CN112226173B

CN112226173B - Conductive foam double-sided adhesive tape

Info

Publication number: CN112226173B
Application number: CN202011107743.0A
Authority: CN
Inventors: 林志武; 高凌文; 杨滨
Original assignee: It Contains Up To Winged Intelligent Science And Technology Co ltd In Suzhou
Current assignee: It Contains Up To Winged Intelligent Science And Technology Co ltd In Suzhou
Priority date: 2020-10-16
Filing date: 2020-10-16
Publication date: 2022-06-17
Anticipated expiration: 2040-10-16
Also published as: CN112226173A

Abstract

A conductive foam double-sided tape comprises a foaming base material, wherein a first adhesive layer and a second adhesive layer are respectively arranged on the upper surface and the lower surface of the foaming base material; a plurality of first through holes are uniformly formed in the surface of the foaming base material, bosses are respectively arranged on the upper surface and the lower surface of the foaming base material at the two ends of each first through hole, and the first through holes are communicated with the bosses; the surface of the boss is connected with the first through hole and is provided with a conductive material layer; second through holes matched with the shapes and positions of bosses are formed in the first adhesive layer and the second adhesive layer, the bosses are arranged in the second through holes, and the heights of the bosses are slightly larger than the thickness of the first adhesive layer or the second adhesive layer; the invention integrates the functions of electric conduction, buffering and shock absorption, can flexibly select various adhesive materials, has simple structure, can be randomly die-cut, and is particularly suitable for special occasions with double-sided adhesive fixation or sealing requirements.

Description

Conductive foam double-sided adhesive tape

Technical Field

The invention belongs to the technical field of electronic application tapes, and particularly relates to a conductive foam double-sided tape.

Background

With the development of science and technology, the integration level and precision of electronic devices are higher and higher, and the requirements on electrostatic discharge and electromagnetic shielding of the electronic devices are gradually improved, so that higher requirements are provided for the quality and functionality of the conductive foam adhesive tape.

The conductive foam adhesive tape is conductive foam with an adhesive layer on the surface; the conductive foam adhesive tape is formed by wrapping and covering a foam base material with conductive materials such as conductive cloth and the like, and performing composite processing treatment to ensure that the conductive foam adhesive tape has good surface conductivity and can play roles in buffering, shock absorption, electromagnetic shielding, static electricity prevention and the like. Foamed substrates are generally required to have high elasticity and conformability to be suitable for applications requiring low closure forces and minimal amounts of compressive deformation. The conductive foam adhesive tape is widely applied to LCD displays, liquid crystal televisions, communication mobile terminal equipment and cabinets, household appliances, portable computers and the like.

In the traditional conductive foam tape, conductive cloth is fully coated on the surface of foam, or a metal or graphite layer is plated to form a conductive layer, so that good electrical conductivity and thermal conductivity are obtained.

At present, some conductive foam tape materials on the market have the following problems: (1) most of all-round conductive foam tapes in China can only be attached by conductive pressure-sensitive adhesives, or conductive particles are added into hot melt adhesives and the like, so that the adhesiveness is influenced, the resilience of foam is also influenced to a certain extent, and the comprehensive performances such as cold resistance, durability and the like of the conductive pressure-sensitive adhesives are poor; (2) the conductive foam adhesive tape attached by the conductive cloth has the problem of broken filaments during die cutting, so that the product yield and the die cutting efficiency are influenced; for the foam with the surface coated with the graphite layer, the foam has high compressibility, so that the phenomenon that the graphite layer is cracked and even peeled off easily occurs when the foam is greatly compressed during slitting; (3) when the die cutting is carried out for multiple times, the electric conduction and heat conduction effects of the cut foam adhesive tape are possibly greatly reduced and even lost.

Disclosure of Invention

The invention aims to provide a conductive foam double-sided tape which can flexibly select various adhesive materials.

Another object of the present invention is to provide a conductive foam double-sided tape which can be die-cut at will.

In order to solve the technical problem, the invention discloses a conductive foam double-sided tape, which comprises: the foaming base material is provided with a first adhesive layer and a second adhesive layer on the upper surface and the lower surface respectively;

a plurality of first through holes are uniformly formed in the surface of the foaming base material, bosses are respectively arranged on the upper surface and the lower surface of the foaming base material at the two ends of each first through hole, and the first through holes are communicated with the bosses;

the surface of the boss is connected with the first through hole and is provided with a conductive material layer;

second through holes matched with the shapes and positions of the bosses are formed in the first adhesive layer and the second adhesive layer, the bosses are arranged in the second through holes, and the heights of the bosses are slightly larger than the thicknesses of the first adhesive layer or the second adhesive layer.

Preferably, the boss top is free of adhesive.

Preferably, the first through hole is vertically or obliquely arranged.

Preferably, a release film is attached to the surface of the second adhesive layer, or a release film is attached to each of the surfaces of the first adhesive layer and the second adhesive layer.

Preferably, the materials of the first adhesive layer and the second adhesive layer include pressure-sensitive adhesive or hot melt adhesive.

Preferably, the materials of the first adhesive layer and the second adhesive layer are the same or different; one or both of the first adhesive layer and the second adhesive layer have electrical conductivity, or neither has electrical conductivity.

Preferably, the conductive material layer is one of a metal plating layer, a graphite plating layer, a conductive ink coating layer or an infused conductive ink.

Preferably, the boss is in a right-side or inverted semi-cone shape, and the diameter of the round bottom of the semi-cone-shaped boss is slightly larger than or equal to that of the second through hole.

Preferably, the foam base, the boss, and the first through hole are integrally formed.

Preferably, the foam base and the boss are integrally formed, and the first through hole is formed by one-time processing with a punch.

The conductive foam double-sided tape disclosed by the invention at least has the following advantages:

1. and various adhesive materials can be flexibly selected.

2. The adhesive tape can be cut at will, so that the finished adhesive tape can be cut at any specification as required, and the condition that the electric conduction and heat conduction effects of the adhesive tape are greatly reduced or lost due to cutting does not exist.

3. The functions of electric conduction, buffering and shock absorption, heat conduction and the like are integrated.

4. The structure is simple, the number of structural layers in the vertical direction is small, and the manufacturing process and the cost are relatively low.

5. Is suitable for special occasions with double-sided adhesive fixation or sealing requirements.

Drawings

Fig. 1 is a schematic structural diagram of a conductive foam double-sided tape.

Fig. 2 is a schematic structural diagram of another conductive foam double-sided tape.

The reference signs are: the adhesive comprises, by weight, 1-a foam base material, 2 first adhesive layers, 3-second adhesive layers, 4-first through holes, 5-bosses, 6-conductive material layers, 7-second through holes and 8-release films.

Detailed Description

The present invention is further described in detail below with reference to examples so that those skilled in the art can practice the invention with reference to the description.

It will be understood that terms such as "having," "including," and "comprising," when used herein, do not preclude the presence or addition of one or more other elements or groups thereof.

Example 1

As shown in fig. 1, a conductive foam double-sided tape includes: the foaming adhesive comprises a foaming base material 1, wherein the upper surface and the lower surface of the foaming base material are respectively provided with a first adhesive layer 2 and a second adhesive layer 3;

a plurality of first through holes 4 are uniformly formed in the surface of the foaming base material, bosses 5 are respectively arranged on the upper surface and the lower surface of the foaming base material at the two ends of each first through hole, and the first through holes are communicated with the bosses;

the surface of the boss is connected with the first through hole and is provided with a conductive material layer 6; the conductive material layer enables the conductive foam double-sided tape to enable two sides to realize conductive connection;

second through holes 7 which are matched with the shapes and the positions of the bosses are formed in the first adhesive layer and the second adhesive layer, the bosses are arranged in the second through holes, and the heights of the bosses are slightly larger than the thicknesses of the first adhesive layer or the second adhesive layer. When the conductive foam double-sided adhesive tape is adhered to the surface of the equipment, the first adhesive layer or the second adhesive layer is adhered to the surface of the equipment, so that the boss is pressed, the top of the boss is in close contact with the surface of the equipment, and good conductive efficiency is ensured;

and the top of the boss is free of adhesive.

The first through hole is vertically arranged.

And release films 8 are respectively adhered to the surfaces of the first adhesive layer and the second adhesive layer. Because the double surfaces have viscosity, the single conductive foam double-sided tape needs to be pasted with the release film on both surfaces, and the coiled conductive foam double-sided tape only needs to be pasted with the release film on one surface.

The materials of the first adhesive layer and the second adhesive layer comprise pressure-sensitive adhesive or hot melt adhesive. Due to the existence of the conductive material layer, a better conductive effect can be achieved; therefore, the requirements on the conductivity and the like of the materials of the first adhesive layer and the second adhesive layer are reduced, and manufacturers can select different adhesives according to different application requirements so as to solve the problems of poor durability and cold resistance and the like caused by only adopting the acrylic pressure-sensitive adhesive.

The first adhesive layer and the second adhesive layer are made of the same or different materials; one or both of the first adhesive layer and the second adhesive layer have electrical conductivity, or neither has electrical conductivity. The foam base material with a plurality of tiny conductive material layers has a certain shielding function, and can be matched with a conductive adhesive layer to enhance the shielding effect.

The conductive material layer is one of a metal coating, a graphite coating, a conductive ink coating or poured conductive ink. The metal plating, graphite plating, conductive ink coating or infused conductive ink is preferably chosen to fill the first via as much as possible. In this example, a vacuum nickel plating layer is used.

The boss is in a right-handed or inverted semi-cone shape, and the diameter of the round bottom of the semi-cone-shaped boss is slightly larger than or equal to that of the second through hole. The upright or inverted semi-conical boss is helpful for combination of the boss and the adhesive layer.

The foaming base material and the boss are integrally formed, and the first through hole is formed by one-time processing of the punching machine.

In this embodiment, the foam substrate may be formed by foaming polyurethane foam at one time or by performing heat shrinkage on the polyurethane foam with a flat surface to form a boss.

Example 2

Similar to example 1, except that the foam base material, the boss, and the first through-hole are integrally molded.

Example 3

Similarly to embodiment 1, the difference is that the first through-hole is provided obliquely. The first through-hole that the slope set up has better adaptability to the compression deformation of foaming substrate, the phenomenon that the conducting material layer peeled off and drops in the prevention die cutting or long-term use that can be better.

Example 4

As shown in fig. 2, similar to example 1, the difference is that the conductive material layer includes a conductive ink poured into the first through hole and a conductive ink coated on the surface of the land.

While embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable to various fields of endeavor for which the invention may be embodied with additional modifications as would be readily apparent to those skilled in the art, and the invention is therefore not limited to the details given herein and to the embodiments shown and described without departing from the generic concept as defined by the claims and their equivalents.

Claims

1. A conductive foam double-sided tape is characterized by comprising: the upper surface and the lower surface of the foaming base material are respectively provided with a first adhesive layer and a second adhesive layer;

second through holes matched with the shapes and positions of the bosses are formed in the first adhesive layer and the second adhesive layer, the bosses are arranged in the second through holes, and the heights of the bosses are slightly larger than the thicknesses of the first adhesive layer or the second adhesive layer;

the top of the boss is free of adhesive;

the boss is in a right-handed or inverted semi-cone shape, and the diameter of the round bottom of the semi-cone-shaped boss is slightly larger than or equal to that of the second through hole.

2. The double-sided tape of claim 1, wherein the first through hole is vertically or obliquely disposed.

3. The double-sided adhesive tape with conductive foam as claimed in claim 2, wherein a release film is attached to the surface of the second adhesive layer, or a release film is attached to each of the surfaces of the first adhesive layer and the second adhesive layer.

4. The double-sided conductive foam tape according to claim 3, wherein the materials of the first adhesive layer and the second adhesive layer comprise pressure-sensitive adhesive or hot melt adhesive.

5. The conductive foam double-sided tape of claim 1, wherein the first adhesive layer and the second adhesive layer are the same or different in material; one or both of the first adhesive layer and the second adhesive layer have electrical conductivity, or neither has electrical conductivity.

6. The double-sided tape of claim 5, wherein the conductive material layer is one of a metal plating layer, a graphite plating layer, a conductive ink coating layer or an infused conductive ink.

7. The double-sided tape of claim 1, wherein the foam substrate, the boss, and the first through hole are integrally formed.

8. The double-sided tape of claim 1, wherein the foam substrate and the boss are integrally formed, and the first through hole is formed by a punching machine at one time.