CN112118723A - Production process for computer mainboard paster Rubber - Google Patents

Production process for computer mainboard paster Rubber Download PDF

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Publication number
CN112118723A
CN112118723A CN201910540319.6A CN201910540319A CN112118723A CN 112118723 A CN112118723 A CN 112118723A CN 201910540319 A CN201910540319 A CN 201910540319A CN 112118723 A CN112118723 A CN 112118723A
Authority
CN
China
Prior art keywords
rubber
vacuum adsorption
production process
camera
main board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910540319.6A
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Chinese (zh)
Inventor
盛易
邓川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Show Industrial Equipment Co ltd
Original Assignee
Suzhou Show Industrial Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Show Industrial Equipment Co ltd filed Critical Suzhou Show Industrial Equipment Co ltd
Priority to CN201910540319.6A priority Critical patent/CN112118723A/en
Publication of CN112118723A publication Critical patent/CN112118723A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815Controlling of component placement on the substrate during or after manufacturing

Abstract

In order to solve the problem that the precision and the speed of the existing computer mainboard labeling equipment are low, the invention discloses a production process for sticking Rubber on a computer mainboard, wherein a plurality of vacuum adsorption heads which are arranged in sequence are used for adsorbing stripped Rubber, and then a high-speed camera is used for visually photographing the Rubber on the vacuum adsorption heads; the mark camera is used for carrying out mark point positioning on the positioned main board, the machine vision system is combined with the high-speed camera and the image data obtained by the mark camera to generate a group of paths, and the vacuum adsorption head pastes Rubber on the main board one by one according to the paths.

Description

Production process for computer mainboard paster Rubber
Technical Field
The invention relates to the field of computer mainboard processing, in particular to a production process for sticking Rubber on a computer mainboard.
Background
The existing Rubber pasting equipment can only realize the function of pasting one Rubber at a time, so that the Rubber pasting speed is low, the pasting precision rate is relatively low, the Rubber pasting equipment can only be suitable for single-piece small-batch work, the large-scale production at present cannot be adapted, the use of the Rubber pasting equipment is greatly limited, the feeding speed of the existing Rubber pasting equipment is relatively low, the stability is relatively low, and the improvement of the working efficiency of the Rubber pasting equipment becomes urgent.
Disclosure of Invention
The purpose of the invention is as follows: in order to solve the defects in the background technology, the production process of the computer mainboard sticker Rubber is provided, a visual alignment and lamination mode is adopted, high-speed and accurate alignment and lamination are achieved, labels are automatically peeled off, automatic alignment is achieved, and lamination efficiency is high.
The technical scheme is as follows: the production process of attaching Rubber to a computer mainboard comprises the steps of adsorbing stripped Rubber by a plurality of vacuum adsorption heads arranged in sequence, and visually photographing the Rubber on the vacuum adsorption heads by using a high-speed camera; and (3) carrying out mark point positioning on the positioned main board by using a mark camera, combining the image data acquired by the high-speed camera and the mark camera by using a machine vision system to generate a group of paths, and attaching Rubber to the main board one by using a vacuum adsorption head according to the paths.
In a preferred embodiment of the present invention, the number of the vacuum suction heads is equal to the number of the high-speed cameras, and the vacuum suction heads are arranged in the same manner.
In a preferred embodiment of the present invention, the vacuum suction head is a rotatable vacuum suction head.
In a preferred embodiment of the present invention, the vacuum suction heads are arranged in a line.
In a preferred embodiment of the present invention, the field of view of the high-speed camera is 10 × 10 mm.
As a preferred mode of the present invention, the peeling action of the Rubber is completed by a feeder, the feeder includes an automatic capstan, a peeling plate, and a material receiving platform, the automatic capstan is located at the bottom of the material receiving platform, a step slope is arranged above the material receiving platform, and the peeling plate is located above the step slope.
As a preferable mode of the invention, a V-shaped groove is further arranged at the top of the material receiving platform.
The invention realizes the following beneficial effects:
1. according to the invention, the Rubber adsorbed by the vacuum adsorption head is photographed and detected by the high-speed camera, the mark point on the mainboard is positioned by the mark camera, then the path of the vacuum adsorption head is adjusted, so that the Rubber adsorbed by the vacuum adsorption head can be quickly attached to the mainboard, and the accuracy is higher.
2. According to the feeder, the V-shaped groove is formed, so that the material strip on the material receiving platform can be guided to be stripped, and the stability of feeding is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic view of the overall structure provided by the present invention.
Fig. 2 is a schematic view of an arrangement structure of the vacuum chuck according to the present invention.
Fig. 3 is a schematic view of the feeder structure provided in the present invention.
In the figure: 1. the device comprises a vacuum adsorption head, a 2-high-speed camera, a 3-mark camera, a 4-feeder, a 401-automatic winch, a 402-receiving platform, a 403-scraping plate and a 404-V-shaped groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example one
The production process of attaching Rubber to a computer mainboard comprises the steps of adsorbing stripped Rubber by a plurality of vacuum adsorption heads arranged in sequence, and visually photographing the Rubber on the vacuum adsorption heads by using a high-speed camera; and (3) carrying out mark point positioning on the positioned main board by using a mark camera, combining the image data acquired by the high-speed camera and the mark camera by using a machine vision system to generate a group of paths, and attaching Rubber to the main board one by using a vacuum adsorption head according to the paths.
The Rubber involved in the invention is a Rubber sheet, the high-speed camera is used for detecting the Rubber adsorbed on the vacuum suction nozzle, detecting whether blanking exists and whether the Rubber is dislocated with the vacuum adsorption head, and the mark camera is used for marking and positioning the position of the mainboard to which the Rubber needs to be attached; after the high-speed camera finishes photographing and detecting the Rubber and the mark camera finishes positioning the mark point of the main board, the machine vision system sets the path of the vacuum adsorption head so that the Rubber can be attached above the main board accurately.
Example two
Referring to fig. 1-3, the second embodiment is implemented based on the first embodiment, except that:
the number of the vacuum adsorption heads is consistent with that of the high-speed cameras, the arrangement modes are consistent, the high-speed cameras can simultaneously carry out camera shooting detection on Rubber on the vacuum adsorption heads, the camera shooting time is shortened, and the working efficiency is improved.
The vacuum adsorption head is a rotatable vacuum adsorption head and can drive the adsorbed Rubber to rotate, so that the Rubber can be rotationally attached to a mark point marked above the mainboard.
The vacuum adsorption heads are arranged in a straight line, so that the whole row of Rubber materials can be simultaneously adsorbed, and the efficiency is higher.
The visual field of the high-speed camera is 10 × 10mm, and the Rubber can be clearly shot and detected.
The automatic material feeding device comprises an automatic winch, a stripping plate and a material receiving platform, wherein the automatic winch is located at the bottom of the material receiving platform, a step inclined plane is arranged above the material receiving platform, the stripping plate is located above the step inclined plane, the material feeding device is used for providing Rubber materials for a vacuum adsorption head, it needs to be noted that Rubber in the automatic material feeding device supplies the materials through a material belt, the automatic winch is used for recycling the material belt stripped of the Rubber, and when the automatic material feeding device is specifically used, a gap for the material belt to pass through is formed between the stripping plate and the material receiving platform, so that the material belt can conveniently.
Connect the material platform top still to be equipped with the V-arrangement groove, can lead to connecing the material area on the material platform to shell the material to the stability of feed has been improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (7)

1. The production process of sticking Rubber on a computer mainboard is characterized in that a plurality of vacuum adsorption heads arranged in sequence are used for adsorbing stripped Rubber, and then a high-speed camera is used for visually photographing the Rubber on the vacuum adsorption heads; and (3) carrying out mark point positioning on the positioned main board by using a mark camera, combining the image data acquired by the high-speed camera and the mark camera by using a machine vision system to generate a group of paths, and attaching Rubber to the main board one by using a vacuum adsorption head according to the paths.
2. The Rubber production process for pasting computer motherboard as recited in claim 1, wherein the number of the vacuum suction heads is consistent with the number of the high speed cameras and the arrangement manner is consistent.
3. The Rubber-pasting production process for a computer motherboard as recited in claim 1, wherein the vacuum adsorption head is a rotatable vacuum adsorption head.
4. The Rubber-pasting production process of a computer motherboard as recited in claim 1, wherein the vacuum adsorption heads are arranged in a straight line.
5. The process for manufacturing computer motherboard with Rubber according to claim 1, wherein the field of view of the high speed camera is 10 x 10 mm.
6. The production process of the computer mainboard paster Rubber as claimed in claim 1, wherein the Rubber stripping action is performed by a feeder, the feeder comprises an automatic capstan, a stripper plate and a receiving platform, the automatic capstan is located at the bottom of the receiving platform, a step slope is arranged above the receiving platform, and the stripper plate is located above the step slope.
7. The Rubber-pasting production process of the computer main board as claimed in claim 6, wherein a V-shaped groove is further formed at the top of the material receiving platform.
CN201910540319.6A 2019-06-21 2019-06-21 Production process for computer mainboard paster Rubber Pending CN112118723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910540319.6A CN112118723A (en) 2019-06-21 2019-06-21 Production process for computer mainboard paster Rubber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910540319.6A CN112118723A (en) 2019-06-21 2019-06-21 Production process for computer mainboard paster Rubber

Publications (1)

Publication Number Publication Date
CN112118723A true CN112118723A (en) 2020-12-22

Family

ID=73796052

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910540319.6A Pending CN112118723A (en) 2019-06-21 2019-06-21 Production process for computer mainboard paster Rubber

Country Status (1)

Country Link
CN (1) CN112118723A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101553106A (en) * 2008-03-31 2009-10-07 松下电器产业株式会社 Element mounting device and element mounting method
JP2013143544A (en) * 2012-01-12 2013-07-22 Yamaha Motor Co Ltd Surface mounting machine
CN206136585U (en) * 2016-10-26 2017-04-26 荣旗工业科技(苏州)有限公司 Conducting resin pastes installation
CN206181584U (en) * 2016-08-29 2017-05-17 北京博瑞精电科技有限公司 LED chip mounter
CN207810001U (en) * 2018-01-05 2018-09-04 深圳市策维科技有限公司 A kind of mobile phone shell LOGO attachment and detection device automatically
EP3376844A1 (en) * 2015-11-11 2018-09-19 Fuji Corporation Image processing device and image processing method for base plate
CN108882674A (en) * 2018-09-18 2018-11-23 昆山晨鼎嘉电子科技有限公司 A kind of automatic placement equipment of vision guide and its application method
CN109018586A (en) * 2018-08-30 2018-12-18 博众精工科技股份有限公司 A kind of nigh velocity bedy mechanism

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101553106A (en) * 2008-03-31 2009-10-07 松下电器产业株式会社 Element mounting device and element mounting method
JP2013143544A (en) * 2012-01-12 2013-07-22 Yamaha Motor Co Ltd Surface mounting machine
EP3376844A1 (en) * 2015-11-11 2018-09-19 Fuji Corporation Image processing device and image processing method for base plate
CN206181584U (en) * 2016-08-29 2017-05-17 北京博瑞精电科技有限公司 LED chip mounter
CN206136585U (en) * 2016-10-26 2017-04-26 荣旗工业科技(苏州)有限公司 Conducting resin pastes installation
CN207810001U (en) * 2018-01-05 2018-09-04 深圳市策维科技有限公司 A kind of mobile phone shell LOGO attachment and detection device automatically
CN109018586A (en) * 2018-08-30 2018-12-18 博众精工科技股份有限公司 A kind of nigh velocity bedy mechanism
CN108882674A (en) * 2018-09-18 2018-11-23 昆山晨鼎嘉电子科技有限公司 A kind of automatic placement equipment of vision guide and its application method

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Application publication date: 20201222