CN107817553A - There are the method for packing and its encapsulating structure of hot AWG chips - Google Patents
There are the method for packing and its encapsulating structure of hot AWG chips Download PDFInfo
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- CN107817553A CN107817553A CN201711087973.3A CN201711087973A CN107817553A CN 107817553 A CN107817553 A CN 107817553A CN 201711087973 A CN201711087973 A CN 201711087973A CN 107817553 A CN107817553 A CN 107817553A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000012856 packing Methods 0.000 title claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 62
- 239000012530 fluid Substances 0.000 claims abstract description 9
- 239000000835 fiber Substances 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 55
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 26
- 239000005297 pyrex Substances 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 24
- 239000013307 optical fiber Substances 0.000 claims description 12
- 238000012216 screening Methods 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910001374 Invar Inorganic materials 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
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- 210000004209 hair Anatomy 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- 238000002955 isolation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
Abstract
The present invention relates to technical field of electro-optical communication, specifically discloses a kind of method for packing and its encapsulating structure for having hot AWG chips, the method comprising the steps of a：The temperature filtered out is unqualified and be cut into the AWG chips of simple grain and coupled with input/output fiber array；Step b：In the input of AWG chips or output end lab waveguide region along any angle straight cuts, AWG chips are cut into two sections；Step c：AWG chips two parts of cut-out are coupled again, ensure the center wavelength shift ITU wavelength of AWG chips between ITU wavelength (T1 T2) × 0.011nm is moved；Step d：At the joint-cutting of the AWG chips coupled, the equivalent matching fluid of filling refractive index, and the AWG chips on joint-cutting both sides are fixed on the positioning；Step e：Above-mentioned whole component is adhesive on heater with heat conduction.The present invention is packaged by the AWG chips rationally using temperature exceeding standard, can greatly improve the utilization rate of AWG chips, reduces product cost.
Description
Technical field
The present invention relates to technical field of electro-optical communication, more particularly to a kind of method for packing of chip and its new encapsulation knot
Structure.
Background technology
With the continuous extension of the capacity of present optical-fiber network, array waveguide grating (AWG：Arrayed Waveguide
Grating) dense wave division multipurpose/demultiplexer of type, the application in backbone network and Metropolitan Area Network (MAN) are more and more extensive.
Using the AWG of silicon based silicon dioxide fabrication techniques, because the refractive index and size of silica are all with the change of temperature
Change and changes, the phase difference for the Same Wavelength that AWG chips transmit in Waveguide array can be caused to change, finally so that AWG
The wavelength with temperature of each output channel and change, about 11pm/ DEG C of changing value, the skew of centre wavelength can cause insertion loss,
The index such as bandwidth and isolation changes.It is applied to ROADM (ROADM to ensure：
Reconfigurable Optical Add-Drop Multiplexer) and the product such as the adjustable wavelength division multiplexer of light (VMUX) in
AWG normal operation, it will usually increase a temperature feedback formula circuit and heater to it so that AWG chips constant temperature works
Under some specified temp, generally between 65 DEG C to 85 DEG C, so that each channel wavelength steady operation of AWG chips exists
ITU wavelength.
Prior art has in hot AWG packaging technology, generally that AWG wafers (Wafer) is slitting along specified straight line
Type, then one single chip is tested at a constant temperature, if the center wavelength shift ITU (International measured
Telecommunication Union International Telecommunication Union) wavelength is between -0.55nm~-0.3nm, then it represents that these chips
It can be worked between 65 DEG C to 85 DEG C, then these chips just can be used for manufacturing AWG modules；, whereas if measure
Center wavelength shift represents the operating temperature of these chips or less than 65 DEG C, Huo Zhegao not between -0.55nm~-0.3nm
In 85 DEG C, the chip of temperature exceeding standard is belonged to, then these chips will be scrapped.After chip testing terminates, set by cutting
It is standby, AWG chips are divided into simple grain, then pick out the chip of test passes, with input/output fiber array (Fiber
Array) it is coupled, then this sub-component is assembled on the substrate with having heaters.Above-mentioned technique is by many producers
For mass producing, technology maturation is stable, but due to its AWG chip utilization rate it is low the shortcomings that, cause product cost higher,
It is therefore desirable to make improvements.
The content of the invention
It is an object of the present invention to propose a kind of method for packing and its encapsulating structure for having hot AWG chips, it is reasonable that it passes through
It is packaged using the AWG chips of temperature exceeding standard, can greatly improves the utilization rate of AWG chips, reduces product cost.
To achieve the above object, the invention provides a kind of method for packing for having hot AWG chips, it comprises the following steps：
Step a：The temperature filtered out is unqualified and be cut into the AWG chips of simple grain and input/output fiber array coupling
Close and form a sub-component；
Step b：Input or output end lab waveguide region in AWG chips, along any angle straight cuts, by AWG
Chip is cut into two sections；
Step c：AWG chips two parts of cut-out are coupled again, coupling environment temperature is T1, and regulation joint-cutting both sides are put down
Board waveguide, ensure the center wavelength shift ITU wavelength of AWG chips in (T1-T2) × 0.011nm, wherein T2 is the work of chip
Temperature；
Step d：At the joint-cutting of the AWG chips coupled, the equivalent matching fluid of filling refractive index, and to joint-cutting both sides
AWG chips are fixed on the positioning；
Step e：Above-mentioned whole component is adhesive on heater with heat conduction.
Selectable, the step b also includes step b1.1：Sub-component in step a is viscous on a substrate；Step
b1.2：Input or output end lab waveguide region in AWG chips, along any angle straight cuts, by AWG chips and substrate
It is cut into two sections simultaneously.
Specifically, the substrate can be silicon wafer substrate, Pyrex heat resistant glasses substrate or Invar substrates.
Further, the step d includes step d1.1：Index matching is filled at the joint-cutting of the chip coupled
Ultraviolet glue；Step d1.2：Cover two blocks of Pyrex heat resistant glasses at the joint-cutting of substrate, and with ultraviolet glue hydropexis.
Or the step d also includes step d2.1：At the joint-cutting of the AWG chips coupled, index matching is filled
Ultraviolet glue；Step d2.2：One block of Pyrex heat resistant glass of lid, around puts ultraviolet glue curing above joint-cutting.
The present invention also provides a kind of encapsulating structure for having hot AWG chips, and it includes：One substrate and the subgroup being bonded on substrate
Part, includes that temperature is unqualified after screening and has been cut into the AWG chips of simple grain in the sub-component, and the AWG chips are close to defeated
The side for entering transverse plane waveguide is coupled with input optical fibre array, and AWG chips are coupled with defeated close to the side of output end slab guide
Go out fiber array；There is the joint-cutting of a straight cuts input of the AWG chips or output end lab waveguide region, and the joint-cutting will
AWG chips and substrate are cut into two sections simultaneously；Filled with the matching fluid that refractive index is equivalent, substrate at the joint-cutting of the AWG chips
Joint-cutting at be provided with positioner.
Wherein, the substrate can be silicon wafer substrate, Pyrex heat resistant glasses substrate or Invar substrates.
Specifically, being filled with the equivalent ultraviolet glue of refractive index at the joint-cutting of the AWG chips, it is stamped at the joint-cutting of substrate
Two blocks of Pyrex heat resistant glasses for being used to position, pass through ultraviolet glue hydropexis between the Pyrex heat resistant glasses and substrate.
The present invention also provides a kind of encapsulating structure for having hot AWG chips, and it is unqualified and that it includes the temperature after screening
The AWG chips of simple grain are cut into, the AWG chips are coupled with input optical fibre array, AWG chips close to the side of input slab guide
Output optical fibre array is coupled with close to the side of output end slab guide；The input or output end flat board ripple of the AWG chips
Leading region has the joint-cutting of a straight cuts, and AWG chips are cut into two sections by the joint-cutting；It is filled with the joint-cutting of the AWG chips
The equivalent matching fluid of refractive index, and positioner is additionally provided with joint-cutting.
Wherein, filled with the ultraviolet glue that refractive index is equivalent at the joint-cutting of the AWG chips, and use is additionally provided with joint-cutting
Pass through ultraviolet glue hydropexis between the Pyrex heat resistant glasses of positioning, the Pyrex heat resistant glasses and AWG chips.
The present invention has the method for packing and its encapsulating structure of hot AWG chips, its AWG core by rationally utilizing temperature exceeding standard
Piece is packaged, it is only necessary to which the input of very little is with regard to that can bring great cost savings so that and the utilization rate of AWG chips maximizes,
Product cost can effectively be reduced；Not only the performance of product and existing scheme have hot AWG to be consistent for it, and simple to operate,
Suitable for industrializing use of large-scale production.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this hairs
Some bright embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the schematic flow sheet for the method for packing that the present invention has hot AWG chips；
Fig. 2 is the structural representation of sub-component in step a of the present invention；
Fig. 3 is the schematic flow sheet for the specific embodiment of method for packing first that the present invention has hot AWG chips；
Fig. 4 is the structural representation after step b1.2 operations in the first specific embodiment of the invention；
Fig. 5 is the encapsulating structure schematic diagram of hot AWG chips in the first specific embodiment in the present invention；
Fig. 6 is the schematic flow sheet for the specific embodiment of method for packing second that the present invention has hot AWG chips；
Fig. 7 is the structural representation after step b operations in the specific implementation of the present invention second；
Fig. 8 is the encapsulating structure schematic diagram of hot AWG chips in the second specific embodiment in the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
As shown in figure 1, the present invention provides a kind of method for packing for having hot AWG chips, it comprises the following steps：
Step a：The temperature filtered out is unqualified and be cut into the AWG chips 10 of simple grain and input/output fiber array
20th, 30 couplings form a sub-component (shown in Fig. 2).In the step in the majority for making AWG, such as optical design, chip manufacturing, encapsulation
And test etc., chip manufacturing and two factors that encapsulation is most relation cost.But if one want to chip manufacturing improves
The temperature exceeding standard problem of chip, then need very big input just to bring the chip cost of very little and save.Of the invention then utilization warp
Temperature exceeding standard after screening, the AWG chips that will be scrapped originally, the chip of temperature exceeding standard is carried out by rational method for packing
Make full use of, it is only necessary to which the input of very little is with regard to that can bring larger cost savings.
Step b：Input planar waveguide 22 or the region of output end planar waveguide 32 in AWG chips 10, along any angle
Straight cuts, AWG chips 10 are cut into two sections.
Step c：Two parts of AWG chips 10 of cut-out are coupled again, coupling environment temperature is T1, regulation joint-cutting both sides
Planar waveguide, pay attention to planar waveguide two parts can that coupling is cut off along X-Z two-dimensional adjustments, and ensure AWG chips 10
Center wavelength shift ITU wavelength in (T1-T2) × 0.011nm, wherein T2 is the operating temperature of chip.For example, in the present invention
In specific embodiment, if coupling environment temperature T1 is 25 DEG C, if to ensure that AWG works between 65 DEG C~85 DEG C, then then
The center wavelength shift ITU wavelength for needing to ensure AWG chips 10 is between -0.66nm~-0.44nm；When Environmental coupling temperature is
At 35 DEG C, then to ensure the center wavelength shift ITU wavelength of AWG chips 10 in -0.55nm~-0.33nm.
Step d：At the joint-cutting of the AWG chips 10 coupled, the equivalent matching fluid of filling refractive index, and to joint-cutting both sides
AWG chips 10 be fixed on the positioning.
Step e：Above-mentioned whole component is adhesive on heater with heat conduction.Using the inventive method encapsulate half into
Product, it is necessary to carry out detection screening, to judge whether it meets temperature conditionss again.Its screening technique and the screening temperature in step a
The operation for spending underproof chip is essentially identical.
As the first specific embodiment of the present invention, as shown in figure 3, step b specifically includes step b1.1：By step a
In sub-component be bonded on a substrate 40；Step b1.2：In the input planar waveguide 22 or output end flat board ripple of AWG chips 10
32 regions are led, along any angle straight cuts, AWG chips 10 and substrate 40 are cut into two sections (shown in Fig. 4) simultaneously.Specifically
, the substrate 40 can be silicon wafer substrate, vycor glass (Pyrex) substrate or invar alloy (Invar) substrate.
Further, the step d specifically includes step d1.1：Index matching is filled at the joint-cutting 12 of the chip 10 coupled
Ultraviolet glue 14；Step d1.2：Two blocks of Pyrex heat resistant glasses 122 are covered at the joint-cutting 12 of substrate 40, and are consolidated with ultraviolet glue
Determine (shown in Fig. 5).As a kind of alternative embodiment of the present invention, the Pyrex heat resistant glasses 122 can also use heat swollen
The equivalent other materials of swollen coefficient (CTE) substitutes.
As shown in fig. 6, second of specific embodiment as the present invention, the difference of itself and the first specific embodiment is,
, without being fixed on the positioning (shown in Fig. 7) using substrate, the step d specifically includes step d2.1 for it：In the AWG cores coupled
The place of joint-cutting 12 ' of piece 10, fill the ultraviolet glue 14 of index matching；Step d2.2：In the top of joint-cutting 12 ' one piece of Pyrex of lid
Heat resistant glass 122 ', around put ultraviolet glue curing (shown in Fig. 8).It is described as a kind of alternative embodiment of the present invention
Pyrex heat resistant glasses 122 ' can also use the equivalent other materials of CTE to substitute.
AWG chips 10 employed in the present invention can be curve or other arbitrary shapes, and it utilizes temperature
The principle that exceeded AWG chips are packaged is as follows：
AWG central wavelength lambda c is：
Wherein, neffFor the effective refractive index of Waveguide array, Δ L is the length difference of Waveguide array adjacent waveguide, and m is diffraction
Series.
To above formula to temperature T derivations, obtain AWG centre wavelengths is to temperature dependency：
WhereinThe thermo-optical coeffecient of composition Waveguide array is represented,For the thermal linear expansion coefficient of substrate.
Usually, array waveguide grating ducting layer is made up of silica glass material, and ducting layer is located on silicon substrate, for this silicon
For base SiO 2 waveguide,
neff=1.456
In λcAt=1550nm, above formula is substituted into, obtains the temperature drift coefficient of centre wavelength
And the reason such as deviation due to chip fabrication technique, the actual temperature deviation ratio of chip is 11pm/ DEG C.
According to AWG linear dispersion relation, the relation for obtaining displacement and wave length shift is：
Wherein LfAnd nsIt is the focal length and refractive index of planar waveguide respectively, d is adjacent array waveguide on output planar waveguide
Spacing, ngIt is the group index of Waveguide array.
Therefore as shown in figs. 4 and 7, if inputting or exporting on planar waveguide any position with any angle along C lines
Cut, by mobile input waveguide part, allow it to produce relative movement in X direction, when the phase of two parts planar waveguide of incision
When being Δ x to displacement, the centre wavelength of a certain output channel with displacement change
Then
If make Δ λ 'cBetween -0.66nm~-0.44nm of ITU wavelength, relative cutting is calculated according to above formula can
Into two-part planar waveguide displacement x.
Further, the present invention also provides a kind of hot AWG chips made using above-mentioned first specific embodiment method
Encapsulating structure (shown in Fig. 5), it includes：One substrate 40 and viscous sub-component on the substrate 40, the sub-component is interior to include one
Temperature is unqualified after screening and has been cut into the AWG chips 10 of simple grain, and the AWG chips 10 are close to the one of input slab guide 22
Side is coupled with input optical fibre array 20, and AWG chips 10 are coupled with output optical fibre array close to the side of output end slab guide 32
30；There is the joint-cutting 12 of a straight cuts input of the AWG chips 10 or output end lab waveguide region, and the joint-cutting 12 will
AWG chips 10 and substrate 40 are cut into two sections simultaneously；Filled with the matching that refractive index is equivalent at the joint-cutting 12 of the AWG chips 10
Liquid, positioner is provided with the joint-cutting 12 of substrate 40.Specifically, the substrate 40 can be silicon wafer substrate, vycor
Glass (Pyrex) substrate or invar alloy (Invar) substrate.In the specific embodiment of the invention, the joint-cutting of the AWG chips 10
Filled with the equivalent ultraviolet glue 14 of refractive index at 12, be stamped at the joint-cutting 12 of substrate 40 two pieces be used for position Pyrex it is heat-resisting
Glass 122, fixed between the Pyrex heat resistant glasses 122 and substrate 40 by ultraviolet glue 14.
Likewise, the present invention also provides a kind of envelope of the hot AWG chips made using above-mentioned second specific embodiment method
Assembling structure (shown in Fig. 8), it is unqualified and be cut into the AWG chips 10 of simple grain that it includes the temperature after screening, the AWG chips 10
Input optical fibre array 20 is coupled with close to the side of input slab guide 22, AWG chips 10 are close to output end slab guide 32
Side be coupled with output optical fibre array 30；There is a straight line input of the AWG chips 10 or output end lab waveguide region
AWG chips 10 are cut into two sections by the joint-cutting 12 ' of cutting, the joint-cutting 12 '；The place of joint-cutting 12 ' of the AWG chips 10 is filled with folding
The equivalent matching fluid of rate is penetrated, and positioner is additionally provided with joint-cutting.In the specific embodiment of the invention, the AWG chips 10
The place of joint-cutting 12 ' filled with the equivalent ultraviolet glue 14 of refractive index, and be additionally provided with the place of joint-cutting 12 ' resistance to for the Pyrex of positioning
Hot glass 122 ', fixed between the Pyrex heat resistant glasses 122 ' and AWG chips 10 by ultraviolet glue 14.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (10)
1. a kind of method for packing for having hot AWG chips, it is characterised in that comprise the following steps：
Step a：The temperature filtered out is unqualified and be cut into the AWG chips of simple grain and couple shape with input/output fiber array
Into a sub-component；
Step b：Input or output end lab waveguide region in AWG chips, along any angle straight cuts, by AWG chips
It is cut into two sections；
Step c：AWG chips two parts of cut-out are coupled again, coupling environment temperature is T1, the flat board ripple of regulation joint-cutting both sides
Lead, ensure the center wavelength shift ITU wavelength of AWG chips in (T1-T2) × 0.011nm, wherein T2 is the operating temperature of chip；
Step d：At the joint-cutting of the AWG chips coupled, the equivalent matching fluid of filling refractive index, and to the AWG on joint-cutting both sides
Chip is fixed on the positioning；
Step e：Above-mentioned whole component is adhesive on heater with heat conduction.
2. there is the method for packing of hot AWG chips as claimed in claim 1, it is characterised in that the step b also includes step
b1.1：Sub-component in step a is viscous on a substrate；Step b1.2：In the input or output end planar waveguide of AWG chips
Region, along any angle straight cuts, AWG chips and substrate are cut into two sections simultaneously.
3. have the method for packing of hot AWG chips as claimed in claim 2, it is characterised in that the substrate be silicon wafer substrate,
Pyrex heat resistant glasses substrate or Invar substrates.
4. there is the method for packing of hot AWG chips as claimed in claim 2, it is characterised in that the step d includes step
d1.1：The ultraviolet glue of index matching is filled at the joint-cutting of the chip coupled；Step d1.2：The lid at the joint-cutting of substrate
Upper two blocks of Pyrex heat resistant glasses, and with ultraviolet glue hydropexis.
5. there is the method for packing of hot AWG chips as claimed in claim 1, it is characterised in that the step d also includes step
d2.1：At the joint-cutting of the AWG chips coupled, the ultraviolet glue of index matching is filled；Step d2.2：Covered above joint-cutting
One block of Pyrex heat resistant glass, around puts ultraviolet glue curing.
6. a kind of encapsulating structure for having hot AWG chips, it is characterised in that including a substrate and the sub-component being bonded on substrate, institute
Stating includes that temperature is unqualified after screening and has been cut into the AWG chips of simple grain in sub-component, and the AWG chips are held level with both hands close to input
The side of face waveguide is coupled with input optical fibre array, and AWG chips are coupled with output optical fibre close to the side of output end slab guide
Array；There is a joint-cutting of a straight cuts input of the AWG chips or output end lab waveguide region, and the joint-cutting is by AWG cores
Piece and substrate are cut into two sections simultaneously；Filled with the matching fluid that refractive index is equivalent, the joint-cutting of substrate at the joint-cutting of the AWG chips
Place is provided with positioner.
7. have the encapsulating structure of hot AWG chips as claimed in claim 6, it is characterised in that the substrate be silicon wafer substrate,
Pyrex heat resistant glasses substrate or Invar substrates.
8. there is the encapsulating structure of hot AWG chips as claimed in claim 6, it is characterised in that filled out at the joint-cutting of the AWG chips
Filled with the equivalent ultraviolet glue of refractive index, be stamped at the joint-cutting of substrate two pieces be used for position Pyrex heat resistant glasses, the Pyrex
Pass through ultraviolet glue hydropexis between heat resistant glass and substrate.
9. a kind of encapsulating structure for having hot AWG chips, it is characterised in that including temperature is unqualified after screening and has been cut into list
The AWG chips of grain, the AWG chips are coupled with input optical fibre array close to the side of input slab guide, and AWG chips are close to defeated
The side for going out transverse plane waveguide is coupled with output optical fibre array；The input of the AWG chips or output end lab waveguide region
There is the joint-cutting of a straight cuts, AWG chips are cut into two sections by the joint-cutting；Refractive index is filled with the joint-cutting of the AWG chips
Equivalent matching fluid, and positioner is additionally provided with joint-cutting.
10. there is the encapsulating structure of hot AWG chips as claimed in claim 9, it is characterised in that at the joint-cutting of the AWG chips
Filled with the equivalent ultraviolet glue of refractive index, and the Pyrex heat resistant glasses for positioning are additionally provided with joint-cutting, the Pyrex is resistance to
Pass through ultraviolet glue hydropexis between hot glass and AWG chip.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109471219A (en) * | 2018-11-28 | 2019-03-15 | 武汉光迅科技股份有限公司 | A kind of AWG chip, production method and its adjusting method |
| CN112180503A (en) * | 2019-07-05 | 2021-01-05 | 博创科技股份有限公司 | Double-body type heat array waveguide grating and manufacturing method thereof |
| CN114114532A (en) * | 2021-11-05 | 2022-03-01 | 武汉永鼎光电子技术有限公司 | Method for implementing spectrum shape transformation of arrayed waveguide grating |
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| CN114114532A (en) * | 2021-11-05 | 2022-03-01 | 武汉永鼎光电子技术有限公司 | Method for implementing spectrum shape transformation of arrayed waveguide grating |
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