CN114125673B

CN114125673B - Microphone assembly and electrical equipment with same

Info

Publication number: CN114125673B
Application number: CN202111426122.3A
Authority: CN
Inventors: 宋伟
Original assignee: Qingdao Haier Technology Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Technology Co Ltd; Haier Smart Home Co Ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2023-10-24
Anticipated expiration: 2041-11-26
Also published as: CN114125673A

Abstract

The application provides a microphone assembly and an electrical device with the same, wherein the microphone assembly is arranged in a shell of the electrical device, and comprises: the PCB is provided with a top surface and a bottom surface, and microphones are arranged on the top surface; and the damping connecting piece is arranged between one side of the PCB, which is provided with the bottom surface, and the wall surface of the shell, so that the PCB and the shell are connected through the damping connecting piece. The microphone assembly solves the problem that the MEMS microphone in the electrical equipment in the prior art is easy to shake due to the action of external force.

Description

Microphone assembly and electrical equipment with same

Technical Field

The application relates to the technical field of MEMS microphones, in particular to a microphone assembly and electrical equipment with the microphone assembly.

Background

At present, the types of microphones commonly used in household appliances are electret microphones, and because the electret microphones are flexible and convenient to install, microphone sensitivity and signal to noise ratio can be very high, and compared with early MEMS (micro electro mechanical system) microphones, the electret microphones have great advantages in the aspects of cost, process, performance and the like.

However, as the voice function of the home appliances has gradually become more and more advanced, some performance bottlenecks of the electret microphone become important reasons for preventing the voice experience, MEMS microphones advantageous in these respects are also re-evaluated as options for analysis, and the electret microphone has poor sensitivity uniformity parameters in terms of product performance due to the limitation of the production process.

Specifically, the electret microphone and MEMS microphone are compared in three ways as follows:

(1) In terms of performance, the electret microphone is easy to generate larger assembly tolerance in the production process, so that the performance parameters of microphones of the same type and batch are distributed in a larger range, and the performance parameters are caused by the structural characteristics of the electret microphone, so that a good improvement method is not available; the MEMS microphone directly etches the acoustic main body structure of the microphone on the silicon crystal (including the vibrating diaphragm and the silicon film), the processing technology is a mature semiconductor processing technology at present, the processing error range is small, the yield is high, the MEMS microphone is a mature processing means in the semiconductor industry, and the problem of larger tolerance of the electret microphone in the aspect of the production process can be perfectly solved.

(2) In terms of production technology, the material and structural characteristics of the electret microphone cause strict requirements on welding temperature and welding duration, the welding duration which cannot be higher than 3 seconds cannot be used for wave soldering, the wave soldering is generally carried out after manual wire bonding and hand welding of microphone manufacturers, the low yield of the hand welding causes higher labor cost, and the production cost is finally converted into purchasing price; the MEMS microphone is a product based on silicon crystal, so wave soldering can be used, and soldering can be completed with other devices in the SMT (surface mount technology) process, and the soldering quality can be sufficiently ensured without additional labor cost.

(3) In terms of cost, as described in the above (2), the MEMS microphone can be used as a standard electronic device to be incorporated into the SMT process, so that two additional costs of defective products and manual links are saved, which is also a direct reason that the production cost of the MEMS microphone is lower than that of the electret microphone.

The MEMS microphone with advantages in the aspects is also re-used as an option for analysis and evaluation, and in the actual analysis and demonstration process, it is found that after the process of the MEMS microphone is improved, the performance gap between the signal to noise ratio and the sensitivity is not obvious for the current software algorithm, and many mainstream algorithm schemes can simultaneously push out two noise reduction schemes of electret and MEMS with similar performances, so that the MEMS microphone scheme really reaches the technical level that design attempts can be performed in household appliances.

Therefore, MEMS microphones have been proposed to replace electret microphones to solve the problem of poor uniformity of sensitivity of microphones in home appliances. MEMS needs to be welded on PCBA, and in practical application, a fixing method with good shock absorption needs to be adopted to reduce noise conduction to PCBA of microphone in the running process of household appliances.

The MEMS microphone is based on MEMS technology, namely a capacitor is integrated on a micro silicon wafer, can be manufactured by adopting a surface mount technology, can bear high reflow soldering temperature, is easy to integrate with a CMOS technology and other audio circuits, and is beneficial to the application in the fields of intelligent terminals such as voice communication, intelligent voice interaction and the like.

However, when the MEMS microphone in the prior art is installed in a device for use, the MEMS microphone is prone to shaking due to external force, so that the MEMS microphone is prone to interference, and finally the sensitivity of the MEMS microphone changes, the service life of the MEMS microphone is shortened, and the practicability of the MEMS microphone is reduced.

Although the performance of MEMS has reached the level of practical application, because of the characteristics that it needs to be welded on the PCB board for use, the MEMS cannot be flexibly installed in any position like an electret, and how to fix the MEMS module so that the sound pick-up cavity structure thereof meets the acoustic design specification, and meanwhile, it can avoid the noise generated during the operation of the home appliance from being transmitted to the PCB board of the module, which becomes a key design link that needs to be considered deeply by the designer.

Disclosure of Invention

The application mainly aims to provide a microphone assembly and electrical equipment with the microphone assembly, so as to solve the problem that an MEMS microphone in the electrical equipment in the prior art is easy to shake due to the action of external force.

In order to achieve the above object, according to one aspect of the present application, there is provided a microphone assembly installed in a housing of an electrical device, the microphone assembly comprising: the PCB is provided with a top surface and a bottom surface, and microphones are arranged on the top surface; the damping connecting piece is arranged between one side of the PCB, which is provided with the bottom surface, and the wall surface of the shell, and the PCB is connected with the shell through the damping connecting piece.

Further, the microphone assembly is located between the inner wall surface of the housing and the structural support within the housing, the microphone assembly further comprising: and the damping buffer part is at least partially positioned between the top surface of the PCB and the structural support part.

Further, one side of the shock absorption buffer piece, which is close to the PCB, is provided with an installation cavity, and the PCB is positioned in the installation cavity.

Further, the installation cavity comprises a first cavity and a second cavity which are communicated in sequence along the direction away from the PCB, the first cavity is used for accommodating the PCB and the damping connecting piece, and the second cavity is used for avoiding the microphone located on the PCB.

Further, a plurality of protrusions are provided on a surface of the shock absorbing buffer member at a side far from the PCB board to be in flexible contact with the structural support member through the plurality of protrusions.

Further, each protrusion is strip-shaped, extends along a first direction, and is arranged at intervals along a second direction, wherein the first direction and the second direction form a preset included angle and are parallel to the surface of the corresponding shock absorption buffer piece so as to form a wave-shaped structure; or each projection comprises at least a portion of a sphere or ellipsoid.

Further, the manufacturing material of the shock absorption buffer piece is foam; and/or the thickness of the shock absorbing buffer is H3, wherein the value range of H3 is 3mm to 7mm.

Further, the PCB is a rectangular plate body; and/or the number of microphones is one or more; and/or the shock absorption connecting piece is double faced adhesive tape; and/or the thickness of the shock absorption connecting piece is H2, wherein the value range of H2 is 0.5mm to 3mm.

Further, a sound receiving hole is formed in the shell, the microphone and the sound receiving hole are correspondingly arranged, a first avoiding hole for sound to pass through is formed in the PCB, a second avoiding hole for sound to pass through is formed in the damping connecting piece, the first avoiding hole and the second avoiding hole are correspondingly arranged with the sound receiving hole, and sound located on the outer side of the shell sequentially passes through the sound receiving hole, the second avoiding hole and the first avoiding hole and then is received by the microphone.

Further, the diameter of the second avoidance hole is larger than or equal to that of the first avoidance hole; and/or the diameter of the first avoiding hole is larger than or equal to the diameter of the sound receiving hole; and/or the minimum diameter of the first avoidance hole is 2.5mm.

Further, a connector is further mounted on the top surface of the PCB, the connector is connected with the microphone through a circuit on the PCB, and the connector is connected with an external device through a wire harness so as to receive data from the microphone and output the data to the external device.

Further, the number of microphones is two, and the two microphones are respectively located at two opposite sides of the connector.

Further, the distance between the center lines of the two microphones is L2, wherein the value of L2 ranges from 30mm to 50mm.

Further, the microphone assembly further comprises a damping buffer part which is at least partially positioned on one side of the PCB, far away from the damping connecting part, the damping buffer part is provided with an avoidance cavity for avoiding the connector, and a cable of the connector penetrates through the avoidance cavity to be connected with an external device.

Further, still be provided with the installation department between casing and the PCB board, be provided with damping member between installation department and the casing, microphone subassembly passes through a plurality of fasteners and installation department fixed connection.

Further, a plurality of first through holes are formed in the PCB, and the plurality of first through holes are respectively used for enabling a plurality of fasteners to pass through in a one-to-one correspondence manner; the damping connecting piece is provided with a plurality of second through holes which are respectively used for a plurality of fasteners to pass through in a one-to-one correspondence manner; the mounting part is provided with a plurality of fastening holes which are respectively used for inserting a plurality of fasteners in a one-to-one correspondence manner; one end of each fastener is inserted into the corresponding fastening hole after passing through the corresponding first through hole and the corresponding second through hole.

According to another aspect of the present application, there is provided an electrical apparatus comprising a housing in which the microphone assembly described above is disposed.

By applying the technical scheme of the application, the microphone assembly is arranged in the shell of the electrical equipment, and comprises: the PCB is provided with a top surface and a bottom surface, and microphones are arranged on the top surface; the damping connecting piece is arranged between one side of the PCB, which is provided with the bottom surface, and the wall surface of the shell, so that the PCB is connected with the shell through the damping connecting piece. Therefore, the microphone assembly achieves the purpose that the PCB of the microphone assembly is not rigidly connected with the shell, when the shell vibrates due to external force, vibration can be buffered through the buffering effect of the damping connecting piece, so that the possibility that noise of electrical equipment is transmitted to the PCB in the operation process is reduced, the phenomenon that the external force is transmitted to the PCB through the shell is avoided to the greatest extent, the possibility that the PCB is stressed and falls off is avoided, the working stability of the microphone is ensured, the sensitivity of the microphone is further ensured, the service life of the microphone is prolonged, the problem that the traditional MEMS microphone is easy to shake due to the external force when the MEMS microphone is installed in electrical equipment for use, the work of the MEMS microphone is disturbed, the problem that the sensitivity of the MEMS microphone is changed is finally caused, and the practicability of the MEMS microphone is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

fig. 1 shows a half cross-sectional view of an embodiment of a microphone assembly according to the application;

fig. 2 shows a half cross-sectional view of the PCB board of the microphone assembly shown in fig. 1;

fig. 3 shows a top view of the PCB board of the microphone assembly shown in fig. 1;

FIG. 4 illustrates a half cross-sectional view of the shock absorbing connector of the microphone assembly illustrated in FIG. 1; and

fig. 5 illustrates a half cross-sectional view of a damper of the microphone assembly illustrated in fig. 1.

Wherein the above figures include the following reference numerals:

10. a PCB board; 101. a top surface; 102. a bottom surface; 11. a first avoidance hole; 12. a first through hole; 20. a microphone; 30. a connector; 40. a shock absorbing connector; 41. a second avoidance hole; 42. a second through hole; 50. a shock absorbing buffer; 51. a first cavity; 52. a second cavity; 53. an avoidance cavity; 54. a protrusion; 60. a housing; 61. a sound receiving hole; 70. a structural support.

Detailed Description

In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application. Embodiments of the application and features of the embodiments may be combined with each other without conflict.

As shown in fig. 1 to 5, the present application provides a microphone assembly installed in a housing 60 of an electrical device, the microphone assembly comprising: the PCB 10, two oppositely arranged boards of the PCB 10 are a top surface 101 and a bottom surface 102 respectively, and the top surface 101 is provided with a microphone 20; and a shock absorbing connector 40 disposed between the side of the PCB 10 having the bottom surface 102 and the wall surface of the case 60, the shock absorbing connector 40 connecting the PCB 10 and the case 60 through the shock absorbing connector 40.

The microphone assembly of the present application is mounted in a housing 60 of an electrical device, the microphone assembly comprising: the PCB 10, two oppositely arranged boards of the PCB 10 are a top surface 101 and a bottom surface 102 respectively, and the top surface 101 is provided with a microphone 20; and a shock absorbing connector 40, the shock absorbing connector 40 being disposed between a side of the PCB 10 having the bottom surface 102 and a wall surface of the case 60, such that the PCB 10 is connected with the case 60 through the shock absorbing connector 40. Therefore, the microphone assembly achieves the purpose that the PCB 10 of the microphone assembly is not rigidly connected with the shell 60, when the shell 60 is vibrated due to external force, vibration can be buffered through the buffer effect of the buffer connecting piece 40, so that the possibility that noise of electrical equipment is conducted to the PCB 10 in the operation process is reduced, the phenomenon that the external force is conducted to the PCB 10 through the shell 60 is avoided to the greatest extent, the possibility that the PCB 10 falls off due to stress is avoided, the stability of the operation of the microphone 20 is ensured, the sensitivity of the microphone 20 is further ensured, the service life of the microphone 20 is prolonged, the problem that the conventional MEMS microphone is easy to shake due to the effect of the external force when being installed in the electrical equipment, the operation of the MEMS microphone is disturbed, and finally the sensitivity of the MEMS microphone is changed is solved, and the practicability of the MEMS microphone is improved.

The TOP surface 101 of the PCB 10 is a TOP surface, and the BOTTOM surface 102 is a BOTTOM surface.

Preferably, the body of the microphone 20 of the present application is wrapped with a rubber sleeve to prevent external vibration energy from being transmitted to the body of the microphone 20, thereby interfering with the sensitivity of the microphone 20.

Specifically, the microphone 20 of the present application is a MEMS (micro-electromechanical system) microphone, which is a microphone manufactured based on MEMS technology, in short, a capacitor is integrated on a micro silicon wafer, and can be manufactured by a surface mount technology, which can withstand very high reflow soldering temperature, is easy to integrate with CMOS technology and other audio currents, has improved noise cancellation performance and good RF and EMI suppression performance, and can save the audio debugging cost in the manufacturing process due to small sensitivity variation before and after installation.

As shown in fig. 1 and 5, the microphone assembly is located between the inner wall surface of the housing 60 and the structural support 70 within the housing 60, and further includes: the shock absorber 50, at least part of the shock absorber 50 is located between the top surface 101 of the PCB board 10 and the structural support 70.

Optionally, the structural support 70 is integrally formed with or removably attached to the housing 60.

At present, the internal noise and the motor vibration of the electrical equipment are the most main reasons for influencing the signal collection effect of the microphone, the hardware circuit design and the device layout of the microphone assembly of the present application are very simple, and in the installation process of the microphone assembly of the present application, the BOTTOM of the PCB 10 provided with the shock absorbing connector 40 is first aligned with the sound receiving hole 61 on the housing 60 and is installed on the housing 60 through the shock absorbing connector 40, and then the shock absorbing buffer 50 is installed on one side close to the TOP surface of the PCB 10, so that two sides of the shock absorbing buffer 50 are respectively abutted against the TOP surface of the PCB 10 and the structural support 70. In this way, the whole microphone assembly is guaranteed to be connected with the shell 60 and the structural support member 70 in a rigid manner, vibration conducted from the shell 60 and the inner space of the electrical equipment to the microphone assembly is greatly reduced, the structural support member 70 on the TOP surface can also provide a certain strength to ensure that the microphone assembly can be tightly attached to the shell 60, and the hidden danger of loose attachment possibly occurring after the shock-absorbing connecting member 40 is aged is prevented.

As shown in fig. 1 to 4, the housing 60 is provided with a sound receiving hole 61, the microphone 20 is correspondingly arranged with the sound receiving hole 61, wherein the PCB board 10 is provided with a first avoiding hole 11 for passing sound, the shock absorbing connector 40 is provided with a second avoiding hole 41 for passing sound, the first avoiding hole 11 and the second avoiding hole 41 are correspondingly arranged with the sound receiving hole 61, so that the sound receiving hole 61, the second avoiding hole 41 and the first avoiding hole 11 are sequentially communicated, and sound at the outer side of the housing 60 sequentially passes through the sound receiving hole 61, the second avoiding hole 41 and the first avoiding hole 11 and then reaches the microphone 20 to be received by the microphone 20.

In at least one embodiment of the microphone assembly of the present application, the number of the microphones 20, the sound receiving holes 61, the first avoiding holes 11 and the second avoiding holes 41 is plural, and the plurality of microphones 20, the plurality of first avoiding holes 11 and the plurality of second avoiding holes 41 are disposed in one-to-one correspondence with the plurality of sound receiving holes 61.

Preferably, the diameter of the second relief hole 41 is greater than or equal to the diameter of the corresponding first relief hole 11, to avoid blocking sound.

Preferably, the diameter of the first escape hole 11 is greater than or equal to the diameter of the corresponding sound receiving hole 61, so as to avoid blocking of sound.

Wherein the minimum diameter of the first avoiding hole 11 is 2.5mm.

In the embodiment of the present application shown in fig. 2 and 3, the PCB board 10 is a rectangular board body.

In at least one embodiment of the present application, the length L1 of the PCB 10 is 50mm, the width V1 of the PCB 10 is 8mm, and the thickness H1 of the PCB 10 is 4mm.

In the embodiment of the PCB board 10 of the present application, not shown, the PCB board 10 may also be a circular board body, a triangular board body, or other regular and irregular board bodies.

Preferably, the shock absorbing connector 40 is double sided tape, and by providing double sided tape between the BOTTOM surface and the inner wall surface of the housing 60, not only connection between the PCB 10 and the housing 60 can be achieved, but also the PCB 10 and the housing 60 can be well blocked except for the position corresponding to the sound receiving hole 61, so as to ensure air tightness of the whole sound cavity between the sound receiving hole 61 and the microphone 20.

In at least one embodiment of the shock absorbing connecting piece 40 of the present application, the shock absorbing connecting piece 40 is a 3M double sided tape, the 3M double sided tape is widely used in electrical equipment such as computers, mobile phones, etc., has good adhesion, processing and high temperature resistance, has high stability and reliability, is less affected by temperature, and can ensure reliable connection between the PCB 10 and the housing 60 after the PCB 10 is adhered to the housing 60 of the electrical equipment through the 3M double sided tape, and can meet the requirements of waterproof and dustproof grades of the electrical equipment.

As shown in fig. 4, the thickness of the shock absorbing connector 40 is H2, wherein the value of H2 ranges from 0.5mm to 3mm. The thickness of the shock absorbing connector 40 is determined according to the installation gap between the PCB 10 and the housing 60, but the range of H2 values is required to be 0.5mm to 3mm, if the thickness of the shock absorbing connector 40 is less than 0.5mm, the shock absorbing connector 40 may not achieve the expected shock absorbing effect, and if the thickness of the shock absorbing connector 40 is greater than 3mm, the PCB 10 may shake greatly due to too small rigidity.

Preferably, the shock absorbing buffer 50 is made of foam, i.e. foamed plastic particles.

In at least one embodiment of the present application, the shock absorbing cushioning members 50 are made of EVA foam.

Specifically, EVA is prepared by copolymerizing ethylene (E) and Vinyl Acetate (VA), EVA foam is a novel environment-friendly material, different colors can be selected according to the needs, the cells on the EVA foam are closed cells, the sound insulation effect is good, and the EVA foam has the advantages of good buffering, shock resistance, heat insulation, moisture resistance, chemical corrosion resistance and the like, is nontoxic, does not absorb water and has no pollution.

As shown in fig. 5, the thickness of the shock absorbing buffer 50 is H3, wherein the value of H3 ranges from 3mm to 7mm.

Further preferably, H3 is 5mm.

As shown in fig. 5, a mounting cavity is provided at a side of the shock absorbing buffer 50 adjacent to the PCB board 10, and the PCB board 10 is positioned in the mounting cavity.

Specifically, the mounting cavity includes a first cavity 51 and a second cavity 52 that are sequentially communicated along a direction away from the PCB board 10, the first cavity 51 is correspondingly disposed with the PCB board 10 and the shock absorbing connector 40, so as to accommodate the PCB board 10 and the shock absorbing connector 40, and the second cavity 52 is correspondingly disposed with the microphone 20 on the PCB board 10, so as to avoid the microphone 20.

The number of the microphones 20 and the number of the second cavities 52 are plural, the plurality of second cavities 52 are arranged in one-to-one correspondence with the plurality of microphones 20, and each second cavity 52 is used for avoiding the corresponding microphone 20. In this way, the second cavity 52 is configured as a plurality of small cavities instead of one large cavity, so that more positions contacting the TOP surface of the PCB 10 can be set aside as much as possible, so as to ensure a sufficient contact area between the shock absorbing buffer 50 and the TOP surface of the PCB 10, so as to prevent the PCB 10 from being separated from the housing 60 due to the aging of the shock absorbing connector 40 and shaking in the mounting cavity.

As shown in fig. 5, the depth of the first cavity 51 is H5, and the maximum depth of the first cavity 51 is equal to or slightly smaller than the sum of the thickness H1 of the PCB board 10 and the thickness H2 of the shock absorbing connector 40, so as to ensure that the bottom surface of the first cavity 51 is tightly attached to the PCB board 10, so as to prevent the PCB board 10 and the housing 60 from being separated from each other and shaking in the first cavity 51 due to aging of the shock absorbing connector 40.

As shown in fig. 5, the depth of the second cavity 52 is H6, and the minimum depth of the second cavity 52 is greater than the maximum height H4 of the corresponding microphone 20, so as to avoid the contact between the second cavity 52 and the microphone 20 from adversely affecting the function and installation of the microphone 20.

Preferably, the surface of the shock absorbing buffer 50 on the side far away from the PCB board 10 is provided with a plurality of protrusions 54, so that the shock absorbing buffer 50 has a certain self-adjusting function when adapting to the structural support 70 with different shapes through flexible contact between the plurality of protrusions 54 and the structural support 70, and the phenomenon that the shock absorbing buffer 50 cannot realize the shock absorbing buffer function due to compaction of a certain position of the shock absorbing buffer 50 does not occur.

Wherein the cross-sectional area of each protrusion 54 gradually decreases in a direction away from the PCB board 10.

In the embodiment of the shock absorbing buffer 50 of the present application shown in fig. 5, each of the protrusions 54 is in a shape of a bar, each of the protrusions 54 extends along a first direction and the plurality of protrusions 54 are spaced apart along a second direction, and the first direction and the second direction are disposed at a predetermined angle and are parallel to the surface of the corresponding shock absorbing buffer 50 on which the protrusions 54 are disposed, so as to constitute a wave-shaped structure.

In a not-shown embodiment of the shock absorber subassembly 50 of the present application, each of the protrusions 54 comprises at least a portion of a sphere or ellipsoid shape, and the plurality of protrusions 54 are distributed in a rectangular or circular array or other regular or irregular shape.

As shown in fig. 1 to 3, the top surface 101 of the PCB board 10 is further mounted with a connector 30, the connector 30 is connected with the microphone 20 through a wire on the PCB board 10, and the connector 30 is connected with an external device through a wire harness to receive data from the microphone 20 and output to the external device.

Preferably, the microphone 20 of the present application is of the analog output type to minimize the number of signal channels required by the connector 30 while minimizing the hardware cost of the connector 30 by minimizing the placement of the peripheral matching circuit on the microphone assembly.

Optionally, the number of microphones 20 is one or more, and the number of specific microphones 20 needs to be calculated according to a corresponding algorithm scheme.

In the embodiment of the present application shown in fig. 1 to 5, the number of microphones 20 is two, the two microphones 20 are respectively located at two opposite sides of the connector 30, and the two microphones 20 are connected with the connector 30 through the circuit on the PCB board 10.

Preferably, the PCB board 10 is a rectangular board body, the connector 30 is disposed at a middle position of the rectangular board body in a length direction, the two microphones 20 are spaced apart along the length direction of the rectangular board body and are respectively located at two opposite sides of the connector 30, and a distance between a center line of the two microphones 20 and a center line of the connector 30 is equal.

Further preferably, the distance between the center lines of the two microphones 20 is L2, where the value of L2 ranges from 30mm to 50mm, and the specific distance between the two microphones 20 needs to be calculated according to a corresponding algorithm scheme, and different manufacturers have different algorithm schemes.

In the first embodiment of the microphone 20 of the present application, the number of microphones 20 is two, and the distance L2 between the center lines of the two microphones 20 is 30mm.

In the second embodiment of the microphone 20 of the present application, the number of microphones 20 is two, and the distance L2 between the center lines of the two microphones 20 is 35mm.

In the third embodiment of the microphone 20 of the present application, the number of microphones 20 is two, and the distance L2 between the center lines of the two microphones 20 is 50mm.

As shown in fig. 1, the microphone assembly further includes a shock absorbing buffer member 50 at least partially disposed on a side of the PCB board 10 away from the shock absorbing connector 40, and a cavity 53 for receiving the connector 30 is provided in the shock absorbing buffer member 50, and a cable of the connector 30 is connected to an external device through the cavity 53.

Wherein, one end of the relief cavity 53 communicates with the second cavity 52, and the other end of the relief cavity 53 extends to a side of the shock-absorbing buffer member 50 away from the shock-absorbing connector 40 to form a communication cavity for facilitating connection of the cable between the connector 30 and an external device.

As shown in fig. 2 to 4, a plurality of first through holes 12 are reserved on the PCB 10, and a plurality of second through holes 42 are reserved on the shock absorbing connector 40, wherein the plurality of first through holes 12 and the plurality of second through holes 42 are arranged in a one-to-one correspondence manner, so that a fastener can pass through when the PCB 10 needs to be rigidly fixed under special conditions, but a part of dithering noise may be introduced.

Specific examples of applications of the first through hole 12 and the second through hole 42 described above are as follows:

in at least one embodiment of the present application, not shown, a mounting portion is further provided between the case 60 and the PCB board 10, a shock absorbing member is provided between the mounting portion and the case 60, and the microphone assembly is rigidly and fixedly connected to the mounting portion by a plurality of fasteners to be connected to the case 60 by the mounting portion.

Specifically, the PCB board 10 is provided with a plurality of first through holes 12, and the plurality of first through holes 12 are respectively used for a plurality of fasteners to pass through in a one-to-one correspondence manner; the shock absorbing connecting piece 40 is provided with a plurality of second through holes 42, and the second through holes 42 are respectively used for a plurality of fasteners to pass through in a one-to-one correspondence manner; the mounting part is provided with a plurality of fastening holes which are respectively used for inserting a plurality of fasteners in a one-to-one correspondence manner; one end of each fastener is inserted into the corresponding fastening hole through the corresponding first through hole 12 and the corresponding second through hole 42.

The application also provides an electrical device, which comprises a shell 60, wherein the microphone assembly is arranged in the shell 60.

In particular, the electric devices of the present application include home appliances, which may be kitchen appliances, bathroom appliances, environmental cleaning appliances, health care appliances, cultural entertainment appliances, and the like.

From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

the microphone assembly of the present application is mounted in a housing 60 of an electrical device, the microphone assembly comprising: the PCB 10, two oppositely arranged boards of the PCB 10 are a top surface 101 and a bottom surface 102 respectively, and the top surface 101 is provided with a microphone 20; and a shock absorbing connector 40, the shock absorbing connector 40 being disposed between a side of the PCB 10 having the bottom surface 102 and a wall surface of the case 60, such that the PCB 10 is connected with the case 60 through the shock absorbing connector 40. Therefore, the microphone assembly achieves the purpose that the PCB 10 of the microphone assembly is not rigidly connected with the shell 60, when the shell 60 is vibrated due to external force, vibration can be buffered through the buffer effect of the shock-absorbing connecting piece 40, so that the possibility that noise of electrical equipment is conducted to the PCB 10 in the operation process is reduced, the phenomenon that the external force is conducted to the PCB 10 through the shell 60 is avoided to the greatest extent, the possibility that the PCB 10 falls off due to stress is avoided, the stability of the operation of the microphone 20 is ensured, the sensitivity of the microphone 20 is further ensured, the service life of the microphone 20 is prolonged, the problem that the conventional MEMS microphone is easy to shake due to the effect of the external force when being installed in the electrical equipment, the operation of the MEMS microphone is disturbed, the sensitivity of the MEMS microphone is finally changed is solved, and the practicability of the MEMS microphone is improved.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application.

The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A microphone assembly for mounting within a housing (60) of an electrical device, the microphone assembly comprising:

the PCB (10), two faces of the PCB (10) which are oppositely arranged are a top face (101) and a bottom face (102) respectively, and the microphone (20) is arranged on the top face (101);

the damping connecting piece (40) is arranged between one side, provided with the bottom surface (102), of the PCB (10) and the wall surface of the shell (60), and the PCB (10) is connected with the shell (60) through the damping connecting piece (40);

the microphone assembly is located between an inner wall surface of the housing (60) and a structural support (70) within the housing (60), the microphone assembly further comprising:

-a shock absorber (50), at least part of the shock absorber (50) being located between the top surface (101) of the PCB board (10) and the structural support (70);

wherein, one side of the shock absorption buffer piece (50) close to the PCB (10) is provided with an installation cavity, and the PCB (10) is positioned in the installation cavity;

the mounting cavity comprises a first cavity (51) and a second cavity (52) which are sequentially communicated along a direction away from the PCB (10), the first cavity (51) is used for accommodating the PCB (10) and the shock absorption connecting piece (40), and the second cavity (52) is used for avoiding the microphone (20) on the PCB (10);

the number of the microphones (20) and the number of the second cavities (52) are multiple, the second cavities (52) are arranged in one-to-one correspondence with the microphones (20), and each second cavity (52) is used for avoiding the corresponding microphone (20);

the depth of the first cavity (51) is H5, and the maximum depth of the first cavity (51) is equal to or slightly smaller than the sum of the thickness H1 of the PCB (10) and the thickness H2 of the shock absorption connecting piece (40); -the depth of the second cavity (52) is H6, the minimum depth of the second cavity (52) being greater than the maximum height H4 of the respective microphone (20);

a plurality of protrusions (54) are arranged on the surface of one side, far away from the PCB (10), of the shock absorption buffer (50) so as to be in flexible contact with the structural support (70) through the protrusions (54); the cross-sectional area of each of the protrusions (54) gradually decreases in a direction away from the PCB board (10).

2. The microphone assembly of claim 1 wherein the microphone assembly is configured to receive a microphone signal,

each protrusion (54) is strip-shaped, each protrusion (54) extends along a first direction, the protrusions (54) are arranged at intervals along a second direction, and the first direction and the second direction are arranged at a preset included angle and are parallel to the surfaces of the corresponding shock absorption buffer pieces (50) to form a wave-shaped structure; or alternatively

Each of the projections (54) includes at least a portion of a sphere or an ellipsoid.

3. The microphone assembly of claim 1 wherein the microphone assembly is configured to receive a microphone signal,

the damping buffer piece (50) is made of foam; and/or

The thickness of the shock absorption buffer piece (50) is H3, wherein the value range of H3 is 3mm to 7mm.

4. The microphone assembly of claim 1 wherein the microphone assembly is configured to receive a microphone signal,

the PCB (10) is a rectangular plate body; and/or

-the number of microphones (20) is one or more; and/or

The damping connecting piece (40) is double faced adhesive tape; and/or

The thickness of the shock absorption connecting piece (40) is H2, wherein the value range of H2 is 0.5mm to 3mm.

5. Microphone assembly according to any of claims 1-4, characterized in that the housing (60) is provided with a sound receiving aperture (61), the microphone (20) being arranged in correspondence of the sound receiving aperture (61), wherein,

be provided with on PCB board (10) and be used for supplying the sound first hole (11) of dodging that passes through, be provided with on shock attenuation connecting piece (40) and be used for supplying the sound second hole (41) of dodging that passes through, first hole (11) dodge with hole (41) are all dodged with receive sound hole (61) and correspond the setting, are located the sound of the outside of casing (60) passes in proper order receive sound hole (61) hole (41) with first hole (11) back is dodged by microphone (20) receive.

6. The microphone assembly of claim 5 wherein the microphone assembly is configured to receive a microphone signal,

the diameter of the second avoidance hole (41) is larger than or equal to that of the first avoidance hole (11); and/or

The diameter of the first avoidance hole (11) is larger than or equal to the diameter of the sound receiving hole (61); and/or

The minimum diameter of the first avoidance hole (11) is 2.5mm.

7. Microphone assembly according to any of claims 1-4, characterized in that the top surface (101) of the PCB board (10) is also mounted with a connector (30), the connector (30) being connected with the microphone (20) by means of wires on the PCB board (10), and the connector (30) being connected with an external device by means of a wire harness for receiving data from the microphone (20) and outputting to the external device.

8. The microphone assembly of claim 7 wherein the microphone assembly is configured to receive a microphone signal,

the number of the microphones (20) is two, and the two microphones (20) are respectively positioned on two opposite sides of the connector (30); the distance between the central lines of the two microphones (20) is L2, wherein the value of L2 ranges from 30mm to 50mm.

9. Microphone assembly according to claim 7, characterized in that the microphone assembly further comprises a shock absorbing buffer (50) at least partly located on the side of the PCB board (10) remote from the shock absorbing connector (40), wherein the shock absorbing buffer (50) is provided with a relief cavity (53) for relieving the connector (30), and wherein the cable of the connector (30) is connected to the external device through the relief cavity (53).

10. Microphone assembly according to any of claims 1-4, characterized in that a mounting part is also provided between the housing (60) and the PCB board (10), a damping part is provided between the mounting part and the housing (60), the microphone assembly being fixedly connected with the mounting part by means of a plurality of fasteners.

11. The microphone assembly of claim 10 wherein the microphone assembly is configured to receive a microphone signal,

the PCB (10) is provided with a plurality of first through holes (12), and the plurality of first through holes (12) are respectively used for the plurality of fasteners to pass through in a one-to-one correspondence manner;

the damping connecting piece (40) is provided with a plurality of second through holes (42), and the second through holes (42) are respectively used for enabling the fasteners to pass through in a one-to-one correspondence manner;

the mounting part is provided with a plurality of fastening holes which are respectively used for inserting the fasteners in a one-to-one correspondence manner;

one end of each fastener is inserted into the corresponding fastening hole after passing through the corresponding first through hole (12) and the corresponding second through hole (42).

12. An electrical device comprising a housing (60), characterized in that the microphone assembly of any of claims 1 to 11 is provided in the housing (60).