CN112216635A - Intelligent storage device for chip wafer - Google Patents
Intelligent storage device for chip wafer Download PDFInfo
- Publication number
- CN112216635A CN112216635A CN202011140581.0A CN202011140581A CN112216635A CN 112216635 A CN112216635 A CN 112216635A CN 202011140581 A CN202011140581 A CN 202011140581A CN 112216635 A CN112216635 A CN 112216635A
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- storage device
- disc
- box
- filter
- fixed mounting
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- 238000003860 storage Methods 0.000 title claims abstract description 45
- 235000012431 wafers Nutrition 0.000 claims abstract description 51
- 238000000746 purification Methods 0.000 claims abstract description 16
- 239000000428 dust Substances 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 230000035939 shock Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000002955 isolation Methods 0.000 abstract description 7
- 230000003749 cleanliness Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000011045 prefiltration Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
Abstract
The invention discloses an intelligent storage device for chip wafers, which comprises a body, wherein a display panel is fixedly arranged at the front end of the body, a manual control knob is movably arranged on one side of the display panel, the rear end of the manual control knob extends into the display panel, a cover is movably arranged at the upper end of the body and is movably connected with the body, two handles are fixedly arranged on the upper side of the cover and are symmetrically arranged on the upper side of the cover, a purification box is fixedly arranged at the left end of the body, an isolation box is arranged at the right side of the body, a sensor box is arranged at one side of the purification box, and a rotating motor is arranged at the other side of the purification box. When the chip wafer piece is stored in the storage device, the sensor in the sensor box monitors the external environment in real time, and controls the corresponding component to be started through the control panel, so that the internal cleanliness is continuously maintained, the storage environment is effectively improved, and the protection of the wafer is increased.
Description
Technical Field
The invention relates to the technical field of wafers, in particular to an intelligent storage device for chip wafers.
Background
A wafer, also called a silicon wafer, is a semiconductor material and is a core component of a chip.
In semiconductor manufacturing, semiconductor wafers are placed in storage devices for storage before or after processing.
When the chip wafer is stored, due to dust particles in the air, these pollutants fall onto the unprocessed wafer and accumulate, which easily causes incomplete etching of the contaminated semiconductor wafer in the subsequent processing process, thereby reducing the production yield of the semiconductor process. Meanwhile, the water vapor in the air can also cause corrosion to the wafer easily, and in the prior art, the storage environment is controlled manually aiming at the problem of wafer storage, so that manpower and energy are wasted.
Disclosure of Invention
The present invention is directed to provide an intelligent storage device for chip wafers, so as to solve the problems in the prior art that when a chip wafer is stored, dust particles in air cannot be effectively isolated, so that the wafer is easily damaged, and moisture cannot be effectively isolated, so that the wafer is easily corroded.
In order to achieve the purpose, the invention provides the following technical scheme: an intelligent storage device for chip wafers comprises a body, a control panel is fixedly installed at the front end of the body, a manual control knob is movably installed at one side of the control panel, the rear end of the manual control knob extends into the control panel, a cover is movably installed at the upper end of the body and is movably connected with the body, two handles are fixedly installed at the upper side of the cover and are symmetrically arranged at the upper side of the cover, wherein a purifying box is fixedly installed at the left end of the body, an air inlet is fixedly arranged at the front end of the purifying box and is uniformly distributed at the front end of the purifying box, a filter plate is movably installed at the upper end of the purifying box, the lower end of the filter plate can extend into the purifying box, a motor is installed at one side of the purifying box, a sensor box is arranged at the other side of the purifying box, and an isolating box is fixedly installed at the right end, a ventilation fan is installed at the right end of the inside of the isolation box, and an isolation baffle plate is installed on the left side of the inside of the isolation box.
Preferably, the sensor box is internally provided with a dust concentration sensor, a temperature sensor and a humidity sensor.
Preferably, the filter includes layer and the dust filter screen absorb water, and the one side that the filter is close to the motor is equipped with the rack, and the motor passes through drive mechanism, for example gear and rack and filter swing joint, and the upper end fixed mounting of filter has the handle, can wholly provide the filter through the handle to change required layer and the dust filter screen absorb water.
Preferably, the lower end of the inside of the body is provided with a lower storage disc, the lower storage disc is uniformly distributed at the lower end of the inside of the body, the upper end of the lower storage disc is fixedly provided with a silica gel ring, the lower end of the lower storage disc is provided with a liquid shock absorber, a lower temperature control plate is arranged between the lower storage discs, and the lower temperature control plate is uniformly distributed between the lower storage discs.
Preferably, the purification box is movably provided with a purification fan at the left end inside, and the right side of the purification fan is provided with a filtering sponge body.
Preferably, the upper end of the inner side of the body is provided with a limiting groove, and the limiting groove is matched with the cover.
Preferably, the lower end of the cover is provided with an upper storage disc, the upper storage disc is uniformly distributed at the lower end of the cover, and an upper temperature control plate is fixedly arranged between the upper storage disc and the upper storage disc.
Preferably, the temperature sensor is coupled with the upper temperature control plate, the lower temperature control plate and the control panel, the humidity sensor is coupled with the purifying fan, the ventilating fan and the control panel, the dust concentration sensor is coupled with the rotating motor and the control panel, and the control panel is used for providing signals for the upper temperature control plate, the lower temperature control plate, the purifying fan and the ventilating fan respectively according to the temperature sensor, the humidity sensor and the dust concentration sensor, and controlling the rotating motor so as to adjust the start and stop of each part of the device according to different external environments, so that the input environment reaches a preset value within a certain range.
Preferably, the preset temperature is 17 to 25 ℃.
Preferably, the preset humidity is 7% to 25%.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the intelligent storage device for the chip wafers, when the chip wafer pieces are stored and the purifying box replaces the internal air, the internal filtering plate can filter the external air, so that the internal cleanliness can be continuously maintained, the storage environment is effectively improved, and the protection of the wafers is increased;
2. according to the intelligent storage device for the chip wafers, the silicon rubber ring is fixedly arranged at the upper end of the lower storage disc, so that the defects that the lower parts of the wafers are scratched and the like can be effectively avoided through the silicon rubber ring when the wafers are stored, and meanwhile, the wafers can be stored more stably due to the soft and strong adsorbability of the silicon rubber ring;
3. this an intelligent storage device for chip wafer through installation clean fan, can blow outside air to inside, can filter the dust impurity in the air through filtering the cavernosum simultaneously, and because filtering the cavernosum and have the characteristic of absorbing water, can adsorb the steam in the air, has avoided steam to get into inside and has caused the damage to the wafer, the effectual condition of depositing that improves the wafer.
4. This an intelligent storage device for chip wafer can be through temperature, humidity, dust concentration sensor to external environment real time monitoring in the sensor case to but full-automatic part or opening of whole parts stop, reduce the manual operation, also avoided the waste of resource simultaneously.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a perspective view of the lower storage disk of the present invention;
FIG. 4 is a schematic cross-sectional view of the cap of the present invention.
In the figure: 1. a body; 2. a control panel; 3. a manual control knob; 4. a cover; 5. a handle; 6. a purification box; 7. an air inlet; 8. a filter plate; 9. a handle; 10. an isolation box; 11. a lower storage disc; 12. a silica gel ring; 13. a liquid damper; 14. a purifying fan; 15. filtering the sponge; 16. a ventilation fan; 17. an isolation barrier plate; 18. a lower temperature control plate; 19. a limiting groove; 20. the disc is stored on the storage rack; 21. an upper temperature control plate; 22. a rotation motor; 23. a sensor box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a storage device for chip wafers comprises a body 1, a control panel 2 is fixedly mounted at the front end of the body 1, a manual control knob 3 is movably mounted at one side of the control panel 2, the rear end of the manual control knob 3 extends into a display panel 2, a cover 4 is movably mounted at the upper end of the body 1, the cover 4 is movably connected with the body 1, two handles 5 are fixedly mounted at the upper side of the cover 4, the two handles 5 are symmetrically arranged at the upper side of the cover 4, wherein a purification box 6 is fixedly mounted at the left end of the body 1, an air inlet 7 is fixedly arranged at the front end of the purification box 6, the air inlet 7 is uniformly distributed at the front end of the purification box 6, a filter plate 8 is movably mounted at the upper end of the purification box 6, the lower end of the filter plate 8 can extend into the purification box 6, a motor 22 is mounted at one side of the purification box, and a sensor box 23 is arranged, the right-hand member fixed mounting of body 1 has shielded box 10, ventilation fan 16 is installed to the inside right-hand member of shielded box 10, keep apart baffler 17 is installed to the inside left side of shielded box 10.
Furthermore, a dust concentration sensor, a temperature sensor and a humidity sensor are arranged in the sensor box.
Further, the filter 8 is including absorbing water layer and dust filter screen, one side that the filter is close to the motor is equipped with the rack, the motor passes through gear and rack and filter swing joint, the upper end fixed mounting of filter 8 has handle 9, can be with the whole proposition of filter through the handle, so that change required layer and the dust filter screen that absorb water, in some embodiments, because the long-time operation of device, the layer and the dust filter screen that absorb water can hardly appear blockking up the condition of damage, accessible handle 9 at this moment offers filter 8 to change layer or the dust filter screen that absorbs water, in some embodiments, also can be according to actual conditions, the above-mentioned layer and the dust filter screen that absorb water of adjustment, in order to improve the filter fineness.
Further, disc 11 is deposited under the inside lower extreme of body 1 is installed, deposit disc 11 at the inside lower extreme evenly distributed of body 1 down, the upper end fixed mounting who deposits disc 11 down has silica gel ring 12, the lower extreme of depositing disc 11 down is installed liquid bumper shock absorber 13, deposits down and installs down temperature control plate 18 between the disc 11, temperature control plate 18 deposit under between disc 11 evenly distributed, through depositing disc 11's upper end fixed mounting under there has silica gel ring 12, avoided when depositing the wafer, can effectually avoid causing harmfulness such as fish tail to the wafer lower part through silica gel ring 12, simultaneously because the soft and stronger adsorptivity of silica gel ring 12 for the wafer can be more steady store.
Further, purifying fan 14 is installed to the inside left end of purifying box 6, purifying fan 14's right side fixed mounting has filtration cavernosum 15, through installation purifying fan 14, can blow outside air to inside, can carry out the prefilter with the dust impurity in the air through filtering cavernosum 15, simultaneously because filtering cavernosum 15 has the characteristic of absorbing water, can adsorb the steam in the air, avoided steam to get into inside and caused the damage to the wafer, the effectual condition of depositing that improves the wafer. And meanwhile, circulation is formed with the isolation box 10, so that the working efficiency is improved.
Further, the inboard upper end of body 1 is provided with spacing groove 19, spacing groove 19 and lid 4 looks adaptation can carry on spacingly with lid 4 and body 1 through installation spacing groove 19, can increase the leakproofness between lid 4 and the body 1 simultaneously.
Further, the lower extreme of lid 4 is installed and is deposited disc 20, on deposit disc 20 at the lower extreme evenly distributed of lid (4), on deposit fixed mounting have last temperature control plate 21 between the disc 20, deposit disc 20 through installing, can agree with disc 11 down and compress tightly the wafer, avoided when depositing the transportation, cause the damage to the wafer, and when depositing ambient temperature change great, go up temperature control plate and above-mentioned lower temperature control plate synchronous, adjust the inside temperature of device, make inside temperature change more balanced, more quick accuracy when the accuse temperature.
Further, a temperature sensor is coupled with the upper temperature control plate 21, the lower temperature control plate 18 and the control panel 2, a humidity sensor is coupled with the purifying fan 14, the ventilating fan 16 and the control panel 2, a dust concentration sensor is coupled with the rotating motor 22 and the control panel, wherein the control panel is used for providing signals for the upper temperature control plate 21, the lower temperature control plate 18, the purifying fan 14, the ventilating fan 16 and the rotating motor 22 respectively according to the temperature sensor, the humidity sensor and the dust concentration sensor, so that the input environment can reach preset values within a certain range by adjusting the starting and stopping of each part of the device according to different external environments.
Furthermore, the temperature is preset between 17 and 25 ℃ and the humidity is preset between 7 and 25 percent according to the optimal storage condition of the wafer.
The working principle is as follows: firstly, manually separating the cover 4 from the body 1, placing the wafer on the upper end of the lower storage disc 11, and tightly closing the cover 4 and the body 1, in some embodiments, when the external environment humidity or the dust concentration is not in a preset range, the humidity sensor or the dust concentration sensor transmits a signal to the control panel 2, the control panel 2 turns on the purifying fan 14, the ventilating fan 16 and the rotating motor 23, and the rotating motor 23 moves the filter plate to a working position. Combine to make the inside air cycle replacement that forms of device through purifying fan 14 and ventilation fan 16, simultaneously because the effect of filtering cavernosum 15 and filter 8, filter the vapor and the dust of outside air for the sustainable maintenance of inside cleanliness factor has shielded box 10 at the right-hand member fixed mounting of body 1 simultaneously, can avoid when taking a breath to inside, causes the pollution to make the wafer cause the damage to inside. In some embodiments, when the external environment temperature is not within the preset range, the temperature sensor transmits a signal to the control panel 2, the control panel 2 opens the upper temperature control plate 21 and the lower temperature control plate 18, and the upper temperature control plate 21 and the lower temperature control plate work simultaneously, so that the internal temperature is more balanced, and the temperature control is more rapid and accurate.
Finally, it should be noted that the above-mentioned contents are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, and that the simple modifications or equivalent substitutions of the technical solutions of the present invention by those of ordinary skill in the art can be made without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The utility model provides an intelligent storage device for chip wafer, this storage device includes body (1), the front end fixed mounting of body (1) has control panel (2) one side movable mounting of control panel (2) has manual control knob (3), the rear end of manual control knob (3) extends to the inside of display panel (2) the upper end movable mounting of body (1) has lid (4), lid (4) are swing joint with body (1) the upside fixed mounting of lid (4) has two handles (5), and these two handles (5) are arranged at the upside of lid (4) symmetrically, its characterized in that: the utility model discloses a purification box, the left end fixed mounting of body (1) has purifying box (6), the front end of purifying box (6) is fixed and is provided with a plurality of air intakes (7), air intake (7) are at the front end evenly distributed of purifying box (6), the upper end movable mounting of purifying box (6) has filter (8), the lower extreme of filter (8) can extend to the inside of purifying box (6), motor (22) that are used for driving the filter plate are equipped with to purifying box one side, and the opposite side is provided with sensor case (23), the right-hand member fixed mounting of body (1) has shielded box (10), ventilation fan (16) are installed to the inside right-hand member of shielded box (10), keep apart baffler (17) are installed in the inside left side of shielded box (10).
2. The intelligent storage device for chip wafers of claim 1, wherein: and a dust concentration sensor, a temperature sensor and a humidity sensor are arranged in the sensor box.
3. The smart storage device for chip wafers of claim 1, wherein: the filter (8) is equipped with the rack including layer and the dust filter screen absorb water, the one side of the nearly motor of filter (8), and the motor passes through gear and rack and filter swing joint, and the upper end fixed mounting of filter (8) has handle (9), can be with the whole proposition of filter through the handle to it needs layer and dust filter screen to absorb water to change.
4. The smart storage device for chip wafers of claim 1, wherein: disc (11) are deposited under installing to the inside lower extreme of body (1), deposit disc (11) at the inside lower extreme evenly distributed of body (1) down, the upper end fixed mounting who deposits disc (11) down has silica gel ring (12), the lower extreme of depositing disc (11) down installs liquid bumper shock absorber (13), deposits down and installs down temperature control plate (18) between disc (11), evenly distributed is deposited under of temperature control plate (18) between disc (11).
5. The smart storage device for chip wafers of claim 1, wherein: purification fan (14) are installed to the inside left end of purifying box (6), the right side fixed mounting of purification fan (14) has filtration cavernosum (15).
6. The smart storage device for chip wafers of claim 1, wherein: the upper end of the inner side of the body (1) is provided with a limiting groove (19), and the limiting groove (19) is matched with the cover (4).
7. The smart storage device for chip wafers of claim 1, wherein: the lower extreme of lid (4) is installed and is deposited disc (20), on deposit disc (20) in the lower extreme evenly distributed of lid (4), on deposit between disc (20) fixed mounting have last temperature control plate (21).
8. The intelligent storage device for chip wafers of claim 1, 2, 4, 5 or 7, wherein: the dust concentration sensor is in coupling connection with the rotating motor (22) and the control panel, wherein the control panel is used for providing signals for the upper temperature control plate (21), the lower temperature control plate (18), the purifying fan (14) and the dust concentration sensor respectively, controlling the rotating motor (22) so as to adjust the starting and stopping of each part of the device according to different external environments, and accordingly the input environment reaches a preset value within a certain range.
9. The intelligent storage device for chip wafers of claim 1, wherein: the preset temperature is 17 to 25 ℃.
10. The intelligent storage device for chip wafers of claim 1, wherein: the preset humidity is 7-25%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140581.0A CN112216635A (en) | 2020-10-22 | 2020-10-22 | Intelligent storage device for chip wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140581.0A CN112216635A (en) | 2020-10-22 | 2020-10-22 | Intelligent storage device for chip wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112216635A true CN112216635A (en) | 2021-01-12 |
Family
ID=74054875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011140581.0A Pending CN112216635A (en) | 2020-10-22 | 2020-10-22 | Intelligent storage device for chip wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN112216635A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0296348A (en) * | 1988-09-30 | 1990-04-09 | Fujitsu Ltd | Wafer housing vessel |
| US6521007B1 (en) * | 1997-12-03 | 2003-02-18 | Ebara Corporation | Clean box |
| JP2005026674A (en) * | 2003-06-13 | 2005-01-27 | Kondo Kogyo Kk | Air cleaning device in semiconductor wafer storing container |
| JP2006005072A (en) * | 2004-06-16 | 2006-01-05 | Ebara Corp | Substrate carrying and keeping container and its using method |
| JP2006035180A (en) * | 2004-07-30 | 2006-02-09 | Kondo Kogyo Kk | Breath filter for semiconductor wafer storage container |
| KR20110110063A (en) * | 2011-04-25 | 2011-10-06 | (주)이노시티 | Apparatus for wafer container |
| KR101962752B1 (en) * | 2018-10-08 | 2019-07-31 | 주식회사 싸이맥스 | Side Storage Of Two-Way Exhaust Structure |
| CN211108688U (en) * | 2019-12-09 | 2020-07-28 | 苏州英尔捷半导体有限公司 | Wafer storage box with drying function |
-
2020
- 2020-10-22 CN CN202011140581.0A patent/CN112216635A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0296348A (en) * | 1988-09-30 | 1990-04-09 | Fujitsu Ltd | Wafer housing vessel |
| US6521007B1 (en) * | 1997-12-03 | 2003-02-18 | Ebara Corporation | Clean box |
| JP2005026674A (en) * | 2003-06-13 | 2005-01-27 | Kondo Kogyo Kk | Air cleaning device in semiconductor wafer storing container |
| JP2006005072A (en) * | 2004-06-16 | 2006-01-05 | Ebara Corp | Substrate carrying and keeping container and its using method |
| JP2006035180A (en) * | 2004-07-30 | 2006-02-09 | Kondo Kogyo Kk | Breath filter for semiconductor wafer storage container |
| KR20110110063A (en) * | 2011-04-25 | 2011-10-06 | (주)이노시티 | Apparatus for wafer container |
| KR101962752B1 (en) * | 2018-10-08 | 2019-07-31 | 주식회사 싸이맥스 | Side Storage Of Two-Way Exhaust Structure |
| CN211108688U (en) * | 2019-12-09 | 2020-07-28 | 苏州英尔捷半导体有限公司 | Wafer storage box with drying function |
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