CN112210741A

CN112210741A - Preparation method of ceramic layer applied to integrated circuit industry

Info

Publication number: CN112210741A
Application number: CN202010875797.5A
Authority: CN
Inventors: 徐俊阳; 李加
Original assignee: Shenyang Fortune Precision Equipment Co Ltd
Current assignee: Shenyang Fortune Precision Equipment Co Ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2021-01-12

Abstract

The invention relates to a preparation method of a ceramic coating applied to the integrated circuit industry, and the ceramic coating prepared by the technology mainly plays roles of corrosion resistance and ultra-cleanness. The method mainly comprises the following steps: (1) shielding the part of the sample or the part which does not need to be sprayed; (2) pre-treating a sample or a part before spraying; (3) selecting yttrium oxyfluoride powder with the particle diameter of 25-45 mu m; (4) spraying by using an atmospheric plasma spraying technology; (5) removing the shielding protection and cleaning the parts. The thickness of the yttrium oxyfluoride coating obtained by the method is between 150-250 mu m, the porosity of the coating is lower than 2%, the coating is more compact and uniform, the cleanliness is higher, and the service life of parts in the integrated circuit industry is effectively prolonged.

Description

Preparation method of ceramic layer applied to integrated circuit industry

Technical Field

The invention relates to the technical field of ceramic layers, in particular to a preparation method of a ceramic layer applied to the integrated circuit industry.

Background

At present, with the rapid development and the general application of the integrated circuit industry, the research on semiconductor devices tends to be 14nm or less, and thus, the requirements on the parts of the devices are higher and higher, the traditional method is to prepare an anode film on the surface of an aluminum alloy part by an anodic oxidation method for corrosion resistance, and then prepare an aluminum oxide coating on the surface of the part by a thermal spraying method, and in recent years, the yttrium oxide coating is prepared on the surface of the part by the thermal spraying method because the corrosion resistance of yttrium oxide is higher than that of aluminum oxide. With the continuous improvement of equipment, the corrosion resistance of the yttria coating can not meet the requirement, so that a more corrosion-resistant coating needs to be developed. Meanwhile, the continuous progress of equipment has high requirement on the cleanliness of parts, so that the coating needs to be more corrosion-resistant and have higher cleanliness.

Disclosure of Invention

The invention aims to use a preparation method of a ceramic coating applied to the integrated circuit industry to spray a yttrium oxyfluoride coating by using an atmospheric plasma spraying technology, and can meet the requirements of advanced semiconductor equipment on corrosion resistance and high cleanliness of parts.

In order to achieve the purpose, the invention adopts the technical scheme that:

a preparation method of a ceramic coating applied to the integrated circuit industry comprises the following steps: (1) before spraying, shielding and protecting the sample or the part, wherein the shielding and protecting method comprises but is not limited to soft shielding and hard shielding;

(2) pre-treating a sample or a part before spraying, wherein the main purpose is to obtain certain surface roughness, and the adopted method can be sand blasting or laser texture;

(3) selecting yttrium oxyfluoride powder with the particle diameter ranging from 25 to 45 mu m;

(4) spraying by adopting an atmospheric plasma spraying technology;

(5) and (4) carrying out shielding removal on the sprayed part, and then cleaning.

In the step (1), the sample or the part is shielded and protected, and the shielding method mainly adopts an adhesive tape or a tool for shielding.

In the step (2), the sample or the part needs to be pretreated before spraying, and the treatment mode can be sand blasting, machining texture treatment or laser texture treatment, and the purpose is to increase the bonding force of the coating and obtain the surface roughness of the target coating.

In the step (4), an atmospheric plasma spraying technology is adopted, and the spraying parameters are that the current is 200-; the spraying distance is 150-175 mm; the argon flow used was 180-; the hydrogen flow rate used is 40-60 lpm; the thickness of the prepared coating was 150-250 microns. The coating is applied to the integrated circuit industry and has the functions of high corrosion resistance and high cleanliness.

The invention has the advantages that:

1) the yttrium oxyfluoride coating is prepared by adopting atmospheric plasma spraying, and the corrosion resistance of the coating is stronger;

2) the yttrium oxyfluoride coating is prepared by adopting atmospheric plasma spraying, the cleanliness of the coating is higher, and the requirement of advanced semiconductor equipment on cleanliness can be met.

Drawings

FIG. 1 is an SEM photograph of a cross-section of a 500 Xcoated yttrium oxyfluoride coating of this example.

FIG. 2 is a SEM photograph of the surface topography of a 3000 times magnified coating of yttrium oxyfluoride of this example.

FIG. 3 is an SEM photograph of a cross-section of a 500 magnified yttrium oxyfluoride coating of this example two.

FIG. 4 is a SEM image of the surface topography of the yttria coating of this example at 1000 Xmagnification.

Detailed Description

The invention will now be described in detail with reference to the accompanying figures 1-4 and examples.

Example one

Firstly, the parts where spraying is not needed are shielded and protected by special spraying adhesive tapes. Commercial high-purity yttrium oxyfluoride powder is adopted, the purity of the powder is more than or equal to 99.9 percent, and the diameter of the powder is about 30 mu m.

The masked part was then blasted with alumina as the abrasive material, and the surface roughness of the part after blasting was about Ra 6.4 μm. Then spraying the yttrium oxyfluoride coating by adopting an atmosphere plasma spraying technology, wherein the set spraying current is 200A, and the spraying distance is 150 mm; the argon flow used was 180 lpm; the hydrogen flow rate used was 60 lpm; the thickness of the prepared coating is about 200 microns. The coating was analyzed and had a surface roughness of about Ra 6.4 μm, and as can be seen from fig. 2, the surface of the coating was relatively smooth, the powder particles melted well, and all were flat and were not unmelted particles. As can be seen from FIG. 1, the coating has less porosity, and the porosity is about 1% by software test.

Finally, the shielding protection is removed, and then the parts are cleaned. Because of the higher corrosion resistance of the yttria fluoride coating, the coating itself produces fewer contaminating particles, and thus higher cleanliness can be maintained.

Example two

Firstly, for the parts of volume production, can design special shielding frock, shield the part with hard shielding, can improve production efficiency on the one hand, reach the purpose of shielding again on the other hand. Commercial yttrium oxyfluoride powder is adopted, the purity of the powder is more than or equal to 99.9 percent, and the particle diameter of the powder is about 25 mu m.

Then, the shielded part is subjected to laser processing, laser parameters are set, and texture carving is carried out on the surface of the part by using laser, so that the cost of sand materials is saved, and the precision of the surface roughness of the part is ensured. The surface roughness of the part after texturing with laser was Ra 5 μm. Spraying the yttrium oxyfluoride coating by adopting an atmospheric plasma spraying technology, and setting the spraying current to be 210A; the spraying distance is 170 mm; the argon flow used was 190 lpm; the hydrogen flow rate used was 45 lpm; the thickness of the prepared coating was 150 μm. Analysis of the coating revealed from figure 3 that the coating had slightly more porosity than figure 1, which was measured to be around 1.8%. As can be seen from fig. 4, the particles on the surface of the coating layer are distributed uniformly and flatly, and the surface roughness of the obtained coating layer is about 5.5 μm.

And finally, removing the shielding protection, and cleaning the parts to obtain parts with higher cleanliness.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and combinations are possible for those skilled in the art. The invention is mainly used for parts which have requirements on corrosion resistance in the field of integrated circuits, including but not limited to aluminum parts, and can also be ceramic parts. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A preparation method of a ceramic coating applied to the integrated circuit industry is characterized by comprising the following steps:

(1) before spraying, shielding and protecting the sample or the part, wherein the shielding and protecting method comprises but is not limited to soft shielding and hard shielding;

(2) pre-treating a sample or a part before spraying to obtain certain surface roughness by adopting a sand blasting or laser texture method;

(4) spraying parts by adopting an atmosphere plasma spraying technology;

2. The method for preparing a ceramic coating applied to the integrated circuit industry as claimed in claim 1, wherein in the step (1), the sample or the part is shielded and protected, and the shielding is performed by using an adhesive tape or a tool.

3. The method according to claim 1, wherein in step (2), the sample or the part is pre-treated before spraying, and the treatment may be sand blasting, machining texturing, or laser texturing, so as to increase the bonding force of the coating and obtain the surface roughness of the target coating.

4. The method for preparing a ceramic coating applied to the integrated circuit industry as claimed in claim 1, wherein in the step (3), the particle diameter is selected to be in the range of 25-45 μm, if the powder is too small, the residence time in the flame flow center is too short, the heating is not uniform, and the coating quality is poor; if the powder is too large, the coating quality may be poor when the powder is sprayed in a part under the flame flow or even deviated from the flame flow.

5. The method as claimed in claim 1, wherein in the step (4), an atmospheric plasma spraying technique is adopted, and the spraying parameters are that the current is 200-220A; the spraying distance is 150-175 mm; the argon flow used was 180-; the hydrogen flow rate used is 40-60 lpm; the thickness of the prepared coating is 150-250 microns, and the coating is applied to the integrated circuit industry and plays a role in corrosion resistance and ultra-cleanness.

6. The method of claim 1, wherein the ceramic layer of yttrium oxyfluoride is used to prepare a ceramic layer more resistant to etching by fluoride ions; meanwhile, the corrosion resistance is high, particle impurities are not easy to generate, the cleanliness is higher, and the method is suitable for being applied to the integrated circuit industry.