CN112185921B - 具有混合引线键合焊盘的半导体芯片 - Google Patents
具有混合引线键合焊盘的半导体芯片 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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Abstract
提供了用于半导体芯片的键合焊盘布图和结构的装置和方法。根据本发明的各个方面,所提供的技术可以提供一种半导体芯片,该半导体芯片可以包括在与半导体芯片的边缘平行的第一方向延伸的外键合焊盘和在与半导体芯片的边缘垂直的第二方向延伸的内键合焊盘。该外键合焊盘可具有在第一方向上对准的一个探测区域和两个引线键合区域,而内键合焊盘可具有在第二方向上对准的一个探测区域和一个引线键合区域。该外键合焊盘可以摆放的位置比该内键合焊盘更靠近半导体芯片的边缘。
Description
技术领域
本公开涉及半导体芯片,尤其涉及用于半导体芯片的引线键合焊盘。
背景技术
集成电路(IC)是现代电子产品的基本组成部分。越来越多的功能被集成到IC芯片中,并且半导体芯片需要提供更多的连接。通常,连接是通过引线键合提供的,引线键合使用Au、Cu、Ag合金或任何导电线将芯片电连接到基板或引线框。芯片与基板之间的连接允许芯片上的输入/输出(I/O)信号通过位于芯片边缘的焊盘输入或输出。此外,键合焊盘还为芯片提供电源和接地。此外,需要在引线键合之前对半导体芯片进行测试,因此还需要通过键合焊盘提供测试探测区域。通常,键合焊盘被设计成是将键合区域和探测区域分开的长焊盘,或者是键合区域和探测区域重叠的短焊盘。重叠的键合区域和探测区域会引起可靠性问题,因为引线将在探测区域的顶部进行键合,这可能会影响键合完整性并导致键合引线脱落(lift)问题。因此,在焊盘设计中存在空间(或“不动产”)争用。
发明内容
持续需要改进的焊盘结构和布局。所公开的主题涉及提供混合引线键合焊盘的装置和方法。根据本发明的各个方面,所提供的技术可以在半导体芯片上形成至少两种类型的键合焊盘。通过沿着芯片的边缘放置具有较短高度的键合焊盘并且在芯片的内侧放置具有较高高度的键合焊盘,混合键合焊盘结构可以节省具有双层或多层引线键合焊盘的芯片尺寸。在一实施例中,外键合焊盘可提供电源和接地连接,并且可具有与常规短焊盘设计相同的焊盘高度。可以在键合区域之间的矩形焊盘的中间形成新的探测区域。混合引线键合焊盘可以是成本高效的,并且可以减少对键合焊盘所需的尺寸的需求。
在示例性实施例中,提供了一种半导体芯片,该半导体芯片可以包括在平行于半导体芯片的边缘的第一方向延伸的外键合焊盘和在垂直于半导体芯片的边缘的第二方向延伸的内键合焊盘。该外键合焊盘可具有在第一方向上对准的一个探测区域和两个引线键合区域,而内键合焊盘可具有在第二方向上对准的一个探测区域和一个引线键合区域。该外键合焊盘可以摆放的位置可以比该内键合焊盘更靠近半导体芯片的边缘。
在另一个示例性实施例中,提供了一种半导体芯片,该半导体芯片可以包括在与半导体芯片的边缘平行的行方向上排布一行外键合焊盘和沿着该行外键合焊盘在行方向上排布一行内键合焊盘。该行内键合焊盘可以位于该行外键合焊盘的与半导体芯片的边缘相对的一侧上。该行外键合焊盘中的每一个外键合焊盘可以在行方向上延伸并且具有两个引线键合区域和一个探测区域。该行内键合焊盘中的每一个内键合焊盘可以垂直于行方向上延伸并且具有一个引线键合区域和一个探测区域。
在又一示例性实施例中,提供了一种用于制造半导体芯片的方法。该方法可以包括:形成沿与半导体芯片的边缘平行的第一方向延伸的外键合焊盘;以及形成沿与所述半导体芯片的边缘垂直的第二方向延伸的内键合焊盘。该外键合焊盘可以具有沿着第一方向上排布的的一个探测区域和两个引线键合区域。该内键合焊盘可以具有沿着第二方向上排布的一个探测区域和一个引线键合区域。该外键合焊盘摆放的位置可以比该内键合焊盘更靠近半导体芯片的边缘。
附图简要说明
图1示意性地示出了根据本公开的一个实施例中的半导体芯片的一部分的俯视图。
图2示意性地示出了根据本公开的一个实施例中的半导体芯片的一部分的更详细的视图。
图3是根据本公开的一个实施例中的用于制造半导体芯片的过程的流程图。
具体实施方式
现在将参考附图详细描述根据本申请的具体实施例。为了一致性,各个图中的相同元件由相同的附图标记表示。
根据本公开的示例性实施例可以提供一种半导体芯片,其可以包括混合引线键合焊盘。根据本公开的各个方面,所提供的技术可以在半导体芯片上形成至少两种类型的键合焊盘:在平行于半导体芯片的边缘的第一方向延伸的外键合焊盘和在垂直于半导体芯片边缘的第二方向延伸的内键合焊盘。该外键合焊盘可具有沿着第一方向上排布的一个探测区域和两个引线键合区域,而内键合焊盘可具有沿着第二方向上排布的一个探测区域和一个引线键合区域。该外键合焊盘摆放的位置可以比该内键合焊盘更靠近半导体芯片的边缘。在一个实施例中,半导体芯片可以包括集成电路(IC)。
图1示意性地示出了根据本公开的实施例的半导体芯片100的一部分的俯视图。半导体芯片(die)100可以包括内键合焊盘104的行102,外键合焊盘108的行106和边缘110。在一个实施例中,芯片100可以是具有集成电路(IC)的半导体芯片。外键合焊盘108的行106可以在x方向上对准,其可以平行于边缘110。并且,内键合焊盘104的行102也可以在x方向上基本对准。
每个外键合焊盘108可以在x方向上延伸。即,外键合焊盘108在x方向上的长度大于外键合焊盘108在y方向上的长度,y方向可以垂直于x方向。每个内键合焊盘104可以在y方向上延伸。即,内键合焊盘104在y方向上的长度可以大于内键合焊盘104在x方向上的长度。
应当注意,边缘110可以是芯片100的周边的一部分,其可以具有矩形或正方形的形状。此外,内键合焊盘104的行102和外键合焊盘108的行106可以位于芯片100的焊盘区域中。在一些实施例中,内键合焊盘104的行102可以包括用于信号(例如,I/O或控制信号)、电源和接地的焊盘,而外键合焊盘108的行106可以是电源和接地焊盘。也就是说,内键合焊盘104的行102可以为半导体芯片100提供信号、接地和电源连接,而外键合焊盘108的行106可以为半导体芯片100提供电源和接地连接。在至少一个实施例中,外键合焊盘108的行106的一些焊盘可以提供电源连接,而外键合焊盘108的行106的一些其他焊盘可以提供接地连接。通常,可以由半导体芯片100的电源和接地分布设计来确定哪个外键合焊盘108提供电源以及哪个外键合焊盘108提供接地。在至少一个实施例中,外键合焊盘108的行106可以通过相邻的焊盘提供电源和接地连接。也就是说,如果外键合焊盘108提供电源,则与其相邻的两个相邻的外键合焊盘108可以提供接地。
在一些实施例中,内键合焊盘104和外键合焊盘108可以由铝(Al)、铜或任何其他导电材料形成。
现在参考图2,其中示出了半导体芯片100的一部分的更详细的视图。更详细的视图描绘了内键合焊盘104可以包括探测区域202和引线键合区域204,而外键合焊盘108可以包括探测区域206和两个引线键合区域208.1和208.2。在一个实施例中,引线键合区域(例如,引线键合区域204、208.1或208.2)可以是用于在IC芯片的最终产品中进行永久连接的引线球键合区域,半导体芯片100可以封装于其中。永久连接可以通过引线键合在IC芯片和外界之间提供电互连。
探测区域(例如,探测区域202或206)可以是探针标记区域,探针点或探针卡的引线或探针尖端接触的焊盘的一部分。探测区域可以用于探针测试,而不用于在IC芯片的最终产品中提供与半导体芯片100的永久连接。在一些实施例中,在外键合焊盘108上,探测区域206可以小于导线键合区域208.1和208.2中的任一个;并且,在内键合焊盘104上,探测区域202可以小于引线键合区域204。此外,在一些实施例中,探测区域206可以位于两个引线键合区域208.1和208.2之间。
在一些实施例中,内键合焊盘104的探测区域202和引线键合区域204可以在y方向上对准。在一个实施例中,探测区域202可以比引线键合区域204更远离半导体芯片100的边缘,但是在另一实施例中,引线键合区域204可以比探测区域202更远离半导体芯片100的边缘。
在一些实施例中,外键合焊盘108的探测区域206和两个引线键合区域208.1和208.2可以在x方向上对准。在至少一个实施例中,探测区域206可以位于两个引线键合区域208.1和208.2之间。
应该注意的是,出于说明性目的,内键合焊盘104的引线键合区域204和外键合焊盘108的两个引线键合区域208.1和208.2可以显示为圆形,而内键合焊盘104的探测区域202和外键合焊盘108的探测区域206可以示出为椭圆形。但是可以理解,它们可以以不同的几何构型形成。例如,任何引线键合区域(例如,内键合焊盘104的引线键合区域204以及两个引线键合区域208.1和208.2)以及任何探测区域(例如,内键合焊盘104的探测区域202和外键合焊盘108的探测区域206)可以形成为非标准几何形状,其中心不能通过标准几何定义。在这种情况下,可以通过区域分布的中心或任何其他合适的方式来定义中心,并且可以通过基本上对准相应的探测区域和引线键合区域的中心来实现对准。
此外,应该注意的是,内键合焊盘104和外键合焊盘108的形状不必是矩形甚至是标准几何形状。在各种实施例中,内键合焊盘104可以在y方向上延伸以容纳探测区域202和引线键合区域204,而外键合焊盘108可以在x方向上延伸以容纳探测区域206和两个引线键合区域208.1和208.2。而且,内行102的每个内键合焊盘104不必相同。例如,一些内键合焊盘104可以具有由工艺技术引起的不规则形状。类似地,外行106的每个外键合焊盘108不必相同。例如,一些外键合焊盘108可以具有由工艺技术引起的不规则形状。
图3是根据本公开的一个实施例中的用于制造半导体芯片的过程300的流程图。在框302,可以在半导体芯片上形成外键合焊盘。外键合焊盘可以在平行于半导体芯片的边缘的第一方向上延伸。例如,可以在半导体芯片100上形成在x方向上延伸的外键合焊盘108。在一个实施例中,外键合焊盘108可以具有在x方向上对准的一个探测区域206和两个引线键合区域208.1和208.2。在框304,可以在半导体芯片上形成内键合焊盘。内键合焊盘可以在垂直于半导体芯片的边缘的第二方向上延伸。内键合焊盘可具有在第二方向上对准的一个探测区域和一个引线键合区域。例如,可以在半导体芯片100上形成在y方向上延伸的内键合焊盘104。在一个实施例中,内键合焊盘104可以包括在y方向上对准的探测区域202和引线键合区域204。外键合焊盘108摆放的位置可以比内键合焊盘104更靠近半导体芯片100的边缘110。
在一个实施例中,过程300可以进一步包括:形成在第一方向上对准的一行外键合焊盘,并且该外键合焊盘作为一行外键合焊盘中的一个;以及形成在第一方向上对准的一行内键合焊盘,并且该内键合焊盘作为一行内键合焊盘中的一个。例如,外键合焊盘的行106可以与在框302中形成的外键合焊盘一起形成,而内键合焊盘的行102可以与在框304中形成的内键合焊盘作为其中之一形成。该行外键合焊盘中的每一个可具有第一细长形状,其具有沿x方向排列的一个探测区域和两个引线键合区域,并且该行内键合焊盘的每一个均可以具有第二细长形状,其具有在y方向对准的一个探测区域和一个引线键合区域。
在各种实施例中,可以使用任何合适的焊盘制造技术来执行过程300,例如化学蚀刻或机械研磨。
在示例性实施例中,提供了一种半导体芯片,该半导体芯片可以包括在平行于半导体芯片的边缘的第一方向延伸的外键合焊盘和在垂直于半导体芯片的边缘的第二方向延伸的内键合焊盘。该外键合焊盘可具有在第一方向上对准的探测区域和两个引线键合区域,而内键合焊盘可具有在第二方向上对准的一个探测区域和一个引线键合区域。该外键合焊盘摆放的位置可以比该内键合焊盘更靠近半导体芯片的边缘。
在一个实施例中,该外键合焊盘的探测区域可以小于该外键合焊盘的两个引线键合区域中的任一个。
在一个实施例中,该外键合焊盘的探测区域可以位于该外键合焊盘的两个引线键合区域之间。
在一个实施例中,该内键合焊盘的探测区域可以小于该内键合焊盘的引线键合区域。
在一个实施例中,该外键合焊盘可经配置以提供到半导体芯片中的电路的接地或电源连接。
在一个实施例中,该外键合焊盘可以是在第一方向上对准的一行外键合焊盘中的一个,而该内键合焊盘可以是在第一方向上对准的一行内键合焊盘中的一个。
在一个实施例中,该行外键合焊盘中的每一个可以具有细长的形状,其具有沿第一方向对准的一个探测区域和两个引线键合区域,并且该行内键合焊盘中的每一个具有另一细长形状,其具有在第二方向上对准的一个探测区域和一个引线键合区域。
在一个实施例中,该行外键合焊盘中的每一个可以被配置为提供电源连接或接地连接。
在另一个示例性实施例中,提供了一种半导体芯片,该半导体芯片可以包括在与半导体芯片的边缘平行的行方向上排布的一行外键合焊盘和沿着该行外键合焊盘在行方向上排布的一行内键合焊盘。该行内键合焊盘可以位于该行外键合焊盘的与半导体芯片的边缘相对的一侧上。该行外键合焊盘中的每一个可以在行方向上延伸并且具有两个引线键合区域和一个探测区域。该行内键合焊盘中的每一个可以垂直于行方向上延伸并且具有一个引线键合区域和一个探测区域。
在一个实施例中,该行外键合焊盘中的外键合焊盘的探测区域可以小于外键合焊盘的两个引线键合区域中的任一个。
在一个实施例中,该外键合焊盘的探测区域和该外键合焊盘的两个引线接合区域可以在行方向上对准,而该探测区域位于两个引线接合区域之间。
在一个实施例中,该内键合焊盘的探测区域可以小于该内键合焊盘的引线键合区域。
在一个实施例中,该内键合焊盘的探测区域和该内键合焊盘的引线键合区域可以垂直于该行方向对准。
在一个实施例中,该行外键合焊盘中的每一个可以被配置为提供电源连接或接地连接。
在又一示例性实施例中,提供了一种用于制造半导体芯片的方法。该方法可以包括:形成沿与半导体芯片的边缘平行的第一方向上延伸的外键合焊盘;以及形成沿与半导体芯片的边缘垂直的第二方向上延伸的内键合焊盘。该外键合焊盘可以具有沿着第一方向上排布的一个探测区域和两个引线键合区域。该内键合焊盘可具有沿着二方向上排布的一个探测区域和一个引线键合区域。该外键合焊盘摆放的位置可以比该内键合焊盘更靠近半导体芯片的边缘。
在一个实施例中,该外键合焊盘的探测区域可以小于该外键合焊盘的两个引线键合区域中的任一个,并且可以位于该外键合焊盘的两个引线键合区域之间。
在一个实施例中,该内键合焊盘的探测区域可以小于该内键合焊盘的引线键合区域。
在一个实施例中,该外键合焊盘可经配置以提供到半导体芯片中的电路的接地或电源连接。
在一个实施例中,该方法可以进一步包括:形成在第一方向上对准的一行外键合焊盘,并且该外键合焊盘作为该行外键合焊盘中的一个;以及形成在第一方向上对准的一行内键合焊盘,并且该内键合焊盘作为该行内键合焊盘中的一个。该行外键合焊盘中的每一个可以具有第一相同的细长形状,其具有在第一方向上对准的一个探测区域和两个引线键合区域,并且该行内部键合焊盘中的每一个可以具有第二相同的细长形状,其具有在第二方向上对准的一个探测区域和一个引线键合区域。
在一个实施例中,该行外键合焊盘中的每一个可以被配置为提供电源连接或接地连接。
可以以有助于理解本发明的实施方式的方式将各种操作依次描述为多个离散操作。但是,描述的顺序不应解释为暗示这些操作与顺序有关。此外,一些实施例可以包括比所描述的更多或更少的操作。
该描述可以使用短语“在一个实施例中”,“在实施例中”,“在一些实施例中”或“在各种实施例中”,其可以分别指代相同或不同实施例中的一个或多个。此外,关于本发明的实施例使用的术语“包括”、“包含”、“具有”等是同义的。
可以在本文中使用术语“耦合到”及其派生词。“耦合”可以表示两个或更多个元件直接物理或电接触。然而,“耦合”还可以意味着两个或更多个元件间接地彼此接触,但是仍然彼此协作或相互作用,并且可以意味着一个或多个其他元件在被称为彼此耦合的元素之间耦合或连接。
术语芯片、颗粒、集成电路、单片器件、半导体器件和微电子器件在微电子领域中经常互换使用。如本领域中通常所理解的,本发明适用于所有上述内容。
尽管本文已经公开了各个方面和实施例,但是其他方面和实施例对于本领域技术人员将是显而易见的。本文所公开的各个方面和实施例是出于说明的目的,而不是旨在进行限制,真实的范围和精神由所附权利要求书指示。
Claims (18)
1.一种半导体芯片,其特征在于,包括:
沿与半导体芯片的边缘平行的第一方向延伸的外键合焊盘,所述外键合焊盘具有在所述第一方向上对准的一个探测区域和两个引线键合区域;和
沿与所述半导体芯片的边缘垂直的第二方向延伸的内键合焊盘,所述内键合焊盘具有在第二方向上对准的一个探测区域和一个引线键合区域,其中,所述外键合焊盘摆放的位置比所述内键合焊盘更靠近所述半导体芯片的边缘,其中,所述外键合焊盘的探测区域小于所述外键合焊盘的两个引线键合区域中的任一个。
2.根据权利要求1所述的半导体芯片,其特征在于,所述外键合焊盘的探测区域位于所述外键合焊盘的两个引线键合区域之间。
3.根据权利要求1所述的半导体芯片,其特征在于,所述内键合焊盘的探测区域小于所述内键合焊盘的引线键合区域。
4.根据权利要求1所述的半导体芯片,其特征在于,所述外键合焊盘被配置为提供到所述半导体芯片中的电路的接地或电源连接。
5.根据权利要求1所述的半导体芯片,其特征在于,所述外键合焊盘是在所述第一方向上对准的一行外键合焊盘中的一个,所述内键合焊盘是在所述第一方向上对准的一行内键合焊盘中的一个。
6.根据权利要求5所述的半导体芯片,其特征在于,所述一行外键合焊盘中的每一个具有第一相同的细长形状,其具有在所述第一方向上对准的一个探测区域和两个引线键合区域,并且所述一行内键合焊盘中的每一个具有第二相同的细长形状,其具有在所述第二方向上对准的一个探测区域和一个引线键合区域。
7.根据权利要求6所述的半导体芯片,其特征在于,所述一行外键合焊盘中的每一个被配置为提供接地或电源连接。
8.一种半导体芯片,其特征在于,包括:
在与半导体芯片的边缘平行的行方向上排列的一行外键合焊盘;和
在沿着所述一行外键合焊盘的所述行方向上排列的一行内键合焊盘,并且所述一行内键合焊盘在所述一行外键合焊盘的与所述半导体芯片的边缘相对的一侧上,其中,所述一行外键合焊盘中的每一个在所述行方向上是细长的,并具有两个引线键合区域和一个探测区域,并且其中,所述一行内键合焊盘中的每一个在垂直于行方向上是细长的,并且具有一个引线键合区域和一个探测区域,其中,所述一行外键合焊盘的外键合焊盘的探测区域小于所述外键合焊盘的两个引线键合区域中的任一个。
9.根据权利要求8所述的半导体芯片,其特征在于,所述外键合焊盘的探测区域和所述外键合焊盘的两个引线键合区域在所述行方向上对准,其中所述探测区域位于所述两个引线键合区域之间。
10.根据权利要求8所述的半导体芯片,其特征在于,所述内键合焊盘的探测区域小于所述内键合焊盘的引线键合区域。
11.根据权利要求10所述的半导体芯片,其特征在于,所述内键合焊盘的探测区域和所述内键合焊盘的引线键合区域沿着垂直于所述行方向对准。
12.根据权利要求8所述的半导体芯片,其特征在于,所述一行外键合焊盘中的每一个被配置为提供接地或电源连接。
13.一种制造半导体芯片的方法,其特征在于,包括:
形成沿与半导体芯片的边缘平行的第一方向延伸的外键合焊盘,所述外键合焊盘具有在所述第一方向上对准的一个探测区域和两个引线键合区域;和
形成沿与所述半导体芯片的边缘垂直的第二方向延伸的内键合焊盘,所述内键合焊盘具有在第二方向上对准的一个探测区域和一个引线键合区域,其中,所述外键合焊盘摆放的位置比所述内键合焊盘更靠近所述半导体芯片的边缘,其中,所述外键合焊盘的探测区域小于所述外键合焊盘的两个引线键合区域中的任一个。
14.根据权利要求13所述的方法,特征在于,所述外键合焊盘的探测区域位于所述外键合焊盘的两个引线键合区域之间。
15.根据权利要求13所述的方法,特征在于,所述内键合焊盘的探测区域小于所述内键合焊盘的引线键合区域。
16.根据权利要求13所述的方法,特征在于,所述外键合焊盘被配置为提供到所述半导体芯片中的电路的接地或电源连接。
17.根据权利要求13所述的方法,特征在于,还包括:
形成沿所述第一方向对准的一行外键合焊盘,并将所述外键合焊盘作为所述一行外键合焊盘中的一个,其中,所述一行外键合焊盘中的每一个均具有第一细长形状,该第一细长形状具有沿所述第一方向对准的一个探测区域和两个引线键合区域;和
形成沿所述第一方向对准的一行内键合焊盘,并且所述内键合焊盘作为所述一行内键合焊盘中的一个,其中,所述一行内键合焊盘中的每一个均具有第二细长形状,该第二细长形状具有沿所述第二方向对准的一个探测区域和一个引线键合区域。
18.根据权利要求17所述的方法,特征在于,所述一行外键合焊盘中的每一个被配置为提供接地或电源连接。
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