CN205030925U - Built -in semiconductor refrigeration piece water -cooling pillow - Google Patents
Built -in semiconductor refrigeration piece water -cooling pillow Download PDFInfo
- Publication number
- CN205030925U CN205030925U CN201520685929.2U CN201520685929U CN205030925U CN 205030925 U CN205030925 U CN 205030925U CN 201520685929 U CN201520685929 U CN 201520685929U CN 205030925 U CN205030925 U CN 205030925U
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- CN
- China
- Prior art keywords
- chilling plate
- pillow
- cooling piece
- radiator fan
- semiconductor chilling
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a built -in semiconductor refrigeration piece water -cooling pillow, including radiator fan, semiconductor refrigeration piece, aquogel, sealed water bag, thermal conductivity of copper tube, heat conduction fin, temperature controller device, DC power supply, controller, wherein: the aquogel is as the pillow upper surface, sealed water bag inlays and links to each other with semiconductor refrigeration piece cold junction at the pillow upper surface and through thermal conductivity of copper tube, semiconductor refrigeration piece hot junction links to each other with radiator fan through the heat conduction fin, the temperature controller device links to each other with the semiconductor refrigeration piece, after connecting in parallel, the semiconductor refrigeration piece inserts DC power supply with the controller, the utility model provides a built -in semiconductor refrigeration piece water -cooling pillow can provide nice and cool sleep environment, also can alleviate human fatigue, promote shoulder blood circulation and have assistant therapy action to the cervical spondylopathy.
Description
Technical field
The utility model relates to bedding, especially relates to a kind of embedded semiconductor cooling piece water-cooled pillow.
Background technology
Pillow, be the one sleep instrument that people must adopt when sleeping, it can maintain normal physiological activity when people sleep, but common pillow does not have other functions, and when heat, especially easily causes insomnia.
The pillowcase of water pillow forms with high-strength composite fiber material adhesive mostly in the market, the inside is placed with some borneols or other cool liquid or hollow, but this can not meet the growing demand of people, therefore, how designing a water-cooled pillow is those skilled in the art's problem demanding prompt solutions.
Utility model content
The utility model object is to provide a kind of embedded semiconductor cooling piece water-cooled pillow, to solve the problems of the technologies described above.
The utility model provides a kind of embedded semiconductor cooling piece water-cooled pillow, comprises radiator fan, semiconductor chilling plate, hydrogel, sealed water bag, heat-conducting copper pipe, heat transmission fin, thermostat arrangement, dc source, controller.
Wherein said hydrogel is as pillow upper surface; Described sealed water bag is embedded in pillow upper surface and is connected with described semiconductor chilling plate cold junction by described heat-conducting copper pipe; Described semiconductor chilling plate hot junction is connected with described radiator fan by described heat transmission fin; Described thermostat arrangement is connected with described semiconductor chilling plate; Described dc source is accessed after described semiconductor chilling plate is in parallel with described controller.
Preferably, as a kind of embodiment, described radiator fan is small-sized DC fan, and radiator fan air inlet is connected with described semiconductor chilling plate hot junction.
Preferably, as a kind of embodiment, described semiconductor chilling plate produces hot and cold two ends by external direct current power supply.
Preferably, as a kind of embodiment, described direct current power source voltage is 6 ~ 12v, can be battery.
Preferably, as a kind of embodiment, described sealed water bag is built with common cooling water.
Preferably, as a kind of embodiment, described thermostat arrangement is 0 ~ 50 DEG C of temperature monitoring, comprises temperature controller, temperature indicator, temperature adjustment button.
Preferably, as a kind of embodiment, described hydrogel is as described pillow upper surface.
Preferably, as a kind of embodiment, described heat transmission fin makes described radiator fan be connected with described semiconductor chilling plate hot junction.
Compared with prior art, the advantage of the utility model embodiment is:
A kind of embedded semiconductor cooling piece water-cooled pillow that the utility model provides, mainly contain radiator fan, semiconductor chilling plate, hydrogel, sealed water bag, heat-conducting copper pipe, heat transmission fin, thermostat arrangement, dc source, the structure compositions such as controller, analysis said structure is known: produce cold after above-mentioned semiconductor chilling plate is connected with above-mentioned dc source, hot two ends, wherein semiconductor chilling plate cold junction is connected with above-mentioned sealed water bag by heat-conducting copper pipe, above-mentioned sealed water bag is embedded in pillow inner surface, above-mentioned hydrogel is as pillow upper surface, sealed water bag makes semiconductor chilling plate cold junction be connected with hydrogel, and refrigeration is reached hydrogel, semiconductor chilling plate hot junction is connected with above-mentioned radiator fan by above-mentioned conduction copper fin, when above-mentioned radiator fan accesses the work of above-mentioned dc source, can blow out warm soft wind, above-mentioned thermostat arrangement is connected with above-mentioned semiconductor chilling plate, and temperature controllable is lower than human body temperature 7 ~ 9 DEG C.
A kind of embedded semiconductor cooling piece water-cooled pillow that the utility model provides, there is the devices such as temperature controller, controller and power switch, suitable degree and the time of refrigeration can be provided according to demand, solve Long-Time Service a kind of pillow used in summer, ice pillow temperature too ice-cold, human body head cranial nerve can be made to suffer unexpected stimulation, thus cause the problem of the disease of cerebrovascular aspect.
A kind of embedded semiconductor cooling piece water-cooled pillow that the utility model embodiment provides, design together with framework by rational in infrastructure to radiator fan, semiconductor chilling plate, hydrogel, sealed water bag, heat-conducting copper pipe, heat transmission fin, thermostat arrangement, dc source, temperature controller etc., pillow surface temperature can be made to decline 7 ~ 9 DEG C, there is the sleep environment that nice and cool, and promote shoulders of human body blood circulation by the warm soft wind energy of above-mentioned radiator fan blowout, and have certain physiotherapy function to cervical spondylopathy.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model detailed description of the invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in detailed description of the invention or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The overall structure schematic diagram of a kind of embedded semiconductor cooling piece water-cooled pillow that Fig. 1 provides for the utility model embodiment.
Fig. 2 is the cross-sectional view of a kind of embedded semiconductor cooling piece water-cooled pillow that the utility model embodiment provides.
The structural representation of a kind of embedded semiconductor cooling piece water-cooled pillow that Fig. 3 provides for the utility model embodiment.
Reference numeral:
1-radiator fan 2-air inlet 3-thermostat arrangement 4-semiconductor chilling plate 5-controller
6-power supply 7-hydrogel 8-sealed water bag 9-heat conduction aluminium flake 10-heat transmission fin.
Detailed description of the invention
Be clearly and completely described the technical solution of the utility model below in conjunction with accompanying drawing, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Also by reference to the accompanying drawings the utility model is described in further detail below by specific embodiment.
See Fig. 2, a kind of embedded semiconductor cooling piece water-cooled pillow that the utility model provides, comprises hydrogel 7, sealed water bag 8, semiconductor chilling plate 4, radiator fan 1.
Described hydrogel 7 is as described pillow surface; Described sealed water bag 8 is embedded in below described hydrogel 7; Described semiconductor chilling plate 4 is connected to below described sealed water bag 8; Described radiator fan 1 is connected with described semiconductor chilling plate 4 by described heat transmission fin 10; (heat transmission fin and radiator fan nut are fixed, can so that dismounting and maintenance).
Analysis said structure is known: heat transmission fin adopts aluminium matter structure, and it has good heat conductivility, make use of the heat conductivility that heat transmission fin is good just, the heat that sufficient absorption semiconductor chilling plate produces, and make it to be delivered to radiator fan, and then blow out warm soft wind; And the refrigeration of semiconductor chilling plate is delivered to pillow surface by sealed water bag by heat-conducting copper pipe, make pillow surface temperature lower than human body temperature 7-9 DEG C.
In concrete scheme, a kind of embedded semiconductor cooling piece water-cooled pillow that the utility model embodiment provides, comprise at least one chip semiconductor cooling piece, wherein semiconductor chilling plate produces cold by being connected with dc source, hot two ends, heat-conducting copper pipe makes semiconductor chilling plate cold junction be connected with sealed water bag, heat transmission fin makes semiconductor chilling plate hot-side heat dissipation fan be connected, and then make pillow surface obtain refrigeration and the warm soft wind of radiator fan blowout, , nice and cool sleep environment can be provided, also can relieving fatigue, promote shoulder blood circulation and have auxiliary therapeutic action to cervical spondylopathy.
Below the concrete structure of a kind of embedded semiconductor cooling piece water-cooled pillow that the utility model embodiment provides is done and describe in detail: the circuit structure of above-mentioned embedded semiconductor cooling piece water-cooled pillow is dc source, controller, semiconductor chilling plate, thermostat arrangement, radiator fan (with reference to figure 3) successively.
Preferably, above-mentioned direct current power source voltage is 6 ~ 12v, can be battery.
Wherein, thermostat arrangement comprises temperature controller, temperature indicator, temperature adjustment button, and can be regulated the temperature of cooling piece cold junction by temperature adjustment button, make the temperature environment of an applicable sleep quality, in addition, air inlet 2 is the air intake place of radiator fan 1.
A kind of embedded semiconductor cooling piece water-cooled pillow that the utility model embodiment provides, there is apparatus structure simple, multi-functional, nice and cool sleep environment can be provided, also can relieving fatigue, promote shoulder blood circulation and have auxiliary therapeutic action to cervical spondylopathy.Particularly for the crowd needing sufficient sleep, the utility model can alleviate the fatigue and pain that study and work brings to their health (neck and shoulder), can also prevent snoring.
Last it is noted that above each embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to foregoing embodiments, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of each embodiment technical scheme of the utility model.
Claims (8)
1. an embedded semiconductor cooling piece water-cooled pillow, is characterized in that,
Comprise radiator fan, semiconductor chilling plate, hydrogel, sealed water bag, heat-conducting copper pipe, heat transmission fin, thermostat arrangement, dc source, controller, wherein: described hydrogel is as pillow upper surface; Described sealed water bag is embedded in pillow upper surface; Described semiconductor chilling plate cold junction pain is crossed heat-conducting copper pipe and is connected with described sealed water bag; Described radiator fan is connected with described semiconductor chilling plate hot junction by described heat transmission fin; Described thermostat arrangement is connected with semiconductor chilling plate; Described semiconductor chilling plate is connected with described dc source with after described controller parallel connection.
2. embedded semiconductor cooling piece water-cooled pillow according to claim 1, is characterized in that: described radiator fan is small-sized DC fan, and radiator fan is connected with above-mentioned semiconductor chilling plate hot junction by above-mentioned heat transmission fin.
3. embedded semiconductor cooling piece water-cooled pillow according to claim 1, is characterized in that: described semiconductor chilling plate produces hot and cold two ends by access dc source.
4. embedded semiconductor cooling piece water-cooled pillow according to claim 1, is characterized in that: described direct current power source voltage is 6 ~ 12v dc source, can be battery.
5. embedded semiconductor cooling piece water-cooled pillow according to claim 1, is characterized in that: described sealed water bag is built with common cooling water.
6. embedded semiconductor cooling piece water-cooled pillow according to claim 1, is characterized in that: described thermostat arrangement is 0 ~ 50 DEG C of temperature monitoring, comprises temperature controller, temperature indicator, temperature adjustment button.
7. embedded semiconductor cooling piece water-cooled pillow according to claim 1, is characterized in that: described hydrogel is as pillow upper surface.
8. embedded semiconductor cooling piece water-cooled pillow according to claim 1, is characterized in that: described heat transmission fin makes described radiator fan be connected with described semiconductor chilling plate hot junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520685929.2U CN205030925U (en) | 2015-09-08 | 2015-09-08 | Built -in semiconductor refrigeration piece water -cooling pillow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520685929.2U CN205030925U (en) | 2015-09-08 | 2015-09-08 | Built -in semiconductor refrigeration piece water -cooling pillow |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205030925U true CN205030925U (en) | 2016-02-17 |
Family
ID=55289866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520685929.2U Expired - Fee Related CN205030925U (en) | 2015-09-08 | 2015-09-08 | Built -in semiconductor refrigeration piece water -cooling pillow |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205030925U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524565A (en) * | 2016-12-22 | 2017-03-22 | 爱义思（上海）科技发展有限公司 | Neck warming and head cooling device for intelligent pillow |
| CN110748479A (en) * | 2018-07-06 | 2020-02-04 | 合肥宇创液压件有限公司 | Hydraulic oil pump for engineering machinery |
| CN112263378A (en) * | 2020-10-22 | 2021-01-26 | 南通市第一人民医院 | Clinical heat sink that uses of emergency call |
| CN114286636A (en) * | 2019-08-30 | 2022-04-05 | 学校法人甲南学园 | Head cooling device and head cooling method |
-
2015
- 2015-09-08 CN CN201520685929.2U patent/CN205030925U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524565A (en) * | 2016-12-22 | 2017-03-22 | 爱义思（上海）科技发展有限公司 | Neck warming and head cooling device for intelligent pillow |
| CN110748479A (en) * | 2018-07-06 | 2020-02-04 | 合肥宇创液压件有限公司 | Hydraulic oil pump for engineering machinery |
| CN114286636A (en) * | 2019-08-30 | 2022-04-05 | 学校法人甲南学园 | Head cooling device and head cooling method |
| CN112263378A (en) * | 2020-10-22 | 2021-01-26 | 南通市第一人民医院 | Clinical heat sink that uses of emergency call |
| CN112263378B (en) * | 2020-10-22 | 2022-11-15 | 南通市第一人民医院 | Clinical heat sink that uses of emergency call |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160217 Termination date: 20160908 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |