CN112186090A - LED packaging body, packaging method and light-emitting device - Google Patents

LED packaging body, packaging method and light-emitting device Download PDF

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Publication number
CN112186090A
CN112186090A CN202010897280.6A CN202010897280A CN112186090A CN 112186090 A CN112186090 A CN 112186090A CN 202010897280 A CN202010897280 A CN 202010897280A CN 112186090 A CN112186090 A CN 112186090A
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China
Prior art keywords
led chip
led
light
layer
reflecting layer
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CN202010897280.6A
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Chinese (zh)
Inventor
邢美正
杨丽敏
王传虎
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Shenzhen Jufei Optoelectronics Co Ltd
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Shenzhen Jufei Optoelectronics Co Ltd
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Priority to CN202010897280.6A priority Critical patent/CN112186090A/en
Publication of CN112186090A publication Critical patent/CN112186090A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The embodiment of the invention provides an LED packaging body, a packaging method and a light-emitting device, wherein the LED packaging body comprises: the LED light source comprises a support, an LED chip, a reflecting layer, a packaging adhesive layer and a light blocking layer; the LED packaging structure comprises a support, and is characterized in that a die bonding function area is arranged on one side of the support, an LED chip is electrically connected to the die bonding function area, a reflecting layer is arranged on the die bonding function area and surrounds the LED chip, the upper surface of one side, close to the LED chip, of the reflecting layer is lower than the upper surface of the LED chip, a packaging adhesive layer covers the LED chip and the reflecting layer, at least part of the upper surface of the packaging adhesive layer is provided with a light blocking layer, and the reflecting layer and the light blocking layer enable light emitted by the LED chip to be emitted out from the side face of. Through set up the reflection stratum around the LED chip, cover the layer that is in the light at the upper surface of encapsulation glue film, through the cooperation of mutually in reflection stratum and the layer that is in the light, let light carry out multiple reflection in the LED packaging body, improved the luminous homogeneity of LED packaging body, multiple reflection light can also let more light follow the side of LED packaging body and jet out simultaneously, has increased the luminous angle of LED packaging body.

Description

LED packaging body, packaging method and light-emitting device
Technical Field
The present invention relates to the field of LED technologies, and in particular, to an LED package, a packaging method, and a light emitting device.
Background
The LED packaging body adopting the traditional TOP structure is limited by the support structure, so that the light-emitting angle can only reach about 120 degrees, and the light-emitting angle is generally smaller.
Meanwhile, in the conventional LED packaging body, the LED packaging body consists of a support and a substrate, and because the LED chip is arranged at the center of the LED packaging body, the light intensity of the light generated by the LED packaging body at the center of the support is strongest, and the light intensity emitted to two sides around the support is weakest, so that the uniformity of the light generated by the LED packaging body is poor.
Disclosure of Invention
The invention provides an LED package, a packaging method and a light-emitting device, aiming at solving the technical problems that the existing LED package is small in light-emitting angle and poor in light-emitting uniformity.
In order to solve the above technical problem, the present invention provides an LED package, including: the LED light source comprises a support, an LED chip, a reflecting layer, a packaging adhesive layer and a light blocking layer;
the LED packaging structure is characterized in that a die bonding function area is arranged on one side of the support, the die bonding function area is electrically connected with the LED chip, the reflecting layer is arranged on the die bonding function area and surrounds the LED chip, the upper surface of one side, close to the LED chip, of the reflecting layer is lower than the upper surface of the LED chip, the packaging adhesive layer covers the LED chip and the reflecting layer, the light blocking layer is at least partially arranged on the upper surface of the packaging adhesive layer, and the reflecting layer and the light blocking layer enable light emitted by the LED chip to be emitted from the side face of the LED packaging chip.
Optionally, the bracket further includes a sidewall surrounding the die bonding functional region; the LED chip is located in the center of the area surrounded by the side wall, and the upper surface of the side wall is not lower than the upper surface of the light blocking layer.
Optionally, the sidewall is a white light-transmitting sidewall made of white glue, or a light-transmitting sidewall made of a transparent material.
Optionally, a boss for bearing the LED chip is disposed on the die bonding functional region, and the range of the boss is greater than or equal to the projection range of the LED chip;
the reflecting layer is arranged between the boss and the side wall, and the upper surface of one side, connected with the boss, of the reflecting layer is not higher than that of the boss.
Optionally, the die bond functional region further includes a die bond region around the LED chip, and the die bond region is used for fixing and adsorbing reflective glue in a fluid form.
Further, the invention also provides a packaging method of the LED packaging body, which comprises the following steps:
fixing and electrically connecting the LED chip on the die bonding functional area on one side of the bracket;
manufacturing a reflecting layer around the LED chip, wherein the upper surface of one side of the reflecting layer close to the LED chip is lower than the upper surface of the LED chip;
covering a packaging adhesive layer on the reflecting layer and the LED chip;
and at least part of the upper surface of the packaging adhesive layer is provided with a light blocking layer.
Optionally, the reflective layer is made by adopting a multi-point simultaneous glue discharging process; the LED chip is characterized in that a plurality of glue dispensing positions are uniformly arranged on the periphery of the LED chip, when glue is dispensed, the plurality of glue dispensing positions extrude reflection glue at the same time, and the reflection glue of the plurality of glue dispensing positions are mutually fused and solidified to form a reflection layer.
Optionally, before the die attach function region on one side of the support is fixed and electrically connected to the LED chip, the method further includes:
and arranging a boss for bearing the LED chip on the die bonding functional area on one side of the support, and manufacturing a die bonding area around the corresponding position of the LED chip fixed on the die bonding functional area.
Optionally, the reflective layer, the encapsulant and the light blocking layer are all manufactured by die pressing or hot pressing.
Further, the invention also provides a light-emitting device, which comprises the LED packaging body, wherein the light-emitting device is a lighting device, a light signal indicating device, a light supplementing device or a backlight device.
Advantageous effects
The embodiment of the invention provides an LED packaging body, a packaging method and a light-emitting device, wherein the LED packaging body comprises: the LED light source comprises a support, an LED chip, a reflecting layer, a packaging adhesive layer and a light blocking layer; the LED packaging structure comprises a support, and is characterized in that a die bonding function area is arranged on one side of the support, an LED chip is electrically connected to the die bonding function area, a reflecting layer is arranged on the die bonding function area and surrounds the LED chip, the upper surface of one side, close to the LED chip, of the reflecting layer is lower than the upper surface of the LED chip, a packaging adhesive layer covers the LED chip and the reflecting layer, at least part of the upper surface of the packaging adhesive layer is provided with a light blocking layer, and the reflecting layer and the light blocking layer enable light emitted by the LED chip to be emitted out from the side face of. Through set up the reflection stratum around the LED chip, cover the layer that is in the light at the upper surface of encapsulation glue film, through the cooperation of mutually in reflection stratum and the layer that is in the light, let light carry out multiple reflection in the LED packaging body, improved the luminous homogeneity of LED packaging body, multiple reflection light can also let more light follow the side of LED packaging body and jet out simultaneously, has increased the luminous angle of LED packaging body.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic structural diagram of a conventional LED package;
fig. 2 is a schematic structural diagram of an LED package according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of an LED package in which a light-blocking layer partially covers an upper surface of a reflective layer according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of an LED package with a support including a sidewall according to a first embodiment of the present invention;
fig. 5 is a schematic partial structural view of an LED package with a support including a boss according to a first embodiment of the present invention;
fig. 6 is a schematic partial structural view of an LED package with a frame including a glue region according to a first embodiment of the present invention;
fig. 7 is a schematic flowchart of a method for packaging an LED package according to a second embodiment of the present invention;
fig. 8 is a schematic dispensing diagram of an LED package according to a second embodiment of the present invention.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1 is a schematic structural diagram of a conventional LED package, which includes: the LED packaging structure comprises a bracket, a light source and a light source, wherein the bracket consists of a substrate and a side wall, an LED chip arranged in the center of the bracket and fluorescent glue covering the LED chip, in the existing LED packaging body, the LED chip generates light to excite a fluorescent body in the fluorescent glue to generate light with a specific wavelength, in the existing LED packaging body, because the LED chip has a certain light-emitting angle, the intensity of the light generated in the central area of the LED chip is the maximum in the central area of the LED packaging body, and the intensity of the light gradually decreases from the center to the periphery, so that the uniformity of the light is poor; meanwhile, in the existing LED package, light generated by the LED chip is directly reflected by the substrate, so that the light emitting angle of the LED package cannot be particularly large.
First embodiment
The embodiment provides an LED package, including: the LED light source comprises a support, an LED chip, a reflecting layer, a packaging adhesive layer and a light blocking layer; the LED packaging structure is characterized in that a die bonding function area is arranged on one side of the support, the die bonding function area is electrically connected with the LED chip, the reflecting layer is arranged on the die bonding function area and surrounds the LED chip, the upper surface of one side, close to the LED chip, of the reflecting layer is lower than the upper surface of the LED chip, the packaging adhesive layer covers the LED chip and the reflecting layer, the light blocking layer is at least partially arranged on the upper surface of the packaging adhesive layer, and the reflecting layer and the light blocking layer enable light emitted by the LED chip to be emitted from the side face of the LED packaging chip.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of an LED package provided in the present embodiment, and fig. 3 is a schematic structural diagram of an LED package in which a light blocking layer partially covers an upper surface of a reflective layer provided in the present embodiment. The LED package includes: the LED chip comprises a support 100, an LED chip 200, a reflecting layer 300, an encapsulation adhesive layer 400 and a light blocking layer 500.
The support 100 is a supporting member of the entire LED package, and a die bonding functional region is disposed on the upper surface of the support 100, and the die bonding functional region is used for fixing and electrically connecting the LED chip 200. It should be noted that the LED chip 200 is usually disposed in the central region of the bracket 100, but it is not excluded that in other embodiments, the LED chip 200 is disposed in other positions.
The reflective layer 300 is disposed around the LED chip, the upper surface of the reflective layer 300 close to the LED chip 200 is lower than the upper surface of the LED chip 200, so as to prevent the side surface of the reflective layer 300 from shielding the LED chip 200, the reflective layer 300 has a relatively good light reflection performance, and the reflective angle of the reflected light can be controlled by changing the shape of the reflective surface of the reflective layer 300, for example, the reflective surface of the reflective layer 300 in fig. 2 is a groove with two protruding ends and a concave middle, when the light irradiates the reflective surface close to the LED chip 200, the light can be emitted to the side surface of the LED package at a larger angle, when the light irradiates the reflective surface at the outer side, the light can be continuously remained in the LED package, and the number of reflections can be increased to improve the uniformity of the light.
Encapsulation glue film 400 covers on LED chip 200 and reflecting layer 300, plays the effect of protection and sealing, and encapsulation glue film 400 can choose for use transparent adhesive tape or fluorescent glue, uses the fluorescent glue can be with the light conversion of LED chip 200 light-emitting to the light of different wavelength.
The light blocking layer 500 covers the upper surface of the encapsulation adhesive layer 400 to block and reflect light, the light blocking layer 500 may partially cover the upper surface of the encapsulation adhesive layer 400, as shown in fig. 3, or completely cover the upper surface of the encapsulation adhesive layer 400, as shown in fig. 2, the ratio of blocking light may be changed by adjusting the thickness and material of the light blocking layer 500, and the light reflection performance may also be improved. In other embodiments, in order to improve the light reflection performance, the shape of the light blocking layer 500 may be adjusted, for example, in fig. 2, the light blocking layer 500 is gradually recessed from the edge to the center, and since the brightness of the light at the center of the LED package is the largest, the central region of the light blocking layer 500 is recessed downward to reflect the light at the center to both sides, so as to improve the brightness of the light at both sides. It should be noted that, since the light-blocking layer 500 covers the encapsulation adhesive layer 400, the shape and structure of the light-blocking layer 500 are related to the encapsulation adhesive layer 400, and the upper surface of the encapsulation adhesive layer 400 has a corresponding shape and structure.
In some embodiments, the support further comprises a sidewall surrounding the die attach region; the LED chip is located in the center of the area surrounded by the side wall, and the upper surface of the side wall is not lower than the upper surface of the light blocking layer.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an LED package with a bracket including a sidewall according to this embodiment. In the LED package provided in fig. 4, the support further includes a sidewall 101, the sidewall 101 surrounds the outside of the die bonding functional region of the support to protect and facilitate production, the sidewall 101 surrounds the outside of the die bonding functional region to form a closed ring, and when the LED package is produced and manufactured, the LED chip, the encapsulant and the light blocking layer can be sequentially formed in the closed ring formed by the sidewall 101, so that the upper surface of the sidewall 101 is not lower than the upper surface of the light blocking layer.
In some embodiments, the sidewalls are white light-transmissive sidewalls made of white glue, or light-transmissive sidewalls made of a transparent material.
In order to increase the light emitting angle of the LED package and avoid the sidewall from blocking light, the sidewall in this embodiment is transparent, and the white transparent sidewall made of white glue can adjust the light transmittance by adjusting the component ratio of the white glue and changing the thickness of the sidewall, so as to improve the light uniformity of the whole LED package. When the LED packaging body can achieve a better uniform effect through the reflection of the reflecting layer and the light blocking layer, the transparent light-transmitting side wall can be selected. White glues used in embodiments of the present invention include, but are not limited to, white glues made of silicone and titanium dioxide TiO/barium sulfate BaSO4A reflective colloid made of the mixture of (a); or from titanium dioxide TiO2Silicon dioxide SiO2Aluminum oxide Al2O3And a reflective colloid made of a mixture of silica gel/methyl silicone/phenyl silicone.
In some embodiments, a boss for bearing the LED chip is disposed on the die bonding functional region, and the range of the boss is greater than or equal to the projection range of the LED chip; the reflecting layer is arranged between the boss and the side wall, and the upper surface of one side, connected with the boss, of the reflecting layer is not higher than that of the boss.
Referring to fig. 5, fig. 5 is a schematic partial structural view of an LED package provided in this embodiment and including a boss. The boss 102 is outwards protruded in the region of fixing and electrically connecting the LED chip 200 in the die bonding function region of the support, the height of the LED chip 200 is increased, the light emitting angle of the LED packaging body can be further increased, meanwhile, the reflecting layer 300 is arranged in the groove below the boss, the upper surface of one side, connected with the boss, of the reflecting layer 300 is not higher than the upper surface of the boss, light generated by the side surface of the LED chip 200 can be prevented from being shielded by the reflecting layer, and the light emitting efficiency of the LED packaging body is improved.
It should be noted that, in the present embodiment, the positional relationship between the reflective layer 300 and the LED chip 200 includes, but is not limited to, the reflective layer 300 contacting the side of the LED chip 200, such as fig. 2, 3 and 4, and the reflective layer 300 not contacting the side of the LED chip 200, such as fig. 5.
In some embodiments, the die bond functional region further includes a die bond region around the LED chip, and the die bond region is configured to fix and adsorb a reflective adhesive in a fluid form.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a part of an LED package including a frame including a glue region according to this embodiment. In fig. 6, the glue fixing area 103 is disposed around the LED chip 200, the glue fixing area 103 mainly functions to make more emitting glue in a fluid form be adsorbed around the LED chip 200, and also functions to fix the reflective layer, for the purpose of adsorption and fixation, the optional structure of the glue fixing area 103 includes but is not limited to roughening the surface of the die bonding functional area, and performing sawtooth processing on the surface of the die bonding functional area.
In some embodiments, the reflective layer and the light blocking layer are both light blocking walls made of white glue.
The reflecting layer 400 and the light blocking layer 600 are made of white glue, the same material is adopted to reduce the production cost, the white glue is adopted to reduce the loss during light reflection, and meanwhile, the light transmittance can be easily adjusted by adjusting the component proportion of the white glue and the thickness of the light blocking wall made of the white glue.
The present embodiment provides an LED package, including: the LED light source comprises a support, an LED chip, a reflecting layer, a packaging adhesive layer and a light blocking layer; the LED packaging structure comprises a support, and is characterized in that a die bonding function area is arranged on one side of the support, an LED chip is electrically connected to the die bonding function area, a reflecting layer is arranged on the die bonding function area and surrounds the LED chip, the upper surface of one side, close to the LED chip, of the reflecting layer is lower than the upper surface of the LED chip, a packaging adhesive layer covers the LED chip and the reflecting layer, a light blocking layer is arranged on at least part of the upper surface of the packaging adhesive layer, and the reflecting layer and the light blocking layer enable light emitted by the LED chip to be emitted out from the side face. Through set up the reflection stratum around the LED chip, cover the layer that is in the light at the upper surface of encapsulation glue film, through the cooperation of mutually in reflection stratum and the layer that is in the light, let light carry out multiple reflection in the LED packaging body, improved the luminous homogeneity of LED packaging body, multiple reflection light can also let more light follow the side of LED packaging body and jet out simultaneously, has increased the luminous angle of LED packaging body.
Second embodiment
Fig. 7 is a schematic flowchart of a method for packaging an LED package according to this embodiment, where fig. 7 is a schematic flowchart of the method for packaging an LED package according to this embodiment. The process of the packaging method of the LED packaging body comprises the following steps:
and S101, fixing and electrically connecting the LED chip on the die bonding function area on one side of the support.
S102, manufacturing a reflecting layer around the LED chip, wherein the upper surface of one side, close to the LED chip, of the reflecting layer is lower than the upper surface of the LED chip.
S103, covering a packaging adhesive layer on the reflecting layer and the LED chip.
And S104, at least partially arranging a light blocking layer on the upper surface of the packaging adhesive layer.
In step S102, the reflecting layer is manufactured by adopting a multi-point simultaneous glue discharging process; the LED chip is characterized in that a plurality of glue dispensing positions are uniformly arranged on the periphery of the LED chip, when glue is dispensed, the plurality of glue dispensing positions extrude reflection glue at the same time, and the reflection glue of the plurality of glue dispensing positions are mutually fused and solidified to form a reflection layer.
Referring to fig. 8, fig. 8 is a schematic diagram illustrating dispensing of an LED package according to this embodiment. In fig. 8, 700 represents one dispensing point, a dispensing nozzle is disposed above a position corresponding to 700 during dispensing, 4 dispensing points 700 are simultaneously disposed in fig. 8, which represents that 4 dispensing points perform dispensing simultaneously, and the 4 dispensing points are uniformly distributed in an area of the substrate between the LED chip and the support, the dispensing points are uniformly distributed, so that the reflective glue can be more uniformly fused, the thickness of the generated reflective layer is more uniform, and the more the dispensing points are disposed, the more the thickness of the manufactured reflective layer is uniform.
In step S103, the encapsulation adhesive layer is a fluorescent adhesive or a transparent adhesive; the packaging adhesive layer is filled on the bracket by adopting a mould pressing or hot pressing process.
And the packaging adhesive layer can be better filled on the bracket by adopting a mould pressing or hot pressing process.
In steps S102 and S104, the reflective layer and the light-blocking layer are both light-blocking walls made of white glue; the light blocking layer is covered on the light conversion layer by adopting a mould pressing or hot pressing process, and the reflecting layer can also be fixed on the bracket by adopting a mould pressing or hot pressing process.
The light blocking layer is made of a mold pressing or hot pressing process, the light blocking layer can be attached to the packaging adhesive layer better, the thickness of the light blocking layer can be controlled more easily, the light transmittance of the light blocking layer can be adjusted, the reflecting layer is fixed on the support through mold pressing or hot pressing, and the structure and the thickness of the reflecting layer can be adjusted conveniently.
Before the step S101 of soldering the LED chip, the method further includes: and printing solder on the position corresponding to the center of the substrate fixed with the bracket.
Because the difference of the position and the uniformity of the printed solder affects the position and the uniformity of the chip after the chip is welded due to the reflow soldering after the die bonding of the material, the position of the printed solder paste and the uniformity of the printed solder paste are controlled, the printed solder paste is positioned in the center of the LED support during printing, and the SPI detection is carried out by using a 3D detector after the printing is finished, so that the consistency of the printing area, the height and the volume of the printed solder paste is ensured, and the precision of the LED chip during welding is improved.
The embodiment provides a packaging method of an LED packaging body, which comprises the following steps: welding an LED chip at the center of the substrate fixed with the bracket; dispensing is carried out on the substrate between the LED chip and the support, a reflecting layer is generated on the substrate, the thickness of the reflecting layer is smaller than that of the LED chip, and light rays generated by the LED chip are reflected out at a larger angle by the reflecting layer; filling a light conversion material in the support to generate a light conversion layer, wherein the filling height of the light conversion layer is higher than the top end of the LED chip and lower than the top end of the support; the light blocking layer is covered on the light conversion layer, and the light blocking layer enables the distribution of light rays to be more uniform. The reflecting layer is generated around the LED chip, the light emitting angle of the LED packaging body is increased through reflection of the reflecting layer, the light blocking layer covers the light conversion layer, and light cannot pass through the light blocking layer at one time, so that the light is reflected for multiple times in the LED packaging body, and the light emitting uniformity of the LED packaging body is improved.
Third embodiment
The present embodiment provides a light emitting device, which includes an LED package provided in the embodiments of the present invention, and the light emitting device provided in the embodiments includes, but is not limited to, a lighting device, an optical signal indicating device, a light supplementing device or a backlight device.
The light-emitting device provided by the embodiment of the invention comprises the LED package provided by the embodiment of the invention, and the LED package enables the light generated by the lighting device, the light signal indicating device, the light supplementing device or the backlight device formed by the light-emitting device provided by the embodiment of the invention to have better uniformity and larger light-emitting angle.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. An LED package, comprising: the LED light source comprises a support, an LED chip, a reflecting layer, a packaging adhesive layer and a light blocking layer;
the LED packaging structure is characterized in that a die bonding function area is arranged on one side of the support, the die bonding function area is electrically connected with the LED chip, the reflecting layer is arranged on the die bonding function area and surrounds the LED chip, the upper surface of one side, close to the LED chip, of the reflecting layer is lower than the upper surface of the LED chip, the packaging adhesive layer covers the LED chip and the reflecting layer, the light blocking layer is at least partially arranged on the upper surface of the packaging adhesive layer, and the reflecting layer and the light blocking layer enable light emitted by the LED chip to be emitted from the side face of the LED packaging chip.
2. The LED package of claim 1, wherein said support further comprises sidewalls surrounding said die attach feature; the LED chip is located in the center of the area surrounded by the side wall, and the upper surface of the side wall is not lower than the upper surface of the light blocking layer.
3. The LED package of claim 2, wherein the sidewalls are white light-transmissive sidewalls made of white glue or light-transmissive sidewalls made of a transparent material.
4. The LED package according to claim 2, wherein a boss for supporting the LED chip is disposed on the die attach region, and a range of the boss is greater than or equal to a projection range of the LED chip;
the reflecting layer is arranged between the boss and the side wall, and the upper surface of one side, connected with the boss, of the reflecting layer is not higher than the upper surface of the platform.
5. The LED package of claim 2, wherein the die attach feature further comprises a glue bond region around the LED chip, the glue bond region configured to attach and absorb a reflective glue in a fluid form.
6. A packaging method of an LED package body is characterized by comprising the following steps:
fixing and electrically connecting the LED chip on the die bonding functional area on one side of the bracket;
manufacturing a reflecting layer around the LED chip, wherein the upper surface of one side of the reflecting layer close to the LED chip is lower than the upper surface of the LED chip;
covering a packaging adhesive layer on the reflecting layer and the LED chip;
and at least part of the upper surface of the packaging adhesive layer is provided with a light blocking layer.
7. The method of claim 6, wherein the reflective layer is formed by a multi-point simultaneous dispensing process; the LED chip is characterized in that a plurality of glue dispensing positions are uniformly arranged on the periphery of the LED chip, when glue is dispensed, the plurality of glue dispensing positions extrude reflection glue at the same time, and the reflection glue of the plurality of glue dispensing positions are mutually fused and solidified to form a reflection layer.
8. The method of claim 6, wherein before the step of fixing and electrically connecting the LED chip to the die attach area on the side of the support, the method further comprises:
and arranging a boss for bearing the LED chip on the die bonding functional area on one side of the support, and manufacturing a die bonding area around the corresponding position of the LED chip fixed on the die bonding functional area.
9. The method of claim 7, wherein the reflective layer, the encapsulant and the light blocking layer are formed by molding or hot pressing.
10. A light-emitting device comprising the LED package according to any one of claims 1 to 5.
CN202010897280.6A 2020-08-31 2020-08-31 LED packaging body, packaging method and light-emitting device Pending CN112186090A (en)

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