CN212413516U

CN212413516U - Electronic components installation soldering tin base plate

Info

Publication number: CN212413516U
Application number: CN202021249497.8U
Authority: CN
Inventors: 徐征
Original assignee: East China Jiaotong University
Current assignee: East China Jiaotong University
Priority date: 2020-07-01
Filing date: 2020-07-01
Publication date: 2021-01-26
Anticipated expiration: 2030-07-01

Abstract

The utility model discloses an electronic component mounting soldering tin substrate in the technical field of electronic component mounting soldering tin substrates, the top of an inner conductor is uniformly and integrally formed with bump electrodes, the top of a conductive substrate is fixedly assembled with a mounting post, the bottom outer edge of the mounting plate is integrally formed with an annular columnar electrode assembled on the mounting post, the periphery of the outer wall of the mounting post is movably assembled with a clamping post, the inner end of the clamping post is fixedly assembled with a supporting spring, the bottom of the outer wall of the annular columnar electrode is fixedly provided with a first magnetic attraction ring, a second magnetic attraction ring matched with the first magnetic attraction ring is fixedly arranged on an insulating flexible substrate, the assembling part of the annular columnar electrode and the insulating flexible substrate is assembled with a soldering tin ring, the mounting modes of various components are increased, and the mounting convenience and mounting stability of the components are improved, prevent that components and parts from taking place to drop, also improve the use reliability of circuit board simultaneously.

Description

Electronic components installation soldering tin base plate

Technical Field

The utility model relates to an electronic components installation soldering tin base plate technical field specifically is an electronic components installation soldering tin base plate.

Background

When an electronic component is mounted on a ceramic substrate, a surface electrode portion of the ceramic substrate is coated with a paste, the electronic component is mounted on the surface electrode portion by a mounting machine, and then the ceramic substrate on which the electronic component is mounted is subjected to reflow soldering, so that the electronic component is bonded and fixed to the ceramic substrate by solder, and both an external terminal electrode and a surface electrode of a board are formed by the sintering process, so that a minute gap remains in the electrode, and there are problems such as solder burrs and the like at the time of solder mounting, and when a conventional electronic component is mounted on the substrate by solder, a portion for mounting and fixing the external terminal electrode is connected only by solder, so that the functional component is likely to fall off when large vibration or vibration occurs in the circuit board, and malfunction of the entire circuit board is affected by the terminal electrode of a small component, because the use reliability of the circuit board is poor due to instable installation of the electronic components, a soldering tin substrate for installing the electronic components is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic components installation soldering tin base plate to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an electronic component mounting tin-soldering substrate comprises a ceramic mounting substrate, wherein an insulating flexible substrate is fixedly assembled at the top of the ceramic mounting substrate, an in-plane conductor is fixedly assembled between the ceramic mounting substrate and the insulating flexible substrate, a bump electrode is uniformly and integrally formed at the top of the in-plane conductor, a conductive substrate arranged on the insulating flexible substrate is fixedly assembled at the top of the bump electrode, a mounting column is fixedly assembled at the top of the conductive substrate, a component is mounted on the mounting column, a mounting plate is fixedly arranged at the bottom of the component, an annular columnar electrode assembled on the mounting column is integrally formed at the outer edge of the bottom of the mounting plate, a conductive joint end is fixedly arranged at the bottom of the annular columnar electrode, a clamping column is movably assembled around the outer wall of the mounting column, and a supporting spring is fixedly assembled at the inner end of, the other end fixed connection of supporting spring is on the erection column, the fixed first magnetism of being provided with in outer wall bottom of annular column electrode is inhaled the ring, the fixed second magnetism that is provided with first magnetism and inhales the ring looks adaptation on the insulating flexible substrate is inhaled the ring, the assembly department of annular column electrode and insulating flexible substrate is equipped with the soldering tin ring.

Preferably, the top of the insulating flexible substrate is uniformly provided with mounting holes corresponding to the components, the conductive substrate is fixedly assembled at the bottom of the mounting holes, and the second magnetic suction ring is fixedly assembled on the side wall of the mounting holes.

Preferably, annular holding tank is seted up at electrically conductive base plate top, and the holding tank setting is in the outside of erection column, and the holding tank is the arc wall with electrically conductive joint end looks adaptation.

Preferably, the periphery of the outer wall of the mounting column is provided with plug holes matched with the clamping columns, and the end parts of the supporting springs are fixedly assembled on the inner walls of the plug holes.

Preferably, the inner wall of the annular columnar electrode is provided with a clamping hole corresponding to the plug hole, the clamping hole corresponds to the plug hole, and the clamping hole is matched with the clamping column.

Preferably, the soldering tin ring is arranged on the outer side of the annular columnar electrode, and the top of the soldering tin ring is flush with the top of the insulating flexible substrate.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model has the advantages of reasonable design, install annular column electrode on the erection column, annular column electrode can extrude the joint post in the process of cup jointing the erection column like this, can impel supporting spring to take place the compression, can impel the joint post to contract in the spliced eye, so when spliced eye and spliced eye correspond, supporting spring can promote the joint post block in the spliced eye, thereby realize the cup joint assembly of annular column electrode and erection column, electrically conductive joint end can contact with the conductive substrate to realize the electricity and connect simultaneously, first magnetism inhale the ring and the second magnetism inhale the ring can take place the actuation, improve the installation steadiness of components and parts, can realize the detachable fixed mounting of components and parts, then practical soldering tin spot welding forms the soldering tin ring between annular column electrode and insulating flexible substrate, can accomplish the non-detachable installation between components and parts and insulating flexible substrate, the mounting mode of multiple components is increased, the installation convenience and the installation steadiness of components are improved, the components are prevented from falling off, and meanwhile, the use reliability of the circuit board is also improved.

Drawings

Fig. 1 is a schematic view of a partial structure of a mounting substrate of the present invention;

fig. 2 is an enlarged schematic view of part a of the present invention.

In the figure: 1. a ceramic mounting substrate; 2. an insulating flexible substrate; 3. an in-plane conductor; 4. a bump electrode; 5. a conductive substrate; 6. mounting a plate; 7. an annular columnar electrode; 8. a conductive joint end; 9. mounting a column; 10. a clamping column; 11. a support spring; 12. a first magnetic ring; 13. a second magnetic ring; 14. a soldering tin ring; 15. and (6) a component.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 and fig. 2, the present invention provides a technical solution: an electronic component mounting tin-soldering substrate comprises a ceramic mounting substrate 1, an insulating flexible substrate 2 is fixedly assembled at the top of the ceramic mounting substrate 1, an in-plane conductor 3 is fixedly assembled between the ceramic mounting substrate 1 and the insulating flexible substrate 2, bump electrodes 4 are uniformly and integrally formed at the tops of the in-plane conductors 3, a conductive substrate 5 arranged on the insulating flexible substrate 2 is fixedly assembled at the tops of the bump electrodes 4, mounting columns 9 are fixedly assembled at the tops of the conductive substrates 5, components 15 are mounted on the mounting columns 9, a mounting plate 6 is fixedly arranged at the bottom of each component 15, annular columnar electrodes 7 assembled on the mounting columns 9 are integrally formed at the outer edges of the bottom of the mounting plate 6, conductive joint ends 8 are fixedly arranged at the bottoms of the annular columnar electrodes 7, clamping columns 10 are movably assembled around the outer walls of the mounting columns 9, and supporting springs 11 are fixedly assembled at the inner, the other end fixed connection of supporting spring 11 is on erection column 9, and the fixed first magnetism of being provided with in outer wall bottom of annular column electrode 7 is inhaled ring 12, and the fixed second magnetism that is provided with first magnetism and inhales ring 12 looks adaptation is inhaled ring 13 on insulating flexible substrate 2, and the assembly department of annular column electrode 7 and insulating flexible substrate 2 is equipped with soldering tin ring 14.

Referring to fig. 2, mounting holes corresponding to the components 15 are uniformly formed in the top of the insulating flexible substrate 2, the conductive substrate 5 is fixedly mounted at the bottom of the mounting holes, and the second magnetic ring 13 is fixedly mounted on the side wall of the mounting holes;

referring to fig. 2, an annular accommodating groove is formed at the top of the conductive substrate 5, the accommodating groove is disposed at the outer side of the mounting post 9, the accommodating groove is an arc-shaped groove matched with the conductive joint end 8, and the conductive joint end 8 can contact with the conductive substrate 5 to realize electrical connection;

referring to fig. 2, insertion holes adapted to the fastening posts 10 are formed around the outer wall of the mounting post 9, and the end of the supporting spring 11 is fixedly mounted on the inner wall of the insertion hole;

when the inserting hole corresponds to the clamping hole, the supporting spring 11 can push the clamping column 10 to be clamped in the clamping hole, so that the annular columnar electrode 7 and the mounting column 9 are sleeved and assembled;

the soldering ring 14 is arranged on the outer side of the annular columnar electrode 7, and the top of the soldering ring 14 is flush with the top of the insulating flexible substrate 2.

The working principle is as follows: when a component 15 is installed, the annular columnar electrode 7 is firstly installed on the installation column 9, so that the outer side wall of the installation column 9 can extrude the clamping column 10 in the process of sleeving the installation column 9 by the annular columnar electrode 7, the supporting spring 11 can be promoted to be compressed, the clamping column 10 can be promoted to be retracted in the inserting hole, and when the inserting hole corresponds to the clamping hole, the supporting spring 11 can push the clamping column 10 to be clamped in the clamping hole, so that the sleeving assembly of the annular columnar electrode 7 and the installation column 9 is realized, meanwhile, the conductive joint end 8 can be contacted with the conductive substrate 5 to realize the electric connection, the first magnetic attraction ring 12 and the second magnetic attraction ring 13 can be attracted, the installation stability of the component 15 is improved, the detachable fixed installation of the component 15 can be realized, and then a soldering tin ring 14 is formed between the annular columnar electrode 7 and the insulating flexible substrate 2 by practical soldering tin spot welding, can accomplish the non-detachable installation between components and parts 15 and insulating flexible substrate 2, increase multiple components and parts 15's mounting means, improve components and parts 15's installation convenience and installation steadiness, prevent that components and parts 15 from taking place to drop, also improve the use reliability of circuit board simultaneously.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An electronic component mounting solder substrate includes a ceramic mounting substrate (1), and is characterized in that: the top of the ceramic mounting substrate (1) is fixedly provided with an insulating flexible substrate (2), an in-plane conductor (3) is fixedly arranged between the ceramic mounting substrate (1) and the insulating flexible substrate (2), a bump electrode (4) is arranged on the top of the in-plane conductor (3) in an even integrated forming mode, a conductive substrate (5) arranged on the insulating flexible substrate (2) is fixedly arranged on the top of the bump electrode (4), a mounting column (9) is fixedly arranged on the top of the conductive substrate (5), a component (15) is arranged on the mounting column (9), a mounting plate (6) is fixedly arranged at the bottom of the component (15), an annular columnar electrode (7) arranged on the mounting column (9) is arranged on the bottom of the mounting plate (6) in an integrated forming mode, and a conductive joint end (8) is fixedly arranged at the bottom of the annular columnar electrode (7), the outer wall of erection column (9) all moves about all around and is equipped with joint post (10), the inner fixed bearing spring (11) that is equipped with of joint post (10), the other end fixed connection of bearing spring (11) is on erection column (9), the outer wall bottom of annular column electrode (7) is fixed and is provided with first magnetism and inhale ring (12), insulating flexible substrate (2) are gone up the fixed second that is provided with and inhales ring (12) looks adaptation and inhale ring (13) with first magnetism, the assembly department of annular column electrode (7) and insulating flexible substrate (2) is equipped with soldering tin ring (14).

2. A solder substrate for mounting an electronic component according to claim 1, wherein: the top of the insulating flexible substrate (2) is uniformly provided with mounting holes corresponding to the components (15), the conductive substrate (5) is fixedly assembled at the bottom of the mounting holes, and the second magnetic suction ring (13) is fixedly assembled on the side wall of the mounting holes.

3. A solder substrate for mounting an electronic component according to claim 1, wherein: annular holding tank has been seted up at electrically conductive base plate (5) top, and the holding tank setting is in the outside of erection column (9), the arc wall of holding tank and electrically conductive joint end (8) looks adaptation.

4. A solder substrate for mounting an electronic component according to claim 1, wherein: the outer wall of the mounting column (9) is provided with inserting holes matched with the clamping columns (10) at the periphery, and the end parts of the supporting springs (11) are fixedly assembled on the inner walls of the inserting holes.

5. A solder substrate for mounting electronic components according to claim 4, wherein: the inner wall of the annular columnar electrode (7) is provided with a clamping hole corresponding to the plug hole, the clamping hole corresponds to the plug hole, and the clamping hole is matched with the clamping column (10).

6. A solder substrate for mounting an electronic component according to claim 1, wherein: the soldering tin ring (14) is arranged on the outer side of the annular columnar electrode (7), and the top of the soldering tin ring (14) is flush with the top of the insulating flexible substrate (2).