CN112180503A - Double-body type heat array waveguide grating and manufacturing method thereof - Google Patents
Double-body type heat array waveguide grating and manufacturing method thereof Download PDFInfo
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- CN112180503A CN112180503A CN201910602095.7A CN201910602095A CN112180503A CN 112180503 A CN112180503 A CN 112180503A CN 201910602095 A CN201910602095 A CN 201910602095A CN 112180503 A CN112180503 A CN 112180503A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
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Abstract
The invention relates to a double-body type thermal array waveguide grating and a manufacturing method thereof, which is innovated in adjusting the central wavelength of the thermal array waveguide grating mainly through a double-body structure. The main body of the thermal arrayed waveguide grating is separated into two parts, and the central wavelength of the thermal arrayed waveguide grating can be adjusted by re-coupling the two parts of the main body of the thermal arrayed waveguide grating in the production process. Compared with the prior scheme, the method can utilize the hot array waveguide grating which exceeds the working temperature range, and improves the utilization rate of raw materials; compared with the prior scheme, the high-temperature-point thermal array waveguide grating has the advantages that the lower temperature compensation is only needed in the use process, the thermal array waveguide grating works in a small temperature range which is higher than the upper limit of the room temperature (such as 65 ℃) and is only a few degrees centigrade, and the waste of a large amount of energy is reduced. Therefore, the process yield can be improved, the material cost is reduced, the manufacturing efficiency is effectively improved, the manufacturing cost is reduced, and the environment friendliness is realized.
Description
Technical Field
The invention relates to a wavelength division multiplexer in the technical field of optical fibers, in particular to a double-body type hot array waveguide grating and a manufacturing method thereof.
Background
With the forward development of high speed and large capacity of Optical Fiber communication, the combination of Erbium-doped Fiber Amplifier (EDFA) and Dense Wavelength division Multiplexing (Dense Wavelength division Multiplexing, DWDM) technology has become a main technical means in this system. The Thermal Array Waveguide Grating (TAWG) is a core device in a DWDM system, makes full use of the huge bandwidth of optical fibers, more effectively realizes the capacity expansion of an optical fiber communication system, meets the ever-increasing communication demand of people, and has wide market prospect.
In thermal arrayed waveguide grating applications, the wavelength accuracy of the center wavelength of the device spectral characteristics to the specified operating center wavelength is one of the key parameters of the device. In order to satisfy the wavelength accuracy of the central wavelength of the thermal arrayed waveguide grating, temperature compensation needs to be performed on the thermal arrayed waveguide grating. In the actual production, the temperature compensation of a part of the thermal array waveguide grating is too small or too large, so that the working temperature range of the thermal array waveguide grating exceeds the conventional working temperature range, such as 65-85 ℃. Prior to the present invention, such a waveguide grating with a thermal array could only be discarded. In applications with thermal arrayed waveguide gratings, power consumption is also an indicator of great concern to users. And part of user application environments are limited, and the power consumption requirement is high. The power consumption of the heating sheet of the thermal array waveguide grating is in direct proportion to the working temperature, and in order to meet the requirements of the user, only the thermal array waveguide grating with a lower working temperature point can be selected for use. These problems greatly reduce the utilization rate of raw materials, reduce the process yield, increase the material cost, reduce the manufacturing efficiency and increase the manufacturing cost.
Disclosure of Invention
The invention provides a double-body type heat array waveguide grating to improve the manufacturing efficiency and reduce the manufacturing cost.
The technical scheme adopted by the invention for solving the technical problems is as follows: providing a double-body type thermal arrayed waveguide grating, wherein the thermal arrayed waveguide grating is provided with a thermal arrayed waveguide grating main body, a carrier and a heating sheet, the thermal arrayed waveguide grating main body can be separated into two parts, the thermal arrayed waveguide grating main body separated into the two parts can be recoupled to adjust the central wavelength so that the thermal arrayed waveguide grating is closer to the wavelength of a specified working center, and the thermal arrayed waveguide grating can work in a small temperature range which is only a few degrees higher than the upper limit of room temperature (such as 65 ℃), and the recoupled thermal arrayed waveguide grating main body is packaged on the carrier; the heating plate is packaged on the back of the carrier, so that the thermal array waveguide grating can be stabilized at different temperatures.
The working temperature range of the thermal array waveguide grating can be from 65 ℃ to 85 ℃ in the conventional way, and the working temperature range can also be narrowed, such as from 65 ℃ to 75 ℃.
The separation of the thermal array waveguide grating main body can be realized by mechanical cutting, laser cutting, chemical erosion and other methods.
The position where the thermal arrayed waveguide grating main body is separated can be any position where the thermal arrayed waveguide grating chip is perpendicular to the waveguide.
When the thermal arrayed waveguide grating main body separated into two parts is recoupled, the main body can move horizontally or vertically relative to the separation section, and one part of the main body can also move rotationally relative to the other part on the plane of the chip.
The carrier is a metal sheet, a ceramic sheet or a quartz sheet and the like.
The heat patch may stabilize the thermal arrayed waveguide grating at a temperature between 65 ℃ and 95 ℃.
The heating plate is a silica gel heating plate, a ceramic heating plate, a film heating plate and other types of heating plates.
Another technical problem to be solved by the present invention is to provide a method for manufacturing a dual-body waveguide grating with thermal array. Therefore, the invention adopts the following technical method:
the method for manufacturing the double-body type heat array waveguide grating is characterized by comprising the following manufacturing steps:
1) preparing various component materials required by the thermal array waveguide grating, wherein the component materials mainly comprise a thermal array waveguide grating chip, an input optical fiber array, an output optical fiber array, a carrier, a circuit board, a heating plate, an input rubber cap, an output rubber cap and a module box;
2) coupling a thermal array waveguide grating chip, an input optical fiber array and an output optical fiber array together to manufacture a thermal array waveguide grating main body;
3) separating the coupled thermal array waveguide grating main body into two parts;
4) recoupling the main body of the thermal arrayed waveguide grating separated into two parts, and adjusting the central wavelength of the thermal arrayed waveguide grating to be closer to the wavelength of the specified working center;
5) packaging the recoupled main body with the thermal arrayed waveguide grating on a carrier, packaging the carrier with the main body with the thermal arrayed waveguide grating on a circuit board, and finally packaging the heating plate in the circuit board with the hollow back of the carrier;
6) installing a circuit board into the module box, then respectively sleeving the optical fibers of the input optical fiber array and the output optical fiber array on an input rubber cap and an output rubber cap, and installing the optical fibers into the module box;
7) and (4) carrying out optical performance test on the assembled thermal array waveguide grating, and packaging and delivering qualified products.
The thermal array waveguide grating is manufactured by adopting a double-body structure, and the central wavelength of the thermal array waveguide grating can be adjusted by re-coupling the two parts of the main body of the thermal array waveguide grating in the production process. The thermal array waveguide grating which exceeds the working temperature range can be adjusted to enter the working temperature range; the hot arrayed waveguide grating with the higher working temperature point can be adjusted to the lower working temperature point. Compared with the prior art, the invention can utilize the heat array waveguide grating which exceeds the working temperature range, thereby improving the utilization rate of raw materials; compared with the prior scheme, the invention ensures that the thermal array waveguide grating with higher working temperature point only needs lower temperature compensation in the use process, ensures that the thermal array waveguide grating works in a small temperature range which is only a few degrees centigrade higher than the upper limit of room temperature (such as 65 ℃), and reduces the waste of a large amount of energy. Therefore, the process yield can be improved, the material cost is reduced, the manufacturing efficiency is effectively improved, the manufacturing cost is reduced, and the environment friendliness is realized.
Drawings
FIG. 1 is a flow chart of the present invention.
FIG. 2 is a schematic diagram of a separated position of a waveguide grating body with thermal array according to the present invention.
FIG. 3 is a schematic view showing the relative movement of two bodies when the thermally arrayed waveguide grating body is re-coupled according to the present invention.
FIG. 4 is a schematic view of the interior of a thermally arrayed waveguide grating in accordance with the present invention.
FIG. 5 is a schematic diagram of the structure of the heat arrayed waveguide grating main body, the carrier, the circuit board and the heating plate according to the present invention.
FIG. 6 is an external view of a thermally arrayed waveguide grating in accordance with the present invention.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Embodiments of the present invention relate to a dual thermal arrayed waveguide grating that separates a thermal arrayed waveguide grating body into two parts. The thermal arrayed waveguide grating body separated into two parts can be recoupled to adjust the center wavelength so that the thermal arrayed waveguide grating is closer to the designated operating center wavelength and the thermal arrayed waveguide grating can operate in a small temperature range of only a few degrees centigrade above the upper limit of room temperature (e.g., 65 ℃). The specific steps are as shown in the figure:
the method comprises the following steps: the method comprises the steps of preparing various component materials required by the thermal array waveguide grating, wherein the component materials mainly comprise a thermal array waveguide grating chip 1, an input optical fiber array 2, an output optical fiber array 3, a carrier 4, a circuit board 5, a heating sheet 6, an input rubber cap 7, an output rubber cap 8 and a module box 9.
Step two: the thermal array waveguide grating main body is manufactured by coupling a thermal array waveguide grating chip 1, an input optical fiber array 2 and an output optical fiber array 3 together.
Step three: separating the coupled thermal array waveguide grating main body into two parts;
step four: the main body of the thermal arrayed waveguide grating separated into two parts is recoupled, and the central wavelength of the thermal arrayed waveguide grating is adjusted to be closer to the wavelength of the specified working center.
Step five: and packaging the recoupled main body with the thermal arrayed waveguide grating on a carrier 4, packaging the carrier with the main body with the thermal arrayed waveguide grating on a circuit board 5, and finally packaging a heating plate 6 in the circuit board with the back surface of the carrier hollowed.
Step six: the circuit board is mounted into the modular box 9 and then the fibers of the input fiber array 2 and the output fiber array 3 are respectively sleeved over the input rubber cap 7 and the output rubber cap 8 and mounted into the modular box 9.
Step seven: and (4) carrying out optical performance test on the assembled thermal array waveguide grating, and packaging and delivering qualified products.
The inventive arrangements are described below in terms of a 1x40 thermal arrayed waveguide grating, but it should be understood that the inventive arrangements are equally applicable to thermal arrayed waveguide gratings of other channel numbers.
The invention provides a double-body type heat array waveguide grating:
the method comprises the following steps: the 40-channel thermal array waveguide grating chip, the single-channel input optical fiber array and the 40-channel output optical fiber array are coupled together to manufacture a 40-channel thermal array waveguide grating main body, and the initial test working temperature point is 86 ℃.
Step two: the coupled 40-channel thermally arrayed waveguide grating body was separated into two parts.
Step three: the main body of the 40-channel thermal arrayed waveguide grating separated into two parts is recoupled, and the central wavelength of the thermal arrayed waveguide grating is adjusted to be closer to the specified working central wavelength, so that the working temperature point of the thermal arrayed waveguide grating is adjusted to 72 ℃.
Step four: and packaging the recoupled 40-channel thermal array waveguide grating main body on a carrier, packaging the carrier with the thermal array waveguide grating main body on a circuit board, and finally packaging the heating plate in the circuit board with the hollow back of the carrier.
Step five: the circuit board is installed into the modular box and the optical fibers of the input and output fiber arrays are then respectively sleeved over the input and output rubber caps and installed into the modular box.
Step six: and (4) carrying out optical performance test on the assembled hot array waveguide grating, and packaging and delivering the assembled hot array waveguide grating when the assembled hot array waveguide grating is qualified.
The manufacturing scheme of the double-body thermal arrayed waveguide grating is used for 1x40 thermal arrayed waveguide gratings, and for thermal arrayed waveguide gratings with other channel numbers, the manufacturing scheme is different from the steps only in that the number of channels of the thermal arrayed waveguide grating chip, the input optical fiber array and the output optical fiber array is different.
Claims (9)
1. A double-body type thermal arrayed waveguide grating is characterized in that a thermal arrayed waveguide grating main body, a carrier and a heating sheet are arranged, the thermal arrayed waveguide grating main body is separated into two parts, the thermal arrayed waveguide grating main body separated into the two parts can be recoupled to adjust the central wavelength so that the thermal arrayed waveguide grating is closer to the specified working central wavelength and further the thermal arrayed waveguide grating can work in a small temperature range which is only a few degrees centigrade higher than the upper limit of the room temperature, and the recoupled thermal arrayed waveguide grating main body is packaged on the carrier; the heating plate is packaged on the back of the carrier, so that the thermal array waveguide grating can be stabilized at different temperatures.
2. The dual-body thermal arrayed waveguide grating of claim 1, wherein the thermal arrayed waveguide grating has an operating temperature range of 65 ℃ to 85 ℃ as normal or a reduced operating temperature range of 65 ℃ to 75 ℃.
3. The dual-body thermal arrayed waveguide grating of claim 1, wherein the separation of the main body of the thermal arrayed waveguide grating is achieved by mechanical cutting, laser cutting, or chemical etching.
4. The dual-body thermal arrayed waveguide grating of claim 1, wherein the separated positions of the main bodies of the thermal arrayed waveguide grating can be any positions of the chip of the thermal arrayed waveguide grating perpendicular to the waveguide.
5. The dual-body thermal arrayed waveguide grating of claim 1, wherein the two-part thermal arrayed waveguide grating body is moved and then coupled when being re-coupled, and the movement comprises horizontal movement or vertical movement of the two-part body relative to the splitting section, or rotation movement of one part of the body relative to the other part of the body in the plane of the chip.
6. The dual-body thermal arrayed waveguide grating of claim 1, wherein the carrier is a metal sheet, a ceramic sheet or a quartz sheet.
7. The dual-body thermal arrayed waveguide grating of claim 1, wherein the heat patch is capable of stabilizing the thermal arrayed waveguide grating at a temperature of between 65 ℃ and 95 ℃.
8. The dual-body thermal arrayed waveguide grating of claim 1, wherein the heat patch is a silica gel heat patch, a ceramic heat patch, a thin film heat patch, or the like.
9. The method of claim 1, comprising the steps of:
1) preparing various component materials required by the thermal array waveguide grating, wherein the component materials mainly comprise a thermal array waveguide grating chip, an input optical fiber array, an output optical fiber array, a carrier, a circuit board, a heating plate, an input rubber cap, an output rubber cap and a module box;
2) coupling a thermal array waveguide grating chip, an input optical fiber array and an output optical fiber array together to manufacture a thermal array waveguide grating main body;
3) separating the coupled thermal array waveguide grating main body into two parts;
4) recoupling the main body of the thermal arrayed waveguide grating separated into two parts, and adjusting the central wavelength of the thermal arrayed waveguide grating to be closer to the wavelength of the specified working center;
5) packaging the recoupled main body with the thermal arrayed waveguide grating on a carrier, packaging the carrier with the main body with the thermal arrayed waveguide grating on a circuit board, and finally packaging the heating plate in the circuit board with the hollow back of the carrier;
6) installing a circuit board into the module box, then respectively sleeving the optical fibers of the input optical fiber array and the output optical fiber array on an input rubber cap and an output rubber cap, and installing the optical fibers into the module box;
7) and (4) carrying out optical performance test on the assembled thermal array waveguide grating, and packaging and delivering qualified products.
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| CN201910602095.7A CN112180503A (en) | 2019-07-05 | 2019-07-05 | Double-body type heat array waveguide grating and manufacturing method thereof |
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| CN201910602095.7A CN112180503A (en) | 2019-07-05 | 2019-07-05 | Double-body type heat array waveguide grating and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113740972A (en) * | 2021-09-15 | 2021-12-03 | 四川天邑康和通信股份有限公司 | Multi-core joint array waveguide grating wavelength division multiplexer and manufacturing method |
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| CN108594363A (en) * | 2018-03-30 | 2018-09-28 | 武汉光迅科技股份有限公司 | A kind of array waveguide grating and optical module |
| CN207965210U (en) * | 2018-03-28 | 2018-10-12 | 武汉光迅科技股份有限公司 | A kind of encapsulating structure of bilinearity temperature-compensating array waveguide grating |
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2019
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| US20080199130A1 (en) * | 2005-09-02 | 2008-08-21 | The Furukawa Electric Co, Ltd. | Arrayed waveguide grating |
| CN103955029A (en) * | 2014-05-09 | 2014-07-30 | 上海亨通宏普通信技术有限公司 | Curve-shaped arrayed waveguide grating (AWG) dense wavelength division multiplexing device with heat and manufacturing device, manufacturing method and testing method thereof |
| CN105676350A (en) * | 2016-03-03 | 2016-06-15 | 博创科技股份有限公司 | Packaging structure of arrayed waveguide grating module and preparation method |
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| CN107817553A (en) * | 2017-11-08 | 2018-03-20 | 深圳新飞通光电子技术有限公司 | There are the method for packing and its encapsulating structure of hot AWG chips |
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| CN113740972A (en) * | 2021-09-15 | 2021-12-03 | 四川天邑康和通信股份有限公司 | Multi-core joint array waveguide grating wavelength division multiplexer and manufacturing method |
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