CN112218219B

CN112218219B - Electret microphone suitable for high-temperature backflow

Info

Publication number: CN112218219B
Application number: CN202011433667.2A
Authority: CN
Inventors: 夏龙海; 丁书星
Original assignee: Shandong Xingang Electronic Technology Co ltd
Current assignee: Shandong Xingang Electronic Technology Co ltd
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2021-02-26
Anticipated expiration: 2040-12-10
Also published as: CN112218219A

Abstract

The invention provides an electret microphone applicable to high-temperature backflow, which comprises a metal protective shell, a PCBA assembly, a metal integrated piece and a vibration diaphragm, and is characterized in that: the utility model discloses a vibration diaphragm, including integrated metal piece, metal supporting part, PCBA subassembly, metal protective housing, metal diaphragm and metal protective housing, integrated metal piece cup joints with the metal protective housing, integrated metal piece annular supporting part and polar plate portion, annular supporting part lower extreme and polar plate portion fixed connection, annular supporting part upper end is connected with PCBA subassembly contact, the metal protective housing includes annular peripheral part and income sound tip, be equipped with the insulating film between annular peripheral part and the annular supporting part, the insulating film pastes tightly with the annular supporting part and is connected, the terminal surface pastes tightly to be connected with the insulating film under the polar plate portion. The electret microphone is aged at high temperature in a backflow mode, so that the state of the internal components of the electret microphone tends to be a more stable state, the service life of the electret microphone is prolonged, and the quality of the electret microphone is guaranteed.

Description

Electret microphone suitable for high-temperature backflow

Technical Field

The invention relates to the field of electret microphones, in particular to an electret microphone suitable for high-temperature backflow.

Background

At present, electret microphones are divided into a diaphragm type and an SMT type, internal accessories of the diaphragm type are made of non-high temperature resistant materials, the connection modes of the diaphragm type electret microphone and an external circuit are mainly divided into two modes, one mode is contact pin type connection, the other mode is lead type connection, the two connection modes are suitable for various types of microphones, the compatibility is strong, manual welding is needed when connection is conducted, and welding time and temperature need to be controlled.

The traditional electret microphone is not suitable for being welded in a reflow soldering mode, the mutual matching of the structures is changed after the welding temperature is increased, so that the sensitivity is changed, the welding process is complex and has high labor intensity, short circuit is easy to occur due to misoperation, and the process is not beneficial to automatic mass production due to the complexity of the process, so that the production efficiency is reduced.

Disclosure of Invention

The invention aims to overcome the defects of the traditional technology and provide the electret microphone with more stable performance by adopting a high-temperature reflux mode.

The aim of the invention is achieved by the following technical measures:

the utility model provides a be suitable for electret microphone of high temperature backward flow, includes metal protective housing, PCBA subassembly and vibration diaphragm, the vibration diaphragm is installed in the metal protective housing, the metal protective housing is connected its characterized in that with the PCBA subassembly: the utility model discloses a metal vibration damping device, including metal protective housing, metal integrated piece, metal supporting part lower extreme and polar plate portion fixed connection, ring supporting part upper end and PCBA subassembly contact are connected, metal protective housing includes annular peripheral part and income sound tip, metal integrated piece surface is attached to have the insulating film, polar plate portion constitutes transaudient vibration cavity with the income sound tip, the vibration diaphragm is settled in transaudient vibration cavity, the mid portion of vibration diaphragm is unsettled setting in transaudient vibration cavity, the vibration diaphragm is connected with the metal protective housing electricity.

As an improvement: the metal protection shell comprises an arc-shaped buckle, and the arc-shaped buckle is fixedly connected with the annular peripheral portion.

As an improvement: the PCBA subassembly covers the copper PCB board including covering, cover the copper PCB board and include that first cover copper face and second cover the copper face, first cover copper face is connected with arc buckle contact, the second covers the copper face and is connected with annular supporting part contact.

As an improvement: the first copper clad surface is provided with an output welding spot, and the second copper clad surface is provided with an FET component and other electrical elements.

As an improvement: at least one sound inlet hole is formed in the sound inlet end portion, and a dust guard is fixedly connected to the end face of the outer side of the sound inlet end portion.

As an improvement: the metal integrated piece comprises a boss ring, the boss ring is fixedly connected to the lower end face of the pole plate portion, and the lower end face of the boss ring is connected with an insulating film in a clinging mode.

As an improvement: and a gasket is arranged on the periphery of at least one end face of the vibration diaphragm and is a conductive gasket or an insulating gasket.

As an improvement: the gasket connected with the upper end face of the vibrating diaphragm is an insulating gasket, and the insulating gasket is an annular high-temperature-resistant insulating gasket.

As an improvement: the gasket connected with the lower end face of the vibrating diaphragm is a conductive gasket.

Due to the adoption of the technical scheme, compared with the prior art, the invention has the advantages that:

compare with traditional electret microphone structure, reduced the part of plastics material, change original plastics material part into metal integrated piece, make electret microphone overall structure can bear better ambient temperature, make product function stable, life extension adopts the ageing electret microphone of backward flow mode high temperature, can make the state of electret microphone internal part tend to more stable state to increase the life and the quality assurance of electret microphone.

The invention is further described with reference to the following figures and detailed description.

Drawings

Fig. 1 is a schematic cross-sectional structure diagram of embodiment 1 of the present invention.

Fig. 2 is a schematic sectional structure view of the metal protective shell in fig. 1.

Fig. 3 is a schematic cross-sectional view of the unitary piece of metal of fig. 1.

Figure 4 is a schematic diagram of the construction of the PCBA assembly of figure 1.

Fig. 5 is a schematic cross-sectional structure diagram of embodiment 2 of the present invention.

In the figure: 1-protective metal shell: 2-PCBA component: 3-metal one piece: 4-vibrating the diaphragm: 5-conductive gasket: 6-insulating spacer: 11-annular peripheral portion: 12-sound entry end: 13-dust guard: 14-arc buckle: 15-sound entrance hole: 31-annular support: 32-pole plate part: 33-boss ring: 34-insulating film: 21-first copper-clad surface: 22-second copper-clad surface: 23-output solder joint: 24-FET components.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1: as shown in fig. 1 to 4, an electret microphone suitable for high-temperature reflow includes a metal protective case 1, a PCBA assembly 2, and a vibrating diaphragm 4, wherein the vibrating diaphragm 4 is installed in the metal protective case 1, the metal protective case 1 is connected with the PCBA assembly 2, a metal integrated piece 3 is sleeved in the metal protective case 1, the metal integrated piece 3 includes an annular support portion 31 and a polar plate portion 32, a lower end of the annular support portion 31 is fixedly connected with the polar plate portion 32, an upper end of the annular support portion 31 is connected with the PCBA assembly 2 in a contact manner, the metal protective case 1 includes an annular peripheral portion 11 and a sound entrance end portion 12, an insulating film 34 is attached to an outer surface of the metal integrated piece 3, the polar plate portion 32 and the sound entrance end portion 12 form a sound transmission vibration cavity, the vibrating diaphragm 4 is disposed in the sound transmission vibration cavity, a middle portion of the vibrating diaphragm 4 is disposed in a suspension manner, the vibrating diaphragm 4 is electrically connected with the metal protective shell 1.

As shown in fig. 2, the protective metal shell 1 includes an arc-shaped buckle 14, and the arc-shaped buckle 14 is fixedly connected to the annular peripheral portion 11. Through the mode of arc buckle 14, on the one hand can reduce assembly process to reduce intensity of labour, reduce or eliminate the error that causes when welded connection is fixed, on the other hand can make metal protective housing 1 can regard as the component part in return circuit, reduces the use of other parts, thereby simplifies overall structure.

As shown in fig. 4, the PCBA assembly includes a copper-clad PCB including a first copper-clad surface 21 and a second copper-clad surface 22, the first copper-clad surface 21 is in contact connection with the arc-shaped buckle 14, and the second copper-clad surface 22 is in contact connection with the annular support portion 31. The first copper-clad surface 21 and the second copper-clad surface 22 can be printed with input and output circuits, the copper-clad PCB is provided with a via hole, and the via hole can effectively connect the first copper-clad surface 21 and the second copper-clad surface 22, so that the input and output circuits on the first copper-clad surface 21 and the second copper-clad surface 22 are connected together.

As shown in fig. 1, the material of the arc clip 14 is the same as that of the annular peripheral portion 11, the arc clip 14 has a certain conductivity, so that the first copper-clad surface 21 can be connected as a component of the input/output circuit, the annular support portion 31 and the annular peripheral portion 11 have an insulating film 34 therebetween, but the annular support portion 31 and the second copper-clad surface 22 are electrically connected to each other, so that the annular support portion 31 can be used as a component of the input/output circuit

As shown in fig. 4, the first copper-clad surface 21 is provided with an output pad 23, and the second copper-clad surface 22 is provided with an FET component and other electrical elements. The output pads 23 can connect the electret microphone as a component of a circuit to other circuits, thereby ensuring better compatibility and universality, and the FET component and other electrical components mounted on the second copper-clad surface 22 can be effectively isolated from the outside, thereby preventing sensitivity reduction due to high temperature, and also effectively preventing the components from being damaged during the mounting process.

As shown in fig. 2, at least one sound inlet hole 15 is opened on the sound inlet end portion 12, and a dust guard 13 is fixedly connected to an outer end face of the sound inlet end portion 12. The dust guard 13 can effectually prevent that external dust from entering into the acoustic vibration cavity through going into sound hole 15, if get into the sensitivity that the dust can influence vibrating diaphragm 4 in the acoustic vibration cavity, and then reduce the sensitivity and the life of electret microphone.

As shown in fig. 3, the metal integrated member 3 includes a boss ring 33, the boss ring 33 is fixedly connected to the lower end surface of the plate portion 32, and the lower end surface of the boss ring 33 is closely connected to an insulating film 34. The boss ring 33 plays a supporting role, so that the polar plate part 32 and the vibrating diaphragm 4 keep a certain distance, and the polar plate part 32 and the vibrating diaphragm 4 form a parallel plate capacitor, and the protruding height of the edge of the boss ring 33 ensures that the middle part of the vibrating diaphragm 4 has enough up-and-down moving space, so that the change of the charge quantity of the formed parallel plate capacitor is caused. The metal integrated part 3 is an integrated stamping part, before stamping, the metal integrated part 3 is firstly attached with the insulating film 34 on the outer surface and then is integrally stamped and formed by a stamping machine.

At least one end surface of the vibrating diaphragm 4 is provided with a gasket at the periphery, and the gasket is a conductive gasket 5 or an insulating gasket 6.

The gasket connected with the lower end face of the vibrating diaphragm 4 is a conductive gasket 5. The conductive pad 5 is connected to the acoustic input end 12 and is effective to pass the signal from the diaphragm 4 to the PCBA assembly 2, thereby making the diaphragm 4 the other end of the parallel plate capacitor and completing the input/output circuit.

Example 2: as shown in fig. 5, the gasket connected to the upper end surface of the vibrating diaphragm 4 is an insulating gasket 6, the lower end surface of the pole plate portion 32 is a smooth plane, the insulating gasket 6 is in contact connection with the lower end surface of the pole plate portion 32, and the insulating gasket 6 is an annular high-temperature-resistant insulating gasket. The high temperature resistance can make insulating gasket 6 can make the performance more stable through the mode of high temperature backward flow, and is strong to external environment's high temperature bearing capacity, compares increase of service life with conventional electret microphone.

Other component structural features are the same as those of embodiment 1.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a be suitable for electret microphone of high temperature backward flow, includes metal protective housing (1), PCBA subassembly (2) and vibrating diaphragm (4), install in metal protective housing (1) vibrating diaphragm (4), metal protective housing (1) is connected its characterized in that with PCBA subassembly (2): the metal protection shell (1) is internally sleeved with a metal integrated piece (3), the metal integrated piece (3) comprises an annular supporting part (31), a polar plate part (32) and a boss ring (33), the lower end of the annular supporting part (31) is fixedly connected with the pole plate part (32), the lug boss ring is fixedly connected with the lower end face of the pole plate part (32), the upper end of the annular supporting part (31) is in contact connection with the PCBA component (2), the metal protective shell (1) comprises an annular peripheral part (11) and a sound inlet end part (12), an insulating film (34) is attached to the outer surface of the metal integrated piece (3), the polar plate part (32) and the sound inlet end part (12) form a sound transmission vibration cavity, the vibrating diaphragm (4) is arranged in the sound transmission vibrating cavity, the middle part of the vibrating diaphragm (4) is arranged in the sound transmission vibrating cavity in a suspended mode, and the vibrating diaphragm (4) is electrically connected with the metal protective shell (1).

2. The electret microphone adapted for high temperature reflow as claimed in claim 1, wherein: the metal protection shell (1) comprises an arc-shaped buckle (14), and the arc-shaped buckle (14) is fixedly connected with the annular peripheral portion (11).

3. The electret microphone adapted for high temperature reflow as claimed in claim 1, wherein: PCBA subassembly covers the copper PCB board including covering, cover the copper PCB board and include that first covering copper face (21) and second cover copper face (22), first covering copper face (21) is connected with arc buckle (14) contact, the second covers copper face (22) and annular supporting part (31) contact connection.

4. The electret microphone adapted for high temperature reflow as claimed in claim 3, wherein: the first copper-clad surface (21) is provided with an output welding spot (23), and the second copper-clad surface (22) is provided with an FET component (24) and other electric elements.

5. The electret microphone adapted for high temperature reflow as claimed in claim 1, wherein: at least one sound inlet hole (15) is formed in the sound inlet end portion (12), and a dust guard (13) is fixedly connected to the end face of the outer side of the sound inlet end portion (12).

6. The electret microphone adapted for high temperature reflow as claimed in claim 1, wherein: at least one end face of the vibrating diaphragm (4) is provided with a gasket at the periphery, and the gasket is a conductive gasket (5) or an insulating gasket (6).

7. The electret microphone adapted for high temperature reflow as claimed in claim 6, wherein: the gasket connected with the upper end face of the vibrating diaphragm (4) is an insulating gasket (6), and the insulating gasket (6) is an annular high-temperature-resistant insulating gasket.

8. The electret microphone adapted for high temperature reflow as claimed in claim 6, wherein: the gasket connected with the lower end face of the vibrating diaphragm (4) is a conductive gasket (5).