CN112163342A - Workpiece internal ultrasonic sound ray path simulation algorithm - Google Patents
Workpiece internal ultrasonic sound ray path simulation algorithm Download PDFInfo
- Publication number
- CN112163342A CN112163342A CN202011062543.8A CN202011062543A CN112163342A CN 112163342 A CN112163342 A CN 112163342A CN 202011062543 A CN202011062543 A CN 202011062543A CN 112163342 A CN112163342 A CN 112163342A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- sound ray
- reflection
- line segment
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004422 calculation algorithm Methods 0.000 title claims abstract description 17
- 238000004088 simulation Methods 0.000 claims abstract description 56
- 238000010586 diagram Methods 0.000 claims abstract description 33
- 238000001514 detection method Methods 0.000 claims abstract description 32
- 239000000523 sample Substances 0.000 claims description 21
- 238000004364 calculation method Methods 0.000 claims description 4
- 238000002372 labelling Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/10—Numerical modelling
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Geometry (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Computational Mathematics (AREA)
- Mathematical Analysis (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses an ultrasonic sound ray path simulation algorithm in a workpiece, which comprises the following steps: simulating a workpiece; marking a workpiece; determining an Ii sound ray detection starting point; determining an internal incident angle of the Ii sound ray workpiece; acquiring a first reflection intersection point; forming an Ii sound ray simulation diagram; and the complete simulation diagram is obtained, a plurality of sub sound ray simulation diagrams are obtained, and the plurality of sub sound ray simulation diagrams are overlapped to obtain the complete simulation diagram. The workpiece internal ultrasonic sound ray path simulation algorithm simulates the path of sound rays in a workpiece or a special-shaped workpiece through the refraction and reflection principle of the sound rays after converting the workpiece into a plurality of line segments, determines the path of the sound rays, feeds back the defect in a certain sound path through ultrasonic echo during actual detection, and finds the position of the workpiece corresponding to the defect according to the simulation result, thereby realizing the accurate positioning of the defect position of the workpiece and realizing the purpose of quickly positioning the defect of the workpiece and even the special-shaped workpiece.
Description
Technical Field
The invention belongs to the technical field of ultrasonic detection algorithms, and particularly relates to an ultrasonic sound ray path simulation algorithm in a workpiece.
Background
The ultrasonic phased array technology is the leading-edge technology in the technical field of nondestructive testing, develops rapidly in recent years, and is widely applied to various fields such as petroleum, chemical engineering, metallurgy, shipbuilding, aviation, aerospace and the like. The workpieces used in various fields are not only common flat plates and pipelines, but also other special-shaped workpieces such as elbows, flanges, corner joints, TKY, fillet welds, rails and the like. The workpieces have complex structures, the probe is not placed on a single horizontal plane, each reflecting edge is not a pure horizontal plane or a pure vertical plane, but an inclined plane, an arc surface and the like exist, and various types of planes and curved surfaces are combined.
For the special-shaped structures, an ultrasonic detection process is required to be established according to the covering condition of sound rays, and defect judgment is carried out on the acquired ultrasonic images.
At present, for such ultrasonic testing, a shape drawing gauge is generally used to obtain a shape outline of a workpiece testing surface, the shape is drawn on paper, and sound rays are manually drawn on the paper according to an echo sound path of an obtained image, a placing position and a probe angle, so as to determine defects. Such a determination method is troublesome, and when the shape profiles of different positions of the workpiece are different, the shape profile of the detection surface needs to be acquired many times. For example, a workpiece such as a TKY or a corner joint is formed by inserting two round pipes obliquely or straight, and since the shape of a weld between the two round pipes is saddle-shaped, the workpiece needs to be divided into 12 sections with a branch pipe as a center, and the shape and the contour of each section are different. The specific requirements of N different types of welded joint ultrasonic detection in NB-T47013.3-2015 appendix list the detection requirements of several common structural parts of the pressure-bearing equipment, the arrangement positions of the inner probes are different, and the covering conditions of sound rays are different.
Disclosure of Invention
The invention aims to provide an ultrasonic sound ray path simulation algorithm in a workpiece, which is suitable for workpieces in various shapes, can quickly simulate sound rays of various workpieces, particularly workpieces with special-shaped structures, and meets the requirement of quickly judging defects of the workpieces.
The technical scheme for solving the technical problems comprises the following steps:
an ultrasonic sound ray path simulation algorithm in a workpiece comprises the following steps:
workpiece simulation, namely inputting the appearance structure information of the workpiece into a processing terminal according to the appearance of the workpiece to simulate the shape of an electronic workpiece;
marking the workpiece, marking the shape of the electronized workpiece, and marking the reflection line segment as L1，L2，……LnLet us denote the non-reflection line segment as L1’，L2’，……Ln' and correspondingly marking the connecting angles Xi between the reflection line segment and the emission line segment and between the reflection line segment and the non-reflection line segment so as to determine the space positions between the line segments;
determining an Ii sound ray detection starting point, labeling the placement position of an ultrasonic probe in a processing terminal according to actual detection, determining a virtual position P0 corresponding to the wafer, reversely deducing an incident angle Ai ' of the Ii sound ray corresponding to the probe wafer through Snell's law when the sound ray angle Ai of the Ii sound ray emitted by the ultrasonic probe, calculating a surface intersection point P0 ' of the Ii sound ray emitted from the wafer to the probe wedge through the incident angle Ai ' of the wafer position P0 and the Ii sound ray, and determining a first point which meets error parameters 1 and 2 and passes through the intersection point of a straight line of P0 and P0 ' and a reflection line segment to be an Ii sound ray detection starting point P1;
determining the incident angle Bi inside the Ii sound ray workpiece, calculating the intersection point of the straight line where the Ii sound ray is located and the reflection line segment through the Ii sound ray angle Ai and the Ii sound ray detection starting point P1, and determining the incident angle Bi inside the workpiece of the Ii sound ray according to the refraction law and different refractive indexes of different workpiece materials;
acquiring a first reflection intersection point, calculating a refraction angle Bi as an incident angle according to the Ii sound ray refracted by the initial refraction angle Bi, and determining a reflection angle Ci of the Ii sound ray through a reflection law, wherein the refraction angle Bi is used as the incident angle, and the first reflection intersection point P2 of the refracted Ii sound ray and a reflection line segment;
forming an Ii sound ray simulation diagram, repeatedly calculating the intersection point Pj of the Ii sound ray and a reflection line segment by taking the reflection angle Ci obtained each time as a new incident angle according to the step of obtaining a first reflection intersection point until the reflection sound ray falls on a non-reflection line segment or reaches X times of echo number, stopping the algorithm, and sequentially connecting a plurality of intersection points Pj to obtain a complete Ii sound ray simulation diagram;
and (3) a complete simulation diagram, wherein the steps of determining a plurality of sound rays emitted by the wafer according to the Ii sound ray detection starting point, determining the internal incidence angle of the Ii sound ray workpiece, acquiring the first reflection intersection point and forming the Ii sound ray simulation diagram are sequentially carried out to obtain a plurality of pairs of sound ray simulation diagrams, and the pairs of sound ray simulation diagrams are overlapped to obtain the complete simulation diagram.
Specifically, the error parameter 1 is the maximum tolerance error value from an intersection point P0' of the sound ray and the surface of the wedge block of the probe to an intersection point P1 of the surface of the workpiece; the error parameter 2 is the maximum tolerance error value of the distance between the intersection point of the line segment and the line segment when the point P1 is not intersected with the line segment but is intersected with the straight line where the line segment is located when the point P1 is calculated as the intersection point of the sound ray and the line segment.
Specifically, the step of acquiring the first reflection intersection point further includes the following steps:
judging adjacent action line segment angle Z, the action line segment is a reflection line segment where a reflection point is located when reflecting Ii sound ray, the adjacent action line segment is a reflection line segment where two reflection points are located when the two reflection points are closest to the Ii sound ray, the adjacent action line segments are respectively marked as Li and Li + j, when Li is parallel to Li + j, the Ii sound ray is uniformly reflected, the adjacent action line segment angle Z =180 degrees, when Li is directly intersected with Li + j, a processing terminal reads the angle Xi of Li and Li + j marked in a workpiece marking step, the adjacent action line segment angle Z = Xi, when Li is not directly intersected with Li + j, the processing terminal directly passes through an intersection point formed by extending Li and Li + j and reads the angles corresponding to Li, Li and Li + j marked in the workpiece marking step and a plurality of line segments clamped between the two line segments, and calculates the angle Yi of Li and Li + j, at this time, the adjacent action line segment angle Z = Yi;
obtaining a reflection angle Ci of the Ii sound ray, wherein the reflection angle Ci is equal to an incident angle Bi when Z =180 degrees, and when Z = Xi or Yi is that the intersection of a line segment Li and Li + j and two corresponding reflection points form a triangle, and combining the angle of Li and Li + j and the incident angle Bi of the Ii sound ray through the internal angle sum of the triangle to be 180 degrees to obtain the reflection angle Ci =90 degrees- (180-Xi/Yi- (90-Bi)).
Specifically, in the workpiece marking step, the marking of the workpiece is calculated by a specific workpiece calculation method or converted by an engineering drawing to obtain corresponding marking data.
Specifically, the reflection line segment is a simulation line segment formed by a workpiece simulation step on a corresponding surface which requires the workpiece to be reflected during actual detection, and the non-reflection line segment is a simulation line segment formed by a workpiece simulation step on a corresponding surface which does not require the workpiece to be reflected during actual detection.
The invention has the following beneficial effects: the method comprises the steps of converting a workpiece into multiple line segments, simulating the path of sound rays in the workpiece or the special-shaped workpiece through the refraction and reflection principle of the sound rays, determining the path of the sound rays, feeding back the defect in a certain sound path through ultrasonic echo during actual detection, and finding the position of the workpiece corresponding to the defect according to the simulation result, so that the position of the defect of the workpiece is accurately positioned, and the purpose of quickly positioning the defect of the workpiece and even the special-shaped workpiece is realized.
Drawings
FIG. 1 is a schematic illustration of the location of the surface intersection point P0' of the probe wedge of the present invention.
Fig. 2 is a schematic diagram of the position of the Ii sound ray detection starting point P1 according to the present invention.
Fig. 3 is a diagram of an Ii sound ray simulation according to the present invention.
Fig. 4 is a simulation result simulation diagram of the present invention.
Fig. 5 is a simulation of simulation results of the present invention application in fig. 2.
The reference numbers in the figures have the following meanings:
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
Example (b):
the ultrasonic sound ray path simulation algorithm in the workpiece 3 comprises the following steps:
simulating the workpiece 3, inputting the appearance structure information of the workpiece 3 into a processing terminal according to the appearance of the workpiece 3, and simulating the shape of the electronized workpiece 3; the workpiece 3 simulation can form the workpiece 3 by performing corresponding calculation on the actual workpiece 3, or derive a line drawing of the workpiece 3 by mechanical drawing software, and simulate the specific shape of the workpiece 3 at a processing terminal.
Marking the workpiece 3, marking the shape of the electronized workpiece 3, and marking the reflection line segment as L1，L2，……LnLet us denote the non-reflection line segment as L1’，L2’，……Ln' and correspondingly marking the connecting angles Xi between the reflection line segment and the emission line segment and between the reflection line segment and the non-reflection line segment so as to determine the space positions between the line segments; specifically, in the step of labeling the workpiece 3, the label of the workpiece 3 is calculated by a specific workpiece 3 calculation method or converted by an engineering drawing to obtain corresponding label data. In the conventional workpiece 3, each line segment represents a straight line, a circular arc or other line segment, but in general, the line segment is a uniform transition without a break angle, and is mainly obtained by obtaining all points of the workpiece 3 and then arranging the points.
Specifically, the reflection line segment is a simulation line segment formed by a simulation step of the workpiece 3 on a corresponding surface which requires reflection of the workpiece 3 in actual detection, and the non-reflection line segment is a simulation line segment formed by a simulation step of the workpiece 3 on a corresponding surface which does not require reflection of the workpiece 3 in actual detection.
For example, a common flat plate is composed of an upper parallel line segment and a lower parallel line segment, and a vertical line segment perpendicular to and closing the two parallel line segments. For example, a circular tube section, we can form a reflection line segment by two circles, and here, it is necessary to convert the two circles according to the formula (x-x0)2+ (y-y0)2= r2 of the circle, divide the circle n equally according to the required accuracy, and connect the points into a line segment as an input. These input conditions are all dissected according to the characteristics of the workpiece 3, for different workpieces 3. For more complex workpieces 3, the conversion may be performed by means of other mechanical drawing software (e.g. CAD software) which is generally capable of converting a particular workpiece 3 into a line segment output.
Determining an Ii sound ray detection starting point, labeling the placement position of an ultrasonic probe in a processing terminal according to actual detection, determining a virtual position P0 corresponding to the wafer 1, reversely deducing an incident angle Ai ' of the Ii sound ray corresponding to the probe wafer 1 through Snell's law when the Ii sound ray angle Ai is emitted by the ultrasonic probe, calculating a surface intersection point P0 ' of the Ii sound ray emitted from the wafer 1 to the probe wedge 2 through the incident angle Ai ' of the wafer 1 position P0 and the Ii sound ray, as shown in FIG. 1, and determining the Ii sound ray detection starting point P1 as shown in FIG. 2 through a first point of intersection points of a straight line where P0 and P0 ' are located and a reflection line segment, which meets error parameters 1 and 2; specifically, the error parameter 1 is the maximum tolerance error value from an intersection point P0' of the sound ray and the surface of the probe wedge 2 to an intersection point P1 of the surface of the workpiece 3; the error parameter 2 is the maximum tolerance error value of the distance between the intersection point of the line segment and the line segment when the point P1 is not intersected with the line segment but is intersected with the straight line where the line segment is located when the point P1 is calculated as the intersection point of the sound ray and the line segment. The error parameter is mainly set for slight errors which may exist when the processing terminal carries out processing and the actual workpiece 3 is detected, generally, the ultrasonic probe wedge block 2 is directly attached to the workpiece 3, but sometimes due to the special condition of the workpiece 3, the wedge block 2 cannot be directly attached to the workpiece 3, so that the error parameter 1 is introduced, and the simulation effect is close to the actual detection condition, namely, the value of the error parameter 1 is determined by the distance error when the wedge block 2 is attached to the workpiece 3. The error parameter 2 is set because the line segment should intersect the sound ray theoretically due to the accuracy error of the processing terminal, so that the calculated point has an error with the theoretical point, and the actual display condition of the workpiece is generally controlled according to the processing terminal. The processing terminal generally employs a computer as a function.
Determining the incident angle inside the Ii sound ray workpiece 3, calculating the intersection point of the straight line where the Ii sound ray is located and the reflection line segment through the Ii sound ray angle Ai and the Ii sound ray detection starting point P1, and determining the incident angle Bi of the Ii sound ray inside the workpiece 3 according to the refraction law and different refractive indexes of different materials of the workpiece 3; the incident angle Bi inside the workpiece 3 is the initial angle of sound ray propagation inside the workpiece 3, and the angle needs to be accurately determined so as to ensure that the sound ray simulation and the actual detection are matched with each other.
Acquiring a first reflection intersection point, calculating a refraction angle Bi as an incident angle according to the Ii sound ray refracted by the initial refraction angle Bi, and determining a reflection angle Ci of the Ii sound ray through a reflection law, wherein the refraction angle Bi is used as the incident angle, and the first reflection intersection point P2 of the refracted Ii sound ray and a reflection line segment;
specifically, the method also comprises the following steps:
judging adjacent action line segment angle Z, the action line segment is a reflection line segment where a reflection point is located when reflecting Ii sound ray, the adjacent action line segment is a reflection line segment where two reflection points are located when the two reflection points are closest to the Ii sound ray, the adjacent action line segments are respectively marked as Li and Li + j, when Li is parallel to Li + j, the Ii sound ray is uniformly reflected, the adjacent action line segment angle Z =180 degrees, when Li is directly intersected with Li + j, the processing terminal reads the angle Xi of Li and Li + j marked in the marking step of the workpiece 3, the adjacent action line segment angle Z = Xi, when Li is not directly intersected with Li + j, the processing terminal directly reads the angle corresponding to Li, Li + j and a plurality of line segments clamped between the Li and Li + j marked in the marking step of the workpiece 3, and calculates the angle Yi of Li and Li + j, at this time, the adjacent action line segment angle Z = Yi; the adjacent action line segment angle Z is determined as long as it is ensured that the reflection angle of the Ii sound ray can be calculated, when the workpiece 3 is in a uniform shape, the sound ray is uniformly propagated, and when the detected special-shaped workpiece 3 is in a non-uniform shape, the propagation of the sound ray is diversified, so that the adjacent action line segment angle Z needs to be determined to determine each reflection angle of the Ii sound ray.
Obtaining a reflection angle Ci of the Ii sound ray, wherein the reflection angle Ci is equal to an incident angle Bi when Z =180 degrees, and when Z = Xi or Yi is that the intersection of a line segment Li and Li + j and two corresponding reflection points form a triangle, and combining the angle of Li and Li + j and the incident angle Bi of the Ii sound ray through the internal angle sum of the triangle to be 180 degrees to obtain the reflection angle Ci =90 degrees- (180-Xi/Yi- (90-Bi)). Because the shapes of the special-shaped workpieces 3 are different, the adjacent action line segments may be non-adjacent line segments, and therefore the reflection angle Ci of the Ii sound ray needs to be independently judged, and the accuracy and the availability of the simulation effect are ensured.
Forming an Ii sound ray simulation diagram, repeatedly calculating the intersection point Pj of the Ii sound ray and a reflection line segment by taking the reflection angle Ci obtained each time as a new incident angle according to the step of obtaining a first reflection intersection point until the reflection sound ray falls on a non-reflection line segment or reaches X times of echo number, stopping the algorithm, and sequentially connecting a plurality of intersection points Pj to obtain a complete Ii sound ray simulation diagram; a single sound ray forms a single sound ray simulation diagram as shown in fig. 3.
And (3) a complete simulation diagram, wherein the steps of determining a plurality of sound rays emitted by the wafer 1 according to the Ii sound ray detection starting point, determining the internal incidence angle of the Ii sound ray workpiece 3, obtaining the first reflection intersection point and forming the Ii sound ray simulation diagram are sequentially carried out to obtain a plurality of sub sound ray simulation diagrams, and the plurality of sub sound ray simulation diagrams are overlapped to obtain the complete simulation diagram. And (3) superposing the multiple sound ray simulation diagrams to obtain a complete simulation diagram, wherein fig. 4 and 5 are simulation result simulation diagrams of two different workpieces 3.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (5)
1. An ultrasonic sound ray path simulation algorithm in a workpiece is characterized by comprising the following steps:
workpiece simulation, namely inputting the appearance structure information of the workpiece into a processing terminal according to the appearance of the workpiece to simulate the shape of an electronic workpiece;
marking the workpiece, marking the shape of the electronized workpiece, and marking the reflection line segment as L1，L2，……LnLet us denote the non-reflection line segment as L1’，L2’，……Ln' and correspondingly marking the connecting angles Xi between the reflection line segment and the emission line segment and between the reflection line segment and the non-reflection line segment so as to determine the space positions between the line segments;
determining an Ii sound ray detection starting point, labeling the placement position of an ultrasonic probe in a processing terminal according to actual detection, determining a virtual position P0 corresponding to the wafer, reversely deducing an incident angle Ai ' of the Ii sound ray corresponding to the probe wafer through Snell's law when the sound ray angle Ai of the Ii sound ray emitted by the ultrasonic probe, calculating a surface intersection point P0 ' of the Ii sound ray emitted from the wafer to the probe wedge through the incident angle Ai ' of the wafer position P0 and the Ii sound ray, and determining a first point which meets error parameters 1 and 2 and passes through the intersection point of a straight line of P0 and P0 ' and a reflection line segment to be an Ii sound ray detection starting point P1;
determining the incident angle Bi inside the Ii sound ray workpiece, calculating the intersection point of the straight line where the Ii sound ray is located and the reflection line segment through the Ii sound ray angle Ai and the Ii sound ray detection starting point P1, and determining the incident angle Bi inside the workpiece of the Ii sound ray according to the refraction law and different refractive indexes of different workpiece materials;
acquiring a first reflection intersection point, calculating a refraction angle Bi as an incident angle according to the Ii sound ray refracted by the initial refraction angle Bi, and determining a reflection angle Ci of the Ii sound ray through a reflection law, wherein the refraction angle Bi is used as the incident angle, and the first reflection intersection point P2 of the refracted Ii sound ray and a reflection line segment;
forming an Ii sound ray simulation diagram, repeatedly calculating the intersection point Pj of the Ii sound ray and a reflection line segment by taking the reflection angle Ci obtained each time as a new incident angle according to the step of obtaining a first reflection intersection point until the reflection sound ray falls on a non-reflection line segment or reaches X times of echo number, stopping the algorithm, and sequentially connecting a plurality of intersection points Pj to obtain a complete Ii sound ray simulation diagram;
and (3) a complete simulation diagram, wherein the steps of determining a plurality of sound rays emitted by the wafer according to the Ii sound ray detection starting point, determining the internal incidence angle of the Ii sound ray workpiece, acquiring the first reflection intersection point and forming the Ii sound ray simulation diagram are sequentially carried out to obtain a plurality of pairs of sound ray simulation diagrams, and the pairs of sound ray simulation diagrams are overlapped to obtain the complete simulation diagram.
2. The workpiece internal ultrasonic sound ray path simulation algorithm of claim 1, wherein: the error parameter 1 is the maximum tolerance error value from the intersection point P0' of the sound ray and the surface of the wedge block of the probe to the intersection point P1 of the surface of the workpiece; the error parameter 2 is the maximum tolerance error value of the distance between the intersection point of the line segment and the line segment when the point P1 is not intersected with the line segment but is intersected with the straight line where the line segment is located when the point P1 is calculated as the intersection point of the sound ray and the line segment.
3. The workpiece internal ultrasonic sound ray path simulation algorithm of claim 2, wherein the step of obtaining the first reflection intersection point further comprises the steps of:
judging adjacent action line segment angle Z, the action line segment is a reflection line segment where a reflection point is located when reflecting Ii sound ray, the adjacent action line segment is a reflection line segment where two reflection points are located when the two reflection points are closest to the Ii sound ray, the adjacent action line segments are respectively marked as Li and Li + j, when Li is parallel to Li + j, the Ii sound ray is uniformly reflected, the adjacent action line segment angle Z =180 degrees, when Li is directly intersected with Li + j, a processing terminal reads the angle Xi of Li and Li + j marked in a workpiece marking step, the adjacent action line segment angle Z = Xi, when Li is not directly intersected with Li + j, the processing terminal directly passes through an intersection point formed by extending Li and Li + j and reads the angles corresponding to Li, Li and Li + j marked in the workpiece marking step and a plurality of line segments clamped between the two line segments, and calculates the angle Yi of Li and Li + j, at this time, the adjacent action line segment angle Z = Yi;
obtaining a reflection angle Ci of the Ii sound ray, wherein the reflection angle Ci is equal to an incident angle Bi when Z =180 degrees, and when Z = Xi or Yi is that the intersection of a line segment Li and Li + j and two corresponding reflection points form a triangle, and combining the angle of Li and Li + j and the incident angle Bi of the Ii sound ray through the internal angle sum of the triangle to be 180 degrees to obtain the reflection angle Ci =90 degrees- (180-Xi/Yi- (90-Bi)).
4. The workpiece internal ultrasonic sound ray path simulation algorithm according to any one of claims 1 to 3, wherein: in the workpiece marking step, the marking of the workpiece is calculated by a specific workpiece calculation method or converted by an engineering drawing to obtain corresponding marking data.
5. The workpiece internal ultrasonic sound ray path simulation algorithm of claim 4, wherein: the reflection line segment is a simulation line segment formed by a workpiece simulation step on a corresponding surface which requires the workpiece to be reflected during actual detection, and the non-reflection line segment is a simulation line segment formed by a workpiece simulation step on a corresponding surface which does not require the workpiece to be reflected during actual detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011062543.8A CN112163342A (en) | 2020-09-30 | 2020-09-30 | Workpiece internal ultrasonic sound ray path simulation algorithm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011062543.8A CN112163342A (en) | 2020-09-30 | 2020-09-30 | Workpiece internal ultrasonic sound ray path simulation algorithm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112163342A true CN112163342A (en) | 2021-01-01 |
Family
ID=73860933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011062543.8A Pending CN112163342A (en) | 2020-09-30 | 2020-09-30 | Workpiece internal ultrasonic sound ray path simulation algorithm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112163342A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114113325A (en) * | 2021-12-10 | 2022-03-01 | 润电能源科学技术有限公司 | Phased array ultrasonic signal positioning method, device and system and storage medium |
| CN116559297A (en) * | 2023-07-06 | 2023-08-08 | 汕头市超声检测科技有限公司 | Ultrasonic phased array defect image fusion method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014041068A (en) * | 2012-08-23 | 2014-03-06 | Hitachi Ltd | Ultrasonic inspection device and method |
| CN104359982A (en) * | 2014-11-19 | 2015-02-18 | 哈尔滨工业大学 | Method for ultrasonic phased array detection of sheet weld joint by wedge block |
| US20170132335A1 (en) * | 2013-11-26 | 2017-05-11 | Steve PECHBERTI | Method for simulating wave propagation; simulator, computer program and recording medium for implementing the method |
| CN107533808A (en) * | 2015-03-20 | 2018-01-02 | 多伦多大学管理委员会 | Ultrasonic simulation system and method |
| CN108490078A (en) * | 2018-02-28 | 2018-09-04 | 汕头市超声检测科技有限公司 | The single side bilateral Multi-angle ultrasound detection method of foreign structure pattern pipeline-weld |
-
2020
- 2020-09-30 CN CN202011062543.8A patent/CN112163342A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014041068A (en) * | 2012-08-23 | 2014-03-06 | Hitachi Ltd | Ultrasonic inspection device and method |
| US20170132335A1 (en) * | 2013-11-26 | 2017-05-11 | Steve PECHBERTI | Method for simulating wave propagation; simulator, computer program and recording medium for implementing the method |
| CN104359982A (en) * | 2014-11-19 | 2015-02-18 | 哈尔滨工业大学 | Method for ultrasonic phased array detection of sheet weld joint by wedge block |
| CN107533808A (en) * | 2015-03-20 | 2018-01-02 | 多伦多大学管理委员会 | Ultrasonic simulation system and method |
| CN108490078A (en) * | 2018-02-28 | 2018-09-04 | 汕头市超声检测科技有限公司 | The single side bilateral Multi-angle ultrasound detection method of foreign structure pattern pipeline-weld |
Non-Patent Citations (2)
| Title |
|---|
| A. FERRAND等: "Modeling of ray paths of head waves on irregular 1 interfaces in TOFD inspection for NDE", ULTRASONICS, vol. 54, no. 7, 18 December 2013 (2013-12-18), pages 1851 - 1860, XP029009691, DOI: 10.1016/j.ultras.2013.12.007 * |
| 曲文元;熊建设;秦勃;蔡杰;: "基于声线跟踪法开发超声无损检测动态仿真软件", 计算机仿真, vol. 23, no. 04, 28 April 2006 (2006-04-28), pages 269 - 273 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114113325A (en) * | 2021-12-10 | 2022-03-01 | 润电能源科学技术有限公司 | Phased array ultrasonic signal positioning method, device and system and storage medium |
| CN114113325B (en) * | 2021-12-10 | 2024-02-20 | 润电能源科学技术有限公司 | Phased array ultrasonic signal positioning method, device, system and storage medium |
| CN116559297A (en) * | 2023-07-06 | 2023-08-08 | 汕头市超声检测科技有限公司 | Ultrasonic phased array defect image fusion method |
| CN116559297B (en) * | 2023-07-06 | 2023-09-12 | 汕头市超声检测科技有限公司 | Ultrasonic phased array defect image fusion method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111537612B (en) | Phased array detection and assessment method for austenitic stainless steel small-diameter pipe welding joint | |
| US10921291B2 (en) | Method for inspecting a weld seam | |
| CN112163342A (en) | Workpiece internal ultrasonic sound ray path simulation algorithm | |
| US9672187B2 (en) | System and method for directing guided waves through structures | |
| CN109781860B (en) | Reference block and calibration method | |
| CA1270940A (en) | Method for classification of point and elongated single defects in workpieces by means of ultrasonics | |
| Casula et al. | Control of complex components with smart flexible phased arrays | |
| Mineo et al. | Generalised bisection method for optimum ultrasonic ray tracing and focusing in multi-layered structures | |
| CN102662000B (en) | Ultrasonic flaw detection method for computer-assisted examination | |
| CN109239184B (en) | Ultrasonic phased array detection method for pipe seat fillet weld | |
| CN103604869B (en) | Based on the recognition methods of the Non-Destructive Testing simulating test pieces defect parameters of numerical inversion | |
| JP2005274583A (en) | Ultrasonic flaw detection method and its system | |
| Kainat et al. | Identifying initial imperfection patterns of energy pipes using a 3D laser scanner | |
| JP2010175259A (en) | Ultrasonic flaw detector and ultrasonic flaw detecting method | |
| CN112326799A (en) | Method for applying phased array technology to pressure pipeline regular inspection and grading | |
| CN113533531A (en) | Material damage positioning device, positioning method and verification method | |
| SÉGUIN-CHARBONNEAU et al. | Automated Path Generation for Robotic UT Inspection of CFRP Components | |
| Dorval et al. | Simulation of the UT inspection of planar defects using a generic GTD-Kirchhoff approach | |
| CN215641042U (en) | Phased array ultrasonic detection test block for stainless steel small-diameter pipe weld joint | |
| JP2005351760A (en) | Distortion measuring method and system | |
| Richard et al. | Advanced software tools for design and implementation of phased array UT inspection techniques on complex components | |
| Kainat | Initial Imperfections of High Strength UOE Manufactured Steel Pipes and Their Effects on Pipe Buckling | |
| Upadhyay et al. | Robot based preventive maintenance system for in-service inspection of equipments | |
| JP4667752B2 (en) | Thickness measurement method | |
| Mackintosh et al. | Field experience and best practices for laser assessment of pipeline damage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |