CN112235670B - Microphone assembly and electronic equipment - Google Patents
Microphone assembly and electronic equipment Download PDFInfo
- Publication number
- CN112235670B CN112235670B CN202010898712.5A CN202010898712A CN112235670B CN 112235670 B CN112235670 B CN 112235670B CN 202010898712 A CN202010898712 A CN 202010898712A CN 112235670 B CN112235670 B CN 112235670B
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- Prior art keywords
- microphone
- circuit board
- shell
- key
- hole
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/02—Circuits for transducers, loudspeakers or microphones for preventing acoustic reaction, i.e. acoustic oscillatory feedback
Abstract
The application relates to a microphone assembly and an electronic device. The device comprises a shell, a damping piece, keys and a circuit board, wherein the circuit board is positioned between the shell and the damping piece and is attached to at least part of the surface of the damping piece, and the shell is provided with at least one sound inlet through hole and at least one key mounting hole; the surface of circuit board facing the shell is equipped with the microphone that corresponds with the sound through-hole that advances, and the microphone subassembly still includes: a sealing member which is positioned between the housing and the circuit board, surrounds the microphone, and is provided with an opening communicated with the sound inlet through hole; the key is arranged in the key mounting hole and is attached to the part surface of the shell close to the key mounting hole and the part surface of the sealing element close to the key mounting hole. Make sealing connection between microphone and the shell through the sealing member, realized the good seal between the sound inlet through-hole of seting up on microphone and the shell on the circuit board, avoid the sound that the button was pressed to pass to microphone department after, to the influence that the microphone pickup effect caused.
Description
Technical Field
The present application relates to the field of speaker devices, and in particular, to a microphone assembly and an electronic device.
Background
Along with the increasing requirements of people on microphone pickup effect, more and more products adopting microphone arrays are required to achieve good pickup and echo cancellation effects, and microphone array algorithms have two requirements on structures: 1. the microphone has good sealing performance, namely sound can only enter from the pick-up hole; 2. the microphone has good shock absorption, and the echo cancellation during the playing of the microphone is improved.
Typically, a silica gel sleeve is added above the microphone, so that the purpose of sealing the microphone is achieved; the PCBA board of the microphone is not in direct contact with the components below the PCBA board by adopting the independent shock pad, so that the purpose of shock absorption is achieved; however, when other functions of the product having the microphone array are used, the generated abnormal sound is easily transmitted into the microphone, and the sound pickup effect of the microphone array is deteriorated due to influence on the sound pickup of the microphone and the algorithm of the microphone array.
Disclosure of Invention
Based on this, it is necessary to provide a microphone assembly and an electronic device for solving the problem that when other functions of a product having a microphone array are used, abnormal sounds generated are easily transmitted to the inside of the microphone, and the sound pickup effect of the microphone array is deteriorated due to influence on the sound pickup of the microphone and the algorithm of the microphone array.
The microphone assembly comprises a shell, a damping piece, keys and a circuit board, wherein the circuit board is positioned between the shell and the damping piece and is attached to at least part of the surface of the damping piece, and the shell is provided with at least one sound inlet through hole and at least one key mounting hole; the surface of the circuit board facing the shell is provided with a microphone corresponding to the sound inlet through hole, and the microphone assembly further comprises:
a seal member that is located between the circuit boards of the housing and surrounds the microphone, the seal member being provided with an opening communicating with the sound inlet through hole; the key is arranged in the key mounting hole and is attached to the part surface of the shell, which is close to the key mounting hole, and the part surface of the sealing element, which is close to the key mounting hole.
In one embodiment, the sealing member is made of an elastic material, and an isolation groove corresponding to the key is formed between the sealing member and the circuit board, and the isolation groove changes along with the deformation of the sealing member.
In one embodiment, the microphone assembly further comprises at least two elastic members, one ends of the elastic members are abutted with the shell, and the other ends of the elastic members are abutted with the shock absorbing members.
In one embodiment, the shock absorbing member is provided with a mounting groove for mounting the elastic member.
In one embodiment, the surface of the sealing member facing the circuit board is provided with at least one first protrusion, and the circuit board is provided with a first groove corresponding to the first protrusion.
In one embodiment, the first projection comprises an annular projection.
In one embodiment, the projection of the key onto the seal surface is surrounded by the annular projection.
In one embodiment, the seal comprises a silicone seal.
In one embodiment, the resilient member comprises a spring.
The microphone assembly comprises a shell, a damping piece, keys and a circuit board, wherein the circuit board is positioned between the shell and the damping piece and is attached to at least part of the surface of the damping piece, and the shell is provided with at least one sound inlet through hole and at least one key mounting hole; the surface of the circuit board facing the shell is provided with a microphone corresponding to the sound inlet through hole, and the microphone assembly further comprises: a seal member that is located between the housing and the circuit board and surrounds the microphone, the seal member being provided with an opening that communicates with the sound inlet through-hole; the key is arranged in the key mounting hole and is attached to the part surface of the shell, which is close to the key mounting hole, and the part surface of the sealing element, which is close to the key mounting hole. According to the application, the microphone is arranged on the surface of the circuit board facing the shell, the sealing element is arranged between the shell and the circuit board and surrounds the microphone, the sealing element is provided with the opening communicated with the sound inlet through hole, the key is arranged in the key mounting hole and is attached to the part surface of the shell close to the key mounting hole and the part surface of the sealing element close to the key mounting hole, the microphone is in sealing connection with the shell through the sealing element, so that good sealing between the microphone on the circuit board and the sound inlet through hole formed in the shell is realized, meanwhile, isolation between the key and the circuit board and isolation between the key and the microphone are realized, and influence on the sound pickup effect of the microphone caused after sound pressed by the key is transmitted to the microphone is avoided.
An electronic device comprising a microphone assembly as claimed in any one of the preceding claims.
The microphone assembly in the electronic equipment comprises a shell, a damping piece, keys and a circuit board, wherein the circuit board is positioned between the shell and the damping piece and is attached to at least part of the surface of the damping piece, and the shell is provided with at least one sound inlet through hole and at least one key mounting hole; the surface of the circuit board facing the shell is provided with a microphone corresponding to the sound inlet through hole, and the microphone assembly further comprises: a seal member that is located between the housing and the circuit board and surrounds the microphone, the seal member being provided with an opening that communicates with the sound inlet through-hole; the key is arranged in the key mounting hole and is attached to the part surface of the shell, which is close to the key mounting hole, and the part surface of the sealing element, which is close to the key mounting hole. According to the application, the microphone is arranged on the surface of the circuit board facing the shell, the sealing element is arranged between the shell and the circuit board and surrounds the microphone, the sealing element is provided with the opening communicated with the sound inlet through hole, the key is arranged in the key mounting hole and is attached to the partial surface of the shell close to the key mounting hole and the partial surface of the sealing element close to the key mounting hole, the microphone is in sealing connection with the shell through the sealing element, so that good sealing between the microphone on the circuit board and the sound inlet through hole formed in the shell is realized, meanwhile, isolation between the key and the circuit board is realized, and influence on the sound pickup effect of the microphone caused by sound pressed by the key is avoided after the sound pressed by the key is transmitted to the microphone.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic cross-sectional view of a microphone assembly according to an embodiment;
fig. 2 is a schematic cross-sectional view of a microphone assembly according to another embodiment;
reference numerals illustrate:
100-shell, 102-sound inlet through hole, 104-key mounting hole, 106-fixed slot, 200-shock absorbing piece, 202-mounting slot, 300-key, 400-circuit board, 402-microphone, 404-sealing structure, 500-sealing piece, 502-opening, 504-isolation slot, 600-elastic piece.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1, fig. 1 shows a schematic cross-sectional view of a microphone assembly according to an embodiment of the present application, in one embodiment, a microphone assembly is provided, which includes a housing 100, a shock absorbing member 200, a key 300, and a circuit board 400, wherein the circuit board 400 is located between the housing 100 and the shock absorbing member 200 and is attached to at least a portion of a surface of the shock absorbing member 200, and at least one sound inlet through hole 102 and at least one key mounting hole 104 are formed in the housing 100; the surface of the circuit board 400 facing the housing 100 is provided with a microphone 402 corresponding to the sound inlet through hole 102, and the microphone assembly further comprises:
a seal 500 located between the housing 100 and the circuit board 400 and surrounding the microphone 402, the seal 500 being provided with an opening 502 communicating with the sound inlet through hole 102; the key 300 is disposed in the key mounting hole 104 and is attached to a portion of the surface of the housing 100 near the seal 500 and a portion of the surface of the seal 500.
The microphone 402 is isolated from the housing 100 by the sealing member 500, and the microphone 402 is isolated from the keys 300, and the keys 300 and the microphone 402 are positioned on both sides of the sealing member 500, so that the operation of the keys 300 will not affect the pickup of the microphone 402 when the keys 300 are used. Meanwhile, the sealing member 500 plays a role in shock absorption.
In one embodiment, the sealing member 500 is made of an elastic material, and a separation groove 504 corresponding to the key 300 is formed between the sealing member 500 and the circuit board 400, and the separation groove 504 varies with the deformation of the sealing member 500.
When the key 300 is pressed, the sealing member 500 between the key 300 and the circuit board 200 is deformed under force, and approaches the circuit board 200 until contacting the surface of the circuit board, the pressing action received by the key 300 is transferred to the circuit board, so that the function corresponding to the pressing action is executed, that is, after the pressing module corresponding to the key on the circuit board receives the pressing signal, the microphone assembly executes the function corresponding to the pressing signal, and the isolation groove 504 formed between the sealing member 500 and the circuit board 400 changes along with the deformation of the sealing member 500. The provision of the isolation grooves 504 improves the tactile sensation when the key 300 is operated, and at the same time, it is possible to feel whether or not the operation of the key 300 is completed.
In one embodiment, the microphone assembly further includes at least two elastic members 600, one end of the elastic member 600 abuts against the housing 100, and the other end of the elastic member 600 abuts against the shock absorbing member 200. Vibration to which the microphone assembly is subjected can be reduced by the forced deformation of the elastic member 600, and at the same time, the distance between the housing 100 and the shock absorbing member 200 can be adjusted, so that the limitation of the distance between the housing 100 and the shock absorbing member 200 to the thickness of the circuit board 400 is eliminated, and the purpose of providing the circuit board 400 with different thicknesses between the sealing member 500 and the shock absorbing member 200 is achieved.
The length of the elastic member 600 is greater than the distance between the housing 100 and the shock absorbing member 200, and the elastic member 600 is in a compressed state when the elastic member 600 is positioned between the housing 100 and the shock absorbing member 200. In practical application, the elastic members 600 with different lengths can be selected according to the thickness of the circuit board 400, so long as the requirement that the elastic members 600 between the housing 100 and the shock absorbing member 200 are in a compressed state when the circuit board 400 in the microphone assembly is at the maximum thickness is satisfied.
In one embodiment, the shock absorbing member 200 is provided with a mounting groove 202, and the mounting groove 202 is used for mounting the elastic member 600. One end of the elastic member 600 abutting against the shock absorbing member 200 is located in the mounting groove 202, and the mounting position of the elastic member 600 can be set by the mounting groove 202, so that deviation between the mounting position of the elastic member and a preset position is reduced.
In one embodiment, the housing 100 is provided with a fixing groove 106 corresponding to the mounting groove 202, an end of the elastic member 600 abutting against the housing 100 is located in the fixing groove 106, and the mounting groove 202 and the fixing groove 106 together form a placing cavity of the elastic member 600, so that the position of the elastic member 600 in the microphone assembly is fixed.
As shown in fig. 2, in one embodiment, the surface of the sealing member 500 facing the circuit board 400 is provided with at least one first protrusion, the circuit board 400 is provided with a first groove corresponding to the first protrusion, and the first protrusion and the first groove are in one-to-one correspondence to form a sealing structure 404. By providing the first protrusion and the first groove, a sealing connection between the sealing member 500 and the circuit board 400 is realized, and an influence of the deformation of the circuit board on the sealing connection between the sealing member 500 and the circuit board 400 is eliminated.
In one embodiment, the first projection comprises an annular projection.
In one embodiment, the projection of the key 300 onto the surface of the seal 500 is surrounded by the annular projection.
In one embodiment, the projection of the key 300 onto the surface of the seal 500 coincides with the center of the annular projection.
In one embodiment, the projection of the microphone 402 onto the surface of the seal 500 is surrounded by the annular protrusion.
In one embodiment, the seal 500 comprises a silicone seal, a rubber seal.
In one embodiment, the first protrusion includes a strip-shaped protrusion, and the projections of the key 300 and the microphone 402 on the surface of the sealing member 500 are respectively located on two sides of the strip-shaped protrusion.
In one embodiment, the resilient member 600 comprises a spring.
The microphone assembly comprises a shell, a damping piece, keys and a circuit board, wherein the circuit board is positioned between the shell and the damping piece and is attached to at least part of the surface of the damping piece, and the shell is provided with at least one sound inlet through hole and at least one key mounting hole; the surface of the circuit board facing the shell is provided with a microphone corresponding to the sound inlet through hole, and the microphone assembly further comprises: a seal member that is located between the housing and the circuit board and surrounds the microphone, the seal member being provided with an opening that communicates with the sound inlet through-hole; the key is arranged in the key mounting hole and is attached to the part surface of the shell, which is close to the key mounting hole, and the part surface of the sealing element, which is close to the key mounting hole. According to the application, the microphone is arranged on the surface of the circuit board facing the shell, the sealing element is arranged between the shell and the circuit board and surrounds the microphone, the sealing element is provided with the opening communicated with the sound inlet through hole of the microphone, the key is arranged in the key mounting hole and is attached to the part surface of the shell close to the key mounting hole and the part surface of the sealing element close to the key mounting hole, the microphone is in sealing connection with the shell through the sealing element, so that good sealing between the microphone on the circuit board and the sound inlet through hole formed in the shell is realized, meanwhile, isolation between the key and the circuit board is realized, and influence on the pickup effect of the microphone caused by sound pressed by the key is avoided after the sound pressed by the key is transmitted to the microphone.
An electronic device comprising a microphone assembly as claimed in any one of the preceding claims.
The microphone assembly in the electronic equipment comprises a shell, a damping piece, keys and a circuit board, wherein the circuit board is positioned between the shell and the damping piece and is attached to at least part of the surface of the damping piece, and the shell is provided with at least one sound inlet through hole and at least one key mounting hole; the surface of the circuit board facing the shell is provided with a microphone corresponding to the sound inlet through hole, and the microphone assembly further comprises: a seal member that is located between the housing and the circuit board and surrounds the microphone, the seal member being provided with an opening that communicates with the sound inlet through-hole; the key is arranged in the key mounting hole and is attached to the part surface of the shell, which is close to the key mounting hole, and the part surface of the sealing element, which is close to the key mounting hole. According to the application, the microphone is arranged on the surface of the circuit board facing the shell, the sealing element is arranged between the shell and the circuit board and surrounds the microphone, the sealing element is provided with the opening communicated with the sound inlet through hole, the key is arranged in the key mounting hole and is attached to the partial surface of the shell close to the key mounting hole and the partial surface of the sealing element close to the key mounting hole, the microphone is in sealing connection with the shell through the sealing element, so that good sealing between the microphone on the circuit board and the sound inlet through hole formed in the shell is realized, meanwhile, isolation between the key and the circuit board is realized, and influence on the sound pickup effect of the microphone caused by sound pressed by the key is avoided after the sound pressed by the key is transmitted to the microphone.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (7)
1. The microphone assembly comprises a shell, a damping piece, keys and a circuit board, wherein the circuit board is positioned between the shell and the damping piece and is attached to at least part of the surface of the damping piece, and the shell is provided with at least one sound inlet through hole and at least one key mounting hole; the surface of the circuit board facing the shell is provided with a microphone corresponding to the sound inlet through hole, and the microphone assembly is characterized by further comprising:
a seal member that is located between the housing and the circuit board and surrounds the microphone, a portion of the seal member being located between the key and the circuit board, the seal member being provided with an opening communicating with the sound inlet through-hole; the key is arranged in the key mounting hole and is attached to the part surface of the shell close to the key mounting hole and the part surface of the sealing element close to the key mounting hole;
the elastic pieces are not less than two, one end of each elastic piece is in butt joint with the shell, and the other end of each elastic piece is in butt joint with the shock absorbing piece; the elastic piece is of a structure which is not integrated with the sealing piece;
wherein the surface of the sealing element facing the circuit board is provided with at least one first bulge, and the circuit board is provided with a first groove corresponding to the first bulge; the sealing element is made of elastic materials, and an isolation groove corresponding to the key is formed between the sealing element and the circuit board and changes along with deformation of the sealing element.
2. The microphone assembly of claim 1 wherein the shock absorbing member is provided with a mounting groove for mounting the resilient member.
3. The microphone assembly of claim 1 wherein the first projection comprises an annular projection.
4. A microphone assembly as claimed in claim 3 wherein the projection of the key onto the seal surface is surrounded by the annular projection.
5. The microphone assembly of claim 1 wherein the seal comprises a silicone seal.
6. The microphone assembly of claim 1 wherein the resilient member comprises a spring.
7. An electronic device comprising a microphone assembly as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010898712.5A CN112235670B (en) | 2020-08-31 | 2020-08-31 | Microphone assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010898712.5A CN112235670B (en) | 2020-08-31 | 2020-08-31 | Microphone assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112235670A CN112235670A (en) | 2021-01-15 |
| CN112235670B true CN112235670B (en) | 2023-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010898712.5A Active CN112235670B (en) | 2020-08-31 | 2020-08-31 | Microphone assembly and electronic equipment |
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| CN (1) | CN112235670B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114125673B (en) * | 2021-11-26 | 2023-10-24 | 青岛海尔科技有限公司 | Microphone assembly and electrical equipment with same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207766453U (en) * | 2017-12-22 | 2018-08-24 | 西安Tcl软件开发有限公司 | Microphone assembly and electronic equipment |
| CN109168105A (en) * | 2018-08-17 | 2019-01-08 | 广州视源电子科技股份有限公司 | Interactive intelligent tablet computer and microphone mounting structure |
| CN209402681U (en) * | 2019-02-27 | 2019-09-17 | 百度在线网络技术（北京）有限公司 | A kind of pick up facility |
| CN209435386U (en) * | 2019-02-27 | 2019-09-24 | 百度在线网络技术（北京）有限公司 | Audio frequency apparatus |
| CN209787372U (en) * | 2019-05-31 | 2019-12-13 | 深圳宽洋网络发展有限公司 | Microphone module and electronic equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3367703B1 (en) * | 2017-02-27 | 2020-05-13 | Oticon A/s | Hearing device with a microphone structure |
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2020
- 2020-08-31 CN CN202010898712.5A patent/CN112235670B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207766453U (en) * | 2017-12-22 | 2018-08-24 | 西安Tcl软件开发有限公司 | Microphone assembly and electronic equipment |
| CN109168105A (en) * | 2018-08-17 | 2019-01-08 | 广州视源电子科技股份有限公司 | Interactive intelligent tablet computer and microphone mounting structure |
| CN209402681U (en) * | 2019-02-27 | 2019-09-17 | 百度在线网络技术（北京）有限公司 | A kind of pick up facility |
| CN209435386U (en) * | 2019-02-27 | 2019-09-24 | 百度在线网络技术（北京）有限公司 | Audio frequency apparatus |
| CN209787372U (en) * | 2019-05-31 | 2019-12-13 | 深圳宽洋网络发展有限公司 | Microphone module and electronic equipment |
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| CN112235670A (en) | 2021-01-15 |
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