CN112165843B

CN112165843B - Heat sink device

Info

Publication number: CN112165843B
Application number: CN202011191703.9A
Authority: CN
Inventors: 谢德成
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-10-30
Filing date: 2020-10-30
Publication date: 2023-01-06
Anticipated expiration: 2040-10-30
Also published as: CN112165843A

Abstract

The embodiment of the application provides a heat dissipation device, which comprises a shell, a cold accumulator, a magnetic part, a magnet, a driving part, a heat accumulator and a heat dissipation assembly, wherein the cold accumulator, the magnetic part, the magnet, the driving part, the heat accumulator and the heat dissipation assembly are arranged on the shell; the driving part is connected with the magnetic part; the driving part drives the magnetic part to move between a first position and a second position, in the first position, the magnetic part is arranged corresponding to the cold accumulator, and the magnetic part is in a heat absorption state and exchanges heat with the cold accumulator; at the second position, the magnetic part is located in the magnetic field region that the magnet produced, the magnetic part corresponds the heat accumulator setting, just the magnetic part is in exothermic state with the heat accumulator carries out the heat exchange. The embodiment of the application improves the heat dissipation effect of the heat dissipation device.

Description

Heat sink device

Technical Field

The application relates to the technical field of electronic products, in particular to a heat dissipation device.

Background

With the development of electronic devices, functions supported by electronic devices are increasing, for example, mobile phones are gradually developing from simple functions such as making a call and sending a short message to shooting and recording, surfing the internet, watching a movie, chatting a video, playing a large-scale hand game, and the like. At present, electronic equipment has more and more functions, higher and faster operation speed and larger heat productivity. Because the heat consumption of electronic equipment is more and more, the internal space of the mobile phone is limited, and the space reserved for heat dissipation is less, a scheme of an external heat dissipation device is provided. At present, an external heat dissipation device usually adopts a scheme of natural heat dissipation and fan cooling, so that the external heat dissipation device is easily influenced by the external environment temperature, and the heat dissipation effect is poor.

Disclosure of Invention

The embodiment of the application provides a heat dissipation device to solve the problem that the heat dissipation device is affected by the external environment temperature and accordingly has a poor heat dissipation effect.

The embodiment of the application provides a heat dissipation device, which comprises a shell, a cold accumulator, a magnetic part, a magnet, a driving part, a heat accumulator and a heat dissipation assembly, wherein the cold accumulator, the magnetic part, the magnet, the driving part, the heat accumulator and the heat dissipation assembly are arranged on the shell; the driving part is connected with the magnetic part;

the driving part drives the magnetic part to move between a first position and a second position, in the first position, the magnetic part is arranged corresponding to the cold accumulator, and the magnetic part is in a heat absorption state and exchanges heat with the cold accumulator; at the second position, the magnetic part is located in the magnetic field region that the magnet produced, the magnetic part corresponds the heat accumulator setting, just the magnetic part is in exothermic state with the heat accumulator carries out the heat exchange.

The magnetic component is controlled by the driving component to reciprocate between the first position and the second position, so that heat of the cold accumulator is transferred to the heat accumulator through the magnetic component, and the heat on the heat accumulator is released to the environment through the heat dissipation assembly. Therefore, the refrigeration of the cold accumulator is realized through the magnetic component, so that the temperature of the cold accumulator is basically not influenced by the temperature of the external environment, and the heat dissipation effect of the heat dissipation device is improved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a use state of a heat dissipation device according to an embodiment of the present application;

fig. 2 is a second schematic view of a usage state structure of the heat dissipation apparatus according to the embodiment of the present application.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, the present embodiment provides a heat dissipation device, including a housing 10, and a cold accumulator 20, a magnetic member 30, a magnet 40, a driving member 50, a heat accumulator 60, and a heat dissipation assembly 70 disposed on the housing 10, wherein the cold accumulator 20 and the heat accumulator 60 are disposed at an interval, the magnet 40 is disposed between the cold accumulator 20 and the heat accumulator 60, and the heat dissipation assembly 70 is connected to the heat accumulator 60; the driving part 50 is connected with the magnetic part 30;

wherein the driving member 50 drives the magnetic member 30 to move between a first position and a second position, in the first position, the magnetic member 30 is arranged corresponding to the regenerator 20, and the magnetic member 30 exchanges heat with the regenerator 20 in a heat absorption state; in the second position, the magnetic block 30 is located in a magnetic field region generated by the magnet 40, the magnetic block 30 is disposed corresponding to the heat accumulator 60, and the magnetic block 30 is in a heat release state to exchange heat with the heat accumulator 60.

In this embodiment, the housing 10 may be directly detachably connected to the electronic device 80 to be cooled, and the electronic device 80 to be cooled may be carried on the housing and may exchange heat with the cold storage device. The electronic device 80 to be cooled may be an intelligent terminal such as a mobile phone and a PAD, and is not further limited herein.

Specifically, when the heat dissipation device is operated, the driving member 50 may control the magnetic member 30 to reciprocate between a first position and a second position, as shown in fig. 1, when the magnetic member 30 is located at the first position, the magnetic member 30 is not located in a magnetic field area generated by the magnet 40, or the magnet 40 does not generate a magnetic field, and at this time, the magnetic member 30 is in a demagnetized state, and the magnetic member 30 may actively absorb heat from the regenerator 20, so that the temperature of the regenerator 20 is reduced; as shown in fig. 2, when the magnetic member 30 is located at the second position, the magnetic member 30 is located in the magnetic field generated by the magnet 40, the magnetic member 30 is magnetized, and enters a heat release state, and heat is exchanged by the heat accumulator 60 to release heat, and the heat accumulator 60 can release heat to the external environment through the heat dissipation assembly 70.

The embodiment of the present application controls the magnetic member 30 to reciprocate between the first position and the second position by the driving member 50, thereby transferring the heat of the cold accumulator 20 to the heat accumulator 60 through the magnetic member 30, and releasing the heat on the heat accumulator 60 to the environment through the heat dissipating assembly 70. Thus, the refrigeration of the regenerator 20 is realized through the magnetic component, so that the temperature of the regenerator 20 is basically not influenced by the external environment temperature, and the heat dissipation effect of the heat dissipation device is improved.

It should be understood that the cold accumulator 20 and the regenerator 60 described above may be understood as heat exchangers, and are referred to as the cold accumulator 20 and the regenerator 60 only according to the roles played in the heat exchange process. The cold accumulator 20 includes cold accumulation working medium water and glycol solution, etc., for absorbing heat from the electronic device 80 side and releasing heat to the magnetic member 30 when the magnetic member 30 is demagnetized; the heat accumulator 60 includes a heat storage working medium water and a glycol solution, etc. for absorbing heat during magnetization of the magnetic member 30 and releasing heat to the heat dissipating member 70.

It should be noted that the magnetic component 30 may be a component made of a magnetic material, and specifically, may be a flat plate structure or a columnar structure, which is not further limited herein. The magnetic component can be magnetized when being positioned in the magnetic field generated by the magnet; and when the magnetic field is positioned outside the magnetic field generated by the magnet, the magnetic field can be in a demagnetizing state. Because the magnetic component is adopted as the refrigerating working medium, the following effects are achieved: energy conservation, environmental protection, high unit refrigeration rate, low energy consumption and easy miniaturization.

Optionally, the structure of the housing 10 may be set according to actual needs, for example, in some embodiments, the housing 10 includes a back plate 101 and a fixing clip 102, the back plate 101 is attached to the regenerator 20, and the fixing clip 102 is located on a side of the back plate 101 away from the regenerator 20 and is fixedly connected to the back plate 101.

It should be understood that the back plate 101 is used for supporting the electronic device and transferring heat between the electronic device 80 and the regenerator 20, and may be made of a material with good thermal conductivity, such as a metal material. That is, in some embodiments, the back plate 101 may be a metal back plate.

In this embodiment, the regenerator 20 and the fixing clip 102 are located on two opposite sides of the back plate 101, the fixing clip 102 is used for fixing the electronic device 80 on the back plate 101, and the back plate 101 is attached to the back plate, so that the heat dissipation effect of the electronic device 80 is improved. The back plate 101 can support and uniformly heat, and heat transferred from the electronic device 80 is firstly uniformly distributed on the back plate 101, so that the heat exchange area with the cold accumulator 20 is enhanced.

Optionally, in an embodiment, the fixing clip may include a first elastic buckle and a second elastic buckle, which are oppositely arranged, and the back plate 101, the first elastic buckle and the second elastic buckle together form a mounting portion, where the mounting portion is used for mounting the electronic device 80 to be cooled.

The mounting portion is substantially C-shaped, and after the electronic device 80 is mounted on the mounting portion, the electronic device 80 can be clamped and fixed between the first elastic buckle and the second elastic buckle. Each elastic buckle may include an elastic arm connected to the back plate 101, and a buckle body formed by extending one end of the elastic arm away from the back plate 101 to another elastic buckle, and a buckle position of the elastic buckle is on a side of the buckle body facing the back plate 101.

Further, the buckling positions of the first elastic buckle and the second elastic buckle are both provided with a flexible buffer part 103.

In this embodiment, above-mentioned flexible buffering piece 103 can be flexible ball, fixes the electronic equipment 80 installation on the back of detaining position and the second elastic buckle of first elastic buckle, and flexible buffering piece 103 will produce elastic deformation, and the fixed stability of electronic equipment 80 can be guaranteed to this flexible buffering piece 103's reverse effort to can further increase the heat-conduction efficiency of electronic equipment 80 and backplate 101, consequently further improve electronic equipment 80's radiating effect.

Optionally, in an embodiment, a flexible heat conducting gasket is disposed on a side of the back plate 101 away from the regenerator 20.

The flexible heat-conducting gasket can be made of materials such as silica gel and can also be called as a flexible heat-conducting silica gel gasket, and the flexible heat-conducting gasket is arranged between the back plate 101 and the electronic equipment 80, so that a gap between the back plate and the electronic equipment 80 can be filled, heat transfer resistance can be reduced, and heat dissipation performance can be improved.

Optionally, in other embodiments, in order to further enhance the heat dissipation signaling, flexible thermal pads may be disposed between the magnetic component 30 and the regenerator 20, and between the magnetic component 30 and the regenerator 60.

It should be understood that the above-mentioned structure of the magnet 40 can be set according to actual needs, for example, in an embodiment, the magnet 40 is an electromagnet or a permanent magnet.

When the magnet 40 is an electromagnet, the electromagnet may be configured to always generate a magnetic field, or the electromagnet may be configured to generate a magnetic field only when the magnetic member 30 is located at the second position. In order to ensure the strength of the magnetic field, the number of the magnets 40 may be two, and the two magnets 40 are spaced apart, and when the magnetic member 30 is located at the second position, the magnetic member 30 is located between the two magnets 40.

Alternatively, the position of the magnet 40 may be set according to actual requirements, for example, in an embodiment, the magnet 40 is fixedly connected to the housing 10, and when the magnetic component 30 is located at the second position, the magnet 40 is located opposite to the magnetic component 30.

It should be understood that when the magnet 40 is an electromagnet, the magnet 40 and the magnetic member 30 are fixed, and are directly disposed on the housing 10, so that the structure is simple and easy to implement. Specifically, the fixing of the magnet 40 may be achieved by providing a bracket or the like.

The magnet 40 described above with respect to the magnetic component 30 is understood to mean that the perpendicular projection of the magnetic component 30 onto the magnet 40 is located in the central region of the magnetic component 30.

It should be noted that, when the magnet 40 is an electromagnet, the magnetic field strength generated by the magnet 40 can be further set according to different heat dissipation requirements, so as to change the heat release speed of the magnet 40. For example, when the temperature of the electronic device 80 is high, the magnetic field strength may be set to be large, thereby improving the heat dissipation efficiency; when the temperature of the cushion device is low, the magnetic field strength can be set to be small, thereby reducing heat dissipation power consumption while ensuring heat dissipation efficiency.

Optionally, the structure of the heat dissipation assembly 70 may be set according to actual needs, for example, in an embodiment, the heat dissipation assembly 70 includes a heat dissipation substrate 701, heat dissipation fins 702 and a heat dissipation fan 703, where the heat dissipation substrate 701 is fixedly connected to the housing 10, the heat dissipation substrate 701 is attached to the heat accumulator 60, the heat dissipation fins 702 and the heat dissipation fan 703 are both disposed on a side of the heat dissipation substrate 701 away from the heat accumulator 60, and the heat dissipation fan 703 is located on a side of the heat dissipation fins 702 and is disposed corresponding to the heat dissipation fins 702.

In the embodiment of the present application, the heat dissipation assembly 70 may be understood as a fin radiator, and the heat dissipation fins 702 may be disposed in a certain ventilation channel, or a ventilation channel is formed by the heat dissipation fins, and the ventilation channel is controlled by a heat dissipation fan to circulate air, so as to bring heat on the heat dissipation fins to an external environment, thereby achieving heat dissipation. The structure of the heat dissipation fins 702 may be set according to actual needs, and is not further limited herein.

Optionally, the structure of the driving component 50 may be set according to actual needs, for example, in an embodiment, the driving component 50 includes a motor 501 and a lead screw 502, a rotating shaft of the motor 501 is connected with the lead screw 502, the magnetic component 30 includes a threaded through hole adapted to the lead screw 502, and the lead screw 502 is partially located in the threaded through hole.

In the embodiment of the present application, in order to improve the stability of the movement of the magnetic member 30, the number of the driving members 50 may be two and disposed at two opposite ends of the magnetic member 30.

It should be understood that, in an embodiment, the magnetic component 30 may be made of a magnetic material as a whole, or may be provided with a magnetic conductive portion made of a magnetic material, and a connecting portion for connecting with the screw rod 502, where a threaded through hole is provided on the connecting portion, and the connecting portion may be fixedly connected with the magnetic conductive portion, so as to implement the movement of the magnetic conductive portion. The magnetic material may be a rare earth, or may be other magnetic materials, for example, perovskite-like manganese oxide, transition metal-based material, ferromagnetic material, or the like.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation device is characterized by comprising a shell, a cold accumulator, a magnetic component, a magnet, a driving component, a heat accumulator and a heat dissipation assembly, wherein the cold accumulator, the magnetic component, the driving component, the heat accumulator and the heat dissipation assembly are arranged on the shell, the cold accumulator and the heat accumulator are arranged at intervals, the magnet is located between the cold accumulator and the heat accumulator, and the heat dissipation assembly is connected with the heat accumulator; the driving part is connected with the magnetic part;

the driving part drives the magnetic part to move between a first position and a second position, in the first position, the magnetic part is arranged corresponding to the cold accumulator, and the magnetic part is in a heat absorption state and exchanges heat with the cold accumulator; in the second position, the magnetic component is positioned in a magnetic field area generated by the magnet, the magnetic component is arranged corresponding to the heat accumulator, and the magnetic component is in a heat release state to exchange heat with the heat accumulator;

the shell comprises a back plate and a fixing clamp, the back plate is attached to the regenerator, and the fixing clamp is positioned on one side of the back plate, which is far away from the regenerator, and is fixedly connected with the back plate;

the fixation clamp comprises a first elastic buckle and a second elastic buckle which are oppositely arranged, the backboard is connected with the first elastic buckle and the second elastic buckle to form an installation part, and the installation part is used for installing an electronic device to be cooled.

2. The heat dissipation device as claimed in claim 1, wherein the fastening positions of the first elastic buckle and the second elastic buckle are provided with flexible buffering members.

3. The heat dissipating device of claim 1, wherein a flexible thermally conductive spacer is disposed on a side of the back plate remote from the regenerator.

4. The heat dissipating device of claim 1, wherein the magnet is an electromagnet or a permanent magnet.

5. The heat dissipating device of claim 4, wherein the magnet is fixedly attached to the housing and the magnet is disposed opposite the magnetic member when the magnetic member is in the second position.

6. The heat dissipation device of claim 1, wherein the heat dissipation assembly includes a heat dissipation substrate, heat dissipation fins, and a heat dissipation fan, wherein the heat dissipation substrate is fixedly connected to the housing, the heat dissipation substrate is attached to the heat accumulator, the heat dissipation fins and the heat dissipation fan are both disposed on a side of the heat dissipation substrate away from the heat accumulator, and the heat dissipation fan is disposed on a side of the heat dissipation fins and disposed corresponding to the heat dissipation fins.

7. The heat dissipation device as claimed in claim 1, wherein the driving member comprises a motor and a screw rod, a rotating shaft of the motor is connected with the screw rod, the magnetic member comprises a threaded through hole matched with the screw rod, and the screw rod is partially positioned in the threaded through hole.

8. The heat dissipating device of claim 7, wherein the number of the driving members is two and disposed at opposite ends of the magnetic member.