CN112122726A - Brazing method of aluminum target and aluminum back plate - Google Patents
Brazing method of aluminum target and aluminum back plate Download PDFInfo
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- CN112122726A CN112122726A CN202010976235.XA CN202010976235A CN112122726A CN 112122726 A CN112122726 A CN 112122726A CN 202010976235 A CN202010976235 A CN 202010976235A CN 112122726 A CN112122726 A CN 112122726A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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Abstract
The invention relates to a brazing method of an aluminum target material and an aluminum back plate, wherein a first groove is formed in the welding surface of the aluminum back plate, and a second groove is formed in the first groove; the diameter of the first groove is equal to that of the aluminum target; the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate; the brazing method comprises the following steps: (1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 2-3 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate; (2) and adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain the aluminum target assembly. According to the welding method provided by the invention, the special welding structure is set and the welding surface is specially treated, so that the aluminum target and the aluminum back plate are well welded, the welding bonding rate is more than or equal to 97%, the stress distribution of the welding surface is uniform, and the service life of the target assembly is obviously prolonged.
Description
Technical Field
The invention relates to the field of target welding, in particular to a brazing method of an aluminum target and an aluminum back plate.
Background
Currently, in the semiconductor industry, target assemblies are made up of a target material that meets sputtering performance, and a backing plate bonded to the target material. The backing plate plays a supporting role in the target assembly and has the effect of conducting heat. High-purity aluminum target material (more than or equal to 3N) is a commonly used lead manufacturing material for manufacturing semiconductor chips, and the high-purity aluminum target material is usually required to be welded with a back plate when in use.
CN104588810A discloses a welding method of an aluminum target assembly, comprising: providing an aluminum target material and an aluminum back plate; forming a brazing filler metal wetting layer on a surface to be welded of the aluminum target or forming a brazing filler metal wetting layer on a surface to be welded of the aluminum back plate; placing the aluminum back plate and the aluminum target material with the brazing filler metal infiltration layer in a vacuum sheath, wherein the surface to be welded of the aluminum back plate is in contact with the brazing filler metal infiltration layer, or placing the aluminum target material and the aluminum back plate with the brazing filler metal infiltration layer in the vacuum sheath, and the surface to be welded of the aluminum target material is in contact with the brazing filler metal infiltration layer; welding the aluminum target, the brazing filler metal infiltration layer and the aluminum back plate together by using a hot isostatic pressing process to form an aluminum target assembly; and after welding is finished, cooling the vacuum sheath, and removing the vacuum sheath to obtain the aluminum target assembly. The welding between the aluminum target material and the aluminum back plate is realized, the welding efficiency is higher, the welding strength of the formed aluminum target material assembly is higher, the deformation is small, and the requirements of stably producing and using the target material for a long time can be met.
CN103567583A discloses a welding method of an aluminum target assembly, comprising: carrying out surface infiltration treatment on the welding surface of the aluminum target blank by using molten tin solder; carrying out surface wetting treatment on the welding surface of the back plate by using molten indium solder; and welding the welding surface of the aluminum target material blank and the welding surface of the back plate together by using the tin solder and the indium solder. The welding method of the aluminum target material assembly provided by the invention avoids nickel plating treatment on the welding surface of the aluminum target material blank, reduces energy consumption, saves cost and reduces pollution.
However, the existing welding method still has the problems of low welding bonding rate, uneven stress distribution of the welding surface after welding, short service life of the target assembly after welding and the like.
Disclosure of Invention
In view of the problems in the prior art, the invention aims to provide a brazing method for an aluminum target and an aluminum back plate, by which the aluminum target and the aluminum back plate can be well welded, the welding bonding rate is more than or equal to 97%, the stress distribution of a welding surface is uniform, and the service life of a target assembly is remarkably prolonged.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a brazing method of an aluminum target and an aluminum back plate, wherein a first groove is formed in the welding surface of the aluminum back plate, and a second groove is formed in the first groove;
the diameter of the first groove is equal to that of the aluminum target;
the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate;
the brazing method comprises the following steps:
(1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 2-3 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate;
(2) and adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain the aluminum target assembly.
According to the welding method provided by the invention, the special welding structure is set and the welding surface is specially treated, so that the aluminum target and the aluminum back plate are well welded, the welding bonding rate is more than or equal to 97%, the stress distribution of the welding surface is uniform, and the service life of the target assembly is obviously prolonged.
In a preferred embodiment of the present invention, the difference between the diameters of the first groove and the second groove is 0.4 to 1.5mm, and may be, for example, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm or 1.5mm, but not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
In a preferred embodiment of the present invention, the depth of the first groove is 3.5 to 4mm, and may be, for example, 3.5mm, 3.6mm, 3.7mm, 3.8mm, 3.9mm or 4mm, but is not limited to the above-mentioned values, and other values not mentioned in the range are also applicable.
In a preferred embodiment of the present invention, the depth of the second groove is 3 to 3.5mm, and may be, for example, 3mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, or 3.5mm, but is not limited to the above-mentioned values, and other values not listed in the range are also applicable.
In the invention, the depth of the second groove is relative to the depth of the first groove.
Preferably, the difference between the depth of the second groove and the height of the projection of the welding surface of the aluminum target is 0.05-0.25mm, such as 0.05mm, 0.07mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, or 0.25mm, but not limited to the values listed, and other values not listed in this range are equally applicable.
According to the invention, the welding strength of the target assembly is strengthened by utilizing the specific combination of the difference value of the diameters of the first groove and the second groove and the distance between the protruding welding surface of the target and the welding surface of the second groove, the service life of the target is prolonged, and the generation of internal stress between the welding surfaces is reduced.
As a preferred embodiment of the present invention, the electrolyte in the anodic oxidation treatment in step (1) is sulfuric acid having a concentration of 50 to 90g/L, and may be, for example, 50g/L, 55g/L, 60g/L, 65g/L, 70g/L, 75g/L, 80g/L, 85g/L or 90g/L, but is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
As a preferable technical means of the present invention, the current density in the anodic oxidation treatment in the step (1) is 2.5 to 4A/dm2For example, it may be 2.5A/dm2、2.6A/dm2、2.7A/dm2、2.8A/dm2、2.9A/dm2、3A/dm2、3.1A/dm2、3.2A/dm2、3.3A/dm2、3.4A/dm2、3.5A/dm2、3.6A/dm2、3.7A/dm2、3.8A/dm2、3.9A/dm2Or 4A/dm2Etc., but are not limited to the numerical values recited, ranges within whichValues not listed by him are equally applicable.
Preferably, the voltage in the anodic oxidation in step (1) is 50-100V, such as 50V, 55V, 60V, 65V, 70V, 75V, 80V, 85V, 90V, 95V or 100V, but not limited to the recited values, and other values not recited in the range are also applicable.
In a preferred embodiment of the present invention, the time for the anodic oxidation in the step (1) is 30 to 50min, for example, 30min, 35min, 40min, 45min, or 50min, but is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
In a preferred embodiment of the present invention, the solder in the soldering in the step (2) is Sn91 — Zn solder.
Preferably, the temperature of the brazing in the step (2) is 270-290 ℃, such as 270 ℃, 275 ℃, 280 ℃, 285 ℃ or 290 ℃, but not limited to the recited values, and other values not recited in the range are also applicable.
As a preferable technical scheme of the invention, furnace pressure cooling is carried out after the brazing in the step (2) is finished.
Preferably, the terminal pressure of the pressurization is 0.4 to 0.5MPa, and for example, 0.4MPa, 0.41MPa, 0.42MPa, 0.43MPa, 0.44MPa, 0.45MPa, 0.46MPa, 0.47MPa, 0.48MPa, 0.49MPa or 0.5MPa may be used.
Preferably, the time of the furnace pressure cooling is 15min or more, for example, 15min, 20min, 25min, 30min, 35min, 40min, 45min or 50min, but not limited to the values listed, and other values not listed in the range are also applicable.
As a preferable technical scheme, a first groove is formed in the welding surface of the aluminum back plate, and a second groove is formed in the first groove;
the diameter of the first groove is equal to that of the aluminum target;
the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate; the difference between the depth of the second groove and the protruding height of the welding surface of the aluminum target is 0.05-0.25 mm;
the brazing method comprises the following steps:
(1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 2-3 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate;
(2) and adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain the aluminum target assembly.
In the invention, in order to facilitate the installation of the target material, the first groove can be an inverted trapezoidal groove or other grooves with larger openings, and the minimum diameter of the first groove is only required to be kept the same as the diameter of the target material.
In the invention, when the target material and the back plate are pressurized and cooled, the pressing block is arranged among the pressurizing device, the target material and the back plate to protect the target material and the back plate from being lost, and the pressure distribution can be uniform.
Compared with the prior art, the invention at least has the following beneficial effects:
(1) according to the welding method provided by the invention, the special welding structure is set and the welding surface is specially treated, so that the aluminum target and the aluminum back plate are well welded, the welding bonding rate is more than or equal to 97%, the stress distribution of the welding surface is uniform, and the service life of the target assembly is obviously prolonged.
(2) According to the invention, the welding strength of the target assembly is strengthened by utilizing the specific combination of the difference value of the diameters of the first groove and the second groove and the distance between the protruding welding surface of the target and the welding surface of the second groove, the service life of the target is prolonged, and the generation of internal stress between the welding surfaces is reduced.
Drawings
Fig. 1 is an assembly diagram of an aluminum target and an aluminum backing plate in example 1 of the present invention.
In the figure: 1-aluminum target material and 2-aluminum back plate.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Detailed Description
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
example 1
The embodiment provides a brazing method of an aluminum target and an aluminum back plate, wherein a first groove is formed in a welding surface of the aluminum back plate, and a second groove is formed in the first groove;
the diameter of the first groove is equal to that of the aluminum target;
the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate; the difference between the diameters of the first groove and the second groove is 1mm, the depth of the first groove is 3.7mm, the depth of the second groove is 3.2mm, and the difference between the depth of the second groove and the projection height of the welding surface of the aluminum target is 0.1mm, as shown in fig. 1;
the brazing method comprises the following steps:
(1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 2.5 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate; the concentration of the sulfuric acid in the electrolyte in the anodic oxidation treatment is 70g/L, and the current density is 3.3A/dm2The voltage is 70V, and the time is 40 min;
(2) adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain an aluminum target assembly; the solder in the welding is Sn91-Zn solder, and the welding temperature is 280 ℃; and after welding, pressurizing and cooling along with the furnace, wherein the pressurizing end point pressure is 0.44MPa, and the time is 20 min.
The welding bonding rate of the obtained target assembly is 98.5%, and the stress distribution of the welding surface is uniform.
Example 2
The embodiment provides a brazing method of an aluminum target and an aluminum back plate, wherein a first groove is formed in a welding surface of the aluminum back plate, and a second groove is formed in the first groove;
the diameter of the first groove is equal to that of the aluminum target;
the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate; the difference between the diameters of the first groove and the second groove is 0.4mm, the depth of the first groove is 4mm, the depth of the second groove is 3.5mm, and the difference between the depth of the second groove and the projection height of the welding surface of the aluminum target is 0.05 mm;
the brazing method comprises the following steps:
(1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 2 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate; the concentration of the sulfuric acid in the electrolyte in the anodic oxidation treatment is 90g/L, and the current density is 2.5A/dm2The voltage is 50V, and the time is 30 min;
(2) adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain an aluminum target assembly; the solder in the welding is Sn91-Zn solder, and the welding temperature is 270 ℃; and after welding, pressurizing and cooling along with the furnace, wherein the pressurizing end point pressure is 0.4MPa, and the time is 15 min.
The welding bonding rate of the obtained target assembly is 98%, and the stress distribution of the welding surface is uniform.
Example 3
The embodiment provides a brazing method of an aluminum target and an aluminum back plate, wherein a first groove is formed in a welding surface of the aluminum back plate, and a second groove is formed in the first groove;
the diameter of the first groove is equal to that of the aluminum target;
the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate; the difference between the diameters of the first groove and the second groove is 1.5mm, the depth of the first groove is 3.5mm, the depth of the second groove is 3mm, and the difference between the depth of the second groove and the projection height of the welding surface of the aluminum target is 0.25 mm;
the brazing method comprises the following steps:
(1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 3 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate; the anodic oxidation siteThe concentration of sulfuric acid in the electrolyte during the treatment is 50g/L, and the current density is 4A/dm2The voltage is 100V, and the time is 50 min;
(2) adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain an aluminum target assembly; the solder in the welding is Sn91-Zn solder, and the welding temperature is 290 ℃; and after welding, pressurizing and cooling along with the furnace, wherein the pressurizing end point pressure is 0.4MPa, and the time is 30 min.
The welding bonding rate of the obtained target material assembly is 99%, and the stress distribution of the welding surface is uniform.
Example 4
The difference from the embodiment 1 is only that the difference between the diameters of the first groove and the second groove is 0.1mm, the welding bonding rate of the obtained target assembly is 97.5%, the stress distribution of the welding surface is uniform, and the stress of the welding surface is increased by 5%.
Example 5
The difference from the embodiment 1 is only that the difference between the diameters of the first groove and the second groove is 2mm, the welding bonding rate of the obtained target assembly is 97%, the stress distribution of the welding surface is uniform, and the stress of the welding surface is increased by 7%.
Example 6
The difference from the embodiment 1 is only that the difference between the depth of the second groove and the protruding height of the welding surface of the aluminum target is 0.4mm, the welding bonding rate of the obtained target assembly is 97.2%, the stress distribution of the welding surface is uniform, and the stress of the welding surface is increased by 9%.
Comparative example 1
The difference from the example 1 is only that the roughness of the welding surface of the aluminum target is 1 μm, the welding bonding rate of the obtained target assembly is 88%, the stress distribution of the welding surface is uneven, and the service life is short.
Comparative example 2
The difference from the example 1 is only that the roughness of the welding surface of the aluminum target is 8 μm, the welding bonding rate of the obtained target assembly is 85%, the stress distribution of the welding surface is uneven, and the service life is short.
Comparative example 3
The difference from the embodiment 1 is that the welding surface of the aluminum backboard is not subjected to anodic oxidation treatment, the welding bonding rate of the obtained target assembly is 82%, the stress distribution of the welding surface is uneven, and the service life is short.
According to the results of the embodiment and the comparative example, the welding method provided by the invention realizes good welding of the aluminum target and the aluminum back plate by setting the special welding structure and performing specific treatment on the welding surface, the welding bonding rate is more than or equal to 97%, the stress distribution of the welding surface is uniform, and the service life of the target assembly is obviously prolonged. Furthermore, the welding strength of the target assembly is strengthened by the specific combination of the difference value of the diameters of the first groove and the second groove and the distance between the protruding welding surface of the target and the welding surface of the second groove, the service life of the target is prolonged, and the generation of internal stress between the welding surfaces is reduced.
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. A brazing method of an aluminum target and an aluminum back plate is characterized in that a first groove is formed in a welding surface of the aluminum back plate, and a second groove is formed in the first groove;
the diameter of the first groove is equal to that of the aluminum target;
the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate;
the brazing method comprises the following steps:
(1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 2-3 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate;
(2) and adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain the aluminum target assembly.
2. The brazing method according to claim 1, wherein the difference between the diameters of the first groove and the second groove is 0.4 to 1.5 mm.
3. The brazing method according to claim 1 or 2, wherein the depth of the first groove is 3.5 to 4 mm.
4. The brazing method according to any one of claims 1 to 3, wherein the depth of the second grooves is 3 to 3.5 mm;
preferably, the difference between the depth of the second groove and the projection height of the welding surface of the aluminum target is 0.05-0.25 mm.
5. The brazing method according to any one of claims 1 to 4, wherein the electrolyte in the anodizing treatment of step (1) is sulfuric acid having a concentration of 50 to 90 g/L.
6. The brazing method according to any one of claims 1 to 5, wherein the current density in the anodic oxidation treatment of step (1) is 2.5 to 4A/dm2；
Preferably, the voltage in the anodic oxidation in the step (1) is 50-100V.
7. The brazing method according to any one of claims 1 to 6, wherein the anodizing time of step (1) is 30 to 50 min.
8. The brazing method according to any one of claims 1 to 7, wherein the solder in the brazing in the step (2) is Sn91-Zn solder;
preferably, the temperature of the brazing welding in the step (2) is 270-.
9. The brazing method according to any one of claims 1 to 8, wherein the brazing in the step (2) is carried out with furnace pressure cooling after the brazing is completed;
preferably, the end pressure of the pressurization is 0.4 to 0.5 MPa;
preferably, the time of the furnace pressure cooling is more than or equal to 15 min.
10. The brazing method according to any one of claims 1 to 9, wherein the welding surface of the aluminum backing plate is provided with a first groove, and a second groove is arranged in the first groove;
the diameter of the first groove is equal to that of the aluminum target;
the welding surface of the aluminum target is provided with a bulge matched with the second groove of the welding surface of the aluminum back plate; the difference between the depth of the second groove and the protruding height of the welding surface of the aluminum target is 0.05-0.25 mm;
the brazing method comprises the following steps:
(1) carrying out sand blasting treatment on the welding surface of the aluminum target material until the roughness is 2-3 mu m, and carrying out anodic oxidation treatment on the welding surface of the aluminum back plate;
(2) and adding solder into the first groove and the second groove of the aluminum back plate, and then brazing to obtain the aluminum target assembly.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113458528A (en) * | 2021-07-12 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Target material assembly and welding method and application thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0867978A (en) * | 1994-08-26 | 1996-03-12 | Sumitomo Chem Co Ltd | Method for soldering target for sputtering |
| JP2000045068A (en) * | 1998-07-27 | 2000-02-15 | Japan Energy Corp | Backing plate for sputtering target and target/backing plate assembled body |
| TW530147B (en) * | 2001-06-20 | 2003-05-01 | Showa Denko Kk | Cooling plate and production method therefor |
| CN104513952A (en) * | 2013-09-30 | 2015-04-15 | 宁波江丰电子材料股份有限公司 | Manufacturing method of target material assembly and the target material assembly |
| CN107755837A (en) * | 2016-08-18 | 2018-03-06 | 宁波江丰电子材料股份有限公司 | The manufacture method of target material assembly |
| CN108149203A (en) * | 2016-12-05 | 2018-06-12 | 宁波江丰电子材料股份有限公司 | The manufacturing method of target material assembly |
| CN108237279A (en) * | 2016-12-27 | 2018-07-03 | 宁波江丰电子材料股份有限公司 | The welding method of target material assembly and target material assembly welding structure |
| CN111321444A (en) * | 2020-04-09 | 2020-06-23 | 宁波江丰电子材料股份有限公司 | Method for reducing surface treatment rework of back plate |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
-
2020
- 2020-09-16 CN CN202010976235.XA patent/CN112122726B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0867978A (en) * | 1994-08-26 | 1996-03-12 | Sumitomo Chem Co Ltd | Method for soldering target for sputtering |
| JP2000045068A (en) * | 1998-07-27 | 2000-02-15 | Japan Energy Corp | Backing plate for sputtering target and target/backing plate assembled body |
| TW530147B (en) * | 2001-06-20 | 2003-05-01 | Showa Denko Kk | Cooling plate and production method therefor |
| CN104513952A (en) * | 2013-09-30 | 2015-04-15 | 宁波江丰电子材料股份有限公司 | Manufacturing method of target material assembly and the target material assembly |
| CN107755837A (en) * | 2016-08-18 | 2018-03-06 | 宁波江丰电子材料股份有限公司 | The manufacture method of target material assembly |
| CN108149203A (en) * | 2016-12-05 | 2018-06-12 | 宁波江丰电子材料股份有限公司 | The manufacturing method of target material assembly |
| CN108237279A (en) * | 2016-12-27 | 2018-07-03 | 宁波江丰电子材料股份有限公司 | The welding method of target material assembly and target material assembly welding structure |
| CN111321444A (en) * | 2020-04-09 | 2020-06-23 | 宁波江丰电子材料股份有限公司 | Method for reducing surface treatment rework of back plate |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113458528A (en) * | 2021-07-12 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Target material assembly and welding method and application thereof |
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| CN112122726B (en) | 2022-09-30 |
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