CN112212978A - High-temperature field camera based on color camera chip - Google Patents
High-temperature field camera based on color camera chip Download PDFInfo
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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Abstract
The invention discloses a high-temperature field camera based on a color camera chip, which comprises an optical lens, a temperature field camera and a computer with display software; the optical lens is connected with the temperature field camera; the temperature field camera is electrically connected with a computer containing display software; the temperature field camera comprises a band-pass filter, a color camera chip, a circuit and a temperature image processing unit, wherein the band-pass filter is connected with the color camera chip; the optical radiation emitted by the high-temperature target to be detected is focused by the optical lens, the out-of-band noise is filtered by the band-pass filter, the out-of-band noise is imaged on the color camera chip, the color camera chip converts an optical signal into an electric signal according to R, G, B three primary colors, the electric signal is transmitted to the computer after being processed by the circuit and the temperature image processing unit, and the temperature field distribution of the high-temperature target to be detected is given. The test result of the invention is slightly influenced by the conditions of the target to be tested, the surface roughness, the surface chemical characteristics and other factors, and the test of the temperature field distribution of the high-temperature target to be tested can be accurately realized.
Description
Technical Field
The invention belongs to the technical field of temperature testing, and particularly relates to a high-temperature field camera based on a color camera chip.
Background
In the fields of metal smelting, ceramic firing and the like, the temperature of the surface of a product in the production process is efficiently and accurately measured and monitored, and the method is one of important links for ensuring the quality of the product; in the field of engines, particularly aeroengines, in order to ensure the performance stability of the engine and prolong the service life of the engine, the temperature of a vane which runs at high speed needs to be accurately tested; in the field of scientific research, the temperature characteristics of the aerospace plane entering the atmosphere, the temperature characteristics in the process of ultra-high-speed target wind tunnel research, the temperature test and control in the process of new technology, new material research and development and the like can not be separated from the high-temperature field distribution, and the temperature field characteristics of the target to be tested can be accurately reflected in real time.
Temperature field test equipment in the market at present mainly comprises two types, namely a thermal imager based on radiation temperature measurement and temperature indicating paint (temperature sensitive paint). The thermal imagers work in two types, one type works in a far infrared (8-14 μm) wave band, the other type works in a visible red light wave band and a near infrared wave band (0.6-1.1 μm), the thermal imagers of the two types of wave bands both adopt a single wave band, the emissivity of the material is considered to be constant and does not change along with the change of temperature and state, and approximate values are required to be manually input during testing, so that the influence on the testing result is not large under the conditions that the requirements on the emissivity of the material with definite emissivity and the temperature testing precision are not high, but the influence on the testing result is not negligible under the conditions of high temperature, particularly the conditions of solid-liquid state transition, surface roughness change, oxide layer existence and the like.
The temperature indicating paint is a functional paint which is coated on the surface of an object to be measured, the color of the temperature indicating paint changes along with the change of the temperature, and the surface temperature and the distribution of the object are read through the change of the color. The temperature measurement mode belongs to non-invasive type, does not need a test lead wire, cannot damage a test piece, cannot interfere with a target temperature field, can be used for measurement in severe environment, does not damage the structure and the working state of the tested piece, does not influence the starting and heat transfer characteristics of the tested piece, has unique parts for wall surface temperature of a high-speed rotating structure and a complex component and large-area display distribution, and is convenient to use and low in cost. The defects of the method are that the temperature measurement range is narrow, the measured temperature is low, the temperature resolution precision is low, the method is used up and is waste, and the method belongs to an easily-consumed product.
Therefore, how to provide a high temperature field camera based on a color camera chip is a problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of this, the present invention provides a high temperature field camera based on a color camera chip, which is less affected by the state of the target to be tested, the surface roughness, the surface chemical characteristics, and other factors, and can accurately implement the test of the temperature field distribution of the high temperature target to be tested, and accurately reflect the temperature field characteristics of the target to be tested in real time.
In order to achieve the purpose, the invention adopts the following technical scheme:
a high temperature field camera based on a color camera chip, comprising: an optical lens, a temperature field camera and a computer with display software;
wherein the optical lens is in threaded connection with the temperature field camera; the temperature field camera is electrically connected with the computer containing the display software through a data line;
the temperature field camera comprises a band-pass filter, a color camera chip, a circuit and a temperature image processing unit, wherein the band-pass filter is mechanically connected with the color camera chip or is adhered by optical glue;
the optical radiation emitted by the high-temperature target to be detected is focused by the optical lens, out-of-band noise is filtered by the band-pass filter, and is imaged on the color camera chip, the color camera chip converts optical signals of corresponding wave bands into electric signals according to R, G, B three primary colors, the electric signals are amplified by the circuit and the temperature image processing unit, subjected to AD conversion and operation, transmitted to the computer with display software through the data line, and the temperature field distribution of the high-temperature target to be detected is given through the display software.
Preferably, based on the temperature measurement principle of the colorimetric method, the temperature of the target to be measured meets the requirement
In the formula, λR、λG、λBThe center wavelengths of the three primary color separation filters of the camera chip R, G, B respectively; delta lambdaR、ΔλG、ΔλBAre respectively denoted by λR、λG、λBSpectral bandwidth of the center wavelength; t isR-GTarget thermodynamic temperatures characterized by R and G; t isB-GTarget thermodynamic temperatures characterized by B and G; c2Is the Planck second radiation constant; a. theR、AGAnd ABR, G, B conversion coefficients of gray scale and signal intensity of three primary colors respectively, which are constants; h (lambda)R)、H(λG)、H(λB) R, G, B spectrum gray levels corresponding to three primary colors respectively; ε (λ)R,T)、ε(λG,T)、ε(λBAnd T) spectral emittance at the center wavelength in the R, G, B three primary color spectral band, respectively; i (lambda)R)、I(λG)、I(λB) Are each lambdaR、λG、λBAn intensity distribution function as a center wavelength;
in the range of the visible light, the light,
is constant and is provided with
In the formula IR、IG、IBIntensity information corresponding to the three primary color pixels of the camera chip R, G, B;
so that the radiation temperature of the surface of the object to be measured is
Preferably, the optical lens has functions of focal length adjustment and aperture adjustment.
Preferably, the band-pass filter has a bandwidth of 0.4 μm to 0.8. mu.m.
Preferably, the color camera chip is a silicon-based CCD or CMOS color camera chip.
Preferably, the circuit and the temperature image processing unit perform temperature analysis of the corresponding point of the target to be measured by adopting the following steps:
the method comprises the following steps: the central processing unit of the circuit and the temperature image processing unit (230) collects R, G, B three-primary-color pixel intensity information IR、IG、IB；
Step two: interpretation IR、IG、IBNumerical values if IR、IGThe temperature of the corresponding point of the high-temperature target to be measured is far more than 0, and the temperature of the corresponding point of the high-temperature target to be measured is calculated according to the formula (3); if IRIs close to or equal to 0, and IB、IGIf the temperature is greater than 0, calculating the temperature of the corresponding point of the high-temperature target to be measured according to the formula (4); in formula (6) or formula (7), if IGEqual to 0, or IR、IG、IBIf the two terms of the numerical value of (1) are 0, the temperature of the target is lower than the judging threshold value and the temperature cannot be judged, and the lowest judging temperature is displayed;
step three: and transmitting the temperature information of each point analyzed in the second step to the computer (300) containing display software through a data line, and constructing a temperature field of the high-temperature target to be detected through the display software to give temperature field distribution information.
The invention has the beneficial effects that:
the device is slightly influenced by factors such as the state of the target to be tested, the surface roughness, the surface chemical property and the like, can work in environments with low visibility, such as a kiln and a hot rolling furnace, can accurately realize the test of the temperature field distribution of the high-temperature target to be tested, meets the requirements of the kiln, smelting, wind tunnel test and the like, and accurately reflects the temperature field property of the target to be tested in real time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic diagram of the present invention.
FIG. 2 is a block diagram of the present invention.
FIG. 3 is a flowchart of a method for analyzing the temperature of a corresponding point of a target according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a high temperature field camera based on a color camera chip, comprising: an optical lens 100, a temperature field camera 200 and a computer 300 with display software;
wherein, the optical lens 100 is in threaded connection with the temperature field camera 200; the temperature field camera 200 is electrically connected with the computer 300 containing the display software through a data line;
the temperature field camera 200 comprises a band-pass filter 210, a color camera chip 220, a circuit and temperature image processing unit 230, wherein the band-pass filter 210 is mechanically connected with the color camera chip 220 or is adhered by optical glue;
the light radiation emitted by the high-temperature target to be measured is focused by the optical lens 100, the out-of-band noise is filtered by the band-pass filter 210 and imaged on the color camera chip 220, the color camera chip 220 converts the optical signals of the corresponding wave band into electric signals according to R, G, B three primary colors, the electric signals are amplified, AD converted and calculated by the circuit and temperature image processing unit 230, and then the electric signals are transmitted to the computer 300 with display software through a data line, and the temperature field distribution of the high-temperature target to be measured is given through the display software.
Based on the temperature measurement principle of the colorimetric method, the temperature of the target to be measured meets the requirement
In the formula, λR、λG、λBThe center wavelengths of the three primary color separation filters of the camera chip R, G, B, respectively, are given by: m; delta lambdaR、ΔλG、ΔλBAre respectively denoted by λR、λG、λBSpectral bandwidth of the center wavelength; t isR-GTarget thermodynamic temperatures characterized by R and G; t isB-GTarget thermodynamic temperatures characterized by B and G, unit: k; c2Is the planck second radiation constant,
unit: m.K; a. theR、AGAnd ABR, G, B conversion coefficients of gray scale and signal intensity of three primary colors respectively, which are constants; h (lambda)R)、H(λG)、H(λB) R, G, B spectrum gray levels corresponding to three primary colors respectively; ε (λ)R,T)、ε(λG,T)、ε(λBAnd T) spectral emittance at the center wavelength in the R, G, B three primary color spectral band, respectively; i (lambda)R)、I(λG)、I(λB) Are each lambdaR、λG、λBAn intensity distribution function as a center wavelength;
in the range of the visible light, the light,
is constant and is provided with
In the formula IR、IG、IBIntensity information corresponding to the three primary color pixels of the camera chip R, G, B;
so that the radiation temperature of the surface of the object to be measured is
In another embodiment, the optical lens 100 has functions of focal length adjustment and aperture adjustment.
In another embodiment, the band pass filter 210 has a bandwidth of 0.4 μm to 0.8 μm.
In another embodiment, the color camera chip 220 is a silicon-based CCD or CMOS color camera chip.
Referring to fig. 3, the circuit and temperature image processing unit 230 performs temperature analysis of the corresponding point of the target to be measured by the following steps:
the method comprises the following steps: the central processing unit of the circuit and temperature image processing unit 230 collects R, G, B three-primary-color pixel intensity information IR、IG、IB；
Step two:interpretation IR、IG、IBNumerical values if IR、IGThe temperature of the corresponding point of the high-temperature target to be measured is far more than 0, and the temperature of the corresponding point of the high-temperature target to be measured is calculated according to the formula (3); if IRIs close to or equal to 0, and IB、IGIf the temperature is greater than 0, calculating the temperature of the corresponding point of the high-temperature target to be measured according to the formula (4); in formula (6) or formula (7), if IGEqual to 0, or IR、IG、IBIf the two terms of the numerical value of (1) are 0, the temperature of the target is lower than the judging threshold value and the temperature cannot be judged, and the lowest judging temperature is displayed;
step three: and (3) transmitting the temperature information of each point analyzed in the second step to a computer 300 containing display software through a data line, and constructing a temperature field of the high-temperature target to be detected through the display software to give temperature field distribution information.
The invention discloses a high-temperature field camera with self-adaptive emissivity, which can overcome the influence of the solid-liquid state, surface roughness, surface chemical property, emissivity and the like of the surface of a target to be tested on the test of a target temperature field, can accurately realize the test of the temperature field distribution of the high-temperature target to be tested, meets the requirements of kiln, smelting, wind tunnel test and the like, and accurately reflects the temperature field property of the target to be tested in real time.
The invention has the temperature measuring range of 500-5000 ℃, is suitable for the high-temperature field test of various furnaces and kilns such as ceramics, glass and the like, is also suitable for the high-temperature field test of high-temperature wind tunnels, is also suitable for the high-temperature field test of severe environments with low visibility, and has the advantages and characteristics of high sensitivity, large temperature measuring range, long service life, safety and the like.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A high temperature field camera based on a color camera chip, comprising: an optical lens (100), a temperature field camera (200) and a computer (300) with display software;
wherein the optical lens (100) is in threaded connection with the temperature field camera (200); the temperature field camera (200) is electrically connected with the computer (300) containing the display software through a data line;
the temperature field camera (200) comprises a band-pass filter (210), a color camera chip (220), a circuit and a temperature image processing unit (230), wherein the band-pass filter (210) is mechanically connected with the color camera chip (220) or is bonded by optical glue;
the optical radiation that the high temperature target that awaits measuring sent, the warp optical lens (100) focus, the warp band pass filter (210) filtering out the out-of-band noise, image to on the color camera chip (220), the color camera chip (220) is according to R, G, B three primary colors, converts the light signal of corresponding wave band into the signal of telecommunication, the warp circuit and temperature image processing unit (230) enlargies, AD transform, and the operation back, the warp the data line transmits to computer (300) that contain display software, through display software, gives the temperature field distribution of the high temperature target that awaits measuring.
2. The camera as claimed in claim 1, wherein the temperature of the target satisfies the temperature requirement based on the principle of colorimetry
In the formula, λR、λG、λBThe center wavelengths of the three primary color separation filters of the camera chip R, G, B respectively; delta lambdaR、ΔλG、ΔλBAre respectively denoted by λR、λG、λBSpectral bandwidth of the center wavelength; t isR-GTarget thermodynamic temperatures characterized by R and G; t isB-GTarget thermodynamic temperatures characterized by B and G; c2Is the Planck second radiation constant; a. theR、AGAnd ABR, G, B conversion coefficients of gray scale and signal intensity of three primary colors respectively, which are constants; h (lambda)R)、H(λG)、H(λB) R, G, B spectrum gray levels corresponding to three primary colors respectively; ε (λ)R,T)、ε(λG,T)、ε(λBAnd T) spectral emittance at the center wavelength in the R, G, B three primary color spectral band, respectively; i (lambda)R)、I(λG)、I(λB) Are each lambdaR、λG、λBAn intensity distribution function as a center wavelength;
in the range of the visible light, the light,
is constant and is provided with
In the formula IR、IG、IBIntensity information corresponding to the three primary color pixels of the camera chip R, G, B;
so that the radiation temperature of the surface of the object to be measured is
3. The high-temperature field camera based on the color camera chip as claimed in claim 1, wherein the optical lens (100) has functions of focal length adjustment and aperture adjustment.
4. The high temperature field camera based on color camera chip as claimed in claim 1, wherein the band width of the band pass filter (210) is 0.4 μm to 0.8 μm.
5. The color camera chip-based high temperature field camera according to claim 1, wherein the color camera chip (220) is a silicon-based CCD or CMOS color camera chip.
6. The camera as claimed in claim 2, wherein the circuit and temperature image processing unit (230) performs the temperature analysis of the corresponding point of the target by the following steps:
the method comprises the following steps: the central processing unit of the circuit and the temperature image processing unit (230) collects R, G, B three-primary-color pixel intensity information IR、IG、IB；
Step two: interpretation IR、IG、IBNumerical values if IR、IGThe temperature of the corresponding point of the high-temperature target to be measured is far more than 0, and the temperature of the corresponding point of the high-temperature target to be measured is calculated according to the formula (3); if IRIs close to or equal to 0, and IB、IGIf the temperature is greater than 0, calculating the temperature of the corresponding point of the high-temperature target to be measured according to the formula (4); in formula (6) or formula (7), if IGEqual to 0, or IR、IG、IBIf the two terms of the numerical value of (1) are 0, the temperature of the target is lower than the judging threshold value and the temperature cannot be judged, and the lowest judging temperature is displayed;
step three: and transmitting the temperature information of each point analyzed in the second step to the computer (300) containing display software through a data line, and constructing a temperature field of the high-temperature target to be detected through the display software to give temperature field distribution information.
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