CN112234084A - Display module, display device and manufacturing method - Google Patents
Display module, display device and manufacturing method Download PDFInfo
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- CN112234084A CN112234084A CN202011098040.6A CN202011098040A CN112234084A CN 112234084 A CN112234084 A CN 112234084A CN 202011098040 A CN202011098040 A CN 202011098040A CN 112234084 A CN112234084 A CN 112234084A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 62
- 238000000059 patterning Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 3
- 230000037303 wrinkles Effects 0.000 abstract description 10
- 238000010030 laminating Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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Abstract
The invention discloses a display module, a display device and a manufacturing method, wherein the display module comprises: the display panel comprises a base film arranged on the display panel, a plurality of driving chips bound on the base film, and a flexible circuit board bound with the driving chips, wherein the base film further comprises a release part arranged between every two adjacent driving chips and used for releasing pressure formed on the base film when the driving chips are bound and the corresponding flexible circuit board is bound. According to the display module provided by the invention, the stress borne by the time base film when the display module is subjected to COP and FOP processes is released through the release part arranged between the two adjacent driving chips, so that the poor wrinkle of the display panel is reduced, the yield of the back-end laminating process is improved, the yield of the display module is effectively improved, meanwhile, the product yield of a display device applying the display module is further improved, and the display module has a wide application prospect.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a display device and a manufacturing method.
Background
The OLED product is widely concerned with by the advantages of self luminescence, low power consumption, lightness, thinness, gorgeous color, high contrast, high response speed and the like, gradually replaces the LCD product, and is applied to the fields of Mobile products, notebook products, Note Book and the like. However, with the increasing requirements of OLED product size and resolution, the number of channels of a single driving chip (IC) of a display module cannot meet the requirement in the manufacturing process of a display device, and therefore, multiple ICs are often used for correspondence in practical production.
However, the display module with multiple ICs is prone to display defects in the lit state, and particularly when the defective display module is further applied to a display device, the display defects of the display device are prone to be caused, so that the yield of the display device is affected.
Therefore, a new display module, a display device and a manufacturing method are needed.
Disclosure of Invention
In order to solve at least one of the above problems, a first embodiment of the invention provides a display module, including:
a base film disposed on the display panel, a plurality of driving chips bound on the base film, and a flexible circuit board bound with each driving chip,
the base film further comprises a release part arranged between two adjacent driving chips and used for releasing pressure formed on the base film when the driving chips are bound and the corresponding flexible circuit boards are bound.
Further, the release portion is a through hole penetrating through the base film and disposed between two adjacent driving chips.
Further, the release part is a plurality of holes arranged on the base film between two adjacent driving chips in an array manner.
Further, the release part is a net structure formed by patterning the base film between the two adjacent driving chips.
Further, the base film includes a plurality of film layers disposed on the substrate, including at least two layers of a base layer, a crystalline silicon layer, a passivation layer, and a planarization layer.
The second embodiment of the invention provides a display device, which comprises the display module.
A third embodiment of the present invention provides a method for manufacturing the display module, including:
forming a base film on a substrate;
forming a plurality of release portions on the base film;
binding a plurality of driving chips on the base film, wherein the driving chips and the releasing part are arranged at intervals;
and binding a corresponding flexible circuit board on the drive chip.
Further, the forming a plurality of release portions on the base film further includes:
and forming a plurality of through holes penetrating through the base film at the spacing positions of the base film corresponding to two adjacent to-be-formed driving chips.
Further, the forming a plurality of release portions on the base film further includes:
and forming a plurality of holes which are arranged in an array at the interval position of the base film corresponding to two adjacent to-be-formed driving chips.
Further, the forming a plurality of release portions on the base film further includes:
and patterning the base film corresponding to the interval position of two adjacent to-be-formed driving chips to form a net-shaped structure.
The invention has the following beneficial effects:
aiming at the existing problems, the invention sets a display module, and releases the stress borne by a time base film when the display module carries out COP and FOP processes through a release part arranged between two adjacent driving chips, so that the poor wrinkle of a display panel is reduced, the yield of the back-end laminating process is improved, the yield of the display module is effectively improved, meanwhile, the yield of a display device applying the display module is further improved, and the display module has wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a block diagram illustrating a display module according to an embodiment of the present invention;
FIG. 2 is a flow chart of a prior art process for fabricating a display module;
FIG. 3 is a schematic diagram illustrating a wrinkle defect of a display module processed according to the prior art;
FIG. 4 is a schematic illustration of prior art processing resulting in poor wrinkling of the base film;
fig. 5 is a block diagram of a display module according to another embodiment of the invention;
FIG. 6 is a block diagram of a display module according to yet another embodiment of the present invention;
fig. 7 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the invention.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
It is noted that references herein to "on … …", "formed on … …" and "disposed on … …" can mean that one layer is formed or disposed directly on another layer or that one layer is formed or disposed indirectly on another layer, i.e., there is another layer between the two layers. As used herein, unless otherwise specified, the term "on the same layer" means that two layers, components, members, elements or portions can be formed by the same patterning process, and the two layers, components, members, elements or portions are generally formed of the same material. Herein, unless otherwise specified, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like. The expression "one-time patterning process" means a process of forming a patterned layer, member, or the like using one mask plate.
As shown in fig. 2, on the basis of a display panel, a COP binding process (ChipOn Pi binding) is first performed to sequentially bind a base film 12 on a display panel 11 and a plurality of driver chips IC13, and as shown in fig. 3 and 4, a plurality of ICs 13 are bound on the base film 12 at a certain first arrangement distance L1; then, an FOP Bonding process (FPC On COP Bonding) is performed to sequentially bond the flexible circuit board FPC14 corresponding to each IC13 On the base film 12, and then the display module 1 shown in fig. 3 and 4 is formed by the FOP Bonding process and the subsequent Bonding process. However, the display module formed by the process flow is prone to display poor crease in a lighting state and after being applied to a display device.
After a lot of experiments, the inventor proposes that the reason for the display device to have poor display is as follows: in the prior art, after the COP process and the FOP process, the corresponding base films between two adjacent ICs 13 and between two adjacent FPCs 14 are deformed in a doming manner, so that the display panel 11 at the corresponding position has a poor wrinkle as shown in fig. 3. Further, the inventors have found that the cause of the display failure of the display panel 11 is: as shown in fig. 4, the base films 12 between two adjacent ICs 13 and between two adjacent FPCs 14 are shrunk after being processed by the COP process and the FOP process, the first arrangement distance L1 and the second arrangement distance L2 are both reduced compared to those before being bound, and the base films 12 at the end portions of each IC13 and each FPC14 are pressed against each other to generate a large stress, so that the display panel 11 is wrinkled as shown in fig. 3, and the processed display device is poor in display.
Therefore, to solve the above problems, embodiments of the present invention provide a display module, a display device and a manufacturing method thereof.
As shown in fig. 1, an embodiment of the present invention provides a display module 1, including a base film 12 disposed on a display panel 11, a plurality of driver chips 13 bound on the base film 12, and a flexible circuit board 14 bound to each driver chip 13, specifically:
the base film 12 further includes a release portion 15 provided between two adjacent driver chips 13 for releasing a pressure formed on the base film 12 when bonding each of the driver chips 13 and bonding the corresponding flexible circuit board 14.
In this embodiment, the release portion 15 disposed between two adjacent driving chips 13 releases the stress borne by the time base film when the display module performs COP and FOP processes, so as to reduce the wrinkle defect of the display panel, improve the yield of the back-end bonding process, effectively improve the yield of the display module, and further improve the product yield of the display device using the display module.
In an alternative embodiment, as shown in fig. 1, the release portion 15 is a through hole penetrating the base film and provided between two adjacent driving chips 13.
In the present embodiment, the release portion 15 is a through hole penetrating through the base film 12, and can completely release the stress generated in the processing process of the base film 12 between two adjacent driving chips 13 and between two adjacent FPCs 14. Furthermore, in order to ensure the integrity of the display module during the subsequent bonding process, the through hole provided by the embodiment of the invention is manufactured in a laser cutting mode, so that the phenomenon that the FPC14 and the IC fall off in the process of transferring Panel is avoided, and a mask plate is not required to be added in the processing process of the through hole, so that the complex process flow and the production cost are not increased.
It should be noted that, in the embodiment of the present invention, no trace is designed at the position of the base film 12 corresponding to the release portion 15, that is, the release portion is disposed on the base film without the trace, so that the circuit structure of the display module is not damaged. The release part can effectively reduce the bad wrinkles of the display panel, improve the yield of the display module and further improve the product yield of the display device manufactured by the display module.
Considering that the release portions in the above embodiments have no film layer connected between two adjacent driver chips 13 and between two adjacent FPCs 14 due to the through holes, and the FPCs are prone to shake and tear during the transfer process, in an alternative embodiment, as shown in fig. 5, the release portions 15 are a plurality of holes arranged in an array on the base film 12 between two adjacent driver chips 13.
In the present embodiment, the release portion 15 is a plurality of holes disposed on the base film 12 between two adjacent driver chips 13, and the plurality of holes can release the stress generated in the processing process of the base film 12 between two adjacent driver chips 13 and between two adjacent FPCs 14. Further, the release part 15 is in a hole structure, so that the base film 12 connected between two adjacent ICs 13 is further arranged, the stability and the safety between the FPC and the base film and between the ICs and the base film are improved, and the phenomenon that the FPC and the ICs fall off in the process of transferring Panel is effectively avoided.
In order to ensure that the hole structure of the releasing portion does not affect the subsequent bonding process, in a specific example, the plurality of holes of the embodiment of the present invention are processed and manufactured by laser drilling, and the complicated process flow and the production cost are not increased. Similarly, the base film corresponding to the release part in the embodiment of the invention is not provided with the routing, so that the circuit structure of the display module is not damaged.
It is understood that the specific shape of the hole can be selected by one skilled in the art according to the actual application, and is not limited to the circular hole of the embodiment of the present invention.
In consideration of the problem that the stress cannot be sufficiently released by using the holes, in an alternative embodiment, as shown in fig. 6, the release portion 15 is a mesh structure formed by patterning the base film 12 between the two adjacent driving chips 13.
In this embodiment, the release portion 15 is a mesh structure formed by patterning the base film 12 between two adjacent driver chips 13, and the mesh structure can effectively release the stress generated by the base film 12 between two adjacent driver chips 13 and between two adjacent FPCs 14 in the processing process, and the release portion 15 of the mesh structure can also connect the base films 12 at the ends of two adjacent ICs 13, so as to improve the stability and safety between the FPC14 and the base film 12 and between the ICs 13 and the base film 12, and effectively avoid the phenomenon that the FPCs and the ICs fall off during the process of transferring Panel.
Similarly, the base film corresponding to the release part in the embodiment of the invention is not provided with the routing, so that the circuit structure of the display module is not damaged.
In a specific example, the mesh structure of the embodiment of the invention can be formed by performing patterned etching on the base film between two adjacent driving chips by using a mask plate.
It should be noted that the release portions of the above embodiments are only used for illustrating specific embodiments of the present application, and no specific structure of the release portions is defined, and those skilled in the art should select an appropriate release portion according to practical application requirements to achieve the release of the stress borne by the base film during the COP and FOP processes as a design criterion, and details are not repeated herein.
In an alternative embodiment, the base film includes a plurality of film layers disposed on the substrate, including at least two of a base layer, a crystalline silicon layer, a passivation layer, and a planarization layer.
In this embodiment, the base film is a multi-layer structure, and may include at least two layers of a flexible base layer, a low-temperature ordered polysilicon layer, a passivation layer, and a planarization layer, and the material thereof may be selected from one or more of silicon-based oxide, nitride, and polyimide, and those skilled in the art may select the base film according to practical applications.
Corresponding to the display module provided in the foregoing embodiment, as shown in fig. 7, an embodiment of the present application further provides a method for manufacturing the display module, including:
forming a base film 12 on a substrate;
forming a plurality of release portions 15 on the base film 12;
binding a plurality of driving chips 13 on the base film 12, the driving chips 13 being spaced apart from the discharge portion 15;
and binding a corresponding flexible circuit board 14 on the driving chip 13.
In this embodiment, the release portion 15 is formed before COP and FOP processes are performed, the release portion 15 of the base film 12 having the through hole structure, the hole structure or the mesh structure is formed by laser cutting or patterned etching, after the release portion is manufactured, the base film 12 and the plurality of driving chips 13 are sequentially bonded by the COP process, in the COP process, the driving chips 13 and the release portion 15 are arranged at intervals, and a release portion 15 is arranged between two adjacent driving chips 13, so that the stress of the COP process on the base film can be effectively released; and sequentially binding the base film 12 and the FPC14 of each driver chip 13 through an FOP process, so that the stress of the FOP process on the base film can be effectively released, and a display module is formed.
The release part of the embodiment of the invention can effectively release the stress of the display module between two adjacent driving chips and between two adjacent flexible circuit boards in COP and FOP processes, improve the yield of the back-end laminating process, reduce the poor wrinkle of the display panel, improve the yield of the display module and further improve the product yield of the display device manufactured by applying the display module.
In an alternative embodiment, the forming a plurality of release portions on the base film further comprises:
a plurality of through holes are formed through the base film at spaced positions corresponding to two adjacent driver chips 13 to be formed.
In the present embodiment, the release portion 15 is a through hole penetrating the entire width D of the base film 12, and the base film 12 between two adjacent driving chips 13 is cut by laser before the COP process and the FOP process are performed, and the cut region is specifically formed by the second arrangement distance L2 and the base film width distance D as shown in fig. 4. The release part formed by laser cutting can completely release stress generated by the base film between two adjacent FPCs in the subsequent processing process, so that poor wrinkles of the display panel are reduced, the yield of the display module is improved, and the product yield of the display device manufactured by the display module is further improved.
In an alternative embodiment, the forming of the plurality of release portions 15 on the base film 12 further comprises:
a plurality of holes arranged in an array are formed at the interval positions of the base film 12 corresponding to two adjacent driving chips 13 to be formed.
In the present embodiment, the release portion is a plurality of holes disposed on the base film between two adjacent driving chips, and the base film between two adjacent driving chips is perforated by laser before the COP process and the FOP process are performed, and the perforated area is specifically formed by the second arrangement distance L2 and the base film width distance D as shown in fig. 4. The release part formed by laser drilling can release stress generated by the base film between two adjacent driving chips and between two adjacent FPCs in the subsequent processing process. Furthermore, the release part is of a hole structure, so that a connected base film is arranged between two adjacent ICs, the stability and the safety between the FPC and the base film and between the ICs and the base film are improved, and the phenomenon that the FPC and the ICs fall off in the process of transferring the Panel is effectively avoided.
In an alternative embodiment, the forming of the plurality of release portions 15 on the base film 12 further comprises:
the base film 12 is patterned to form a mesh structure corresponding to the spacing position of two adjacent driving chips 13 to be formed.
In this embodiment, the release portion is a mesh structure formed by patterning a base film between two adjacent driver chips, and before performing the COP process and the FOP process, the base film between two adjacent driver chips is exposed by using a mask plate, and then laser drilling is performed on a region of the base film corresponding to the release portion, so as to form a mesh-shaped release portion as shown in fig. 6. The release part can effectively release the stress generated by the base films between two adjacent driving chips and between two adjacent FPCs in the processing technology, and meanwhile, the release part of the net structure can also be connected with the base films at the end parts of two adjacent ICs, so that the stability and the safety between the FPC and the base films and between the ICs and the base films are improved, and the phenomenon that the FPC and the ICs fall off in the process of transferring Panel is effectively avoided.
The specific structure of the release part in the embodiment of the present invention may adopt one of the above-mentioned through hole structure, hole structure and mesh structure or adopt several of the above-mentioned structures at the same time, and the manufacturing method corresponding to the specific structure may be selected by a skilled person according to actual needs.
It should be noted that the display module provided in the embodiments of the present invention is not limited to the specific structure formed by the manufacturing method of the embodiments of the present invention, and those skilled in the art may also use other processing techniques to form the specific structure of the display module.
The display module according to the above embodiment of the present invention is used for a display device that may have a display requirement, and an embodiment of the present invention provides a display device including the display module according to the above embodiment, where the display module includes a base film disposed on a display panel, a plurality of driver chips bonded to the base film, and a flexible circuit board bonded to each driver chip, and the base film further includes a releasing portion disposed between two adjacent driver chips, and configured to release a pressure formed on the base film when each driver chip is bonded and a corresponding flexible circuit board is bonded.
In this embodiment, the display device may be any product or component having a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, and a navigator, which is not limited in this embodiment.
The display device applied to the display module can release the stress generated by the base films between two adjacent driving chips and between two adjacent flexible circuit boards in COP and FOP processes of the display module, and reduce the poor wrinkle of the display panel, thereby improving the product yield of the display device manufactured by applying the display module.
The display device provided by the invention can be any product or component with a display function, including the display panel provided by the embodiment of the invention. The foregoing embodiments and the advantages thereof are also applicable to the present embodiment, and therefore, the description of the same parts is omitted.
Aiming at the existing problems, the invention sets a display module, and releases the stress borne by a time base film when the display module carries out COP and FOP processes through a release part arranged between two adjacent driving chips, so that the poor wrinkle of a display panel is reduced, the yield of the back-end laminating process is improved, the yield of the display module is effectively improved, meanwhile, the yield of a display device applying the display module is further improved, and the display module has wide application prospect.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (10)
1. A display module comprises a base film arranged on a display panel, a plurality of drive chips bound on the base film, and a flexible circuit board bound with the drive chips,
the base film further comprises a release part arranged between two adjacent driving chips and used for releasing pressure formed on the base film when the driving chips are bound and the corresponding flexible circuit boards are bound.
2. The display module according to claim 1, wherein the release portion is a through hole penetrating the base film and provided between two adjacent driving chips.
3. The display module of claim 1, wherein the releasing portion is a plurality of holes arranged in an array on the base film between two adjacent driving chips.
4. The display module of claim 1, wherein the release portion is a mesh structure formed by patterning a base film between the two adjacent driving chips.
5. The display module of any of claims 1-4, wherein the base film comprises a plurality of film layers disposed on the substrate, including at least two of a base layer, a crystalline silicon layer, a passivation layer, and a planarization layer.
6. A display device, characterized in that it comprises a display module according to any one of claims 1 to 5.
7. A method for manufacturing the display module according to claim 1, comprising:
forming a base film on a substrate;
forming a plurality of release portions on the base film;
binding a plurality of driving chips on the base film, wherein the driving chips and the releasing part are arranged at intervals;
and binding a corresponding flexible circuit board on the drive chip.
8. The method of claim 7, wherein the forming a plurality of releases on the base film further comprises:
and forming a plurality of through holes penetrating through the base film at the spacing positions of the base film corresponding to two adjacent to-be-formed driving chips.
9. The method of claim 7, wherein the forming a plurality of releases on the base film further comprises:
and forming a plurality of holes which are arranged in an array at the interval position of the base film corresponding to two adjacent to-be-formed driving chips.
10. The method of claim 7, wherein the forming a plurality of releases on the base film further comprises:
and patterning the base film corresponding to the interval position of two adjacent to-be-formed driving chips to form a net-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011098040.6A CN112234084A (en) | 2020-10-14 | 2020-10-14 | Display module, display device and manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011098040.6A CN112234084A (en) | 2020-10-14 | 2020-10-14 | Display module, display device and manufacturing method |
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| CN112234084A true CN112234084A (en) | 2021-01-15 |
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| CN202011098040.6A Pending CN112234084A (en) | 2020-10-14 | 2020-10-14 | Display module, display device and manufacturing method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05265020A (en) * | 1992-03-18 | 1993-10-15 | Hitachi Ltd | Tape carrier package |
| CN105448252A (en) * | 2014-09-23 | 2016-03-30 | 三星显示有限公司 | Curved display device |
| CN107464503A (en) * | 2017-08-23 | 2017-12-12 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof and display device |
-
2020
- 2020-10-14 CN CN202011098040.6A patent/CN112234084A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05265020A (en) * | 1992-03-18 | 1993-10-15 | Hitachi Ltd | Tape carrier package |
| CN105448252A (en) * | 2014-09-23 | 2016-03-30 | 三星显示有限公司 | Curved display device |
| CN107464503A (en) * | 2017-08-23 | 2017-12-12 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof and display device |
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