CN112213528A - Device for testing integrated circuit board - Google Patents
Device for testing integrated circuit board Download PDFInfo
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- CN112213528A CN112213528A CN202011087415.9A CN202011087415A CN112213528A CN 112213528 A CN112213528 A CN 112213528A CN 202011087415 A CN202011087415 A CN 202011087415A CN 112213528 A CN112213528 A CN 112213528A
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- guide rail
- integrated circuit
- circuit board
- testing
- transportation guide
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a device for testing an integrated circuit board, which comprises a testing rack, a transportation guide rail, a driving motor, an integrated circuit board to be tested, a pressure head, a testing machine and a controller, wherein the transportation guide rail is a double-layer transportation guide rail and comprises an upper layer transportation guide rail, a lower layer transportation guide rail and a support frame, the support frame is arranged on two sides of the upper layer transportation guide rail and the lower layer transportation guide rail, the upper layer transportation guide rail and the lower layer transportation guide rail are arranged in a step-shaped parallel mode from top to bottom, the upper layer transportation guide rail comprises an oval rail, a transportation assembly and a cooling assembly, the transportation assembly comprises a plurality of circular shafts, the circular shafts are fixedly and uniformly laid on the rail through bearing seats, and the cooling assembly is fixedly arranged on two sides of the. The testing device is provided with the double-layer conveying guide rail, so that the integrated circuit board can be effectively cooled, and the integrated circuit board is prevented from being rubbed with the testing machine frame to generate static electricity in the testing process to damage the integrated circuit board.
Description
Technical Field
The invention relates to the technical field of integrated circuit testing, in particular to a device for testing an integrated circuit board.
Background
The integrated circuit test runs through the whole process from design verification to finished product test of the integrated circuit, and the failed integrated circuit is removed from the production flow as soon as possible, so that the aim of reducing the production cost is fulfilled.
If the application number is: 201610414779.0 discloses an integrated circuit testing device, which comprises a frame, a guide rail assembly, a carrier plate assembly, a pressure head assembly, a testing seat and a fine positioning mechanism, wherein the guide rail assembly, the testing seat and the pressure head assembly are arranged on the frame, the carrier plate assembly is arranged on the guide rail assembly, the carrier plate assembly comprises a mounting seat, a floating connection mechanism and a floating bearing seat for loading an integrated circuit to be tested, the mounting seat is formed with a frame body, the floating bearing seat can be floatingly arranged in the frame body through the floating connection mechanism, a preset gap is kept between the outer side wall of the floating bearing seat and the inner side wall of the frame body, the pressure head assembly is positioned above the testing seat, and the fine positioning mechanism is used for floating bearing on the floating bearing seat in the process that the pressure head assembly presses the floating bearing seat downwards so as to be used for transversely and/or.
If the application number is as follows: 201511022400.3 discloses an integrated circuit testing device and method, the device includes a transfer board, a testing base, a tester and a PC; the adapter plate is provided with a test area comprising a plurality of test points and a data output structure of the tester; the plurality of test points are respectively provided with a unique identifier which can be identified by the tester; the test base is provided with an insertion hole connected with the integrated circuit pin; the test base is positioned in the test area, and the insertion holes correspond to the test points one by one; the tester is provided with a data input interface which is correspondingly connected with the plurality of test points and is used for testing the electrical parameters of the integrated circuit connected through the test base; the PC is connected with the tester, and an integrated circuit testing method is also provided.
The testing device for the integrated circuit is disclosed in the two Chinese patents, but static electricity can not exist in the testing process, for example, static friction exists when a guide rail assembly transports a carrier plate assembly, and as is well known, the static electricity is a problem which is not a tiny variable for the integrated circuit board, and if the problem cannot be solved properly, the damage of the integrated circuit board is extremely easy to cause, and the repetitive work can be increased for subsequent detection and screening. In addition, during the test of the integrated circuit board, the integrated circuit needs to be heated, various tests are carried out on the integrated circuit board in a high-temperature environment, the same integrated circuit relates to various tests in the manufacturing process, and when the temperature difference between two adjacent tests is large, the integrated circuit needs to be cooled.
Disclosure of Invention
In order to solve the problems that static electricity can be generated to damage an integrated circuit board and the cooling time of the integrated circuit board is too long in the testing process, so that the testing efficiency is influenced in the prior art, the invention provides a device for testing the integrated circuit board.
The specific technical scheme is as follows: the utility model provides a device for testing integrated circuit board, includes test rack, transportation guide rail, driving motor, integrated circuit support plate, pressure head, test machine and controller that awaits measuring, the integrated circuit support plate that awaits measuring sets up on the transportation guide rail, the transportation guide rail links to each other with the test rack, pressure head and test machine all set up in the test rack, driving motor links to each other with the transportation guide rail, driving motor, pressure head and test machine all link to each other with the controller, the transportation guide rail is double-deck transportation guide rail, includes upper transportation guide rail, lower floor's transportation guide rail and support frame, the support frame sets up the both sides at upper transportation guide rail and lower floor's transportation guide rail, upper transportation guide rail and lower floor's transportation guide rail are echelonment parallel arrangement from last.
On this basis, upper strata transportation guide rail includes oval track, transportation subassembly and cooling subassembly, the transportation subassembly includes a plurality of circle axle, the circle axle is fixed evenly to be laid on the track through the bearing frame, cooling subassembly and the corresponding fixed setting of circle axle are in orbital both sides.
On this basis, the circle axle includes first circle axle, connecting piece and second circle axle, first circle axle, connecting piece and second circle axle link to each other in proper order, first circle axle and second circle axle are hollow structure, first circle axle and second circle are epaxial all evenly to be provided with the through-hole.
On the basis, grooves are formed in two sides of the middle of the connecting piece, transverse fixing assemblies and vertical fixing assemblies are arranged in the grooves in two sides of the connecting piece, protruding grooves of the transverse fixing assemblies are parallel to the rail, and protruding grooves of the vertical fixing assemblies are perpendicular to the rail.
On this basis, the horizontal subassembly of the inside recess of connecting piece both sides sets up dorsad, the vertical subassembly parallel arrangement of the inside recess of connecting piece both sides.
On this basis, horizontal fixed subassembly includes clamping, spring and outer permanent magnet, clamping, spring and outer permanent magnet are fixed continuous in proper order, vertical fixed subassembly includes interior permanent magnet and rotatory stick, interior permanent magnet and the fixed swivelling joint of rotatory stick, the magnetism of interior permanent magnet and outer permanent magnet is the same.
On this basis, the conducting rubber piece has been laid to the inside wall of clamping.
On this basis, the cooling assembly includes air jet system and getter device, air jet system and getter device evenly spaced apart the interval setting that corresponds the circle axle.
On the basis, a temperature tester is arranged above the upper-layer transportation guide rail and connected with a controller.
On the basis, an anti-static pad is paved on the lower-layer transportation guide rail and is grounded, the lower-layer transportation guide rail is connected with the test rack, and the vertical distance between the upper-layer transportation guide rail and the lower-layer transportation guide rail is 5 cm-10 cm.
Compared with the prior art, the invention has the beneficial effects that:
1. the integrated circuit testing device comprises an upper layer transportation guide rail, a lower layer transportation guide rail and a support frame, wherein the support frame is arranged on two sides of the upper layer transportation guide rail and the lower layer transportation guide rail, the upper layer transportation guide rail and the lower layer transportation guide rail are arranged in a ladder-shaped parallel mode from top to bottom, the integrated circuit is cooled independently through the arrangement of the upper layer transportation guide rail and the lower layer transportation guide rail, the integrated circuit block and the guide rails can be effectively prevented from generating static electricity due to friction in the transportation process, the integrated circuit board is damaged, the testing efficiency is accelerated, and the effectiveness of the integrated circuit is guaranteed.
2. The transverse fixing assembly comprises a clamp, a spring and an outer permanent magnet, wherein the clamp, the spring and the outer permanent magnet are sequentially and fixedly connected, the vertical fixing assembly comprises an inner permanent magnet and a rotating rod, the inner permanent magnet and the rotating rod are fixedly and rotatably connected, and the magnetism of the inner permanent magnet is the same as that of the outer permanent magnet. The invention utilizes the cooperation of the two permanent magnets to fix the integrated circuit board, has simple structure and easy realization, and in addition, the conductive rubber block is paved on the inner side wall of the clamp, thereby not only eliminating the static on the integrated circuit board, but also not damaging the integrated circuit board.
3. The air injection device and the air suction device are arranged on two sides of the upper-layer transportation guide rail, and when the integrated circuit board is cooled by the transportation assembly, air flow is accelerated around the circular shaft, so that the cooling efficiency of the integrated circuit board is greatly improved.
Drawings
FIG. 1 is a top view of a portion of an upper transport rail in an apparatus for testing integrated circuit boards according to the present invention;
fig. 2 is a schematic structural diagram of a horizontal fixing component and a vertical fixing component in the device for testing the integrated circuit board.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention discloses a device for testing an integrated circuit board, which comprises a testing rack, a transportation guide rail, a driving motor, an integrated circuit board to be tested, a pressure head, a testing machine and a controller, wherein the integrated circuit board to be tested is arranged on the transportation guide rail, the transportation guide rail is connected with the testing rack, the pressure head and the testing machine are both arranged on the testing rack, the driving motor is connected with the transportation guide rail, the driving motor, the pressure head and the testing machine are all connected with the controller, in the testing process, the controller monitors and executes all steps, and preferably, the controller is a single chip controller or a PLC (programmable logic controller). All the components in the invention are arranged in a grounding way. When the previous test is performed in a high-temperature environment, the integrated circuit board needs to be cooled, and then the integrated circuit board is placed on the device for testing. Firstly, an integrated circuit board to be tested is placed on an integrated circuit transportation support plate to be tested, then the integrated circuit transportation support plate is placed on a transportation guide rail, the transportation guide rail is driven by a driving motor, the integrated circuit board to be tested is transported to the position under a pressure head, the pressure head moves downwards at the moment to fix and compress the integrated circuit board to be tested, and after the integrated circuit board to be tested is completely fixed, the testing machine tests the integrated circuit board to be tested.
Preferably, the transportation guide rail is a double-layer transportation guide rail and comprises an upper layer transportation guide rail, a lower layer transportation guide rail and a support frame, wherein the support frame is arranged on two sides of the upper layer transportation guide rail and the lower layer transportation guide rail, and the upper layer transportation guide rail and the lower layer transportation guide rail are arranged in a stepped parallel manner from top to bottom. Further preferably, a temperature tester is arranged above the upper-layer transportation guide rail, preferably, the temperature tester in the invention is an infrared temperature sensor, and the temperature tester is connected with the controller. The upper-layer transport guide rail is used for circularly pre-cooling the integrated circuit boards to be tested, the temperature tester continuously performs temperature detection and data collection on each integrated circuit board to be tested and transmits the temperature detection and data collection to the controller, and when the temperature of the integrated circuit boards to be tested is cooled to a preset temperature, the controller displays that the circuit boards can be taken out for testing in the next step. According to the invention, the integrated circuit is cooled independently by arranging the upper and lower transportation guide rails, and the integrated circuit block and the guide rails can be effectively prevented from generating static electricity by friction in the transportation process to damage the integrated circuit board, so that the test efficiency is accelerated, and the effectiveness of the integrated circuit is ensured. Preferably, the lower-layer conveying guide rail is a conveying belt, an anti-static pad is paved on the conveying belt and grounded, the lower-layer conveying guide rail is connected with the testing rack, and the vertical distance between the upper-layer conveying guide rail and the lower-layer conveying guide rail is 5 cm-10 cm. Integrated circuit board that awaits measuring places and cools off on upper transport guide rail, and carry out temperature test to this integrated circuit board that awaits measuring by the temperature tester of fixed position, when cooling to predetermineeing the temperature, show that this integrated circuit board of department can detect at the controller, integrated circuit that awaits measuring falls to lower floor's transport guide rail from upper transport guide rail directly promptly, further preferentially, vertical distance between upper transport guide rail and the lower floor's transport guide rail is 5cm, because the antistatic backing has been laid to lower floor's transport guide rail top, both can prevent integrated circuit board whereabouts damage, can increase the frictional force between conveyer belt and the integrated circuit board again, reduce static simultaneously.
As shown in fig. 1, the upper transportation guide rail comprises an oval track 1, a transportation assembly and a cooling assembly, the transportation assembly comprises a plurality of circular shafts, the circular shafts are evenly paved on the track 1 through bearing seats, and the cooling assembly is fixedly arranged on two sides of the track 1 corresponding to the circular shafts. The upper transportation guide rail is oval track 1, in limited space, sets transportation track 1 to oval, can increase the integrated circuit board time of awaiting measuring on the guide rail, improves cooling efficiency. Be provided with the transportation subassembly on this track 1, the transportation subassembly is fixed to be set up on track 1, and when track 1 under driving motor's effect, the transportation subassembly is along with track 1 simultaneous movement, preferably, this transportation subassembly is the circle axle, and the both ends of circle axle are fixed on track 1, and the circle axle drives integrated circuit that awaits measuring promptly and carries out circulating reciprocating motion. The circular shaft is fixedly arranged on the track 1 and does not generate relative displacement with the track 1. And this circle axle includes first circle axle 21, connecting piece 22 and second circle axle 23, first circle axle 21, connecting piece 22 and second circle axle 23 link to each other in proper order, first circle axle 21 and second circle axle 23 are hollow structure, all evenly be provided with the through-hole on first circle axle 21 and the second circle axle 23. Connecting piece 22 middle part both sides have been seted up recess 221, connecting piece 22 both sides the inside horizontal fixed subassembly and the vertical fixed subassembly of all being provided with of recess 221, the outstanding recess 221 of horizontal fixed subassembly is parallel with track 1, the outstanding recess 221 of vertical fixed subassembly is perpendicular with track 1. The transverse assemblies in the grooves 221 on the two sides of the connecting piece 22 are arranged in a back-to-back mode, and the vertical assemblies in the grooves 221 on the two sides of the connecting piece 22 are arranged in parallel. The first round shaft 21 and the second round shaft 23 are respectively arranged at two ends of the round shaft, namely one end of the first round shaft 21 and one end of the second round shaft 23 are respectively fixedly arranged above the track 1, and the other ends of the first round shaft 21 and the second round shaft 23 are respectively connected with two ends of the connecting piece 22. The two ends of the round shafts are fixed on the track 1 through screws and nuts, and the interval between the adjacent round shafts on the track 1 can be adjusted in advance according to the width of the integrated circuits to be tested in batches. The integrated circuit to be tested does not directly contact with the upper surface of the circular shaft, but moves after the two ends of the integrated circuit to be tested are clamped and fixed through the cooperation of the transverse assemblies of the two adjacent circular shafts.
As shown in fig. 2, the horizontal fixing assembly of the present invention comprises a clip 2211, a spring 2212 and an outer permanent magnet 2213, wherein the clip 2211, the spring 2212 and the outer permanent magnet 2213 are sequentially and fixedly connected, the vertical fixing assembly comprises an inner permanent magnet 2214 and a rotating rod 2215, the inner permanent magnet 2214 and the rotating rod 2215 are fixedly and rotatably connected, and the magnetism of the inner permanent magnet 2214 and the magnetism of the outer permanent magnet 2213 are the same. The transverse fixing component and the vertical fixing component are at right angle, and the outer permanent magnet 2213 of the transverse component and the inner permanent magnet 2214 of the vertical component are arranged in the groove 221 of the connecting piece 22. The conducting rubber piece has been laid to the inside wall of clip 2211, and this conducting rubber piece not only can prevent that clip 2211 from causing the injury to it when the integrated circuit board that awaits measuring is held to it, can transmit the conducting rubber piece in the clip 2211 with the small amount of static that produces on the integrated circuit board that awaits measuring in addition for transportation track 1, because transportation track 1 all is grounded, consequently can effectively eliminate static. Interior permanent magnet 2214 is rotatory extremely through rotatory stick 2215 in the vertical fixed subassembly, the magnetism of interior permanent magnet 2214 and the outer magnet in the horizontal fixed subassembly is the same, under the effect of the same repulsion force of magnetism, the clip 2211 of the connecting piece 22 of adjacent round axle firmly grasps the both sides of the integrated circuit board that awaits measuring respectively, simultaneously because be provided with spring 2212 between clip 2211 in the horizontal fixed subassembly and outer permanent magnet 2213, consequently adjacent connecting piece 22 can finely tune according to the width of the integrated circuit that awaits measuring, be applicable to the cooling of multiple type integrated circuit board. The invention utilizes the cooperation of the two permanent magnets to fix the integrated circuit board, has simple structure and easy realization, and in addition, the conductive rubber block is paved on the inner side wall of the clamp 2211, thereby not only eliminating the static on the integrated circuit board, but also not damaging the integrated circuit board.
Further preferably, as shown in fig. 1, a cooling assembly is further provided in the present invention, and the cooling assembly includes an air injection device 31 and an air suction device 32, where the air injection device 31 and the air suction device 32 are uniformly spaced apart from each other and are disposed at a distance corresponding to the circular axis. According to the invention, the air injection device 31 and the air suction device 32 are arranged on two sides of the upper-layer transportation guide rail, so that when the transportation assembly cools the integrated circuit board, the air flow around the circular shaft is accelerated, and the cooling efficiency of the integrated circuit board is greatly improved. The air injection device 31 is preferably an air injection pipeline, the air suction device 32 is an air suction pipeline, the air injection pipeline and the air suction pipeline are arranged at intervals on two sides of the track 1, and the interval distance between the air injection pipeline and the air suction pipeline is equal to the interval between the circular shafts. When upper transportation track 1 operates, the cooling subassembly starts to accelerate the cooling to the integrated circuit board that awaits measuring on track 1, the first circle axle 21 and the second circle axle 23 of jet-propelled track 1 alignment circle axle of track 1 both sides promptly jet-propelled, gaseous along with the through-hole effluvium on first circle axle 21 and the second circle axle 23 is cooled down to the integrated circuit board, it is still operating at jet-propelled in-process upper transportation track 1, at this moment, same round axle that follows reaches the pipeline department of breathing in, the pipeline of breathing in is with the gaseous suction in the first circle axle 21 second circle axle 23 through-hole, most heat of integrated circuit board has been taken away to the gas in first circle axle 21 and the second circle axle 23 this moment, through the setting of cooling subassembly, the gaseous flow around the integrated circuit board has been accelerated, the integrated circuit board's that awaits measuring cooling rate has been improved. Further preferably, the gas ejected from the gas ejecting device 31 may be air or other gas capable of accelerating cooling.
Preferably, the tester of the invention comprises a probe card and an arranging assembly, wherein the arranging assembly comprises a first arranging assembly and a second arranging assembly, when the pressure head is arranged above the first assembly, the probe card is arranged above the pressure head, the second arranging assembly is connected with the first arranging assembly, and the first arranging assembly and the second arranging assembly are both connected with the controller. First arrangement subassembly sets up the one end at the transportation guide rail, docks the transmission integrated circuit board that awaits measuring with the transportation guide rail, and integrated circuit board can remove when transporting on the transportation guide rail, and when the integrated circuit board that awaits measuring removes the transportation guide rail end, transfer to first arrangement subassembly on, arrange in order the location by first arrangement subassembly, after removing the integrated circuit board that awaits measuring to preset the position, carry out accurate test to integrated circuit through the probe card, guaranteed the exactness of detection data. First arrangement subassembly can carry out automatic arrangement and location to the integrated circuit board that awaits measuring that the transmission comes on the transportation guide rail, has improved detection efficiency, and intelligent degree is high. Second arrangement subassembly and first arrangement subassembly link to each other for the arrangement is classifyd the integrated circuit board that the test has finished, finishes the integrated circuit board test when the probe card on first arrangement subassembly, reachs the test result after, classifies the arrangement with integrated circuit board through second arrangement subassembly, classifies the classification like: the second arranging component is simple in structure, greatly saves the time for arranging and classifying, and is suitable for detecting the integrated circuit boards in batches.
First arrangement subassembly includes sleeve, arrangement dish, support column and skew device set gradually from last to down, the sleeve suit is in the outside of arrangement dish, support column and skew device for protection arrangement dish, support column and skew device. Wherein the arrangement dish is used for docking with the transportation guide rail, tests the integrated circuit board that awaits measuring promptly on first arrangement subassembly, the support column is used for supporting the arrangement dish to link to each other the arrangement dish with biasing means, make arrangement dish and biasing means simultaneous movement, biasing means is used for carrying out the slope about the arrangement dish, makes the automatic slope towards one side of integrated circuit board, the arrangement of the next step of being convenient for.
Wherein the arrangement dish includes tray and a plurality of location separation blade, the tray is not with the sleeve contact, tray bottom and location separation blade inboard all are provided with pressure sensor, and are a plurality of the location separation blade sets gradually one side at the tray, the width of location separation blade is not less than the diameter of tray, and further preferably, the location separation blade and the tray fixed connection that are closest to tray one side, one side that is used for fixed integrated circuit board that awaits measuring, all the other location separation blades can carry out rotary motion for all the other sides of fixed integrated circuit board that awaits measuring. The positioning baffle plate comprises a horizontal baffle plate and a vertical baffle plate, wherein an included angle between the horizontal baffle plate and the vertical baffle plate is 90 degrees, and the horizontal baffle plate and the vertical baffle plate are integrally formed. The vertical separation blade of location separation blade is used for the fixed integrated circuit board's that awaits measuring border, and horizontal separation blade is used for linking to each other with the support column, and the rotation through the support column drives horizontal separation blade and removes, and then moves different location separation blades to different positions and fix a position.
Wherein, the support column includes cylinder and a plurality of rotating member, cylinder and tray fixed connection, a plurality of recesses have evenly been seted up from last to down to the cylinder whole body, a plurality of the rotating member suit is in the recess of cylinder, and is a plurality of the rotating member is each other contactless, and preferably, this rotating member is the gear, rotating member and horizontal separation blade fixed connection. Further preferably, the support column in the present invention is a hollow structure, and a plurality of independent small-sized driving motors are arranged inside the support column, that is, one driving motor is individually configured for each rotating member, each driving motor is connected to the controller, and each rotating member can be individually controlled to rotate. The integrated circuit test board is suitable for integrated circuit test boards with different sizes by arranging a plurality of groups of rotating pieces and positioning blocking pieces, and has strong practicability and wide application range.
The shifting device comprises a fixed pile, a shifting platform and telescopic rods, wherein the shifting platform is arranged above the fixed pile, the telescopic rods are arranged on two sides of the shifting platform and connected with the fixed pile, preferably, the fixed pile is triangular and hollow, and a driving device, such as a motor and the like, is arranged in the shifting device and connected with the telescopic rods. The skew platform links to each other with the bottom of support column, and the telescopic link of the both sides of skew platform drives the skew platform and inclines about the drive of motor.
The working process of the first arranging assembly is as follows: first arrangement subassembly includes sleeve, arrangement dish, support column and skew device set gradually from last to down, the sleeve suit is in the outside of arrangement dish, support column and skew device. The arrangement disc is in butt joint with the conveying guide rail, the integrated circuit board to be tested moves onto the tray, the pressure sensor at the lower portion of the tray senses pressure, the deviation platform is driven by the motor to incline towards one side of the positioning separation blade, namely, the telescopic rod at one side of the deviation platform is lengthened, when the pressure sensor on the positioning separation blade senses pressure, it is indicated that one side of the integrated circuit board is in contact with the positioning separation blade, the lengthened telescopic rod restores to the original length, and the deviation platform is horizontal. The size of an integrated circuit board to be tested is prestored in a controller, firstly, a rotating piece on a support column is rotated to one side opposite to a fixed positioning separation blade, the distance between the fixed positioning separation blade and the rotating positioning separation blade is equal to the length of the integrated circuit board to be tested, if a pressure sensor on the fixed positioning separation blade senses pressure, the controller judges that the integrated circuit board to be tested is placed in the forward direction, the rotating pieces on the other two sides of the integrated circuit board to be tested sequentially rotate to a preset place, and when the positioning separation blades on the periphery of the integrated circuit board to be tested sense the pressure, a probe card starts to test according to a circuit of the integrated circuit board to be tested when the integrated circuit; if the rotary positioning separation blade does not feel the pressure sensor, the controller judges that the integrated circuit board to be tested is placed transversely, the distance between the positioning separation blade which is rotated to one side opposite to the fixed positioning separation blade and the fixed positioning separation blade is equal to the width of the integrated circuit board to be tested, then the positioning separation blades on the other two sides are sequentially rotated, and when the positioning separation blades on the periphery of the integrated circuit board to be tested all feel pressure, the probe card starts to test according to a circuit when the integrated circuit board to be tested is placed transversely.
The second arrangement assembly comprises a placing portion, a lifting portion and a rotating portion, the lifting portion is arranged above the placing portion, the placing portion is annular, and the rotating portion is arranged below the placing portion. The placing part is used for collecting the integrated circuit boards which are detected completely, the rotating part is used for rotating the placing part, such as chain transmission and the like, so that the integrated circuit boards are placed in different areas of the placing part, and the lifting part is used for lifting the placing part which is collected completely.
The storage rack comprises a storage rack body, a storage rack body and a placement portion, wherein the placement portion comprises a plurality of placement frames, the placement frames are abutted end to end and are sequentially arranged, a storage panel is arranged in the placement frames, an anti-slip sheet is perpendicularly arranged on one side of the storage panel, a bouncing mechanism is arranged below the storage panel, and a weighing sensor is arranged below the storage panel. And at least one tested integrated circuit board is arranged above the access panel. Further preferably, the bouncing mechanism comprises a bouncing plate, a torsion spring, a fixing frame and a bolt strip, the bouncing plate is arranged on the inner side of the lower surface of the access panel, the fixing frame penetrates through the torsion spring and is arranged on the outer side of the bouncing plate, the torsion distance of the torsion spring is preferably 90 degrees, and the fixing frame penetrates through the torsion spring and is used for arranging the torsion spring in a torsion state and fixing the torsion spring through the bolt strip. One end of the bolt strip is fixedly connected with the outermost edge of the access panel, a hole is formed in the springboard, and the other end of the bolt strip presses the fixing frame and the torsion spring and is arranged in the hole of the springboard.
The working process of the second arranging assembly is as follows: after the integrated circuit board on the first arranging component is detected, the shifting device shifts to transfer the integrated circuit board to the access panel on the second arranging component, and the weighing sensor below the placing frame and the bouncing mechanism below the access panel continuously sense the weight on the access panel. Place an at least integrated circuit board on the access panel, when the quality of placing the integrated circuit board on the access panel reached a certain amount, can extrude the springboard, the gib left the springboard this moment, torque spring gyration will access the panel and bounce to it is fixed through the mount, the weighing sensor who places the frame below can not experience weight, it finishes to explain that this place the frame, the rotating part drives the rotation of portion of placing to another region this moment, place until many place the frame and place the completion. Further preferably, the test results can be distinguished by presetting placement frames for placing different integrated circuit boards in the controller.
Example 1:
the device for testing the integrated circuit board comprises a testing rack, a transportation guide rail, a driving motor, an integrated circuit carrier board to be tested, a pressure head, a testing machine and a controller, wherein the integrated circuit carrier board to be tested is arranged on the transportation guide rail, the transportation guide rail is connected with the testing rack, the pressure head and the testing machine are both arranged on the testing rack, the pressure head is arranged above the transportation guide rail, a testing seat is arranged above the pressure head, the driving motor is connected with the transportation guide rail, the driving motor, the pressure head and the testing machine are all connected with the controller, the transportation guide rail is a double-layer transportation guide rail and comprises an upper transportation guide rail, a lower transportation guide rail and a supporting frame, the supporting frame is arranged on two sides of the upper transportation guide rail and the lower transportation guide rail, and the upper transportation guide rail and the lower transportation guide rail are in parallel. The upper transportation guide rail comprises an oval rail, a transportation assembly and a cooling assembly, the transportation assembly comprises a plurality of circular shafts, the circular shafts are uniformly and fixedly paved on the rail through bearing seats, and the cooling assembly is fixedly arranged on two sides of the rail corresponding to the circular shafts. The circle axle includes first circle axle, connecting piece and second circle axle, first circle axle, connecting piece and second circle axle link to each other in proper order, first circle axle and second circle axle are hollow structure, first circle axle and the epaxial through-hole that all evenly is provided with of second circle. The two sides of the middle of the connecting piece are provided with grooves, the two sides of the connecting piece are both provided with a transverse fixing component and a vertical fixing component inside the grooves, the protruding grooves of the transverse fixing components are parallel to the rails, and the protruding grooves of the vertical fixing components are perpendicular to the rails. The transverse assemblies inside the grooves on the two sides of the connecting piece are arranged in a back-to-back mode, and the vertical assemblies inside the grooves on the two sides of the connecting piece are arranged in parallel. Horizontal fixed subassembly includes clamping, spring and outer permanent magnet, clamping, spring and outer permanent magnet are fixed continuous in proper order, vertical fixed subassembly includes interior permanent magnet and rotatory stick, interior permanent magnet and the fixed swivelling joint of rotatory stick, the magnetism of interior permanent magnet and outer permanent magnet is the same. Conductive rubber blocks are laid on the inner side wall of the clamp, a temperature tester is arranged above the upper-layer transportation guide rail, and the temperature tester is connected with the controller.
Example 2:
on the basis of embodiment 1, a device for testing integrated circuit board still adds the cooling subassembly, and this cooling subassembly includes air jet system and getter device, air jet system and getter device evenly spaced apart the interval setting that corresponds the circle axle. The air injection device is preferably an air injection pipeline, the air suction device is an air suction pipeline, the air injection pipeline and the air suction pipeline are arranged on two sides of the track at intervals, and the interval distance between the air injection pipeline and the air suction pipeline is equal to the interval between the circular shafts.
Embodiment 2 is compared with embodiment 1, through increasing cooling assembly, has accelerated the gaseous flow around the integrated circuit board, has improved the cooling rate of integrated circuit that awaits measuring.
While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as described herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An apparatus for testing an integrated circuit board, comprising: the integrated circuit testing device comprises a testing rack, a transportation guide rail, a driving motor, an integrated circuit carrier plate to be tested, a pressure head, a testing machine and a controller, wherein the integrated circuit carrier plate to be tested is arranged on the transportation guide rail, the transportation guide rail is connected with the testing rack, the pressure head and the testing machine are arranged on the testing rack, the driving motor is connected with the transportation guide rail, the driving motor, the pressure head and the testing machine are all connected with the controller, the transportation guide rail is a double-layer transportation guide rail and comprises an upper transportation guide rail, a lower transportation guide rail and a supporting frame, the supporting frame is arranged on two sides of the upper transportation guide rail and the lower transportation guide rail, and the upper transportation guide rail and the lower transportation guide rail are.
2. An apparatus for testing an integrated circuit board according to claim 1, wherein: the upper transportation guide rail comprises an oval track (1), a transportation assembly and a cooling assembly, the transportation assembly comprises a plurality of circular shafts, the circular shafts are evenly paved on the track (1) through fixing of bearing seats, and the cooling assembly is fixedly arranged on two sides of the track (1) corresponding to the circular shafts.
3. An apparatus for testing an integrated circuit board according to claim 2, wherein: the circle axle includes first circle axle (21), connecting piece (22) and second circle axle (23), first circle axle (21), connecting piece (22) and second circle axle (23) link to each other in proper order, first circle axle (21) and second circle axle (23) are hollow structure, all evenly be provided with the through-hole on first circle axle (21) and the second circle axle (23).
4. An apparatus for testing an integrated circuit board according to claim 3, wherein: the novel track is characterized in that grooves (221) are formed in two sides of the middle of the connecting piece (22), transverse fixing assemblies and vertical fixing assemblies are arranged in the grooves (221) in the two sides of the connecting piece (22), the protruding grooves (221) of the transverse fixing assemblies are parallel to the track (1), and the protruding grooves (221) of the vertical fixing assemblies are perpendicular to the track (1).
5. An apparatus for testing an integrated circuit board according to claim 4, wherein: the transverse assemblies inside the grooves (221) on the two sides of the connecting piece (22) are arranged in a back-to-back mode, and the vertical assemblies inside the grooves (221) on the two sides of the connecting piece (22) are arranged in parallel.
6. An apparatus for testing an integrated circuit board according to claim 5, wherein: the horizontal fixed subassembly includes card clamp (2211), spring (2212) and outer permanent magnet (2213), card clamp (2211), spring (2212) and outer permanent magnet (2213) are fixed continuous in proper order, vertical fixed subassembly includes interior permanent magnet (2214) and rotatory stick (2215), interior permanent magnet (2214) and rotatory stick (2215) fixed swivelling joint, interior permanent magnet (2214) and outer permanent magnet (2213) magnetism is the same.
7. An apparatus for testing an integrated circuit board according to claim 6, wherein: and a conductive rubber block is paved on the inner side wall of the clamp (2211).
8. An apparatus for testing an integrated circuit board according to claim 2, wherein: the cooling assembly comprises an air injection device (31) and an air suction device (32), wherein the air injection device (31) and the air suction device (32) are uniformly arranged at intervals corresponding to the distance between the circular shafts.
9. An apparatus for testing an integrated circuit board according to claim 1, wherein: and a temperature tester is arranged above the upper-layer transportation guide rail and is connected with the controller.
10. An apparatus for testing an integrated circuit board according to claim 1, wherein: the upper layer of the lower layer of the transportation guide rail is paved with an anti-static pad which is grounded, the lower layer of the transportation guide rail is connected with the test rack, and the vertical distance between the upper layer of the transportation guide rail and the lower layer of the transportation guide rail is 5 cm-10 cm.
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| CN113804999A (en) * | 2021-09-01 | 2021-12-17 | 苏州瀚川智能科技股份有限公司 | Full-automatic detection device for thermistor |
| CN114137395A (en) * | 2021-12-07 | 2022-03-04 | 华东光电集成器件研究所 | Double-sided assembled hybrid integrated circuit testing device |
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| CN112213528B (en) | 2021-05-14 |
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