CN213443764U

CN213443764U - Storage device for chip wafer

Info

Publication number: CN213443764U
Application number: CN202022267770.6U
Authority: CN
Inventors: 常永青
Original assignee: Dongguan Heda Grinding Technology Co ltd
Current assignee: Dongguan Heda Grinding Technology Co ltd
Priority date: 2020-10-13
Filing date: 2020-10-13
Publication date: 2021-06-15
Anticipated expiration: 2030-10-13

Abstract

The utility model discloses a storage device for chip wafer, this storage device include the body the front end fixed mounting of body has display panel the manual control knob is installed with the mode that can move about to one side of display panel, the rear end of manual control knob extends to display panel's inside the lid is installed with the mode that can move about to the upper end of body, lid and body swing joint, the fixed mounting of lid upside has two handles, and these two handles are arranged symmetrically at the upside of lid the left end fixed mounting of body has the purifying box, the front end of purifying box is fixed and is provided with the air intake. When leaving chip wafer spare in storage device, the purifying box is replacing storage device's inside air, can filter outside air through inside filter equipment simultaneously for inside cleanliness factor sustainable keeps, the effectual storage environment that has improved has increased the protection to the wafer.

Description

Storage device for chip wafer

Technical Field

The utility model relates to a wafer technical field specifically is a storage device for chip wafer.

Background

A wafer, also called a silicon wafer, is a semiconductor material and is a core component of a chip.

When current chip wafer is depositing, because the dust granule in the air can't effectually be isolated for the wafer causes the damage easily, and can't effectually isolate moisture, makes the wafer cause the corruption easily.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a storage device for chip wafer to propose current chip wafer when depositing in solving above-mentioned background art, because the dust granule in the air can't effectually be isolated, make the wafer cause the damage easily, and can't effectually be isolated to the moisture, make the wafer cause the problem of corruption easily.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a storage device for chip wafer, this storage device includes the body, the front end fixed mounting of body has display panel, one side movable mounting of display panel has manual control knob, manual control knob's rear end extends to display panel's inside, the upper end movable mounting of body has the lid, lid and body swing joint the upside fixed mounting of lid has two handles, and these two handles are arranged in lid ground side symmetrically, wherein, the front end of purifying box is fixed and is provided with the air intake, the air intake is at the front end evenly distributed of purifying box, the upper end movable mounting of purifying box has the filter, the lower extreme of filter extends to the inside of purifying box.

Preferably, the filter plate comprises a water-absorbing layer.

Preferably, the handle is installed at the upper end of the filter plate, the isolation box is fixedly installed at the right end of the body, the lower end of the interior of the body is movably installed with the lower storage disc, and the lower storage discs are uniformly distributed at the lower end of the interior of the body.

Preferably, the upper end of the lower storage disc is fixedly provided with a silica gel ring, and the lower end of the lower storage disc is movably provided with a liquid shock absorber.

Preferably, the purification box is movably provided with a purification fan at the left end inside, and the right side of the purification fan is provided with a filtering sponge body.

Preferably, the right end of the inside of the isolation box is movably provided with a ventilation fan, and the left side of the inside of the isolation box is provided with an isolation baffle plate.

Preferably, the lower temperature control plates are arranged in the body and located between the lower storage disks, and the lower temperature control plates are uniformly distributed between the lower storage disks.

Preferably, the upper end of the inner side of the body is provided with a limiting groove, and the limiting groove is matched with the cover.

Preferably, the lower end of the cover is provided with an upper storage disc which is uniformly distributed at the lower end of the cover.

Preferably, an upper temperature control plate is fixedly installed between the upper storage disks, and the upper temperature control plate and the lower temperature control plate are fixedly connected with the display panel.

Compared with the prior art, the beneficial effects of the utility model are that:

1. according to the storage device for the chip wafers, when the chip wafer pieces are stored and the purifying box replaces the internal air, the internal filtering plate can filter the external air, so that the internal cleanliness can be continuously maintained, the storage environment is effectively improved, and the protection of the wafers is increased;

2. according to the storage device for the chip wafers, the silicon rubber ring is fixedly arranged at the upper end of the lower storage disc, so that the defects that the lower parts of the wafers are scratched and the like can be effectively avoided through the silicon rubber ring when the wafers are stored, and meanwhile, the wafers can be stored more stably due to the soft and strong adsorbability of the silicon rubber ring;

3. this a storage device for chip wafer through installation clean fan, can blow outside air to inside, can filter the dust impurity in the air through filtering the cavernosum simultaneously, simultaneously because filtering the cavernosum has the characteristic of absorbing water, can adsorb the steam in the air, has avoided steam to get into inside and has caused the damage to the wafer, the effectual condition of depositing that improves the wafer.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic view of the three-dimensional structure of the lower storage disc of the present invention;

fig. 4 is a schematic view of the cross-sectional structure of the cover of the present invention.

In the figure: 1. a body; 2. a display panel; 3. a manual control knob; 4. a cover; 5. a handle; 6. a purification box; 7. an air inlet; 8. a filter plate; 9. a handle; 10. an isolation box; 11. a lower storage disc; 12. a silica gel ring; 13. a liquid damper; 14. a purifying fan; 15. filtering the sponge; 16. a ventilation fan; 17. an isolation barrier plate; 18. a lower temperature control plate; 19. a limiting groove; 20. the disc is stored on the storage rack; 21. and (4) an upper temperature control plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a storage device for chip wafers, comprising a body (1), characterized in that: a display panel (2) is fixedly arranged at the front end of the body (1), a manual control knob (3) is movably arranged at one side of the display panel (2), the rear end of the manual control knob (3) extends to the inside of the display panel (2), a cover (4) is movably arranged at the upper end of the body (1), the cover (4) is movably connected with the body (1), two handles (5) are fixedly arranged on the upper side of the cover (4), the two handles (5) are symmetrically arranged on the upper side of the cover (4), wherein, a purifying box (6) is fixedly arranged at the left end of the body (1), the front end of the purifying box (6) is fixedly provided with an air inlet (7), the air inlet (7) is uniformly distributed at the front end of the purifying box (6), the upper end movable mounting of purifying box (6) has filter (8), the lower extreme of filter (8) extends to the inside of purifying box (6).

Further, filter (8) are including absorbing water the layer, and when depositing chip wafer spare, purifying box 6 can replace inside air, can filter outside air through inside filter 8 simultaneously for the sustainable maintenance of inside cleanliness factor, the effectual storage environment that has improved has increased the protection to the wafer.

Further, the upper end fixed mounting of filter 8 has handle 9, the right-hand member fixed mounting of body 1 has shielded box 10, 1 inside lower extreme movable mounting of body has down deposits disc 11, lower extreme evenly distributed of depositing disc 11 in 1 inside of body, there is shielded box 10 through the right-hand member fixed mounting at body 1, can avoid when taking a breath to inside simultaneously, cause the pollution to make the wafer cause the damage to inside, deposit disc 11 under the installation simultaneously, can carry out the separation support with the wafer in inside, make the wafer can not appear overlapping when storing and cause the damage to the wafer.

Further, the upper end fixed mounting who deposits disc 11 down has silica gel ring 12, and the lower extreme movable mounting who deposits disc 11 down has liquid bumper shock absorber 13, has silica gel ring 12 through the upper end fixed mounting who deposits disc 11 down, has avoided when depositing the wafer, can effectually avoid causing harmfulness such as fish tail to the wafer lower part through silica gel ring 12, simultaneously because the soft and stronger adsorptivity of silica gel ring 12 for the wafer can be more steady store.

Further, 6 inside left end movable mounting of purifying box has purifying fan 14, purifying fan 14's right side fixed mounting has filtration cavernosum 15, through installation purifying fan 14, can blow outside air to inside, can filter the dust impurity in the air through filtering cavernosum 15 simultaneously, simultaneously because filtering cavernosum 15 has the characteristic of absorbing water, can adsorb the steam in the air, avoided steam to get into inside and caused the damage to the wafer, the effectual condition of depositing that improves the wafer.

Further, the inside right-hand member movable mounting of shielded box 10 has ventilation fan 16, isolation barrier 17 is installed in the inside left side of shielded box 10, can be with inside air to outer discharge through installation ventilation fan 16, forms the circulation with clean-up fan 14 for inside air can circulate, has isolation barrier 17 at ventilation fan 16's right side fixed mounting simultaneously, can adsorb the impurity of inside suction, has avoided outside dust to get into inside simultaneously, the effectual inside cleanliness factor of depositing that has improved.

Further, the inside of body 1 is located and deposits under fixed mounting down temperature control plate 18 between the disc 11, and the temperature control plate 18 is depositing evenly distributed under between the disc 11 down, through temperature control plate 18 under the installation, when depositing ambient temperature change great, can adjust the temperature of inside through inside lower temperature control plate 18 for inside is in under comparatively homothermal environment.

Further, the fixed spacing groove 19 that is provided with in inboard upper end of body 1, spacing groove 19 and lid 4 looks adaptation can carry on spacingly with lid 4 and body 1 through installation spacing groove 19, can increase the leakproofness between lid 4 and the body 1 simultaneously.

Further, the lower end of the cover 4 is fixedly provided with an upper storage disc 20, the upper storage disc 20 is uniformly distributed at the lower end of the cover 4, the upper storage disc 20 is installed, and the upper storage disc and the lower storage disc 11 can be matched to compress wafers, so that the wafers are prevented from being damaged during storage and transportation.

Further, on deposit between the disc 20 fixed mounting have last temperature control board 21, go up temperature control board 21 and temperature control board 18 and display panel 2 fixed connection down, through depositing last temperature control board 21 of fixed mounting between the disc 20 at last, when adjusting the temperature to inside, can be synchronous with temperature control board 18 down for inside temperature is more balanced, and is more quick when the accuse temperature.

The working principle is as follows: firstly, manually separating a cover 4 from a body 1, placing a wafer at the upper end of a lower storage disc 11, tightly closing the cover 4 and the body 1, simultaneously, when a chip wafer piece is stored in a purification box 6, replacing the internal air through the purification box 6, simultaneously filtering the external air through an internal filter plate 8 to continuously maintain the internal cleanliness, simultaneously, fixedly installing a separation box 10 at the right end of the body 1, simultaneously avoiding the damage to the wafer caused by the pollution to the inside when the internal air exchange is carried out, simultaneously, separating and supporting the wafer in the internal part by the lower storage disc 11, preventing the wafer from being damaged by superposition when being stored, simultaneously installing a purification fan 14 which can blow the external air to the internal part, and simultaneously filtering dust and impurities in the air through a filtering sponge body 15, simultaneously because filtering cavernosum 15 has the characteristic of absorbing water, can adsorb the steam in the air, ventilation fan 16 can be with the air of inside to discharging outward simultaneously, form the circulation with purifying fan 14, make inside air can circulate, there is isolation barrier plate 17 simultaneously at ventilation fan 16's right side fixed mounting, can adsorb the impurity of inside suction, outside dust has been avoided simultaneously to get into inside, deposit simultaneously last temperature control plate 21 of fixed mounting between disc 20, when adjusting the temperature to inside, can be synchronous with lower temperature control plate 18, make the more balance of inside temperature, and more quick when the accuse temperature.

It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A storage device for chip wafers, comprising a body (1), characterized in that: the utility model discloses a solar energy purification device, including body (1), front end fixed mounting has display panel (2) one side movable mounting of display panel (2) has manual control knob (3), the rear end of manual control knob (3) extends to the inside of display panel (2) upper end movable mounting of body (1) has lid (4), lid (4) and body (1) are swing joint the upside fixed mounting of lid (4) has two handles (5), and these two handles (5) are arranged at the upside of lid (4) symmetrically, wherein, the left end fixed mounting of body (1) has purifying box (6), the front end fixed mounting of purifying box (6) has air intake (7), air intake (7) are in the front end evenly distributed of purifying box (6), the upper end movable mounting of purifying box (6) has filter (8), the lower end of the filter plate (8) can extend to the inside of the purification box (6).

2. A storage device for chip wafers as claimed in claim 1, wherein: the filter plate (8) comprises a water absorbing layer.

3. A storage device for chip wafers as claimed in claim 2, wherein: the upper end fixed mounting of filter (8) has handle (9), the right-hand member fixed mounting of body (1) has shielded box (10), disc (11) are deposited down to the inside lower extreme of body (1) is installed, deposit disc (11) under the inside lower extreme evenly distributed of body (1).

4. A storage device for chip wafers as claimed in claim 3, wherein: the upper end of the lower storage disc (11) is fixedly provided with a silica gel ring (12), and the lower end of the lower storage disc (11) is provided with a liquid shock absorber (13).

5. A storage device for chip wafers as claimed in claim 2, wherein: purification fan (14) are installed to the inside left end of purifying box (6), the right side fixed mounting of purification fan (14) has filtration cavernosum (15).

6. A storage device for chip wafers as claimed in claim 3, wherein: a ventilation fan (16) is installed at the right end inside the isolation box (10), and an isolation barrier plate (17) is installed on the left side inside the isolation box (10).

7. A storage device for chip wafers as claimed in claim 3, wherein: the inner part of the body (1) is positioned between the lower storage disks (11) and is provided with a lower temperature control plate (18), and the lower temperature control plate (18) is uniformly distributed between the lower storage disks (11).

8. A storage device for chip wafers as claimed in claim 1, wherein: the upper end of the inner side of the body (1) is provided with a limiting groove (19), and the limiting groove (19) is matched with the cover (4).

9. A storage device for chip wafers as claimed in claim 1, wherein: the lower end of the cover (4) is provided with an upper storage disc (20), and the upper storage disc (20) is uniformly distributed at the lower end of the cover (4).

10. A storage device for chip wafers as claimed in claim 9, wherein: an upper temperature control plate (21) is fixedly installed between the upper storage disks (20), and the upper temperature control plate (21) and the lower temperature control plate (18) are fixedly connected with the display panel (2).