CN200965366Y - Semiconductor refrigerating device - Google Patents
Semiconductor refrigerating device Download PDFInfo
- Publication number
- CN200965366Y CN200965366Y CN 200620015434 CN200620015434U CN200965366Y CN 200965366 Y CN200965366 Y CN 200965366Y CN 200620015434 CN200620015434 CN 200620015434 CN 200620015434 U CN200620015434 U CN 200620015434U CN 200965366 Y CN200965366 Y CN 200965366Y
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- radiator
- insulation layer
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Abstract
The utility model discloses a semiconductor refrigerator comprising a refrigerating end, a semiconductor refrigerating sheet, a radiator, a thermal-protective coating, a heat-insulating layer and a mounting assembly, wherein the cold end-face of the semiconductor refrigerating sheet is stuck on the refrigerating end; the base of the radiator is stuck on the heat end-face of the semiconductor refrigerating sheet; the perinous face of the semiconductor refrigerating sheet is covered by the thermal-protective coating; the heat-insulating layer is fixedly connected with the refrigerating end and covers the perinous face of the thermal-protective coating; the mounting assembly is fixed on the heat-insulating layer and pressed on the rib of the radiator closely. The radiator and the semiconductor are fixed on the refrigerating end with the pressing action of the mounting assembly, thereby avoiding damaging the semiconductor refrigerating sheet, simultaneously preventing the direct contact of the cold and the heat end-faces of the refrigerating sheet effectively, and enhancing the reliability of the refrigerator. The moist and the refrigerating sheet are effectively separated to improve the reliability of the refrigerating sheet by covering the thermal-protective coating and the heat-insulating layer.
Description
Technical field
The utility model is the refrigerating plant that utilizes semiconductor chilling plate to freeze about a kind of.
Background technology
The reagent dish of automatic clinical chemistry analyzer needs service life and the minimizing volatilization of continual refrigeration in 24 hours with guarantee reagent, so the reagent storehouse needs refrigerating plant.
The mode of biochemical instruments refrigerating plant employing at present is semiconductor refrigerating technology substantially.Semiconductor refrigerating claims thermoelectric cooling, thermoelectric cooling or electronic cooling again.Semiconductor refrigerating has adopted extraordinary semi-conducting material to make refrigeration device, does not need cold-producing medium can directly realize refrigeration after this refrigeration device energising.The advantage of this semiconductor refrigerating is: noiselessness, accurate temperature controller, movement-less part, nothing wearing and tearing, reliable, easy to maintenance, cooling velocity is fast, volume is little and in light weight.This semiconductor cooling device can reach cooling and heat two kinds of purposes by changing sense of current, does not use cold-producing medium, and is free from environmental pollution.
The conventional semiconductor refrigerating plant as shown in Figures 1 and 2, the core components and parts of this refrigerating plant 9 are semiconductor chilling plate 96, by semiconductor chilling plate 96 is produced refrigeration for direct currents.The cold junction of semiconductor chilling plate 96 directly contacts with the refrigeration end 97 that needs cooling, and cooling piece 96 hot junctions and radiator 95 are connected to refrigeration end 97 by bolt 91, bullet pad 92 and plain cushion 93.Radiator 95 is by small-power axial flow blower air blast cooling heat radiation.Slit between cooling piece 96 and radiator 95 and the refrigeration end 97 utilizes heat conductive rubber to fill, and whole refrigeration storehouse adopts heat insulation expanded material with extraneous heat insulation, to reach the refrigeration heat insulation effect.
But this semiconductor cooling device has following shortcoming:
1) adopt bolted installation form, this mounting means causes the hot and cold both ends of the surface of cooling piece directly to contact, and obviously reduces the cooling piece performance, and quickens and cause initial failure.
2) cooling piece is not carried out effective isolation, the moisture in the cooling piece causes performance to reduce, and brings out initial failure, and this moisture can bring following harmful effect: a) water forms acid electrolyte solution with residual scolder, corrodes the cooling piece internal material; B) the ground connection passage on formation between cooling piece hot junction and the radiator is electric causes electric short circuit.
Summary of the invention
Technical problem to be solved by this invention is, overcomes the deficiencies in the prior art, provides a kind of and can effectively protect semiconductor chilling plate and freeze reliable semiconductor cooling device.
The technical solution adopted for the present invention to solve the technical problems is: this semiconductor cooling device comprises refrigeration end, semiconductor chilling plate, radiator, thermal insulation layer, heat-insulation layer and installation component, the cold junction face of this semiconductor chilling plate attaches this refrigeration end, the base of this radiator attaches the hot junction face of this semiconductor chilling plate, this thermal insulation layer coats the peripheral wall surfaces of this semiconductor chilling plate, this heat-insulation layer is fixed in this refrigeration end and coats the peripheral wall surfaces of this thermal insulation layer, and this installation component is fixed on the heat-insulation layer and presses the fin of this radiator.
Described installation component comprises support and securing member, and this support is fixed in this heat-insulation layer, and this securing member is fixed on this support and presses the fin of this radiator.
Described support comprises the mounting bar and two erection columns of vertically placing of horizontal positioned, and this erection column is fixed on the heat-insulation layer, fixedlys connected with two erection columns respectively in the two ends of this mounting bar, and this securing member is fixed on this mounting bar.
Described heat-insulation layer coats the peripheral wall surfaces of this foot of radiator.
The invention has the beneficial effects as follows, pressuring action by installation component is fixed on the refrigeration end radiator and semiconductor, thereby avoided the destruction semiconductor chilling plate, prevented that effectively the hot and cold both ends of the surface of cooling piece from directly contacting simultaneously, increased the reliability of refrigerating plant; By coating thermal insulation layer and heat-insulation layer,, and then also improved the reliability of cooling piece with moisture and cooling piece effective isolation.
Description of drawings
Fig. 1 is the front view of existing semiconductor cooling device.
Fig. 2 is the exploded view of existing semiconductor cooling device.
Fig. 3 is the upward view of the utility model semiconductor cooling device.
Fig. 4 is the cutaway view of the utility model semiconductor cooling device.
Fig. 5 is the wind path flow chart of the Biochemical Analyzer of this refrigerating plant of utilization.
The specific embodiment
See also Fig. 3 to Fig. 5, the utility model semiconductor cooling device comprises refrigeration end 8, semiconductor chilling plate 1, thermal insulation layer 2, heat-insulation layer 3, radiator 4 and installation component.This refrigeration end 8 is for needing the element of refrigeration.This semiconductor chilling plate 1 is made by extraordinary semi-conducting material, and it has cold junction face, hot junction face and the peripheral wall surfaces between this hot and cold end face, and this cold junction face contacts with refrigeration end 8 and slit is between the two filled by heat conductive silica gel.Thermal insulation layer 2 coats the peripheral wall surfaces of this semiconductor chilling plate 1, and the slit between this peripheral wall surfaces and the thermal insulation layer 2 is filled with the material of high moisture-resistant.The base 41 of radiator 4 contacts with the hot junction face of semiconductor chilling plate 1 and slit is between the two filled by heat conductive silica gel.This heat-insulation layer 3 is made by expanded material, and it coats the peripheral wall surfaces of thermal insulation layer 2 and the peripheral wall surfaces of foot of radiator 41.This installation component comprises support and securing member, this support is made up of two erection columns 5 and a mounting bar 6, these two erection columns 5 all are embedded in heat-insulation layer 3 in advance and vertically place, these mounting bar 6 horizontal positioned, its two ends are separately fixed at the bottom of two erection columns 5, and the centre position of this mounting bar 6 is equipped with securing member 7, this securing member 7 presses the fin 42 of this radiator, this radiator 4 presses this semiconductor chilling plate 1, is installed on the refrigeration end 8 thereby this radiator 4 and semiconductor chilling plate 1 compressed.In the present embodiment, this refrigeration end 8 is the thick base plate 8 of the refrigeration pot of Biochemical Analyzer.
The complete machine of Biochemical Analyzer has bottom rack and last rack, the process of its heat radiation is as follows: the cold wind that heat radiation needs enters from the air inlet of bottom rack, by the lower air duct of bottom rack, process upper plate left side air inlet and upper plate right side air inlet have entered the air channel, both sides of last rack respectively.By the radiator fan in the last rack rear side air channel radiator 4 that needs in last rack left air path and the last rack right air path to dispel the heat is carried out forced heat radiation, the hot blast after the heat radiation is by the last rack air outlet rack that sheds.This wind path structure has well guaranteed the needed radiating effect of semiconductor chilling plate 1 operate as normal, avoids simultaneously in front that plate and side panel drive the air port into, thereby has guaranteed the aesthetic property of complete machine.
In the utility model, adopt mounting bar and securing member to compress radiator and cooling piece, control clamping force easily, prevent to destroy cooling piece, simultaneously prevented that effectively the hot and cold both ends of the surface of cooling piece from directly contacting, solve in cold and hot when the cooling piece bolt is installed in the prior art and problem, increase the reliability of refrigerating plant; Way by coating separation layer (thermal insulation layer and heat-insulation layer) is moisture and cooling piece effective isolation, and then also improved the reliability of cooling piece.
The utility model semiconductor cooling device not only can apply to Biochemical Analyzer, but also can be applicable in the products such as portable refrigerating box, automobile refrigerator and exact constant temperature groove.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field; under the prerequisite that does not break away from the utility model design; can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the utility model is determined by claims of being submitted to.
Claims (4)
1. semiconductor cooling device, comprise refrigeration end, semiconductor chilling plate, radiator and installation component, the cold junction face of this semiconductor chilling plate attaches this refrigeration end, the base of this radiator attaches the hot junction face of this semiconductor chilling plate, it is characterized in that: also comprise thermal insulation layer and heat-insulation layer, this thermal insulation layer coats the peripheral wall surfaces of this semiconductor chilling plate, and this heat-insulation layer is fixed in this refrigeration end and coats the peripheral wall surfaces of this thermal insulation layer, and this installation component is fixed on the heat-insulation layer and presses the fin of this radiator.
2. according to the described semiconductor cooling device of claim 1, it is characterized in that: described installation component comprises support and securing member, and this support is fixed in this heat-insulation layer, and this securing member is fixed on this support and presses the fin of this radiator.
3. according to the described semiconductor cooling device of claim 2, it is characterized in that: described support comprises the mounting bar and two erection columns of vertically placing of horizontal positioned, this erection column is fixed on the heat-insulation layer, fixedly connected with two erection columns respectively in the two ends of this mounting bar, this securing member is fixed on this mounting bar.
4. according to any described semiconductor cooling device among the claim 1-3, it is characterized in that: described heat-insulation layer coats the peripheral wall surfaces of this foot of radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620015434 CN200965366Y (en) | 2006-10-26 | 2006-10-26 | Semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620015434 CN200965366Y (en) | 2006-10-26 | 2006-10-26 | Semiconductor refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200965366Y true CN200965366Y (en) | 2007-10-24 |
Family
ID=38869381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620015434 Expired - Lifetime CN200965366Y (en) | 2006-10-26 | 2006-10-26 | Semiconductor refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200965366Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169066A (en) * | 2011-01-10 | 2011-08-31 | 浙江大学 | Small-size vibration-free quick temperature change test device |
| CN102478337A (en) * | 2010-11-25 | 2012-05-30 | 西安大昱光电科技有限公司 | Portable solar refrigerating box |
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN103706957A (en) * | 2013-12-16 | 2014-04-09 | 中山大学 | Thermoelectric refrigerating device and laser processing method using same |
| CN104283402A (en) * | 2013-07-02 | 2015-01-14 | 艾默生网络能源有限公司 | Wind energy converter system and dehumidification method |
| CN105371324A (en) * | 2014-08-29 | 2016-03-02 | 青岛海尔智能技术研发有限公司 | Manufacturing method for externally-arranged semiconductor refrigerating module of smoke exhauster |
| CN105465855A (en) * | 2014-08-29 | 2016-04-06 | 青岛海尔智能技术研发有限公司 | Preparation method for external semiconductor refrigeration module of smoke lampblack machine |
| CN106444892A (en) * | 2016-09-12 | 2017-02-22 | 华东师范大学 | Temperature control system and optical console |
| CN108227350A (en) * | 2016-12-14 | 2018-06-29 | 台达电子工业股份有限公司 | Digital micro reflective projector |
| CN112129009A (en) * | 2020-09-17 | 2020-12-25 | 湖南泰瑞医疗科技有限公司 | Semiconductor cold drying device |
-
2006
- 2006-10-26 CN CN 200620015434 patent/CN200965366Y/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478337A (en) * | 2010-11-25 | 2012-05-30 | 西安大昱光电科技有限公司 | Portable solar refrigerating box |
| CN102169066A (en) * | 2011-01-10 | 2011-08-31 | 浙江大学 | Small-size vibration-free quick temperature change test device |
| CN102169066B (en) * | 2011-01-10 | 2012-08-22 | 浙江大学 | Small-size vibration-free quick temperature change test device |
| CN103206805B (en) * | 2013-04-12 | 2015-04-15 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN104283402A (en) * | 2013-07-02 | 2015-01-14 | 艾默生网络能源有限公司 | Wind energy converter system and dehumidification method |
| CN103706957A (en) * | 2013-12-16 | 2014-04-09 | 中山大学 | Thermoelectric refrigerating device and laser processing method using same |
| CN103706957B (en) * | 2013-12-16 | 2015-07-22 | 中山大学 | Thermoelectric refrigerating device and laser processing method using same |
| CN105371324A (en) * | 2014-08-29 | 2016-03-02 | 青岛海尔智能技术研发有限公司 | Manufacturing method for externally-arranged semiconductor refrigerating module of smoke exhauster |
| CN105465855A (en) * | 2014-08-29 | 2016-04-06 | 青岛海尔智能技术研发有限公司 | Preparation method for external semiconductor refrigeration module of smoke lampblack machine |
| CN106444892A (en) * | 2016-09-12 | 2017-02-22 | 华东师范大学 | Temperature control system and optical console |
| CN106444892B (en) * | 2016-09-12 | 2018-06-22 | 华东师范大学 | Temperature control system and optics console |
| CN108227350A (en) * | 2016-12-14 | 2018-06-29 | 台达电子工业股份有限公司 | Digital micro reflective projector |
| CN108227350B (en) * | 2016-12-14 | 2021-06-08 | 台达电子工业股份有限公司 | Digital miniature reflective projector |
| CN112129009A (en) * | 2020-09-17 | 2020-12-25 | 湖南泰瑞医疗科技有限公司 | Semiconductor cold drying device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20071024 |
|
| EXPY | Termination of patent right or utility model |