CN112117228A - IGBT bonder charging tray conveying and positioning device - Google Patents
IGBT bonder charging tray conveying and positioning device Download PDFInfo
- Publication number
- CN112117228A CN112117228A CN202011086768.7A CN202011086768A CN112117228A CN 112117228 A CN112117228 A CN 112117228A CN 202011086768 A CN202011086768 A CN 202011086768A CN 112117228 A CN112117228 A CN 112117228A
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- dbc
- lead screw
- igbt
- positioning device
- tray conveying
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- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims description 27
- 230000000694 effects Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 13
- 238000007599 discharging Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Ceramic Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a feeding tray conveying and positioning device of an IGBT bonding machine, which comprises an installation frame and a DBC feeding tray which moves along the installation frame through a conveying belt, wherein a positioning mechanism is arranged at the bottom of the installation frame in a sliding mode, the positioning mechanism comprises a screw rod mechanism fixedly arranged on a bottom plate of the installation frame, a telescopic mechanism fixedly arranged on a movable part of the screw rod mechanism and a limiting component fixedly arranged on the telescopic mechanism, and a notch matched with the limiting component is formed in the side surface of the DBC feeding tray. The device, through the drive belt with the DBC charging tray in the inboard translation of mounting bracket, when carrying the bonding operation point, through the positioning mechanism that slides and set up, the intervallic fixes a position the DBC charging tray to guarantee that the DBC base plate on the DBC charging tray carries out the bonding in proper order through the bonding machine of top, save and carry out manual assistance-localization real-time's work with operating personnel, it is higher to place the precision, and accelerated production machining efficiency, the practicality is strong.
Description
Technical Field
The invention belongs to the technical field of electronic element processing equipment, and particularly relates to a tray conveying and positioning device of an IGBT bonding machine.
Background
An insulated Gate Bipolar transistor (igbt) is a core device for energy conversion and transmission, and is widely applied in the fields of rail transit, smart grid, aerospace, electric vehicles, new energy equipment, and the like. In order to improve the heat dissipation performance of the power device and increase the service life and reliability, a modular packaging form with smaller volume, higher efficiency and higher reliability has become a main packaging form of the high-power IGBT.
In the bonding process in the production process of the IGBT module, chips on the DBC substrate and the chips and the DBC substrate are connected through bonding and routing to form a complete circuit structure. At present, in order to improve the utilization rate of equipment, a bonding machine mostly adopts a mode of loading a plurality of DBC substrates by a material tray in batch loading and unloading. In view of the higher positioning accuracy requirement of the bonding process to the DBC substrate, the manual feeding and discharging of the material disc is time-consuming and labor-consuming, the placing accuracy cannot be guaranteed, and the processing production efficiency is limited, so that the material disc conveying and positioning device of the IGBT bonding machine needs to be designed for use.
Disclosure of Invention
The invention aims to provide a tray conveying and positioning device of an IGBT bonding machine, which is put into use to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a IGBT bonder charging tray conveying positioner, includes the mounting bracket and passes through the DBC charging tray of conveyer belt along the mounting bracket activity, the bottom slidable mounting of mounting bracket has positioning mechanism, positioning mechanism is by fixed screw mechanism, the telescopic machanism of fixed mounting on the screw mechanism movable part on setting up and the mounting bracket bottom plate, fixed mounting in the spacing subassembly on the telescopic machanism, the side of DBC charging tray be provided with spacing subassembly assorted breach.
Preferably, the limiting assembly is formed by symmetrically and fixedly arranging two limiting vertical rods at the upper end of a transverse plate, and the transverse plate is fixedly arranged on a movable part of the screw rod mechanism.
Preferably, a photoelectric sensor is fixedly arranged on the transverse plate.
Preferably, a set of correlation sensors is arranged on the vertical plate of the mounting rack.
Preferably, the screw rod mechanism is composed of a screw rod rotatably installed in the middle of the bottom plate of the installation frame, a movable nut in threaded connection with the screw rod and sliding along the screw rod, and a driving motor fixedly installed on the installation frame and used for driving the screw rod to rotate, and the screw rod is arranged in parallel with the installation frame.
Preferably, the movable nut is fixedly installed in the middle of the movable base, the lower end of the movable base is connected with the mounting frame in a sliding mode through the guide rail, and the telescopic mechanism is fixedly installed at the upper end of the movable base.
Preferably, the telescopic mechanism is an electric push rod or an electric cylinder.
Preferably, the conveyor belt is arranged on the side wall of the vertical plate of the mounting frame through a belt wheel rotatably arranged on the vertical plate of the mounting frame.
Preferably, a supporting strip is arranged below the conveyor belt, and when the DBC material tray is pressed on the conveyor belt, the supporting strip supports the conveyor belt and the DBC material tray.
The invention has the technical effects and advantages that: the tray conveying and positioning device of the IGBT bonding machine,
1. through setting up the positioning mechanism of drive translation, the compartment is fixed a position the DBC charging tray many times to make the DBC base plate on the DBC charging tray reach the bonding point in proper order and carry out the bonding operation, finally realize that a plurality of DBC base plates on the DBC charging tray accomplish bonding processing, save the work of carrying out manual assistance-localization real-time with operating personnel, it is higher to place the precision, and accelerated production machining efficiency, the practicality is strong.
2. The DBC material disc is conveyed in a mode that the belt is conveyed to be matched with the mounting support, the material disc can be continuously conveyed to a bonding position, the material disc feeding and discharging efficiency is high, integration with an automatic feeding and discharging device can be facilitated, automatic feeding and discharging are achieved, and machining efficiency is further accelerated.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the internal structure of the mounting bracket.
In the figure: 1. a mounting frame; 2. a conveyor belt; 3. a DBC tray; 4. a positioning mechanism; 41. a screw mechanism; 42. a telescoping mechanism; 43. a limiting component;
411. a screw rod; 412. a movable nut; 413. a drive motor;
431. a transverse plate; 432. a limiting vertical rod;
5. a notch; 6. a photoelectric sensor; 7. a correlation sensor; 8. a movable base; 9. a guide rail; 10. a pulley; 11. a support strip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a tray conveying and positioning device of an IGBT bonding machine, which comprises an installation frame 1 and a DBC tray 3 moving along the installation frame 1 through a conveyor belt 2, wherein a positioning mechanism 4 is slidably installed at the bottom of the installation frame 1, the positioning mechanism 4 comprises a screw 411 mechanism 41 fixedly arranged on a bottom plate of the installation frame 1, a telescopic mechanism 42 fixedly installed on a moving part of the screw 411 mechanism 41 and a limiting component 43 fixedly installed on the telescopic mechanism 42, and a notch 5 matched with the limiting component 43 is arranged on the side surface of the DBC tray 3.
At the beginning, the telescopic mechanism 42 is in an extending state, a plurality of DBC material discs 3 (with DBC substrates arranged in grooves preset on the DBC material discs 3) carrying DBC substrates are driven by the conveying belt to convey forwards until the limiting component 43 at the end part of the telescopic mechanism 42 is just clamped into the notch 5 at the end part of the DBC material disc 3, so that the front, back, left and right directions of the material discs are limited, the positions of the material discs are accurately determined, the photoelectric sensor 6 and the correlation sensor sense that the DBC material discs 3 are in place and the DBC substrates in the material discs are stored behind, and the bonder carries out the next bonding action on the DBC substrates below;
after the step of bonding action is completed, the lead screw 411 mechanism 41 works to drive the telescopic mechanism 42 and the limiting component 43 to move to a next positioning position, the material tray continues to move forward under the driving of the conveying belt and stops after being blocked by the limiting component 43, so that the DBC substrate to be bonded in the DBC material tray 3 is accurately positioned below the bonding machine, and at the moment, the next step of bonding action can be performed again. And repeating the above actions until all DBC substrates in the tray are bonded. Then the telescopic mechanism 42 drives the limiting component 43 to retract, and the DBC material disc 3 is driven by the conveyor belt 2 to be conveyed to a discharging position.
The limiting assembly 43 is formed by symmetrically and fixedly arranging two limiting vertical rods 432 at the upper end of a transverse plate 431, and the transverse plate 431 is fixedly arranged on a movable part of the screw 411 mechanism 41. The two symmetrically arranged limiting vertical rods 432 are respectively clamped into the notches 5 formed in the end parts of the DBC material discs 3, so that the DBC material discs 3 are limited in the front-back and left-right directions, and the positioning is more stable and rapid.
The transverse plate 431 is fixedly provided with a photoelectric sensor 6, and a vertical plate of the mounting rack 1 is provided with a group of correlation sensors 7. Through the photoelectric sensor 6 on the horizontal plate 431 of the limiting component 43, the existence of the DBC charging tray 3 can be detected after the DBC charging tray 3 is positioned by the limiting component 43, meanwhile, the existence of the DBC substrate placed on the DBC charging tray 3 is detected by the correlation sensor 7, and then the next bonding operation is carried out.
The telescopic mechanism 42 is an electric push rod or an electric cylinder.
The conveyor belt 2 is arranged on the side wall of the vertical plate of the mounting frame 1 through a belt wheel 10 which is rotatably arranged on the vertical plate of the mounting frame 1.
The support bars 11 are arranged below the conveyor belt 2, and when the DBC material disc 3 is pressed on the conveyor belt 2, the support bars 11 support the conveyor belt 2 and the DBC material disc 3. When the DBC substrate is bonded on the DBC material disc 3, the two sides of the DBC material disc 3 are supported by the supporting strips 11, so that the condition that the conveying belt 2 is damaged due to overlarge pressure is avoided.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides a IGBT bonder charging tray conveying positioner, includes mounting bracket (1) and DBC charging tray (3) through conveyer belt (2) along mounting bracket (1) activity, its characterized in that: the bottom slidable mounting of mounting bracket (1) has positioning mechanism (4), positioning mechanism (4) are by fixed lead screw (411) mechanism (41) that sets up and mounting bracket (1) bottom plate, fixed mounting telescopic machanism (42), fixed mounting spacing subassembly (43) on telescopic machanism (42) on lead screw (411) mechanism (41) movable part, the side of DBC charging tray (3) be provided with spacing subassembly (43) assorted breach (5).
2. The tray conveying and positioning device for the IGBT bonding machine according to claim 1, characterized in that: the limiting assembly (43) is formed by symmetrically and fixedly arranging two limiting vertical rods (432) at the upper end of a transverse plate (431), and the transverse plate (431) is fixedly arranged on a movable part of the screw rod (411) mechanism (41).
3. The tray conveying and positioning device for the IGBT bonding machine as claimed in claim 2, wherein: and a photoelectric inductor (6) is fixedly arranged on the transverse plate (431).
4. The tray conveying and positioning device for the IGBT bonding machine as claimed in claim 3, wherein: a set of correlation type sensors (7) are arranged on the vertical plate of the mounting rack (1).
5. The tray conveying and positioning device for the IGBT bonding machine according to claim 1, characterized in that: lead screw (411) mechanism (41) are installed by the rotation and are used for driving lead screw (411) pivoted driving motor (413) to constitute in lead screw (411) and mounting bracket (1) on being used for driving lead screw (411) pivoted lead screw (411) and fixed mounting in lead screw (411) threaded connection and along lead screw (411) gliding activity nut (412) and mounting bracket (1), lead screw (411) and mounting bracket (1) parallel arrangement.
6. The tray conveying and positioning device for the IGBT bonding machine as claimed in claim 4, wherein: the movable nut (412) is fixedly installed in the middle of the movable base (8), the lower end of the movable base (8) is connected with the mounting frame (1) in a sliding mode through the guide rail (9), and the telescopic mechanism (42) is fixedly installed at the upper end of the movable base (8).
7. The tray conveying and positioning device for the IGBT bonding machine according to claim 1, characterized in that: the telescopic mechanism (42) is an electric push rod or an electric cylinder.
8. The tray conveying and positioning device for the IGBT bonding machine according to claim 1, characterized in that: the conveyor belt (2) is arranged on the side wall of the vertical plate of the mounting rack (1) through a belt wheel (10) which is rotatably arranged on the vertical plate of the mounting rack (1).
9. The tray conveying and positioning device for the IGBT bonder according to any one of claims 1-9, wherein: the support strip (11) is arranged below the conveyor belt (2), and when the DBC material disc (3) is pressed on the conveyor belt (2), the support strip (11) supports the conveyor belt (2) and the DBC material disc (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011086768.7A CN112117228A (en) | 2020-10-12 | 2020-10-12 | IGBT bonder charging tray conveying and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011086768.7A CN112117228A (en) | 2020-10-12 | 2020-10-12 | IGBT bonder charging tray conveying and positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112117228A true CN112117228A (en) | 2020-12-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011086768.7A Pending CN112117228A (en) | 2020-10-12 | 2020-10-12 | IGBT bonder charging tray conveying and positioning device |
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| Country | Link |
|---|---|
| CN (1) | CN112117228A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114671247A (en) * | 2022-05-07 | 2022-06-28 | 深圳市合智创通讯有限公司 | Belt formula FPC automatic feeding machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206953804U (en) * | 2017-05-26 | 2018-02-02 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its positioner |
| WO2019127033A1 (en) * | 2017-12-26 | 2019-07-04 | 深圳市柔宇科技有限公司 | Film affixing apparatus |
| CN213304090U (en) * | 2020-10-12 | 2021-05-28 | 合肥中恒微半导体有限公司 | IGBT bonder charging tray conveying and positioning device |
-
2020
- 2020-10-12 CN CN202011086768.7A patent/CN112117228A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206953804U (en) * | 2017-05-26 | 2018-02-02 | 大族激光科技产业集团股份有限公司 | Laser marking machine and its positioner |
| WO2019127033A1 (en) * | 2017-12-26 | 2019-07-04 | 深圳市柔宇科技有限公司 | Film affixing apparatus |
| CN213304090U (en) * | 2020-10-12 | 2021-05-28 | 合肥中恒微半导体有限公司 | IGBT bonder charging tray conveying and positioning device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114671247A (en) * | 2022-05-07 | 2022-06-28 | 深圳市合智创通讯有限公司 | Belt formula FPC automatic feeding machine |
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