CN112153820A - Method for improving thick copper plate tin spraying and plate explosion - Google Patents
Method for improving thick copper plate tin spraying and plate explosion Download PDFInfo
- Publication number
- CN112153820A CN112153820A CN202011177814.4A CN202011177814A CN112153820A CN 112153820 A CN112153820 A CN 112153820A CN 202011177814 A CN202011177814 A CN 202011177814A CN 112153820 A CN112153820 A CN 112153820A
- Authority
- CN
- China
- Prior art keywords
- pcb
- plate
- routing
- tin spraying
- explosion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 48
- 239000010949 copper Substances 0.000 title claims abstract description 48
- 238000005507 spraying Methods 0.000 title claims abstract description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004880 explosion Methods 0.000 title claims abstract description 18
- 238000005406 washing Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 238000011068 loading method Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 9
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of PCB (printed circuit board) manufacturing, in particular to a method for improving thick copper plate tin spraying and plate explosion, which comprises the following steps: routing the PCB before tin spraying, and routing copper blocks on the side edges of the PCB in the routing. Compared with the prior art, the copper blocks on the side edges of the PCB are routed before the baking plate, so that the base material of the PCB is exposed. After the copper blocks are omitted on the side of the PCB, heat can be better released during tin spraying, and therefore the PCB can be effectively prevented from being exploded during tin spraying.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a method for improving thick copper plate tin spraying and plate explosion.
Background
The manufacture of the PCB needs to pass through a plurality of processes, and the manufacture of the existing PCB comprises the following steps: the hot-spray tin process is adopted, if the copper layer of the PCB is thicker, the PCB cracks due to the heat release failure in time and capacity, so that the phenomenon of plate explosion is caused.
Therefore, there is a need to provide a new method for improving the hot spraying and plate explosion of thick copper plates to solve the above technical problems.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for improving the tin spraying and board explosion of a thick copper board, which has less working procedures and can effectively prevent the PCB board from exploding during tin spraying.
The invention solves the technical problem by adopting the technical scheme that a method for improving the thick copper plate tin spraying plate explosion comprises the following steps: routing the PCB before tin spraying, and routing copper blocks on the side edges of the PCB in the routing.
Preferably, the copper blocks on any two sides of the PCB are gonged down in the gong board.
Preferably, the copper blocks on any three sides of the PCB are routed away in the routing board.
Preferably, the copper blocks on all sides of the PCB are gonged down in the gong board.
Preferably, the thickness of the copper layer of the PCB is equal to or greater than 5 oz.
Preferably, the method further comprises the following steps of: baking a PCB, entering the PCB, grinding the PCB, overflow washing, pressurized washing, micro-etching, overflow washing, ultrasonic washing, pressurized washing, drying the PCB, combining the PCB with rosin, turning over the PCB and loading the PCB onto the PCB.
Compared with the prior art, the copper blocks on the side edges of the PCB are routed before the baking plate, so that the base material of the PCB is exposed. After the copper blocks are omitted on the side of the PCB, heat can be better released during tin spraying, and therefore the PCB can be effectively prevented from being exploded during tin spraying.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
In the figure:
the manufacturing method comprises the following steps of 1, a PCB, 2, a copper layer, 3, a copper block and 4, wherein the area is milled off.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the embodiment provides a method for improving the hot air solder leveling and plate explosion of a thick copper plate, which comprises the following steps: carrying out routing on the PCB board 1 before tin spraying, and routing the copper blocks 3 on the side edge of the PCB board 1. The copper billet 3 of side is exposed the substrate of PCB board 1 after being gong and fallen, does not have sheltering from of copper billet 3, and the heat dissipation of PCB board is good, can effectively reduce and explode the board risk. If in the routing, the copper blocks 3 of any two sides of the PCB 1 are routed away, the base materials on the two sides are exposed, and the heat dissipation effect is better than that of the copper blocks 3 only routed away one side. If in the routing, the copper blocks 3 of any three sides of the PCB 1 are routed away, the base materials on the three sides are exposed, and the heat dissipation effect is better than that of the copper blocks 3 only routing away two sides. If in the routing, the copper blocks 3 on any four sides of the PCB 1 are routed away, the base materials on the four sides are exposed, and the heat dissipation effect is better than that of the copper blocks 3 only routing away three sides. The better the heat dissipation effect, the lower the risk of board explosion. In this embodiment, the copper block 3 on the side opposite to the PCB 1 is routed away.
When the thickness of the copper layer 2 of the PCB 1 is more than or equal to 5oz, the probability of board explosion in the tin spraying process is very high by adopting the manufacturing process of the existing PCB 1, and the copper block 3 which is used for milling the side edge of the PCB 1 before tin spraying effectively reduces the board explosion of the PCB 1 in the tin spraying process.
In the 1 preparation of PCB board, still include before the tin spraying: roast board, income board, grind board, overflow washing, pressurization washing, microetching, overflow washing, ultrasonic wave washing, pressurization washing, dry board combination, go up rosin, turn over board and last board process, this embodiment carries out the gong board with PCB board 1 before roast board process.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A method for improving the tin spraying and plate explosion of a thick copper plate is characterized by comprising the following steps: routing the PCB before tin spraying, and routing copper blocks on the side edges of the PCB in the routing.
2. The method for improving the thick copper plate solder spraying and board explosion of claim 1, wherein the copper blocks on any two side edges of the PCB are milled off in the milling process.
3. The method for improving the thick copper plate solder spraying and board explosion of claim 1, wherein copper blocks on any three sides of a PCB are milled off in the milling.
4. The method for improving the thick copper plate solder spraying and board explosion of claim 1, wherein the routing is performed by routing copper blocks on all sides of the PCB.
5. The method for improving the thick copper plate tin spraying and explosion plate as claimed in claim 1, wherein the thickness of the copper layer of the PCB is greater than or equal to 5 oz.
6. The method for improving the thick copper plate tin spraying and explosion plate according to claim 1, wherein the method further comprises the following steps before tin spraying: baking a PCB, entering the PCB, grinding the PCB, overflow washing, pressurized washing, micro-etching, overflow washing, ultrasonic washing, pressurized washing, drying the PCB, combining the PCB with rosin, turning over the PCB and loading the PCB onto the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011177814.4A CN112153820A (en) | 2020-10-28 | 2020-10-28 | Method for improving thick copper plate tin spraying and plate explosion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011177814.4A CN112153820A (en) | 2020-10-28 | 2020-10-28 | Method for improving thick copper plate tin spraying and plate explosion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112153820A true CN112153820A (en) | 2020-12-29 |
Family
ID=73953559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011177814.4A Pending CN112153820A (en) | 2020-10-28 | 2020-10-28 | Method for improving thick copper plate tin spraying and plate explosion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112153820A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010278311A (en) * | 2009-05-29 | 2010-12-09 | Kyocer Slc Technologies Corp | Method of manufacturing wiring board |
| CN103096631A (en) * | 2013-01-08 | 2013-05-08 | 广东生益科技股份有限公司 | Processing method of printed circuit board (PCB) and PCB |
| CN105376961A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | HASL surface treatment PCB manufacturing method |
| CN206835469U (en) * | 2017-03-21 | 2018-01-02 | 昆山先胜电子科技有限公司 | A kind of pcb sprays tin streamline |
-
2020
- 2020-10-28 CN CN202011177814.4A patent/CN112153820A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010278311A (en) * | 2009-05-29 | 2010-12-09 | Kyocer Slc Technologies Corp | Method of manufacturing wiring board |
| CN103096631A (en) * | 2013-01-08 | 2013-05-08 | 广东生益科技股份有限公司 | Processing method of printed circuit board (PCB) and PCB |
| CN105376961A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | HASL surface treatment PCB manufacturing method |
| CN206835469U (en) * | 2017-03-21 | 2018-01-02 | 昆山先胜电子科技有限公司 | A kind of pcb sprays tin streamline |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201229 |