer on the bottom end of the bracket, performing laser direct forming processing on the bottom end of the non-metal main body to form a first metal part; in the step of plating the metal layer on the bottom end of the support, the metal layer is formed on the first metal part.

13. The method of claim 12, wherein prior to the step of securing the optical device to the bracket, laser direct structuring is performed at the bottom end of the non-metallic body opposite the first metallic portion to form a second metallic portion, the second metallic portion being in electrical communication with the first metallic portion; in the step of fixing the optical device to the holder, the optical device is in contact with the second metal portion, and the optical device is electrically connected to the first metal portion via the second metal portion.

14. The method of fabricating a light emitting module according to any one of claims 11 to 13, wherein in the step of providing a frame, a circuit board, a light source and an optical device, the circuit board further has a sealing region surrounding a peripheral side of a soldering region of the frame; and after the step of welding the metal layer on the welding area of the bracket through the solder, forming a sealant in the sealing area, wherein the sealant is also connected with the peripheral side of the bracket in a sealing manner.

15. An electronic device, comprising the light emitting module according to any one of claims 1 to 10.