CN112129009A - Semiconductor cold drying device - Google Patents
Semiconductor cold drying device Download PDFInfo
- Publication number
- CN112129009A CN112129009A CN202010977641.8A CN202010977641A CN112129009A CN 112129009 A CN112129009 A CN 112129009A CN 202010977641 A CN202010977641 A CN 202010977641A CN 112129009 A CN112129009 A CN 112129009A
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- box body
- cooling
- liquid
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Gases (AREA)
Abstract
The invention relates to the field of medical equipment, in particular to a semiconductor cold drying device, which comprises: the box body, the box cover, the metal radiating fins, the liquid cooling device and the plurality of semiconductor refrigerating fins; the metal cooling fin is arranged in the box body, the box body is provided with a plurality of mounting holes, the semiconductor refrigeration fin is arranged in the mounting holes, one surface of the semiconductor refrigeration fin is a cold end surface, the other surface of the semiconductor refrigeration fin is a hot end surface, the cold end surface is arranged towards the inside of the box body, the hot end surface is arranged towards the outside of the box body, the cold end surface of the semiconductor refrigeration fin is tightly attached to the metal cooling fin through the mounting holes, and the liquid cooling device is arranged on the semiconductor refrigeration fin; the box cover is provided with a bulge which is embedded in the cavity of the box body to form a closed space, and the box cover is butted with the box body. The device is closely attached to the bottom plate of the metal radiating fin through the cold end face of the semiconductor refrigerating fin, and the semiconductor refrigerating fin is used for cooling compressed air flowing through the sealed cavity and with pressure through the metal radiating fin, so that the device has an obvious cooling effect.
Description
Technical Field
The invention relates to the field of medical equipment, in particular to a semiconductor cold drying device.
Background
The mode that current small-size and dispersion oxygenerator generally adopted simple heat exchanger to cool down and dehumidify compressed air, however at compressed air's in-process, highly-compressed air can produce high temperature, this kind of high temperature can seriously influence going on of follow-up oxygen separation procedure, so carry out cooling treatment to highly-compressed air is an important link in the oxygenerator, current oxygenerator carries out heat exchange through adopting ambient air and high temperature compressed air and realizes the cooling, but because the cold junction temperature is not less than the room temperature, there is the cooling effect poor, can not be less than the problem of room temperature, subsidiary dewatering effect is also not obvious. The oxygen producing principle of common household oxygen producing machine or dispersion oxygen producing machine is to utilize air separating technology, and the air is first compressed in high density and then gas-liquid separated at certain temperature by means of the different condensation points of the components in the air.
Oxygen inhalation or oxygen therapy can not only supply oxygen to hypoxic tissues, but also has use values for dissolving air bubbles in blood, stimulating wound healing, and treating diseases such as air bubble embolism, carbon monoxide poisoning, cyanide poisoning, unhealed wound, bone injury necrosis, soft tissue infection, cerebral edema, etc. Oxygen supply to premature infants, as well as those with serious disease or trauma, at ambient pressure is also an important life saving measure. It is considered that not only the oxygen-deficient patient needs to inhale oxygen, but also the normal people need to supplement certain oxygen in the natural environment. The oxygen therapy can relieve nerve fatigue, relax the body and mind, keep vigorous energy and improve the working efficiency; improving oxygen supply condition of brain, regulating brain nervous system function, improving memory and thinking ability, and improving learning efficiency; reducing pollution and harm to the body in severe environment; can delay aging and enhance metabolism to a certain extent; the hypoxemia is relieved, and the requirement of tissue metabolism is met; relieving pulmonary hypertension caused by hypoxia, relieving polycythemia, reducing blood viscosity, relieving right ventricle burden, and delaying the occurrence and development of pulmonary heart disease; can reduce postoperative infection and antiemetic effect. Oxygen therapy is the main means for correcting physiological and environmental hypoxia and preventing and treating diseases caused by environmental hypoxia. Oxygen therapy is an important adjunct to correct pathological hypoxia. Patent document CN206616010U discloses a high-pressure air cooling system for an oxygen generator, which realizes the cooling of compressed air by the combined action of a heat conducting plate, a cooling water pipe and a cooling fan, and has a complex structure and a poor cooling effect.
Disclosure of Invention
The invention provides a semiconductor cold drying device, and aims to solve the problem that compressed air required by an existing dispersion oxygen generator is poor in cooling effect.
In order to achieve the above object, the present invention provides a semiconductor cooling and drying device, comprising: the box body, the box cover, the metal radiating fins, the liquid cooling device and the plurality of semiconductor refrigerating fins; the metal cooling fin is arranged in the box body, a plurality of mounting holes are formed in the box body, the semiconductor refrigeration piece is installed in the mounting holes, one surface of the semiconductor refrigeration piece is a cold end surface, the other surface of the semiconductor refrigeration piece is a hot end surface, the cold end surface faces the interior of the box body, the hot end surface faces the exterior of the box body, the cold end surface of the semiconductor refrigeration piece is tightly attached to the metal cooling fin through the mounting holes, and the liquid cooling device is arranged on the semiconductor refrigeration piece; the box cover is provided with a bulge, the bulge is embedded in the cavity of the box body to form a closed space, and the box cover is in butt joint with the box body.
Preferably, the metal heat sink includes bottom plate and a plurality of sheetmetal, and is a plurality of the sheetmetal interval sets up, the bottom plate perpendicular to the sheetmetal sets up and locates the tip of sheetmetal, the bottom plate orientation is installed the box body setting of semiconductor heat sink.
Preferably, the cold end face of the semiconductor refrigeration piece is coated with silicone grease.
Preferably, the liquid cooling device further comprises a plurality of water cooling heads corresponding to the semiconductor chilling plates, and the water cooling heads are coated with silicone grease and then are tightly attached to the hot end faces of the semiconductor chilling plates.
Preferably, the liquid cooling device further comprises a plurality of cooling liquid pipes, a liquid inlet and a liquid outlet are formed in the water cooling head, the cooling liquid enters from one of the liquid inlets in the water cooling head through pipelines, the liquid outlet in the water cooling head is communicated with the adjacent liquid inlet in the water cooling head through the cooling pipeline, and the water cooling head is sequentially communicated with the cooling liquid pipes.
Preferably, the liquid cooling device further comprises a buckle and a fastener, fastener mounting holes are formed in the box body and the buckle, the buckle is arranged on the water cooling head, and the fastener penetrates through the fastener mounting holes in the buckle to fix the water cooling head on the box body.
Preferably, the top of the box body is provided with an air inlet joint.
Preferably, an air outlet joint is arranged on the box body, and compressed air can enter from the air inlet joint, pass through the metal radiating fin and then be discharged from the air outlet joint.
Preferably, the bottom end of the box body is provided with a water outlet.
Preferably, the metal heat sink is an aluminum heat sink.
Compared with the prior art, the technical scheme of the invention has the beneficial effects that:
the utility model provides a semiconductor refrigeration is done device and is adopted the cold end face of semiconductor refrigeration piece to refrigerate, produce the cooling effect that is showing relatively to the compressed air that needs the cooling, semiconductor refrigeration piece cold end face is hugged closely in metal radiating fin's bottom plate, use the semiconductor refrigeration piece to pass through metal radiating fin to cool off the cooling to the compressed air of the pressure of flowing through in airtight cavity, can also detach partial moisture in the compressed air simultaneously, reduce compressed air humidity and because the compressed air temperature is showing and is reducing, its condensation dewatering ability promotes.
The semiconductor refrigeration piece can refrigerate and heat, and can be electrified for less than one minute under the condition that the hot end has good heat dissipation and the cold end has no load, so that the refrigeration piece can reach the maximum temperature difference. Be applied to the pressurized air gas circuit in single oxygen-enriched storehouse with the cold device of doing of semiconductor that this application provided, cool down the dehumidification to the compressed air that gets into the under-deck, maintain the humiture in the under-deck and feel comfortable level at one body to fine promotion the experience comfort level in single oxygen-enriched storehouse.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor freeze-drying device provided by the present invention;
FIG. 2 is a schematic view of the installation of the semiconductor freeze drying device provided by the present invention;
FIG. 3 is a schematic rear view of a semiconductor cold drying apparatus according to the present invention;
fig. 4 is a schematic diagram of the liquid cooling apparatus of fig. 1 with the coolant pipes removed.
[ description of reference ]
1: a box body; 11: a cavity; 2: a box cover; 21: a protrusion;
3: a metal heat sink; 31: a base plate; 32: a metal sheet;
41: a water cooling head; 42: a coolant tube; 43: a liquid inlet; 44: a liquid outlet; 45: a fastener;
5: a semiconductor refrigeration sheet; 51: a cold end face; 52: a hot end face;
6: mounting holes; 7: an air inlet joint; 8: an air outlet joint; 9: and a water outlet.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The invention provides a semiconductor cold drying device, which comprises a box body 1, a box cover 2, a metal radiating fin 3, a liquid cooling device and a plurality of semiconductor refrigerating fins 5, wherein the box body is provided with a plurality of cooling fins; the metal cooling fin 3 is arranged in the box body 1, a plurality of mounting holes 6 are formed in the box body 1, the semiconductor refrigerating fins 5 are arranged in the mounting holes 6, one surface of each semiconductor refrigerating fin 5 is a cold end surface 51, the other surface of each semiconductor refrigerating fin is a hot end surface 52, the cold end surface 51 faces the inside of the box body 1, the hot end surface 52 faces the outside of the box body 1, the cold end surfaces 51 of the semiconductor refrigerating fins 5 are tightly attached to the metal cooling fin 3 through the mounting holes 6, and the liquid cooling device is arranged on the semiconductor refrigerating fins 5; the box cover 2 is provided with a bulge 21, the bulge 21 is embedded in the cavity 11 of the box body 1 to form a closed space, the box cover 2 is butted with the box body 1, the metal radiating fins 3 are arranged in a cavity formed by closing the box body 1 and the box cover 2, and the box body 1 and the box cover 2 can be fastened and connected through screws.
The invention adopts the Peltier refrigeration effect of the semiconductor refrigeration piece 5 to refrigerate and cool the compressed air with higher temperature. The semiconductor refrigerating sheet 5 can generate the Peltier effect after being electrified, the cold end face 51 of the semiconductor refrigerating sheet 5 cools, the hot end face 52 of the semiconductor refrigerating sheet 5 heats and dissipates heat to form a temperature difference of about four and fifty degrees centigrade, the heat dissipation of the hot end face 52 is ensured to be good, and the temperature of the cold end face 51 can be ensured to be low enough. The application provides a cold device of doing of semiconductor adopts cold junction surface 51 of semiconductor refrigeration piece 5 to refrigerate, the compressed air to need the cooling produces the cooling effect that is showing relatively, cold junction surface 51 of semiconductor refrigeration piece 5 hugs closely in metal heat sink 3's bottom plate 31, use semiconductor refrigeration piece 5 to pass through metal heat sink 3 to cool off the high temperature compressed air of the area pressure that flows through in cavity 11, can also detach partial moisture in the compressed air simultaneously, reduce compressed air humidity and because the compressed air temperature is showing and is reducing, its condensation dewatering ability promotes.
Referring to fig. 1 and 3, the metal heat sink 3 includes a bottom plate 31 and a plurality of metal sheets 32, the plurality of metal sheets 32 are disposed at intervals, the bottom plate 31 is disposed perpendicular to the metal sheets 32 and is disposed at an end portion of the metal sheets 32, the bottom plate 31 is disposed toward the case 1 on which the semiconductor heat sink is mounted, and the bottom plate 31 and the plurality of metal sheets 32 form a comb-tooth shape. The air inlet joint 7 at the upper end of the box body 1 is introduced with high-temperature compressed air, the high-temperature compressed air flows through the plurality of metal sheets 32 of the aluminum cooling fins, and heat is transferred to the metal cooling fins 3 after cooling, so that the compressed air is cooled. Wherein, the metal radiating fin 3 can be an aluminum radiating fin which has fast heat conduction and is light.
Furthermore, the cold end surface 51 of the semiconductor refrigeration sheet 5 is uniformly coated with silicone grease and is closely attached to the bottom plate 31 of the metal cooling fin 3. The gap between the cold end surface 51 of the semiconductor chilling plate 5 and the bottom plate 31 can be filled by coating silicone grease, which is a good conductor of heat, so that heat is sufficiently conducted.
Referring to fig. 2 and 4, the liquid cooling device further includes a plurality of water cooling heads 41 corresponding to the semiconductor chilling plates 5, and the water cooling heads 41 are uniformly coated with silicone grease and then are tightly attached to the hot end surfaces 52 of the semiconductor chilling plates 5. The gap between the water cooling head 41 and the hot end surface 52 of the semiconductor refrigeration piece 5 can be filled by coating silicone grease, so that heat is sufficiently conducted.
In addition, the liquid cooling device further comprises a plurality of cooling liquid pipes 42, a liquid inlet 43 and a liquid outlet 44 are formed in the water cooling heads 41, cooling liquid enters from the liquid inlet 43 of one of the water cooling heads 41 through a pipeline, the liquid outlet 44 of the water cooling head 41 is communicated with the liquid inlet 43 of the adjacent water cooling head 41 through a cooling pipeline, and the water cooling heads 41 are communicated through the cooling liquid pipes 42. In the embodiment shown in fig. 1, the semiconductor refrigeration device provided by the present invention includes four semiconductor refrigeration sheets 5, the liquid cooling device includes four water cooling heads 41, the number of the semiconductor refrigeration sheets 5 is the same as the number of the water cooling heads 41, and includes three cooling liquid pipes 42, the four water cooling heads 41 are sequentially connected in series through the three cooling liquid pipes 42, a liquid inlet 43 of the first water cooling head 41 is used as a water inlet of the cooling liquid, a liquid outlet 44 of the fourth water cooling head 41 is used as a water outlet of the cooling liquid, and the cooling liquid flows in a water path of the water cooling heads 41 connected in series to take away heat, so as to dissipate heat. The cold energy generated by the refrigeration of the cold end surface 51 of the semiconductor refrigeration piece 5 is transferred to the aluminum heat dissipation piece through the silicone grease, so that the refrigeration and the temperature reduction of the high-temperature compressed air flowing through the aluminum heat dissipation piece are realized.
Further, the liquid cooling device further comprises a buckle 45 and a fastening piece, the box body 1 and the buckle 45 are provided with fastening piece mounting holes 6, the buckle 45 is arranged on the water cooling head 41, the fastening piece penetrates through the fastening piece mounting holes on the buckle 45 to fix the water cooling head 41 on the box body 1, and the buckle 45 and the fastening piece are arranged to facilitate disassembly and maintenance, wherein the fastening piece can be a screw, a bolt and the like.
Referring to fig. 1, an air inlet joint 7 is arranged at the top of a box body 1, an air outlet joint 8 is arranged on the box body 1, compressed air can enter from the air inlet joint 7, pass through a metal radiating fin 3 and then be discharged from the air outlet joint 8, a water outlet 9 is formed in the bottom end of the box body 1, water vapor in humid air is condensed into water to form water drops, and the water drops are discharged through the water outlet 9 at the bottom, so that air-water separation is realized.
The working process of the semiconductor cold drying device provided by the invention is as follows: the semiconductor refrigerating sheet 5 is electrified, the electrified semiconductor refrigerating sheet 5 can generate the Peltier effect, the cold end face 51 of the semiconductor refrigerating sheet 5 is cooled and refrigerated, the hot end face 52 of the semiconductor refrigerating sheet 5 is heated and dissipated to form a temperature difference of about four and fifty degrees centigrade, the heat dissipation of the hot end face 52 is good, and the temperature of the cold end face 51 can be guaranteed to be low enough. High-temperature compressed air is connected through an air inlet joint 7 at the upper end of the box body 1, flows between the metal sheets 32 of the aluminum radiating fins, and transfers heat to the aluminum radiating fins after cooling, so that air cooling is realized; meanwhile, the water vapor in the cooled humid air is condensed after contacting with the cold aluminum radiating fins to form water drops, flows to the bottom of the box body 1 along the aluminum radiating fins under the influence of gravity, and is discharged through a bottom water outlet 9, so that the gas-water separation is realized. The cooled and dehumidified cooling and drying air is output from the air outlet joint 8 located on the upper side of the bottom of the box body 1 and communicated to the rear-end process.
The semiconductor cold drying device provided by the invention can be arranged in a dispersion oxygen generator or a small household oxygen generator, and has obvious air cooling effect and good water removal effect. The semiconductor refrigeration drying device provided by the invention can also be used for cooling and dehumidifying pressurized compressed air in a single oxygen-enriched cabin, and in the use process of the single oxygen-enriched cabin, because the gas exhaled by a human body is rich in water vapor and the human body can continuously dissipate heat, the temperature and the humidity in the cabin can be continuously increased, the comfort level can be obviously reduced after a long time, and the experience is poor.
It should be understood that the above description of specific embodiments of the present invention is only for the purpose of illustrating the technical lines and features of the present invention, and is intended to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, but the present invention is not limited to the above specific embodiments. It is intended that all such changes and modifications as fall within the scope of the appended claims be embraced therein.
Claims (10)
1. A semiconductor cold drying device is characterized by comprising: the box body, the box cover, the metal radiating fins, the liquid cooling device and the plurality of semiconductor refrigerating fins;
the metal cooling fin is arranged in the box body, a plurality of mounting holes are formed in the box body, the semiconductor refrigeration piece is installed in the mounting holes, one surface of the semiconductor refrigeration piece is a cold end surface, the other surface of the semiconductor refrigeration piece is a hot end surface, the cold end surface faces the interior of the box body, the hot end surface faces the exterior of the box body, the cold end surface of the semiconductor refrigeration piece is tightly attached to the metal cooling fin through the mounting holes, and the liquid cooling device is arranged on the semiconductor refrigeration piece;
the box cover is provided with a bulge, the bulge is embedded in the cavity of the box body to form a closed space, and the box cover is in butt joint with the box body.
2. The semiconductor freeze drying apparatus according to claim 1, wherein: the metal cooling fin comprises a bottom plate and a plurality of metal sheets, the metal sheets are arranged at intervals, the bottom plate is perpendicular to the metal sheets and arranged at the end portions of the metal sheets, and the bottom plate is arranged towards the box body of the semiconductor cooling fin.
3. The semiconductor freeze drying apparatus of claim 2, wherein: and silicone grease is coated on the cold end surface of the semiconductor refrigerating sheet.
4. A semiconductor freeze drying apparatus according to any one of claims 1 to 3, characterised in that: the liquid cooling device further comprises a plurality of water cooling heads corresponding to the semiconductor refrigerating sheets, and the water cooling heads are coated with silicone grease and then tightly attached to the hot end surfaces of the semiconductor refrigerating sheets.
5. The semiconductor freeze drying apparatus of claim 4, wherein: the liquid cooling device further comprises a plurality of cooling liquid pipes, wherein a liquid inlet and a liquid outlet are formed in the water cooling head, the cooling liquid enters from the liquid inlet in the water cooling head through a pipeline, the liquid outlet in the water cooling head is communicated with the adjacent liquid inlet in the water cooling head through the cooling pipeline, and the water cooling head is sequentially communicated with the cooling liquid pipes.
6. The semiconductor freeze drying apparatus of claim 5, wherein: the liquid cooling device further comprises a buckle and a fastening piece, wherein the box body and the buckle are provided with fastening piece mounting holes, the buckle is arranged on the water cooling head, and the fastening piece penetrates through the fastening piece mounting holes in the buckle to fix the water cooling head on the box body.
7. A semiconductor freeze drying apparatus according to any one of claims 1 to 3, characterised in that: and an air inlet joint is arranged at the top of the box body.
8. The semiconductor freeze drying apparatus of claim 7, wherein: the box body is provided with an air outlet joint, and compressed air can enter from the air inlet joint and pass through the metal radiating fin and then be discharged from the air outlet joint.
9. A semiconductor freeze drying apparatus according to any one of claims 1 to 3, characterised in that: the bottom of the box body is provided with a water outlet.
10. A semiconductor freeze drying apparatus according to any one of claims 1 to 3, characterised in that: the metal radiating fins are aluminum radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010977641.8A CN112129009A (en) | 2020-09-17 | 2020-09-17 | Semiconductor cold drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010977641.8A CN112129009A (en) | 2020-09-17 | 2020-09-17 | Semiconductor cold drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112129009A true CN112129009A (en) | 2020-12-25 |
Family
ID=73846154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010977641.8A Pending CN112129009A (en) | 2020-09-17 | 2020-09-17 | Semiconductor cold drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112129009A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113847773A (en) * | 2021-09-16 | 2021-12-28 | 武汉惟景三维科技有限公司 | Refrigerating unit and refrigerating method and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001038135A (en) * | 1999-08-04 | 2001-02-13 | Hokuto Corp | Dehumidifying device |
| CN200965366Y (en) * | 2006-10-26 | 2007-10-24 | 深圳迈瑞生物医疗电子股份有限公司 | Semiconductor refrigerating device |
| EP3184935A1 (en) * | 2015-12-23 | 2017-06-28 | Dr. Neumann Peltier-Technik GmbH | Cooling device having a peltier element |
| CN208475727U (en) * | 2018-03-16 | 2019-02-05 | 厦门成飞自动化设备有限公司 | A kind of free-floride cooling driers |
| CN209749011U (en) * | 2018-11-19 | 2019-12-06 | 庆阳欧维机电设备有限公司 | Cooling device |
| CN210718197U (en) * | 2019-08-28 | 2020-06-09 | 深圳市华晶温控技术有限公司 | Liquid-cooled semiconductor refrigeration module |
-
2020
- 2020-09-17 CN CN202010977641.8A patent/CN112129009A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001038135A (en) * | 1999-08-04 | 2001-02-13 | Hokuto Corp | Dehumidifying device |
| CN200965366Y (en) * | 2006-10-26 | 2007-10-24 | 深圳迈瑞生物医疗电子股份有限公司 | Semiconductor refrigerating device |
| EP3184935A1 (en) * | 2015-12-23 | 2017-06-28 | Dr. Neumann Peltier-Technik GmbH | Cooling device having a peltier element |
| CN208475727U (en) * | 2018-03-16 | 2019-02-05 | 厦门成飞自动化设备有限公司 | A kind of free-floride cooling driers |
| CN209749011U (en) * | 2018-11-19 | 2019-12-06 | 庆阳欧维机电设备有限公司 | Cooling device |
| CN210718197U (en) * | 2019-08-28 | 2020-06-09 | 深圳市华晶温控技术有限公司 | Liquid-cooled semiconductor refrigeration module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113847773A (en) * | 2021-09-16 | 2021-12-28 | 武汉惟景三维科技有限公司 | Refrigerating unit and refrigerating method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104644313B (en) | A kind of cold/hot dressing facial mask device with ventilating structure | |
| CN112129009A (en) | Semiconductor cold drying device | |
| CN205030925U (en) | Built -in semiconductor refrigeration piece water -cooling pillow | |
| CN113558850A (en) | Emergency nursing head heat sink | |
| CN111513908A (en) | Traditional chinese and western medicine combines emergency surgery uses shank fixing device | |
| CN201558210U (en) | Miniature high-fever temperature lowering instrument | |
| CN210521180U (en) | Emergency nursing head heat sink | |
| WO2022068117A1 (en) | Adjustable lumbar vertebra fixer with spinal orthopedic function | |
| CN215131380U (en) | Neurosurgery craniocerebral trauma postoperative care device | |
| CN109363825A (en) | A kind of iced Physical temperature-lowering system of medical electric | |
| CN215535563U (en) | Auxiliary cooling nursing device for patients in emergency internal medicine department | |
| CN209459260U (en) | A kind of semiconductor refrigerating, heating module combined system | |
| CN212730632U (en) | Neurosurgery craniocerebral trauma postoperative care device | |
| CN211187411U (en) | Compression hemostasis device | |
| CN211326049U (en) | Thyroid gland postoperative neck nursing device | |
| CN211023446U (en) | Cooling device for emergency intensive care unit | |
| CN209173230U (en) | A kind of mainframe box of repetitive transcranial magnetic stimulation instrument | |
| CN206482717U (en) | A kind of new cranium brain cooler | |
| CN113117460A (en) | Membrane separation assembly for low-oxygen machine | |
| CN215085577U (en) | High-low oxygen training instrument | |
| CN217066752U (en) | Sub-low temperature external fatty liver therapeutic instrument | |
| CN219461846U (en) | Sleep massage device | |
| CN216877029U (en) | Head fixing device for neurosurgery | |
| CN208693587U (en) | Ice cap | |
| CN220404372U (en) | Head massage device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201225 |
|
| RJ01 | Rejection of invention patent application after publication |