CN112210307B - Conductive foam and manufacturing method thereof - Google Patents
Conductive foam and manufacturing method thereof Download PDFInfo
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- CN112210307B CN112210307B CN202011093600.9A CN202011093600A CN112210307B CN 112210307 B CN112210307 B CN 112210307B CN 202011093600 A CN202011093600 A CN 202011093600A CN 112210307 B CN112210307 B CN 112210307B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a conductive foam and a manufacturing method thereof, wherein the conductive foam comprises release paper, a plurality of conductive foam bodies which are uniformly distributed and arranged on the release paper, and a plastic frame, the plastic frame comprises a plurality of plastic grids, two adjacent plastic grids are connected through ribs, the size of each plastic grid is matched with that of the conductive foam body, and each conductive foam body is arranged in one plastic grid. The conductive foam provided by the invention is provided with the conductive plastic frame outside the conductive foam body, so that the conductivity can be improved, and the strength of the conductive foam can be improved by the plastic frame, so that the foam is prevented from deforming or sliding off during transfer, and the transfer efficiency of the conductive foam is improved. The manufacturing method of the conductive foam is simple and easy to operate.
Description
Technical Field
The invention relates to the field of foam, in particular to conductive foam and a manufacturing method thereof.
Background
At present, the conductive foam is widely applied to various electronic communication devices, and the specifications of the conductive foam are also diversified according to different applied electronic devices, and when the ultrathin and ultra-small special-shaped conductive foam inside a miniature electronic device, such as a mobile phone, is attached, a piece of processed special-shaped conductive foam is usually attached to centrifugal paper, and then manually attached to a corresponding electronic element by tweezers. Because the foam is small and soft, when the foam is turned and pasted again when being pinched by the tweezers, the foam can be deformed (such as warping) due to the larger clamping force of the tweezers, so that the foam can not be accurately placed at the placed position, or the foam can slide down due to the smaller clamping force when the foam is turned and pasted, thereby causing unnecessary waste of products. In summary, the above phenomena can lead to inefficient transfer.
Disclosure of Invention
The invention aims to provide conductive foam and a manufacturing method thereof, so as to overcome the defects of the prior art.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the embodiment of the invention discloses a conductive foam, which comprises release paper, a plurality of uniformly distributed conductive foam bodies and a plurality of corresponding plastic grids, wherein the size of each plastic grid is matched with that of the conductive foam body, and each conductive foam body is arranged in one plastic grid.
As one of the preferable schemes of the invention, the conductive foam body comprises a conductive glue layer and a foam layer which are arranged on the release paper.
In a preferred embodiment of the present invention, the conductive glue layer contains conductive particles, and the conductive particles are any one or a combination of two or more of gold particles, graphite particles, and nickel particles.
As one preferable scheme of the invention, the outer wall of the plastic square grid is provided with a texture structure.
As one preferable embodiment of the invention, the plastic grid is a conductive plastic grid.
The embodiment of the invention also discloses a manufacturing method of the conductive foam, which comprises the following steps:
step 1), providing release paper with a set size, and arranging a layer of conductive glue on the release paper in a blade coating or spraying manner so as to form a conductive glue layer substrate on the release paper;
step 2), arranging a layer of foam layer base material with the same size as the release paper on the conductive glue layer;
step 3), placing a combination formed by the release paper, the conductive glue layer substrate and the foam layer substrate on a bearing platform, and adsorbing the combination formed by the release paper, the conductive glue layer substrate and the foam layer substrate on the bearing platform;
step 4), utilizing a cutting silk to cut longitudinally and transversely so as to divide the foam layer base material and the conductive glue layer base material into N transverse units and M longitudinal units, wherein N is more than 2, and M is more than 2;
removing a plurality of units in the N transverse units and a plurality of units in the M longitudinal units, so that a plurality of uniformly distributed small blocks of foam layer base materials and conductive glue layer base materials are formed on the rest foam layer base materials and conductive glue layer base materials, and the small blocks of the foam layer base materials and the conductive glue layer base materials are the conductive foam body; step 6) providing a plastic frame, wherein the plastic frame comprises a plurality of plastic grids, the size of each plastic grid is matched with that of the conductive foam body, two adjacent plastic grids are connected through ribs, the plastic frame is placed on the conductive foam body and attached to release paper, and each conductive foam body is accommodated in one plastic grid;
and 7) cutting off ribs between two adjacent plastic grids by using the cutting silk threads, and removing the cut ribs.
As one of the preferable schemes of the invention, the following steps are further included between the steps 6) and 7): and extruding and injecting glue among the plastic grids, the foam layer base material and the conductive glue layer base material small blocks for bonding.
As one of preferable schemes of the present invention, in the step 3), a positioning fixture is adopted to place a combination formed by the release paper, the conductive glue layer substrate and the foam layer substrate at a set position on the bearing platform, the positioning fixture includes two L-shaped positioning blocks, the two L-shaped positioning blocks are spliced to form a square positioning groove, the inner size of the positioning groove matches with the shape of the combination formed by the release paper, the conductive glue layer substrate and the foam layer substrate, a positioning column matched with the positioning hole on the L-shaped positioning block is arranged on the bearing platform, the positioning column is located at the set position, an air suction hole is arranged on the bearing platform, and the air suction hole is connected with a vacuum generation device.
Further preferably, the step 3) specifically includes: the positioning jig is placed at a setting position on the bearing platform through the matching of the positioning column and the positioning hole; then, a combined body formed by the release paper, the conductive glue layer substrate and the foam layer substrate is placed in the positioning groove of the positioning jig; then, enabling a combination body formed by the release paper, the conductive glue layer substrate and the foam layer substrate to be adsorbed on the bearing platform; and finally, removing the positioning jig.
Further preferably, the suction holes on the carrying platform are divided into a plurality of groups, and when a plurality of units in the N transverse units and a plurality of units in the M longitudinal units need to be torn off, the suction holes in the group of suction holes under the unit to be removed stop sucking.
Further preferably, the ribs positioned at four corners of the plastic frame are provided with positioning holes, the bearing platform is correspondingly provided with liftable positioning needles matched with the positioning holes, the liftable positioning needles are connected with a lifting cylinder positioned below the bearing platform, the liftable positioning needles are lifted when the plastic frame is placed, and when the sheared ribs are removed, the liftable positioning needles are lowered, and the blowing device blows the ribs away.
Compared with the prior art, the invention has the advantages that:
1) the conductive foam provided by the invention is provided with the conductive plastic frame outside the conductive foam body, so that the conductive performance can be improved, and the strength of the conductive foam can be improved by the plastic frame, so that the foam is prevented from deforming or sliding off during transfer, and the transfer efficiency of the conductive foam is improved.
2) The manufacturing method of the conductive foam is simple and easy to operate.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a front view of an electrically and thermally conductive foam tape according to a preferred embodiment of the present invention;
FIG. 2 is a top view of an electrically and thermally conductive foam tape according to a preferred embodiment of the present invention;
FIG. 3 is a schematic view illustrating a positioning state of a substrate and a release paper according to a preferred embodiment of the present invention;
FIG. 4 is a schematic view of a substrate being cut according to a preferred embodiment of the present invention;
FIG. 5 is a schematic view of a substrate with several units removed according to a preferred embodiment of the present invention;
fig. 6 is a schematic view illustrating a state that plastic squares are mounted on a conductive foam body according to a preferred embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-2, a preferred embodiment of the present invention discloses a conductive foam, which includes a release paper 1, and a plurality of conductive foam bodies 2 uniformly distributed on the release paper 1 (the sizes of the bodies 2 are matched, each conductive foam body 2 is disposed in a plastic grid 3. the plastic grid 3 is disposed outside the conductive foam body 2, which is equivalent to a protective wall disposed outside the conductive foam body 2, so as to increase the strength of the conductive foam body 2, prevent the conductive foam body 2 from deforming when being clamped, and prevent the conductive foam body 2 from slipping off when being clamped due to deformation.
The conductive foam body 2 comprises a conductive glue layer 21 and a foam layer 22 which are arranged on the release paper 1. The conductive glue layer 21 contains conductive particles, and the conductive particles are any one or a combination of more than two of gold particles, graphite particles, nickel particles and conductive ceramic particles. Be provided with texture on the outer wall of plastics square 3, can increase the roughness of 3 outer walls of plastics square to further make when the cotton body of centre gripping electrically conductive bubble 2, be difficult for making its landing. The outer wall of the plastic grid 3 is provided with a texture structure, and the texture structure can be formed by injection molding through an injection mold.
Referring to fig. 3-5, the embodiment of the invention also discloses a manufacturing method of the conductive foam, which comprises the following steps:
step 1): providing release paper 1 with a set size, and arranging a layer of conductive glue on the release paper 1 in a blade coating or spraying manner, so as to form a conductive glue layer substrate on the release paper 1;
step 2): arranging a foam layer with the same size as the release paper 1 on the conductive glue layer;
step 3): placing a combination formed by the release paper 1, the conductive glue layer substrate and the foam layer substrate on a bearing platform, and enabling the combination formed by the release paper 1, the conductive glue layer substrate and the foam layer substrate to be adsorbed on the bearing platform;
step 4): as shown in fig. 4, cutting the foam layer substrate and the conductive glue layer substrate longitudinally and transversely by using a cutting wire so that the foam layer substrate and the conductive glue layer substrate are divided into N transverse units and M longitudinal units, wherein N is greater than 2, and M is greater than 2; for example, the transverse cutting is performed 8 times to divide the foam layer base material and the conductive glue layer base material into 9 transverse units, and the longitudinal cutting is performed 8 times to divide the foam layer base material and the conductive glue layer base material into 9 transverse units; during cutting, the widths of the transverse unit and the longitudinal unit are set in advance, and the cutting wire is cut according to actual requirements;
step 5): as shown in fig. 5, removing several of the N transverse units and removing several of the M longitudinal units, so that the remaining foam layer substrate and the conductive glue layer substrate form a plurality of uniformly distributed foam layer substrate and conductive glue layer substrate small blocks, which are the conductive foam body 2; for example, according to the above-listed cutting manner, 5 spaced units B of 9 transverse units are removed, and 5 spaced units a of 9 longitudinal units are removed, so that the remaining foam layer substrate and conductive glue layer substrate form 16 uniformly distributed foam layer substrate and conductive glue layer substrate small blocks, which are the conductive foam body 2, the conductive foam body 2 also includes a foam layer and a conductive glue layer, the foam layer and the conductive glue layer of the conductive foam body 2 are smaller than those of the conductive glue layer substrate and the foam layer substrate in the above steps 1) -2), and the conductive glue layer substrate and the foam layer substrate in steps 1) -2) are of a large-piece structure, which is a basis for subsequently forming a plurality of conductive foam bodies 2;
step 6): as shown in fig. 6, a plastic frame K is provided, the plastic frame K includes a plurality of plastic squares 3, the size of each plastic square 3 matches the size of the conductive foam body 2, two adjacent plastic squares 3 are connected by a rib K1, the plastic frame K is placed on the conductive foam body 2 and attached to the release paper 1, and each conductive foam body 2 is accommodated in one plastic square 3;
step 7): the ribs K1 between two adjacent plastic squares 3 are cut off by using a cutting wire, and the cut ribs K1 are removed, so that the conductive foam (shown in fig. 1 and 2) is obtained.
Preferably, in order to increase the strength and stability between the plastic grid 3 and the foam body 2, the following steps may be further included between steps 6) and 7): glue is squeezed and injected among the plastic grids 3, the foam layer base material and the small conductive glue layer base material blocks (conductive foam bodies 2) for bonding.
Preferably, as shown in fig. 3, in step 3), a positioning jig G is used to place a combination formed by the release paper 1, the conductive glue layer substrate and the foam layer substrate at a set position on the bearing platform, the positioning jig G includes two L-shaped positioning blocks G1, the two L-shaped positioning blocks G1 are spliced to form a square positioning groove, the inner dimension of the positioning groove matches with the shape of the combination formed by the release paper 1, the conductive glue layer substrate and the foam layer substrate, a positioning column (not shown in the figure) matched with the positioning hole G11 on the L-shaped positioning block G1 is arranged on the bearing platform, the positioning column is located at the set position, and an air suction hole is arranged on the bearing platform and connected with a vacuum generator.
The step 3) specifically comprises the following steps: placing a positioning jig G at a setting position on the bearing platform through the matching of the positioning column and the positioning hole; then, a combination body (the shaded part in fig. 3 is the combination body) formed by the release paper 1, the conductive glue layer base material and the foam layer base material is placed in the positioning groove of the positioning jig G; then, adsorbing a combination body formed by the release paper 1, the conductive glue layer substrate and the foam layer substrate on the bearing platform; and finally, removing the positioning jig G.
The combined body formed by the release paper 1, the conductive glue layer substrate and the foam layer substrate can be accurately placed at the set position of the bearing platform through the positioning jig G.
It is further preferred that the suction holes on the carrying platform are divided into a plurality of groups, and when a plurality of the N transverse units and a plurality of the M longitudinal units need to be torn off (manually or mechanically), the suction holes under the units needing to be removed stop sucking. The suction holes are grouped in advance by the position of the unit to be torn as needed and the position of the unit not to be torn.
Further preferably, positioning holes K11 are formed in the ribs K1 at the four corners of the plastic frame K, lifting positioning pins matched with the positioning holes are arranged at corresponding positions on the bearing platform, the lifting positioning pins are connected with a lifting cylinder located below the bearing platform, the lifting positioning pins are lifted when the plastic frame K is placed, the lifting positioning pins are lowered when the cut ribs K1 are removed, and the blowing device blows the ribs K1 away.
Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A method for manufacturing conductive foam is characterized by comprising the following steps: the method comprises the following steps:
step 1), providing release paper with a set size, and arranging a layer of conductive glue on the release paper in a blade coating or spraying manner so as to form a conductive glue layer substrate on the release paper;
step 2), arranging a layer of foam layer base material with the same size as the release paper on the conductive glue layer;
step 3), placing a combination formed by the release paper, the conductive glue layer substrate and the foam layer substrate on a bearing platform, and adsorbing the combination formed by the release paper, the conductive glue layer substrate and the foam layer substrate on the bearing platform;
step 4), utilizing a cutting silk to cut longitudinally and transversely so as to divide the foam layer base material and the conductive glue layer base material into N transverse units and M longitudinal units, wherein N is more than 2, and M is more than 2;
removing a plurality of units in the N transverse units and a plurality of units in the M longitudinal units, so that a plurality of uniformly distributed small blocks of foam layer base materials and conductive glue layer base materials are formed on the rest foam layer base materials and conductive glue layer base materials, and the foam layer and the conductive glue layer small blocks are the conductive foam body;
step 6), providing a plastic frame, wherein the plastic frame comprises a plurality of plastic grids, the size of each plastic grid is matched with that of the conductive foam body, two adjacent plastic grids are connected through ribs, the plastic frame is placed on the conductive foam body and attached to release paper, and each conductive foam body is accommodated in one plastic grid;
and 7) cutting off ribs between two adjacent plastic squares by using a cutting wire, and removing the cut ribs.
2. The manufacturing method of the conductive foam as claimed in claim 1, wherein the manufacturing method comprises the following steps: the following steps are also included between steps 6) and 7):
and extruding and injecting glue among the plastic grids, the foam layer base material and the conductive glue layer base material small blocks for bonding.
3. The manufacturing method of the conductive foam as claimed in claim 1, wherein the manufacturing method comprises the following steps: adopt positioning jig to place the settlement position on load-bearing platform with the combination that the cotton layer substrate of separation type paper, conductive glue layer substrate and bubble formed in step 3), positioning jig includes two L type locating pieces, two L type locating pieces concatenation form square positioning groove, positioning groove's inside dimension with the appearance phase-match of the combination that forms from type paper, conductive glue layer substrate and bubble cotton layer substrate, load-bearing platform is last be provided with locating hole assorted reference column on the L type locating piece, the reference column is located set for position department, the last suction hole that is provided with of load-bearing platform, the suction hole is connected with vacuum generator.
4. The manufacturing method of the conductive foam as claimed in claim 3, wherein the manufacturing method comprises the following steps: the step 3) specifically comprises the following steps: the positioning jig is placed at the arrangement position on the bearing platform through the matching of the positioning column and the positioning hole; then, a combined body formed by the release paper, the conductive glue layer substrate and the foam layer substrate is placed in the positioning groove of the positioning jig; then, enabling a combination body formed by the conductive glue layer substrate and the foam layer substrate to be adsorbed on the bearing platform; and finally, removing the positioning jig.
5. The manufacturing method of the conductive foam as claimed in claim 4, wherein the manufacturing method comprises the following steps: the air suction holes on the bearing platform are divided into a plurality of groups, and when a plurality of units in the N transverse units and a plurality of units in the M longitudinal units need to be torn off, the air suction hole group under the units needing to be removed stops air suction.
6. The manufacturing method of the conductive foam as claimed in claim 1, wherein the manufacturing method comprises the following steps: the rib-type lifting device is characterized in that positioning holes are formed in the ribs at four corners of the plastic frame, lifting positioning needles matched with the positioning holes are arranged at corresponding positions on the bearing platform and connected with lifting cylinders located below the bearing platform, the lifting positioning needles rise when the plastic frame is placed, and when sheared ribs are removed, the lifting positioning needles fall, and the blowing device blows the ribs away.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011093600.9A CN112210307B (en) | 2020-10-14 | 2020-10-14 | Conductive foam and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011093600.9A CN112210307B (en) | 2020-10-14 | 2020-10-14 | Conductive foam and manufacturing method thereof |
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| CN112210307A CN112210307A (en) | 2021-01-12 |
| CN112210307B true CN112210307B (en) | 2022-06-17 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115214159B (en) * | 2021-04-19 | 2024-03-01 | 嘉善安迅织造有限公司 | Manufacturing method of multi-layer buffer structure |
| CN114702910B (en) * | 2022-03-31 | 2024-06-07 | 隆扬电子(昆山)股份有限公司 | Thin and narrow conductive foam transfer structure and forming process thereof |
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| CN108471702A (en) * | 2018-05-15 | 2018-08-31 | 苏州盛达胶粘制品有限公司 | A kind of thermal conductivity foam tape and preparation method thereof |
| CN108650872A (en) * | 2018-05-15 | 2018-10-12 | 苏州盛达胶粘制品有限公司 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
| KR20190008006A (en) * | 2017-07-14 | 2019-01-23 | 윤일구 | Isotropic conductive foam using porous polyurethane foam and manufacturing method thereof |
| CN210651960U (en) * | 2019-07-20 | 2020-06-02 | 歌尔科技有限公司 | Foam sticking tool |
| CN211279807U (en) * | 2019-11-15 | 2020-08-18 | 钜冠协创（深圳）科技有限公司 | Cotton location cross cutting equipment of electrically conductive bubble |
-
2020
- 2020-10-14 CN CN202011093600.9A patent/CN112210307B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190008006A (en) * | 2017-07-14 | 2019-01-23 | 윤일구 | Isotropic conductive foam using porous polyurethane foam and manufacturing method thereof |
| CN108471702A (en) * | 2018-05-15 | 2018-08-31 | 苏州盛达胶粘制品有限公司 | A kind of thermal conductivity foam tape and preparation method thereof |
| CN108650872A (en) * | 2018-05-15 | 2018-10-12 | 苏州盛达胶粘制品有限公司 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
| CN210651960U (en) * | 2019-07-20 | 2020-06-02 | 歌尔科技有限公司 | Foam sticking tool |
| CN211279807U (en) * | 2019-11-15 | 2020-08-18 | 钜冠协创（深圳）科技有限公司 | Cotton location cross cutting equipment of electrically conductive bubble |
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| CN112210307A (en) | 2021-01-12 |
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