CN112122778B - Laser processing slag removal system, method, computer device and readable storage medium - Google Patents
Laser processing slag removal system, method, computer device and readable storage medium Download PDFInfo
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- 239000002893 slag Substances 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000003860 storage Methods 0.000 title claims abstract description 15
- 238000010926 purge Methods 0.000 claims abstract description 195
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000007664 blowing Methods 0.000 claims description 22
- 238000003754 machining Methods 0.000 claims description 18
- 238000004590 computer program Methods 0.000 claims description 16
- 230000000007 visual effect Effects 0.000 claims description 8
- 238000010408 sweeping Methods 0.000 claims description 3
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The application provides a system, a method, a computer device and a readable storage medium for removing slag by laser processing. The laser processing removes slag system includes: the laser processing device, first air nozzle and controlling means. The first air faucet is coaxial with the laser beam output by the laser processing device, and the first air faucet and the laser processing device are arranged on the same side of the hard and brittle substrate to be processed. The control device is respectively electrically connected with the laser processing device and the first air nozzle. The control device is used for determining the purging energy value of the first air nozzle according to the preset purging energy value and the purging energy threshold value of the current hole to be processed of the hard and brittle substrate to be processed.
Description
Technical Field
The present application relates to the field of laser processing technology, and in particular, to a system, method, computer device, and readable storage medium for removing slag by laser processing.
Background
The laser processing is a processing method which utilizes high-energy laser beams to achieve extremely high energy density on a focus after being focused by a lens, and the material to be processed is at high temperature and gasified by virtue of a photothermal effect so as to achieve cutting or punching. During laser processing, the material at the focal point reaches a high temperature of tens of thousands of degrees, and at such a high temperature, the material is instantaneously melted or vaporized. The laser processing method has the advantages of high processing speed, high production efficiency, high precision, wide material processing range, good economic benefit and the like, and is widely applied to the fine micromachining industry.
At present, laser processing is mainly adopted for drilling of hard and brittle materials. For example, working alumina materials, CO2 or Nd: YAG laser. When laser processing is used, a lot of slag is generated. The generated slag floats in the air, and a part of the slag also falls into the punched hole. At present, most of slag removal methods adopt manual scribing or ultrasonic wave to remove slag, and the defect of low removal efficiency is caused.
Disclosure of Invention
Therefore, it is necessary to provide a system, a method, a computer device and a readable storage medium for removing slag by laser processing, which aims at the problem that the slag is removed by manual scribing or ultrasonic wave during the existing laser processing drilling, and the removal efficiency is low.
A laser machining slag removal system, comprising:
a laser processing device;
the first air nozzle is coaxial with the laser beam output by the laser processing device, and the first air nozzle and the laser processing device are arranged on the same side of the hard and brittle substrate to be processed; and
and the control device is respectively electrically connected with the laser processing device and the first air nozzle and is used for determining the purging energy value of the first air nozzle according to the preset purging energy value and the purging energy threshold value of the current hole to be processed of the hard and brittle substrate to be processed.
In one embodiment, the control device is used for comparing the preset purging energy value of the current hole to be processed with the purging energy threshold value;
if the preset purging energy value is larger than or equal to the purging energy threshold value, determining that the purging energy value of the first air tap is the preset purging energy value;
and if the preset purging energy value is smaller than the purging energy threshold, determining the purging energy value of the first air tap as the purging energy threshold.
In one embodiment, the control device is further configured to determine the purging energy threshold according to the number of preset holes to be processed of the hard and brittle substrate to be processed and the preset purging energy value corresponding to each preset hole to be processed.
In one embodiment, the laser processing slag removal system further comprises:
and the second air nozzle is electrically connected with the control device, the second air nozzle and the first air nozzle are arranged on different sides of the hard and brittle substrate to be processed, and the second air nozzle and the first air nozzle are arranged on two opposite sides of the current hole to be processed when sweeping.
In one embodiment, the blowing directions of the second air nozzle and the first air nozzle are not coaxial, and the blowing energy value of the second air nozzle and the blowing energy value of the first air nozzle to the current hole to be processed are the same.
In one embodiment, the laser processing slag removal system further comprises:
and the control device determines that the first air nozzle and the second air nozzle are arranged on two opposite sides of the current hole to be processed through the visual positioning device.
A laser machining slag removal method applied to the laser machining slag removal system of any one of claims, the method comprising:
controlling the first air nozzle and the laser processing device to move to the current hole to be processed of the hard and brittle substrate to be processed;
and determining the purging energy value of the first air tap according to the preset purging energy value and the purging energy threshold of the current hole to be processed.
In one embodiment, the step of determining the purge energy value of the first air tap according to the preset purge energy value and the purge energy threshold value of the current hole to be processed comprises:
comparing the preset purging energy value of the current hole to be processed with the purging energy threshold value;
if the preset purging energy value is larger than or equal to the purging energy threshold, determining the purging energy value of the first air tap as the preset purging energy value;
and if the preset purging energy value is smaller than the purging energy threshold, determining the purging energy value of the first air tap as the purging energy threshold.
In one embodiment, before the step of determining the purge energy value of the first air tap according to the preset purge energy value and the purge energy threshold of the current hole to be machined, the method further includes:
and determining the purging energy threshold according to the number of preset holes to be processed of the hard and brittle substrate to be processed and the preset purging energy value corresponding to each preset hole to be processed.
In one embodiment, before the step of determining the purge energy value of the first air tap according to the preset purge energy value and the purge energy threshold of the current hole to be processed, the method further includes:
controlling a second air nozzle to move to the position opposite to the current hole to be processed, wherein the second air nozzle and the first air nozzle are arranged on different sides of the hard and brittle substrate to be processed, and the second air nozzle and the first air nozzle are arranged on two opposite sides of the current hole to be processed during blowing;
and determining the blowing energy value of the second air tap according to the preset blowing energy value and the blowing energy threshold value of the current hole to be machined.
In one embodiment, the second air nozzle and the first air nozzle are not coaxial with the blowing direction of the current hole to be processed.
A computer device comprising a memory storing a computer program and a processor implementing the steps of the method of any of the above embodiments when the processor executes the computer program.
A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method of any of the preceding embodiments.
Compared with the prior art, the system, the method, the computer equipment and the readable storage medium for removing the slag by laser processing are characterized in that the first air nozzle and the laser beam output by the laser processing device are coaxially arranged, and meanwhile, the first air nozzle and the laser processing device are arranged on the same side of the hard and brittle substrate to be processed. And determining the purging energy value of the first air nozzle through the control device according to the preset purging energy value and the purging energy threshold value of the current hole to be processed of the hard and brittle substrate to be processed, so that the molten slag can be quickly removed, and the processing efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the description of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the description below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic processing diagram of a laser processing slag removal system according to an embodiment of the present application;
FIG. 2 is a block diagram of a laser slag removal system according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of a laser machining slag removal system according to another embodiment of the present disclosure;
FIG. 4 is a block diagram of a laser slag removal system according to another embodiment of the present disclosure;
FIG. 5 is a flow chart of a method for removing slag by laser machining according to an embodiment of the present disclosure;
fig. 6 is an internal structural diagram of a computer device according to an embodiment of the present application.
Description of reference numerals:
10. a slag removing system for laser processing; 100. a laser processing device; 101. processing a hard and brittle substrate; 200. a first air tap; 300. a control device; 400. a second air tap; 500. visual positioning device.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of implementation in many different ways than those herein set forth and those skilled in the art will recognize that many modifications may be made without departing from the spirit and scope of the present application and that the present application is not limited to the specific implementations disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, an embodiment of the present application provides a laser machining slag removal system 10. The laser processing slag removal system 10 includes: laser processing apparatus 100, first gas nozzle 200, and control apparatus 300. The first air faucet 200 is coaxial with the laser beam output by the laser processing device 100, and the first air faucet 200 and the laser processing device 100 are arranged on the same side of the hard and brittle substrate 101 to be processed. The control device 300 is electrically connected to the laser processing device 100 and the first air nozzle 200, respectively. The control device 300 is configured to determine the purging energy value of the first air nozzle 200 according to a preset purging energy value and a purging energy threshold of a current hole to be processed of the hard and brittle substrate 101 to be processed.
It is to be understood that the specific structure of the laser processing apparatus 100 is not limited as long as it has a laser processing function. In one implementation, the laser machining apparatus 100 may include a laser, a transmission fiber, a collimating lens, a galvanometer, and a cutting head. During laser processing, laser emitted by a laser enters a collimating lens through a transmission optical fiber, enters a vibrating mirror, is irradiated into a cutting head through the vibrating mirror to focus and irradiate on the to-be-processed hard and brittle substrate 101, and therefore laser processing of the to-be-processed hard and brittle substrate 101 is achieved. In one embodiment, the hard and brittle substrate 101 to be processed may be a ceramic substrate, a glass substrate, or other hard and brittle material substrate. In one embodiment, the thickness of the brittle and hard substrate 101 to be processed may be 0.05mm to 2.0 mm.
In one embodiment, the first gas nozzle 200 may be a conventional laser machining gas nozzle. In one embodiment, the first nozzle 200 may be used to blow air or water. When the first air nozzle 200 blows air, the blown air may be air, nitrogen, or the like. In one embodiment, the energy value range of the air blowing or water blowing of the first air nozzle 200 is 0-2 Mpa. In one embodiment, the control device 300 may be an upper computer.
In one embodiment, the first nozzle 200 is coaxial with the laser beam output by the laser processing apparatus 100, which means: the blowing direction of the first nozzle 200 is coaxial with the laser beam 102 output by the laser processing apparatus 100. When the first air nozzle 200 and the laser beam output by the laser processing device 100 are coaxially arranged, the first air nozzle 200 and the laser processing device 100 need to be arranged on the same side of the hard and brittle substrate 101 to be processed. Therefore, the laser beam can be ensured to be used for processing the hard and brittle substrate 101 to be processed, and the slag generated by laser processing can be removed in time by matching the first air nozzle 200, so that the processing efficiency is improved.
In one embodiment, the purging energy threshold may be determined by the number of preset holes to be processed of the hard and brittle substrate 101 to be processed and the preset purging energy value corresponding to each preset hole to be processed. For example, if the number of the preset holes to be processed is N, the median of the preset purge energy values of the N preset holes to be processed is calculated. The median value is the purge energy threshold. In an embodiment, the preset purging energy value corresponding to each of the preset holes to be processed in the N preset holes to be processed may be set according to the type of the preset hole to be processed.
In an embodiment, when the laser machining slag removing system 10 is in operation, that is, the laser machining apparatus 100 is machining a current hole to be machined in the hard and brittle substrate 101 to be machined, the control apparatus 300 may determine the purge energy value of the first gas nozzle 200 according to a preset purge energy value and a purge energy threshold of the current hole to be machined in the hard and brittle substrate 101 to be machined. Specifically, the control device 300 may compare (e.g., compare a difference value) the preset purge energy value of the current hole to be processed with the purge energy threshold.
If the preset purging energy value is greater than or equal to the purging energy threshold, determining that the purging energy value of the first air faucet 200 at the moment is the preset purging energy value. That is, the first air nozzle 200 may blow air or water according to a preset blowing energy value. In one embodiment, the preset purge energy value is air pressure or water pressure.
If the preset purging energy value is smaller than the purging energy threshold, determining that the purging energy value of the first air faucet 200 at the moment is the purging energy threshold. That is, when the preset purging energy value is smaller than the purging energy threshold, the first gas nozzle 200 performs purging with the purging energy threshold at this time. Therefore, the purging mode with the self-adaptive energy value can ensure that the slag generated by laser processing is effectively removed, so that the removal efficiency is improved. In one embodiment, when slag is removed by the first nozzle 200, the flow may be guided by the guide groove, so as to further improve the slag removal efficiency.
In this embodiment, the first gas nozzle 200 and the laser beam output by the laser processing apparatus 100 are coaxially disposed, and the first gas nozzle 200 and the laser processing apparatus 100 are disposed on the same side of the hard and brittle substrate 101 to be processed. And determining the purging energy value of the first air nozzle 200 through the control device 300 according to the preset purging energy value and the purging energy threshold of the current hole to be processed of the hard and brittle substrate 101 to be processed, so as to rapidly remove the molten slag and improve the processing efficiency.
Referring to fig. 3, in one embodiment, the laser slag removal system 10 further includes: and a second air nozzle 400. The second air faucet 400 is electrically connected to the control device 300. The second air nozzle 400 and the first air nozzle 200 are arranged on different sides of the hard and brittle substrate 101 to be processed, and the second air nozzle 400 and the first air nozzle 200 are arranged on two opposite sides of the current hole to be processed when sweeping.
In one embodiment, the second air cap 400 has the same structure as the first air cap 200. In one embodiment, the second air nozzles 400 and the first air nozzles 200 are disposed on different sides of the hard and brittle substrate 101 to be processed, which means that: the first air nozzle 200 is arranged on one side of the to-be-processed rigid and brittle substrate 101, and the first air nozzle 200 is arranged on the other side of the to-be-processed rigid and brittle substrate 101. Namely, the second air nozzles 400 and the first air nozzles 200 are disposed on two sides of the rigid and brittle substrate 101 to be processed.
In one embodiment, the second air nozzle 400 and the first air nozzle 200 are disposed on two opposite sides of the current hole to be processed when purging: it is right to treat hard brittle substrate 101 treat that the processing hole is swept at present, first air cock 200 with laser beam machining device 100 set up in treat processing hard brittle substrate 101 same one side, promptly first air cock 200 set up in treat one side of processing hole at present. The second air faucet 400 is disposed on the other side of the hard and brittle substrate 101 to be processed, that is, the second air faucet 400 is disposed on the opposite side of the current hole to be processed. Meanwhile, the blowing directions of the second air nozzle 400 and the first air nozzle 200 are both blowing towards the current hole to be processed.
In one embodiment, the second air nozzle 400 and the first air nozzle 200 simultaneously purge the current hole to be processed with the same energy. Specifically, the purging energy values of the second air faucet 400 and the first air faucet 200 can be respectively monitored by arranging a power meter. Will second air cock 400 with first air cock 200 sweep the same setting of energy value, can guarantee wait to process hard and brittle base plate 101 and be in balanced state, effectively avoid wait to process hard and brittle base plate 101 and appear buckling phenomenon, improve processingquality.
In one embodiment, the purge directions of the second air tap 400 and the first air tap 200 are not coaxial. That is, when the second air tap 400 and the first air tap 200 purge the current hole to be processed, the purging direction between the second air tap 400 and the first air tap 200 may form a non-zero angle, so that the effect is better when slag is removed.
Referring to fig. 4, in one embodiment, the laser slag removal system 10 further includes: a visual pointing device 500. The visual positioning device 500 is electrically connected with the control device 300. The control device 300 determines, through the visual positioning device 500, that the first air nozzle 200 and the second air nozzle 400 are disposed on two opposite sides of the current hole to be processed.
In one embodiment, the visual positioning device 500 may include two CCD (charge coupled device) cameras. One of the CCD cameras is used to assist the first nozzle 200 in positioning the current hole to be processed. Another CCD camera may be used to assist the second nozzle 400 in positioning on the opposite side of the current hole to be processed. Therefore, when the second air nozzle 400 and the first air nozzle 200 purge the current hole to be processed simultaneously, the purging position is more accurate, so that the slag is better removed, and the processing efficiency is improved.
Referring to fig. 5, an embodiment of the present application provides a method for removing slag by laser processing, which is applied to the slag removing system 10 of any of the above embodiments. The method comprises the following steps:
s102: and controlling the first air nozzle 200 and the laser processing device 100 to move to the current hole to be processed of the hard and brittle substrate 101 to be processed.
In one embodiment, the first air nozzle 200 and the laser processing apparatus 100 can be controlled by the control apparatus 300 to move to the current hole to be processed of the hard and brittle substrate 101 to be processed. Specifically, the control device 300 may drive the first air nozzle 200 and the laser processing device 100 to move to the current hole to be processed of the brittle and hard substrate 101 to be processed by a driving motor. That is, the control device 300 moves the first air nozzle 200 and the laser processing device 100 to the current processing position of the hole to be processed. In an embodiment, the first air nozzle 200, the laser processing apparatus 100, and the control apparatus 300 may all adopt the structure described in the above embodiments, and the description thereof is omitted here.
S104: and determining the purging energy value of the first air faucet 200 according to the preset purging energy value and the purging energy threshold of the current hole to be processed.
In one embodiment, the purge energy value of the first gas nipple 200 may be determined by the control device 300 according to the preset purge energy value and the purge energy threshold of the current hole to be processed. In one embodiment, the purging energy threshold may be determined by the number of preset holes to be processed of the hard and brittle substrate 101 to be processed and the preset purging energy value corresponding to each preset hole to be processed. For example, if the number of the preset holes to be processed is N, the median of the preset purge energy values of the N preset holes to be processed is calculated. The median value is the purge energy threshold. In an embodiment, the preset purging energy value corresponding to each of the preset holes to be processed in the N preset holes to be processed may be set according to the type of the preset hole to be processed.
In one embodiment, when the laser processing apparatus 100 processes a current hole to be processed of the brittle and hard substrate 101 to be processed, the control apparatus 300 may compare (e.g., compare a difference value) the preset purge energy value of the current hole to be processed with the purge energy threshold. If the preset purging energy value is greater than or equal to the purging energy threshold, determining that the purging energy value of the first air faucet 200 at this time is the preset purging energy value. That is, at this time, the first air nozzle 200 may blow air or water according to a preset blowing energy value. In one embodiment, the preset purge energy value is air pressure or water pressure.
If the preset purging energy value is smaller than the purging energy threshold, determining that the purging energy value of the first air faucet 200 at this time is the purging energy threshold. That is, when the preset purge energy value is smaller than the purge energy threshold, the first gas nozzle 200 performs the purge with the purge energy threshold. Therefore, the purging mode with the self-adaptive energy value can ensure that the slag generated by laser processing is effectively removed, so that the removal efficiency is improved. In one embodiment, when slag is removed by the first nozzle 200, the flow may be guided by the guide groove, so as to further improve the slag removal efficiency.
In the method for removing slag by laser processing according to this embodiment, first, the first gas nozzle 200 and the laser processing apparatus 100 are controlled to move to the current hole to be processed of the brittle and hard substrate 101 to be processed. And then determining the purging energy value of the first air nozzle 200 according to the preset purging energy value and the purging energy threshold of the current hole to be processed of the hard and brittle substrate 101 to be processed, so that the molten slag can be quickly removed, and the processing efficiency is improved.
In one embodiment, before the step of determining the purge energy value of the first gas nipple 200 according to the preset purge energy value and the purge energy threshold of the current hole to be machined, the method further includes: and controlling the second air nozzle 400 to move to the position opposite to the current hole to be processed. The second air faucet 400 and the first air faucet 200 are disposed on different sides of the hard and brittle substrate 101 to be processed, and the second air faucet 400 and the first air faucet 200 are disposed on two opposite sides of the current hole to be processed when the blowing and blowing are performed. And determining the purging energy value of the second air faucet 400 according to the preset purging energy value and the purging energy threshold of the current hole to be processed.
In one embodiment, the second nozzle 400 can be controlled by the control device 300 to move to a position opposite to the current hole to be processed. Specifically, the control device 300 may also move the second air nozzle 400 to a position opposite to the current hole to be processed by using the driving motor. In an embodiment, the specific structure of the second nozzle 400 and the position relationship between the second nozzle 400 and the first nozzle 200 may be implemented by the above embodiments, and are not described herein again.
In one embodiment, the purge energy value of the second air tap 400 may be determined by the control device 300 according to the preset purge energy value and the purge energy threshold of the current hole to be processed. Specifically, the control device 300 may compare (e.g., compare a difference value) the preset purge energy value of the current hole to be processed with the purge energy threshold. If the preset purging energy value is greater than or equal to the purging energy threshold, determining that the purging energy value of the second air faucet 400 at this time is the preset purging energy value. That is, the second air nozzle 400 may blow air or blow water according to a preset blowing energy value. In one embodiment, the preset purge energy value is air pressure or water pressure. If the preset purging energy value is smaller than the purging energy threshold, determining that the purging energy value of the first air faucet 200 at this time is the purging energy threshold. That is, when the preset purge energy value is smaller than the purge energy threshold, the second air faucet 400 performs purge by using the purge energy threshold. Therefore, the purging mode with the self-adaptive energy value can ensure that the slag generated by laser processing is effectively removed, so that the removal efficiency is improved.
In one embodiment, the second air nozzle 400 and the first air nozzle 200 simultaneously purge the current hole to be processed with the same energy. Specifically, the purging energy values of the second air faucet 400 and the first air faucet 200 can be respectively monitored by arranging a power meter. The second air nozzle 400 and the first air nozzle 200 are arranged in the same purging energy value, so that the hard and brittle substrates 101 to be processed are in a balanced state, the bending phenomenon of the hard and brittle substrates 101 to be processed is effectively avoided, and the processing quality is improved.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 6. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operating system and the computer program to run on the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a laser machining slag removal method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 6 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
Referring to fig. 6, another embodiment of the present application provides a computer apparatus, which includes a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the method for removing slag by laser processing according to any one of the above embodiments when executing the computer program.
In one embodiment, the processor when executing the computer program implements the steps of:
s102: controlling the first air nozzle 200 and the laser processing device 100 to move to the current hole to be processed of the hard and brittle substrate 101 to be processed;
s104: and determining the purging energy value of the first air faucet 200 according to the preset purging energy value and the purging energy threshold of the current hole to be machined.
An embodiment of the present application further provides a computer readable storage medium, on which a computer program is stored, and the computer program is executed by a processor to implement the steps of the method for removing slag by laser processing according to any one of the above embodiments.
In one embodiment, the computer program when executed by the processor implements the steps of:
s102: controlling the first air nozzle 200 and the laser processing device 100 to move to the current hole to be processed of the hard and brittle substrate 101 to be processed;
s104: and determining the purging energy value of the first air faucet 200 according to the preset purging energy value and the purging energy threshold of the current hole to be machined.
The computer device and the computer readable storage medium are used for controlling the first air nozzle 200 and the laser processing device 100 to move to the current hole to be processed of the hard and brittle substrate 101 to be processed. And then determining the purging energy value of the first air nozzle 200 according to the preset purging energy value and the purging energy threshold of the current hole to be processed of the hard and brittle substrate 101 to be processed, so that the molten slag can be quickly removed, and the processing efficiency is improved.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include non-volatile and/or volatile memory. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A laser machining slag removal system, comprising:
a laser processing device;
the first air nozzle is coaxial with the laser beam output by the laser processing device, and the first air nozzle and the laser processing device are arranged on the same side of the hard and brittle substrate to be processed;
the control device is respectively electrically connected with the laser processing device and the first air nozzle and is used for determining the purging energy value of the first air nozzle according to the preset purging energy value and the purging energy threshold value of the current hole to be processed of the hard and brittle substrate to be processed; the purging energy threshold is determined according to the number of preset holes to be machined of the hard and brittle substrate to be machined and the preset purging energy value corresponding to each preset hole to be machined.
2. The laser machining slag removal system of claim 1, wherein the control device is configured to compare the preset purge energy value and the purge energy threshold for the current hole to be machined;
if the preset purging energy value is larger than or equal to the purging energy threshold value, determining that the purging energy value of the first air tap is the preset purging energy value;
and if the preset purging energy value is smaller than the purging energy threshold, determining the purging energy value of the first air tap as the purging energy threshold.
3. The laser machining slag removal system of claim 1, further comprising:
and the second air nozzle is electrically connected with the control device, the second air nozzle and the first air nozzle are arranged on different sides of the hard and brittle substrate to be processed, and the second air nozzle and the first air nozzle are arranged on two opposite sides of the current hole to be processed when sweeping.
4. The laser slag removal system as claimed in claim 3, wherein the purging directions of the second nozzle and the first nozzle are not coaxial, and the purging energy of the second nozzle and the purging energy of the first nozzle for the hole to be processed are the same.
5. The laser machining slag removal system of claim 3, further comprising:
and the visual positioning device is electrically connected with the control device, and the control device determines the first air faucet and the second air faucet through the visual positioning device and is arranged on two opposite sides of the current hole to be machined.
6. The laser machining slag removal system of claim 1, wherein the purge energy threshold is a median of the preset purge energy values for a preset number of the holes to be machined.
7. A method for removing slag by laser processing, which is applied to the slag removing system by laser processing according to any one of claims 1 to 6, and comprises the following steps:
controlling the first air nozzle and the laser processing device to move to the current hole to be processed of the hard and brittle substrate to be processed;
and determining the purging energy value of the first air tap according to the preset purging energy value and the purging energy threshold of the current hole to be processed.
8. The method for removing slag by laser processing according to claim 7, wherein the step of determining the purge energy value of the first gas nozzle according to the preset purge energy value and the purge energy threshold value of the current hole to be processed comprises:
comparing the preset purging energy value of the current hole to be processed with the purging energy threshold value;
if the preset purging energy value is larger than or equal to the purging energy threshold value, determining that the purging energy value of the first air tap is the preset purging energy value;
and if the preset purging energy value is smaller than the purging energy threshold, determining the purging energy value of the first air tap as the purging energy threshold.
9. The method for removing slag by laser processing according to claim 7, wherein the step of determining the purge energy value of the first gas nozzle according to the preset purge energy value and the purge energy threshold of the current hole to be processed is preceded by the step of:
and determining the purging energy threshold according to the number of preset holes to be processed of the hard and brittle substrate to be processed and the preset purging energy value corresponding to each preset hole to be processed.
10. The method for removing slag by laser processing according to claim 7, wherein the step of determining the purge energy value of the first gas nozzle according to the preset purge energy value and the purge energy threshold of the current hole to be processed is preceded by the step of:
controlling a second air nozzle to move to the position opposite to the current hole to be processed, wherein the second air nozzle and the first air nozzle are arranged on different sides of the hard and brittle substrate to be processed, and the second air nozzle and the first air nozzle are arranged on two opposite sides of the current hole to be processed during blowing;
and determining the blowing energy value of the second air tap according to the preset blowing energy value and the blowing energy threshold value of the current hole to be machined.
11. The method for removing slag by laser processing according to claim 10, wherein the second gas nozzle and the first gas nozzle are not coaxial with the purging direction of the hole to be processed.
12. A computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor implements the steps of the method of any one of claims 7 to 11 when executing the computer program.
13. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 7 to 11.
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