CN112218490A - Heat dissipation method of integrated circuit board - Google Patents
Heat dissipation method of integrated circuit board Download PDFInfo
- Publication number
- CN112218490A CN112218490A CN202011039229.8A CN202011039229A CN112218490A CN 112218490 A CN112218490 A CN 112218490A CN 202011039229 A CN202011039229 A CN 202011039229A CN 112218490 A CN112218490 A CN 112218490A
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- Prior art keywords
- circuit board
- box
- air
- heat dissipation
- shell
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/261—Drying gases or vapours by adsorption
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/06—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
- F16F15/067—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only wound springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
- B01D2253/10—Inorganic adsorbents
- B01D2253/102—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/80—Water
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Acoustics & Sound (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a heat dissipation method of an integrated circuit board, which adopts a heat dissipation device to dissipate heat of the integrated circuit board; air after will filtering is carried to bent shape through the fan in, can stay the dust impurity filter sieve in the air through the filter house, at this moment refrigerate the refrigerating fluid of refrigeration incasement chamber through the refrigerator, refrigerating fluid after the refrigeration conducts low temperature to in refrigerating pipe and bent shape pipe, refrigerate the cooling to the air in bent shape pipe through low temperature, the air through the cooling gets into in the dehumidification incasement along the hose, through the active carbon contact with the dehumidification incasement, absorb the moisture in the air, the air after the dehumidification is along the cavity discharge of dehumidification bottom of the case portion, and contact with the circuit board body, the heat that produces is cooled down to circuit board body during operation through the contact, absorb some moisture on the circuit board body through dry air simultaneously, and along radiator-grid discharge casing, accomplish whole circuit board body radiating process from here.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a heat dissipation method of an integrated circuit board.
Background
The integrated circuit board is made by using semiconductor manufacturing process, and many transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by multilayer wiring or tunnel wiring.
The circuit board can generate heat when working, the existing heat dissipation device generally carries out natural heat dissipation through indoor temperature, the heat dissipation effect is poor, and some water vapor generated when the circuit board is scalded cannot be removed, so that the heat dissipation device of the integrated circuit board is provided to solve the problem.
Disclosure of Invention
The invention aims to provide a heat dissipation method of an integrated circuit board, which adopts a heat dissipation device to dissipate heat of the integrated circuit board, has the advantage of good heat dissipation effect, and solves the problems that the existing heat dissipation device generally carries out natural heat dissipation through indoor temperature, the heat dissipation effect is poor, and some water vapor generated when the circuit board is scalded cannot be removed.
In order to achieve the above object, the present invention provides a heat dissipation method for an integrated circuit board, which employs a heat dissipation device to dissipate heat of the integrated circuit board;
the heat dissipation device comprises a shell, a placing plate is arranged in an inner cavity of the shell, a clamping plate is fixedly mounted at the top of the placing plate, a circuit board body is clamped at the inner side of the clamping plate, a transverse plate is fixedly mounted above the circuit board body in the inner cavity of the shell, a fan is arranged on the right side of the top of the transverse plate, a refrigeration box is fixedly mounted on the left side of the top of the transverse plate, a refrigerator is fixedly mounted at the bottom of the inner cavity of the refrigeration box, a refrigeration pipe is fixedly mounted above the refrigerator in the inner cavity of the refrigeration box, a curved pipe is arranged on the surface of the refrigeration pipe, an exhaust end of the fan penetrates through the refrigeration box and extends to the inner cavity to be communicated with one side of the curved pipe, a hose is communicated with the other side of the curved pipe, one side of the hose, which is far away from the curved pipe, the bottom of the inner cavity of the dehumidification box is provided with active carbon; a sound insulation box is fixedly arranged on the right side of the top of the transverse plate, and the bottom of the fan and the bottom of the inner cavity of the sound insulation box are fixedly arranged; the right side of the shell is fixedly provided with a filter cover, and the air exhaust end of the fan sequentially penetrates through the sound insulation box and the shell and extends to the outside of the shell to be communicated with the left side of the filter cover; a water inlet pipe is communicated with the top of the refrigeration box and positioned on the right side of the hose, a pipe cover is connected with the top of the water inlet pipe in a threaded manner, a drain pipe is communicated with the bottom of the right side of the back of the refrigeration box, and the back of the drain pipe penetrates through the shell and extends to the outside to be fixedly provided with a valve; the four corners of the bottom of the placing plate are respectively provided with a telescopic rod, circular plates are fixedly mounted on the upper side and the lower side of each telescopic rod, springs are fixedly mounted on the inner sides of the circular plates and the outer sides of the telescopic rods, the tops of the circular plates are fixedly mounted with the bottom of the placing plate, and the bottoms of the circular plates are fixedly mounted with the bottom of the inner cavity of the shell; notches are formed in the two sides of the bottom of the shell, and radiating nets are embedded in the inner sides of the notches;
the heat dissipation method comprises the following steps: firstly, the switch of a fan, an electric heating box and a fan is turned on by an external controller, the filtered air is conveyed into a curved pipe by the fan, dust impurities in the air can be filtered and retained by a filter cover, the fan is prevented from being blocked by the dust impurities, meanwhile, the dust is prevented from being infected with a circuit board body, at the moment, refrigerating liquid in the inner cavity of a refrigerating box is refrigerated by a refrigerator, the refrigerated refrigerating liquid conducts low temperature to the refrigerating pipe and the curved pipe, the air in the curved pipe is refrigerated and cooled by the low temperature, the cooled air enters a dehumidifying box along a hose, the moisture in the air is absorbed by contacting with active carbon in the dehumidifying box, the dehumidified air is discharged along a cavity at the bottom of the dehumidifying box and contacts with the circuit board body, the heat generated when the circuit board body works is cooled by contacting, and meanwhile, some moisture on the circuit board body is absorbed by dry air, and is discharged out of the shell along the heat dissipation net, thereby completing the heat dissipation process of the whole circuit board body.
Preferably, the front surface of the shell is in threaded connection with a cover plate, the front surface of the dehumidification box is hinged with a box door, and the front surface of the box door is fixedly provided with a handle.
Preferably, both sides of the bottom of the dehumidification box are fixedly provided with support plates, and the outer sides of the support plates are fixedly arranged with the inner wall of the shell.
The invention has the advantages and beneficial effects that: the heat dissipation method of the integrated circuit board has the advantages of good heat dissipation effect due to the fact that the heat dissipation device is adopted for dissipating heat of the integrated circuit board, and the problems that the existing heat dissipation device is poor in heat dissipation effect due to the fact that natural heat dissipation is generally carried out through indoor temperature, and some water vapor generated when the circuit board is not hot can not be removed are solved.
The invention has the following characteristics:
1. according to the invention, through the arrangement of the shell, the placing plate, the clamping plate, the circuit board body, the transverse plate, the fan, the refrigerating box, the refrigerator, the refrigerating pipe, the curved pipe, the hose and the dehumidifying box, the heat dissipation device of the integrated circuit board achieves the purpose of good heat dissipation effect, and simultaneously solves the problems that the existing heat dissipation device generally carries out natural heat dissipation through indoor temperature, the heat dissipation effect is poor, and some water vapor generated when the circuit board is scalded cannot be removed.
2. The invention reduces the noise generated by the fan during working through the sound insulation box, ensures the environmental quality around the device, filters and screens dust and impurities in the air through the filter cover, ensures the cleanness of the inner cavity of the shell, is convenient for adding the refrigerating fluid into the refrigerating box through the water inlet pipe, seals the refrigerating box through the pipe cover, and is convenient for discharging the failed refrigerating fluid out of the refrigerating box through the drain pipe and the valve.
3. According to the invention, the dehumidification box is supported by the support plate, the stability of the dehumidification box is increased, the telescopic rod and the spring are supported by the circular plate, and the shock force generated when the device is collided is reduced by the telescopic rod and the spring, so that the circuit board body is protected, the heat in the inner cavity of the shell is discharged by the radiating net, so that the air in the inner cavity of the shell is circulated, the handle is fixedly arranged on the front surface of the box door, the cover plate is convenient to open the shell, the dehumidification box is convenient to open by the box door, and the box door is convenient.
Drawings
FIG. 1 is a schematic view of a heat dissipation device;
FIG. 2 is a perspective view of a heat dissipation device;
FIG. 3 is a partial top view of the circuit board body;
FIG. 4 is a partial top view of a heat sink structure;
FIG. 5 is a partial front view of the moisture removal tank;
fig. 6 is a partially enlarged view of a portion a in fig. 1.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The invention provides a heat dissipation method of an integrated circuit board, which adopts a heat dissipation device to dissipate heat of the integrated circuit board;
referring to fig. 1-6, the heat dissipation device of the integrated circuit board includes a housing 1, a placing plate 2 is disposed in an inner cavity of the housing 1, a clamping plate 3 is fixedly mounted on a top of the placing plate 2, a circuit board body 4 is clamped on an inner side of the clamping plate 3, a horizontal plate 5 is fixedly mounted in the inner cavity of the housing 1 and above the circuit board body 4, a fan 6 is disposed on a right side of the top of the horizontal plate 5, a refrigeration box 7 is fixedly mounted on a left side of the top of the horizontal plate 5, a refrigerator 8 is fixedly mounted on a bottom of the inner cavity of the refrigeration box 7, a refrigeration tube 9 is fixedly mounted in the inner cavity of the refrigeration box 7 and above the refrigerator 8, a curved tube 10 is wound on a surface of the refrigeration tube 9, an exhaust end of the fan 6 penetrates through the refrigeration box 7 and extends to the inner cavity to be communicated with one side of the curved tube 10, a hose 11 is communicated with the other side of the curved tube 10, one, the bottom of the inner cavity of the dehumidifying box 12 is provided with active carbon;
a sound insulation box 13 is fixedly arranged on the right side of the top of the transverse plate 5, the bottom of the fan 6 and the bottom of the inner cavity of the sound insulation box 13 are fixedly arranged, noise generated when the fan 6 works is reduced through the sound insulation box 13, and the surrounding environmental quality of the device is ensured;
a filter cover 14 is fixedly installed on the right side of the shell 1, the air exhaust end of the fan 6 sequentially penetrates through the sound insulation box 13 and the shell 1 and extends to the outside of the shell 1 to be communicated with the left side of the filter cover 14, and dust and impurities in the air are filtered and sieved through the filter cover 14, so that the cleanness of the inner cavity of the shell 1 is ensured;
the water inlet pipe 15 is communicated with the top of the refrigeration box 7 and the right side of the hose 11, the top of the water inlet pipe 15 is in threaded connection with a pipe cover, the bottom of the right side of the back of the refrigeration box 7 is communicated with a water outlet pipe 16, the back of the water outlet pipe 16 penetrates through the shell 1 and extends to the outside to be fixedly provided with a valve, the water inlet pipe 15 is convenient for adding refrigeration liquid into the refrigeration box 7, the refrigeration box 7 is sealed through the pipe cover, and the failed refrigeration liquid is convenient to be discharged out of the refrigeration box 7 through the water outlet pipe 16 and;
the four corners of the bottom of the placing plate 2 are provided with telescopic rods 18, circular plates 19 are fixedly mounted on the upper side and the lower side of each telescopic rod 18, springs 20 are fixedly mounted on the inner sides of the circular plates 19 and the outer sides of the telescopic rods 18, the tops of the circular plates 19 and the bottom of the placing plate 2 are fixedly mounted, the bottoms of the circular plates 19 and the bottom of the inner cavity of the shell 1 are fixedly mounted, the telescopic rods 18 and the springs 20 are supported through the circular plates 19, and the shock force generated when the device collides is reduced through the telescopic rods 18 and the springs 20, so that the circuit board body 4 is protected;
notches are formed in the two sides of the bottom of the shell 1, radiating nets 21 are embedded in the inner sides of the notches, and heat in the inner cavity of the shell 1 is discharged through the radiating nets 21, so that air in the inner cavity of the shell 1 is circulated;
the front surface of the shell 1 is in threaded connection with a cover plate 22, the front surface of the dehumidification box 12 is hinged with a box door, the front surface of the box door is fixedly provided with a handle, the cover plate 22 facilitates opening of the shell 1, the box door facilitates opening of the dehumidification box 12, and the handle facilitates opening of the box door;
the heat dissipation method of the integrated circuit board comprises the following steps: when the air conditioner is used, firstly, the switch of the fan 6, the electric heating box and the fan is turned on through the external controller, the filtered air is conveyed into the curved pipe 10 through the fan 6, the dust impurity in the air can be filtered and retained through the filter cover 14, the fan 6 is prevented from being blocked due to the dust impurity, meanwhile, the dust is prevented from being infected with the circuit board body 4, at the moment, the refrigerating liquid in the inner cavity of the refrigerating box 7 is refrigerated through the refrigerator 8, the refrigerated refrigerating liquid conducts low temperature into the refrigerating pipe 9 and the curved pipe 10, the air in the curved pipe 10 is refrigerated and cooled through the low temperature, the cooled air enters the dehumidifying box 12 along the hose 11, the air absorbs moisture in the air through contact with the active carbon in the dehumidifying box 12, the dehumidified air is discharged from the cavity at the bottom of the dehumidifying box 12 and is contacted with the circuit board body 4, and the heat generated when the circuit board body 4 works is cooled through contact, meanwhile, some moisture on the circuit board body 4 is absorbed by the dry air and is discharged out of the shell 1 along the heat dissipation net 21, so that the whole heat dissipation process of the circuit board body 4 is completed.
According to the invention, through the arrangement of the shell 1, the placing plate 2, the clamping plate 3, the circuit board body 4, the transverse plate 5, the fan 6, the refrigeration box 7, the refrigerator 8, the refrigeration pipe 9, the curved pipe 10, the hose 11 and the dehumidification box 12, the heat dissipation device of the integrated circuit board achieves the purpose of good heat dissipation effect, and simultaneously solves the problems that the existing heat dissipation device generally carries out natural heat dissipation through indoor temperature, the heat dissipation effect is poor, and some water vapor generated when the circuit board is scalded cannot be removed.
The invention can be automatically controlled by a controller, a control circuit of the controller can be realized by simple programming of a person skilled in the art, the controller belongs to the common knowledge in the field, and the file of the application is mainly used for protecting a mechanical device, so the file of the application does not explain a control mode and circuit connection in detail, and the device supplies power by an external power supply.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (3)
1. A heat dissipation method of an integrated circuit board is characterized in that a heat dissipation device is adopted to dissipate heat of the integrated circuit board;
the heat dissipation device comprises a shell, a placing plate is arranged in an inner cavity of the shell, a clamping plate is fixedly mounted at the top of the placing plate, a circuit board body is clamped at the inner side of the clamping plate, a transverse plate is fixedly mounted above the circuit board body in the inner cavity of the shell, a fan is arranged on the right side of the top of the transverse plate, a refrigeration box is fixedly mounted on the left side of the top of the transverse plate, a refrigerator is fixedly mounted at the bottom of the inner cavity of the refrigeration box, a refrigeration pipe is fixedly mounted above the refrigerator in the inner cavity of the refrigeration box, a curved pipe is arranged on the surface of the refrigeration pipe, an exhaust end of the fan penetrates through the refrigeration box and extends to the inner cavity to be communicated with one side of the curved pipe, a hose is communicated with the other side of the curved pipe, one side of the hose, which is far away from the curved pipe, the bottom of the inner cavity of the dehumidification box is provided with active carbon; a sound insulation box is fixedly arranged on the right side of the top of the transverse plate, and the bottom of the fan and the bottom of the inner cavity of the sound insulation box are fixedly arranged; the right side of the shell is fixedly provided with a filter cover, and the air exhaust end of the fan sequentially penetrates through the sound insulation box and the shell and extends to the outside of the shell to be communicated with the left side of the filter cover; a water inlet pipe is communicated with the top of the refrigeration box and positioned on the right side of the hose, a pipe cover is connected with the top of the water inlet pipe in a threaded manner, a drain pipe is communicated with the bottom of the right side of the back of the refrigeration box, and the back of the drain pipe penetrates through the shell and extends to the outside to be fixedly provided with a valve; the four corners of the bottom of the placing plate are respectively provided with a telescopic rod, circular plates are fixedly mounted on the upper side and the lower side of each telescopic rod, springs are fixedly mounted on the inner sides of the circular plates and the outer sides of the telescopic rods, the tops of the circular plates are fixedly mounted with the bottom of the placing plate, and the bottoms of the circular plates are fixedly mounted with the bottom of the inner cavity of the shell; notches are formed in the two sides of the bottom of the shell, and radiating nets are embedded in the inner sides of the notches;
the heat dissipation method comprises the following steps: the switch of the fan, the electric heating box and the fan is turned on, the filtered air is conveyed into the curved tube through the fan, the dust impurity in the air can be filtered and reserved through the filter cover, the fan is prevented from being blocked due to the dust impurity, meanwhile, the dust is prevented from being infected with the circuit board body, the refrigerating fluid in the inner cavity of the refrigerating box is refrigerated through the refrigerator, the refrigerated refrigerating fluid conducts low temperature to the refrigerating tube and the curved tube, the air in the curved tube is refrigerated and cooled through the low temperature, the cooled air enters the dehumidifying box along the hose and is contacted with the active carbon in the dehumidifying box to absorb moisture in the air, the dehumidified air is discharged along the cavity at the bottom of the dehumidifying box and is contacted with the circuit board body, the heat generated when the circuit board body works through the contact is cooled, and meanwhile, some moisture on the circuit board body is absorbed through the dry air, and is discharged out of the shell along the heat dissipation net, thereby completing the heat dissipation process of the whole circuit board body.
2. The method as claimed in claim 1, wherein a cover plate is screwed to the front surface of the housing, a door is hinged to the front surface of the dehumidifying box, and a handle is fixedly mounted to the front surface of the door.
3. The method for dissipating heat of an integrated circuit board according to claim 1, wherein support plates are fixedly mounted on both sides of the bottom of the dehumidifying tank, and outer sides of the support plates are fixedly mounted on the inner wall of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011039229.8A CN112218490A (en) | 2020-09-28 | 2020-09-28 | Heat dissipation method of integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011039229.8A CN112218490A (en) | 2020-09-28 | 2020-09-28 | Heat dissipation method of integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112218490A true CN112218490A (en) | 2021-01-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011039229.8A Pending CN112218490A (en) | 2020-09-28 | 2020-09-28 | Heat dissipation method of integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112218490A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114714781A (en) * | 2022-03-30 | 2022-07-08 | 诸暨市升派包装材料有限公司 | Heat dissipation device for digital printing equipment |
| CN114928936A (en) * | 2022-06-08 | 2022-08-19 | 深圳市鸿光盛业电子有限公司 | Circuit board of anti-electric shock type integrated circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207692262U (en) * | 2017-12-08 | 2018-08-03 | 青海民族大学 | The radiator of integrated circuit |
| CN208609324U (en) * | 2018-07-23 | 2019-03-15 | 国网陕西省电力公司西咸新区供电公司 | A kind of new and effective communication equipment Intelligent heat dissipation device |
| CN209708784U (en) * | 2019-06-27 | 2019-11-29 | 贵州师范大学 | It is a kind of air-cooled quickly except heat transformer outer cover |
| CN211320649U (en) * | 2019-08-27 | 2020-08-21 | 徐辉 | Distribution box for industrial equipment |
-
2020
- 2020-09-28 CN CN202011039229.8A patent/CN112218490A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207692262U (en) * | 2017-12-08 | 2018-08-03 | 青海民族大学 | The radiator of integrated circuit |
| CN208609324U (en) * | 2018-07-23 | 2019-03-15 | 国网陕西省电力公司西咸新区供电公司 | A kind of new and effective communication equipment Intelligent heat dissipation device |
| CN209708784U (en) * | 2019-06-27 | 2019-11-29 | 贵州师范大学 | It is a kind of air-cooled quickly except heat transformer outer cover |
| CN211320649U (en) * | 2019-08-27 | 2020-08-21 | 徐辉 | Distribution box for industrial equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114714781A (en) * | 2022-03-30 | 2022-07-08 | 诸暨市升派包装材料有限公司 | Heat dissipation device for digital printing equipment |
| CN114928936A (en) * | 2022-06-08 | 2022-08-19 | 深圳市鸿光盛业电子有限公司 | Circuit board of anti-electric shock type integrated circuit |
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Application publication date: 20210112 |
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| RJ01 | Rejection of invention patent application after publication |