CN112197873A - Digital thermopile infrared sensor - Google Patents
Digital thermopile infrared sensor Download PDFInfo
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- CN112197873A CN112197873A CN202011216392.7A CN202011216392A CN112197873A CN 112197873 A CN112197873 A CN 112197873A CN 202011216392 A CN202011216392 A CN 202011216392A CN 112197873 A CN112197873 A CN 112197873A
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
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- 241000218202 Coptis Species 0.000 description 2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J5/14—Electrical features thereof
Abstract
The invention discloses a digital thermopile infrared sensor, which comprises a light filtering module, a thermopile module, a digital module and a pin column, wherein the input end of the digital module is connected with the thermopile module, and the output end of the digital module is connected with the pin column; infrared radiation energy emitted by a measured object passes through the light filtering module, and then is absorbed by the thermopile module to generate thermoelectric signals, the thermoelectric signals enter the digital module to be amplified and subjected to analog-to-digital conversion to obtain digital signals, the digital signals are converted into temperature data through a digital signal processing unit in the digital module, and the temperature data are communicated with the outside through pin columns; compared with the prior art that an analog sensor is needed to be matched with a peripheral signal amplifying circuit and a signal processing circuit, the invention reduces the volume on the premise of consistent functions, can directly measure temperature data, reduces the complexity of the peripheral circuit and lays a foundation for the miniaturization of subsequent modules.
Description
Technical Field
The invention belongs to the technical field of infrared sensors, and particularly relates to a digital thermopile infrared sensor.
Background
The thermopile infrared sensor is formed by connecting a plurality of pairs of thermocouples made of polysilicon and aluminum on a plurality of receiving surfaces in series by utilizing a Seebeck thermoelectric effect, and the hot ends of the thermocouples are placed on a thin film structure at the top of a cavity of a silicon substrate and used for absorbing infrared radiation energy emitted by an object to be measured so as to heat; the cold end of the thermocouple is placed on the heat-conducting side wall of the silicon substrate to keep consistent with the ambient temperature; when there is a temperature difference between the cold and hot ends of the thermocouple, thermoelectromotive force is generated between the positive and negative ends of the thermocouple, and the sum of the thermoelectromotive force of a plurality of thermocouples, namely the output voltage of the sensor, is obtained between the positive and negative ends of the thermopile.
However, the original electrical signal output by the infrared thermopile sensor on the market at present is only very weak in microvolt level, and is difficult to be directly transmitted to a display, record or analysis instrument, and peripheral circuits such as signal amplification and analog-to-digital conversion are required to be processed.
In the prior art, a peripheral circuit is generally used to combine an output pin of a sensor thermopile chip with a high-precision operational amplifier to form a signal amplification circuit, an NTC pin of the sensor and a resistor are connected in series to form a voltage division circuit, a voltage signal amplified by the sensor and a voltage signal divided by the NTC resistor are sent to a high-precision analog-to-digital conversion chip ADC, a voltage analog signal is converted into a digital signal which can be directly read, the digital signal is communicated with a singlechip, and the singlechip converts the digital signal into temperature data of a measured object through a series of conversions; this approach not only takes a lot of time for the user to debug, but also results in complex components on the peripheral circuit PCB.
Disclosure of Invention
In order to solve the above problems, the present invention provides a digital thermopile infrared sensor, which does not require a peripheral circuit, can directly measure the temperature, and reduces the complexity of the peripheral circuit corresponding to the conventional thermopile infrared sensor.
The technical scheme adopted by the invention is as follows:
a digital thermopile infrared sensor comprises a filtering module, a thermopile module, a digital module and a pin column, wherein the input end of the digital module is connected with the thermopile module, and the output end of the digital module is connected with the pin column;
the measured object sends infrared radiant energy and passes through behind the light filtering module, by the thermopile module absorbs and produces thermoelectric signal, obtain digital signal after enlargiing, analog-to-digital conversion in the thermoelectric signal gets into digital module, digital signal passes through the digital signal processing unit among the digital module and converts temperature data into, temperature data passes through the pin post and communicates with the external world.
Preferably, a Flash chip and a Ram chip are arranged in the signal processing unit.
Preferably, the thermopile infrared sensor further comprises a base, wherein the thermopile chip, the digital chip and the pin column are all arranged on the base, and the thermopile chip is located at the center of the base.
Preferably, the filter module comprises a filter and a cap, and the filter is located on the cap.
Preferably, the digital module further comprises an input selector, an amplifier, a digital-to-analog converter, a built-in temperature sensor and a reference voltage, wherein the input end of the input selector is connected with the thermopile module, the output end of the input selector is connected with the amplifier, the amplifier is connected with the digital-to-analog converter, and the digital-to-analog converter is connected with the built-in temperature sensor and the reference voltage.
Preferably, the digital module further comprises a reference voltage connected to the thermopile module for pulling up its voltage, the reference voltage further being connected to an amplifier.
Preferably, the thermopile module is a thermopile chip.
Preferably, the filter may filter out infrared rays of a specific wavelength.
Preferably, the input end of the digital module is connected with the thermopile module through a gold wire, and the output end of the digital module is connected with the pin column through the gold wire.
Preferably, the amplifier is a programmable gain amplifier with adjustable amplification factor.
Compared with the prior art, when the infrared photoelectric sensor is used, infrared radiation energy emitted by a measured object passes through the filtering module, and is absorbed by the thermopile module to generate a thermoelectric signal, the thermoelectric signal enters the digital module to be amplified and subjected to analog-to-digital conversion to obtain a digital signal, the digital signal is converted into temperature data through the digital signal processing unit in the digital module, and the temperature data is communicated with the outside through the pin columns;
in the process, the thermopile module and the digital module are integrated, compared with the prior art that an analog sensor is needed to be matched with a peripheral signal amplifying circuit and a signal processing circuit, the thermopile module and the signal processing circuit obviously reduce the volume on the premise of consistent functions, can directly measure temperature data, reduce the complexity of the peripheral circuit and lay a foundation for the miniaturization of subsequent modules.
Drawings
FIG. 1 is a schematic structural diagram of a digital thermopile infrared sensor provided in an embodiment of the present invention;
FIG. 2 is a block diagram of a digital module in a digital thermopile infrared sensor provided by an embodiment of the present invention;
fig. 3 is an equivalent circuit diagram of a digital thermopile infrared sensor provided by an embodiment of the present invention.
The optical filter module comprises a filter module 1, a thermopile module 2, a digital module 3, a pin column 4, a base 5, an optical filter 11, a tube cap 12, a digital signal processing unit 31, an input selector 32, an amplifier 33, an amplifier 34, a digital-to-analog converter 35, a built-in temperature sensor 36, a reference voltage 37 and a reference voltage.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not mean that the device or member to which the present invention is directed must have a specific orientation or position, and thus, cannot be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment of the invention provides a digital thermopile infrared sensor, which comprises a filtering module 1, a thermopile module 2, a digital module 3 and a pin column 4, wherein the input end of the digital module 3 is connected with the thermopile module 2, and the output end of the digital module 3 is connected with the pin column 4, as shown in fig. 1;
like this, adopt above-mentioned structure, the testee sends infrared radiant energy and passes through behind the light filtering module 1, by thermopile module 2 absorbs and produces thermoelectric signal, thermoelectric signal gets into and obtains digital signal after enlargiing, analog-to-digital conversion in the digital module 3, digital signal passes through digital signal processing unit 31 among the digital module 3 and converts into temperature data, temperature data carries out the communication through pin 4 and external.
The embodiment integrates the thermopile module 2 and the digital module 3 together, and compare in prior art's needs and use analog sensor collocation peripheral signal amplifier circuit and signal processing circuit, the volume has not only obviously been dwindled to the embodiment under the prerequisite of function unanimity, has reduced peripheral circuit's complexity, can also directly record temperature data, has reduced peripheral circuit's operand, has improved the humidity that detects the temperature.
In a specific embodiment:
a Flash chip and an Ram chip are arranged in the signal processing unit 31;
therefore, the digital signals can be processed to obtain temperature data, and then a user can directly read the temperature data through different interfaces according to the self requirement.
This thermopile infrared sensor further includes base 5, thermopile chip 2, digital chip 3 and pin 4 all set up on base 5, and thermopile chip 2 is located 5 central points of base.
The filtering module 1 comprises a filter 11 and a tube cap 12, wherein the filter 11 is positioned on the tube cap 12;
specifically, the optical filter 11 may filter out infrared rays with a specific wavelength;
specifically, moisture, carbon dioxide, and the like in the atmosphere have a strong absorption effect on infrared light with a specific wavelength, and if infrared radiation in the whole wavelength range emitted by an object is allowed to pass through the sensor optical window, the radiation energy received by the thermopile sensor is easily interfered by the concentration of atmospheric components, so that the output result of the sensor is affected. The silicon-based infrared filter loaded on the optical window of the sensor can selectively transmit infrared light in a specific wavelength range, and by designing the transmission-cut-off wavelength parameters of the filter, an atmospheric absorption waveband causing interference can be shielded outside the sensor, so that the radiation energy received by the thermopile sensor is only related to the surface temperature of a measured object and is not interfered by the concentration of atmospheric components.
In one embodiment:
the digital module 3 further comprises an input selector 32, an amplifier 33, a digital-to-analog converter 34, a built-in temperature sensor 35 and a reference voltage 36, wherein the input end of the input selector 32 is connected with the thermopile module 2, the output end of the input selector is connected with the amplifier 33, the amplifier 33 is connected with the digital-to-analog converter 34, and the digital-to-analog converter 34 is connected with the built-in temperature sensor 35 and the reference voltage 36.
Specifically, the amplifier 33 is a programmable gain amplifier with adjustable amplification factor;
the input selector 32 can control and selectively receive two voltage signals generated by the thermopile chips;
the amplifier 33 is a programmable gain amplifier, has adjustable amplification factor and is used for amplifying weak voltage signals generated by the thermopile chip;
the built-in temperature sensor 35 is used for detecting the temperature of the sensor and replacing a thermistor in the traditional analog sensor;
the resolution of the analog-to-digital converter 34 is not less than 16 bits, the sampling rate is adjustable, and the analog voltage signal can be converted into a digital signal for external communication.
In one embodiment:
the thermopile module 2 is a thermopile chip.
The digital module 3 further comprises a reference voltage 37, the reference voltage 37 is connected with the thermopile module 2 for pulling up the voltage thereof, and the reference voltage 37 is further connected with the amplifier 33;
the reference voltage 37 can be selected from 1.2V, 1.25V and the like, and is used for increasing the negative voltage of the thermopile chip so as to meet the condition that the detected temperature is lower than the environmental temperature.
Thus, with the digital module 3 in the present embodiment, the thermoelectric signal first enters the input selector 32, then is amplified by the amplifier 33, and then is converted into a digital signal by the digital-to-analog converter 34, the digital signal is converted into temperature data by the digital signal processing unit 31 in the digital module 3, and the temperature data is communicated with the outside through the pin 4.
Fig. 3 is an equivalent circuit diagram of the present embodiment:
as can be seen from the figure, the output voltages of the first to third pins of the thermopile chip are amplified by the operational amplifier, the second to fourth pins of the sensor are converted into voltage signals by the voltage dividing circuit, and then the voltage signals are respectively sent to the analog-to-digital converter to convert the voltage analog signals into digital signals, and the digital signals are accessed into the digital processing unit 31 to be processed to obtain temperature data.
The digital processing unit 31 is a single chip microcomputer.
The input end of the digital module 3 is connected with the thermopile module 2 through a gold thread, and the output end of the digital module 3 is connected with the pin column 4 through a gold thread.
The working process of the digital thermopile infrared sensor provided by the embodiment mainly comprises the following steps:
firstly, an object to be measured emits infrared radiation energy, and the optical filter 11 filters out unwanted infrared rays and retains the needed infrared rays;
secondly, the thermopile chip absorbs and generates thermoelectric signals, and the hot spot signals enter the digital module 3 through gold wires;
step three, in the digital module 3, the thermoelectric signal firstly enters the input selector 32, then the amplifier 33 amplifies the signal, and then the digital-to-analog converter 34 converts the analog signal into a digital signal, the digital signal is converted into temperature data by the digital signal processing unit 31 in the digital module 3, and the temperature data can be communicated with the outside through different interfaces.
The digital thermopile infrared sensor provided by the embodiment has the following advantages:
firstly, miniaturization is realized, specifically:
compared with the prior art that an analog sensor is needed to be matched with a peripheral signal amplifying circuit and a signal processing circuit, the invention obviously reduces the volume on the premise of consistent functions, can directly measure temperature data, reduces the complexity of the peripheral circuit and lays a foundation for the miniaturization of subsequent modules.
Secondly, improve user development efficiency, specifically do:
the embodiment directly outputs the temperature data, so that a user can directly read the temperature data without processing an original voltage signal by the user, development efficiency is improved, and time is saved.
Finally, the cost is reduced, specifically:
the digital module can receive two paths of sensor signals, can be perfectly matched with NDIR two-channel gas measurement, and can directly output data of NDIR two-channel gas measurement by using only one digital chip.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A digital thermopile infrared sensor is characterized by comprising a filtering module (1), a thermopile module (2), a digital module (3) and pin columns (4), wherein the input end of the digital module (3) is connected with the thermopile module (2), and the output end of the digital module (3) is connected with the pin columns (4);
the measured object sends infrared radiant energy and passes through behind filtering module (1), by thermopile module (2) absorb and produce thermoelectric signal, thermoelectric signal gets into and amplifies, obtains digital signal after the analog-to-digital conversion in digital module (3), digital signal converts temperature data into through digital signal processing unit (31) in digital module (3), temperature data carries out the communication through pin post (4) and external world.
2. The digital thermopile infrared sensor according to claim 1, characterized in that a Flash chip and a Ram chip are built in the signal processing unit (31).
3. The digital thermopile infrared sensor according to claim 2, characterized in that it further comprises a base (5), said thermopile chip (2), digital chip (3) and pin pillars (4) are all disposed on the base (5), and the thermopile chip (2) is located at the center of the base (5).
4. The digital thermopile infrared sensor according to claim 3, characterized in that the filter module (1) comprises a filter (11) and a cap (12), the filter (11) being located on the cap (12).
5. The digital thermopile infrared sensor according to any one of claims 1 to 4, characterized in that the digital module (3) further comprises an input selector (32), an amplifier (33), a digital-to-analog converter (34), a built-in temperature sensor (35) and a reference voltage (36), wherein the input of the input selector (32) is connected to the thermopile module (2), the output is connected to the amplifier (33), the amplifier (33) is connected to the digital-to-analog converter (34), and the digital-to-analog converter (34) is connected to both the built-in temperature sensor (35) and the reference voltage (36).
6. The digital thermopile infrared sensor according to claim 5, characterized in that the digital module (3) further comprises a reference voltage (37), the reference voltage (37) being connected to the thermopile module (2) for pulling up its voltage, the reference voltage (37) being further connected to the amplifier (33).
7. The digital thermopile infrared sensor according to claim 6, characterized in that the thermopile module (2) is a thermopile chip.
8. The digital thermopile infrared sensor according to claim 4, characterized in that the filter (11) can filter out infrared rays of specific wavelengths.
9. The digital thermopile infrared sensor according to claim 1, characterized in that the input of the digital module (3) is connected to the thermopile module (2) by gold wires, and the output of the digital module (3) is connected to the pin pillars (4) by gold wires.
10. The digital thermopile infrared sensor according to claim 5, characterized in that the amplifier (34) is a programmable gain amplifier with adjustable amplification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011216392.7A CN112197873A (en) | 2020-11-04 | 2020-11-04 | Digital thermopile infrared sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011216392.7A CN112197873A (en) | 2020-11-04 | 2020-11-04 | Digital thermopile infrared sensor |
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| CN112197873A true CN112197873A (en) | 2021-01-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880840A (en) * | 2021-01-14 | 2021-06-01 | 深圳市美思先端电子有限公司 | Standard infrared temperature measuring device and control method thereof |
| CN112945890A (en) * | 2021-02-03 | 2021-06-11 | 深圳市美思先端电子有限公司 | Gas concentration detection device and control method thereof |
| CN113138028A (en) * | 2021-03-24 | 2021-07-20 | 深圳市谷德科技有限公司 | Infrared thermopile sensor and temperature measurement device, system and method |
-
2020
- 2020-11-04 CN CN202011216392.7A patent/CN112197873A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880840A (en) * | 2021-01-14 | 2021-06-01 | 深圳市美思先端电子有限公司 | Standard infrared temperature measuring device and control method thereof |
| CN112945890A (en) * | 2021-02-03 | 2021-06-11 | 深圳市美思先端电子有限公司 | Gas concentration detection device and control method thereof |
| CN113138028A (en) * | 2021-03-24 | 2021-07-20 | 深圳市谷德科技有限公司 | Infrared thermopile sensor and temperature measurement device, system and method |
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