CN216957979U

CN216957979U - Chip arranging machine for plastic package of semiconductor discrete device

Info

Publication number: CN216957979U
Application number: CN202122512040.2U
Authority: CN
Inventors: 张海民
Original assignee: Jiangsu Donghai Semiconductor Co ltd
Current assignee: Jiangsu Donghai Semiconductor Co ltd
Priority date: 2021-10-19
Filing date: 2021-10-19
Publication date: 2022-07-12
Anticipated expiration: 2031-10-19

Abstract

The utility model relates to a chip arranging machine for plastic package of semiconductor discrete devices, which structurally comprises a material placing mechanism and a translation mechanism which are adjacently arranged on a machine table, wherein a material rack mechanism is arranged on the material placing mechanism. The utility model has the advantages that: the automatic plastic packaging machine is reasonable in structural design, the translation mechanism moves a group of semiconductor discrete device copper frames to the right group of discharging units of the discharging mechanism where the material rack mechanism is placed at first each time, then moves a group of semiconductor discrete device copper frames to the left group of discharging units, and the material rack mechanism is lifted manually to move all the semiconductor discrete device copper frames to carry out subsequent plastic packaging and other processes. The automatic sheet arranging device has the advantages that the automatic sheet arranging of the copper frame is realized, the reasonable material frame is matched, and the production efficiency can be effectively improved.

Description

Chip arranging machine for plastic package of semiconductor discrete device

Technical Field

The utility model relates to a chip arranging machine for plastic package of a semiconductor discrete device, belonging to the technical field of manufacturing of semiconductor discrete devices.

Background

Electronic products are classified into conductors and insulators according to their conductive properties, semiconductors are interposed between the conductors and the insulators, and semiconductor components are classified into discrete and integrated components in a packaging form.

During manufacturing of the semiconductor discrete device, a plurality of groups of rows of copper frames are required to be subjected to sheet arrangement, then transferred into a plastic packaging machine by using a material rack, subjected to plastic packaging connection by using resin, cured and then subjected to electroplating and tinning; generally, 8 rows of discrete semiconductor devices are packaged together in a plastic package.

In the prior art, the chip arrangement before plastic package of the semiconductor discrete device generally needs manual work to feed and position a copper frame, so that the chip arrangement is realized, the efficiency is low, the defects of inconvenient material rack transfer and the like exist, and the production efficiency is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a chip arranging machine for plastic package of a semiconductor discrete device, which aims to overcome the defects in the prior art, realize automatic chip arrangement on a copper frame, reasonably design a material rack and facilitate transfer.

The technical solution of the utility model is as follows: the chip arranging machine for plastic package of the semiconductor discrete device structurally comprises a discharging mechanism and a translation mechanism which are adjacently arranged on a machine table, wherein a material rack mechanism is arranged on the discharging mechanism.

Preferably, the material placing mechanism comprises 4 material placing units which are same in structure and distributed in a rectangular array, each material placing unit comprises 2 material placing blocks which are symmetrical front and back, 3 material placing tables protruding out of the top surfaces of the material placing blocks are arranged on the material placing blocks at intervals along the length direction, one material placing table is positioned in the middle of each material placing block, the other 2 material placing tables are positioned on the edges of the two sides inside and outside the material placing blocks, inner stop bars and outer stop bars protruding out of the top surfaces of the material placing tables are respectively arranged on the outer sides of the material placing tables on the edges of the two sides inside and outside the material placing blocks, the bottom surface of the copper frame of the single-chip semiconductor discrete device is supported by the top surface of the material placing table on one material placing block, and the edges of the two sides are positioned between the inner stop bars and the outer stop bars.

Preferably, translation mechanism include the translation guide rail that sets up along drop feed mechanism rear side edge, translation casing one end bottom and translation guide rail sliding connection, the lifting cylinder is equipped with to translation casing other end inboard, the lifting cylinder output is perpendicular to connect the lifting strip top surface center that is located the translation casing below downwards, lifting strip top surface both sides still connect the translation casing through the guide arm lift, the lifting strip bottom surface is equipped with 4 groups 2 material heads that move of every group, every group moves a material head position and corresponds a drop feed piece.

Preferably, the material rack mechanism comprises a mounting frame, 4 material rack units are arranged on the mounting frame corresponding to 4 groups of material discharging units, a handle is arranged on the front side surface of the mounting frame, the right side surface and the rear side surface of the mounting frame are in contact with the inner side surface of a limiting block at a corresponding position on a machine table, the material rack units comprise frame bodies, the front side and the rear side of each frame body are respectively pressed on steps at corresponding positions of the mounting frame by screws on the mounting frame, a group of material discharging units are wound in each frame body, a pair of vertical bars are respectively arranged on the front inner side surface and the rear inner side surface of each frame body, each vertical bar extends into a groove at a corresponding position on a material discharging block, each groove extends from an outer blocking bar to the inner side of an adjacent material discharging table, a limiting needle is vertically arranged at the end part of each vertical bar and corresponds to a positioning hole on a copper frame of a semiconductor discrete device, a pair of transverse bars is respectively arranged on the left inner side surface and the right inner side surface of each frame body, an auxiliary transverse bar is arranged at the end part of each transverse bar, the transverse bar and the auxiliary transverse bar extend into a gap at a corresponding position on the material discharging block, the notches are positioned at the left end and the right end of the inner side edge of the material placing block, and the auxiliary cross bar extends to the lower part of the edge of the copper frame of the semiconductor discrete device.

The utility model has the advantages that: the automatic plastic packaging machine is reasonable in structural design, the translation mechanism moves a group of semiconductor discrete device copper frames to the right group of discharging units of the discharging mechanism where the material rack mechanism is placed at first each time, then moves a group of semiconductor discrete device copper frames to the left group of discharging units, and the material rack mechanism is lifted manually to move all the semiconductor discrete device copper frames to carry out subsequent plastic packaging and other processes. The automatic sheet arranging device has the advantages that the sheet arranging is automatically carried out on the copper frame, the reasonable-design material frame is matched, and the production efficiency can be effectively improved.

Drawings

Fig. 1 is a schematic top view of a die bonder for molding semiconductor discrete devices according to the present invention.

Fig. 2 is a schematic structural view of the discharging unit in fig. 1.

Fig. 3 is a schematic structural view of the magazine unit of fig. 1.

Fig. 4 is a side view of the translation mechanism of fig. 1.

In the figure, 1 is a machine table, 2 is a discharging mechanism, 21 is a discharging block, 22 is a discharging table, 23 is an outer barrier, 24 is an inner barrier, 25 is a groove, 26 is a notch, 27 is a limiting block, 3 is a material rest mechanism, 31 is an installation frame, 32 is a handle, 33 is a frame body, 34 is a screw, 35 is a vertical bar, 36 is a limiting needle, 37 is a transverse bar, 38 is an auxiliary transverse bar, 4 is a translation mechanism, 41 is a translation guide rail, 42 is a translation shell, 43 is a lifting cylinder, 44 is a guide rod, 45 is a lifting bar and 46 is a material moving head.

Detailed Description

The present invention will be described in further detail with reference to examples and specific embodiments.

As shown in fig. 1-4, the chip arranging machine for plastic packaging of semiconductor discrete devices structurally comprises a material placing mechanism 2 and a translation mechanism 4 which are adjacently arranged on a machine table 1, a material rack mechanism 3 is arranged on the material placing mechanism 2,

the material placing mechanism 2 comprises 4 groups of material placing units with the same structure and distributed in a rectangular array, the material placing units comprise 2 material placing blocks 21 which are symmetrical front and back, 3 material placing tables 22 which protrude out of the top surfaces of the material placing blocks 21 are arranged on the material placing blocks 21 at intervals along the length direction, one material placing table 22 is positioned in the middle of the material placing blocks 21, the other 2 material placing tables 22 are positioned on the inner side edge and the outer side edge of the material placing blocks 21, the outer sides of the material placing tables 22 on the inner side edge and the outer side edge of the material placing blocks 21 are respectively provided with an inner barrier strip 24 and an outer barrier strip 23 which protrude out of the top surface of the material placing table 22, the bottom surface of the copper frame of the single-chip semiconductor discrete device is supported by the top surface of the material placing table 22 on one material placing block 21, and the two side edges are positioned between the inner barrier strip 24 and the outer barrier strip 23,

the translation mechanism 4 comprises a translation guide rail 41 arranged along the rear side edge of the discharging mechanism 2, the bottom of one end of a translation shell 42 is in sliding connection with the translation guide rail 41 (a power mechanism for driving the translation shell 42 along the translation guide rail 41 is in the prior art and is not described in detail), a lifting cylinder 43 is arranged on the inner side of the other end of the translation shell 42, the output end of the lifting cylinder 43 is vertically connected with the center of the top surface of a lifting strip 45 positioned below the translation shell 42 downwards, two sides of the top surface of the lifting strip 45 are also connected with the translation shell 42 in a lifting way through a

guide rod

44, 4 groups of 2 material moving heads 46 are arranged on the bottom surface of the lifting strip 45, and the position of each group of the material moving heads 46 corresponds to one discharging block 21,

the material rack mechanism 3 comprises a

mounting frame

31, 4 material rack units are arranged on the mounting frame 31 corresponding to 4 groups of material placing units, a handle 32 is arranged on the front side surface of the mounting frame 31, the right side surface and the back side surface of the mounting frame 31 are in contact with the inner side surfaces of the limiting blocks 27 on the corresponding positions of the machine table 1, the material rack units comprise frame bodies 33, the front side and the back side of each frame body 33 are respectively pressed on the steps on the corresponding positions of the mounting frame 31 through screws 34 on the mounting frame 31, one group of material placing units are encircled in each frame body 33, a pair of vertical bars 35 are respectively arranged on the front inner side surface and the back inner side surface of each frame body 33, the vertical bars 35 extend into the grooves 25 on the corresponding positions of the material placing blocks 21, the grooves 25 extend from the outer baffle bars 23 to the inner sides of the adjacent material placing tables 22, limiting pins 36 are vertically arranged at the end parts of the vertical bars 35, the limiting pins 36 correspond to the positioning holes on the copper frames of the semiconductor discrete devices, a pair of transverse bars 37 are respectively arranged on the left inner side surface and the right side surface of each frame body 33, auxiliary transverse bars 38 are respectively arranged at the end parts of the transverse bars 37, the cross bar 37 and the auxiliary cross bar 38 extend into the notches 26 at corresponding positions on the material placing block 21, the notches 26 are positioned at the left end and the right end of the inner side edge of the material placing block 21, and the auxiliary cross bar 38 extends to the position below the edge of the copper frame of the semiconductor discrete device.

Outside the mounting frame 31 left side can be adjacent preferably set up the storage discharge mechanism, and the storage discharge mechanism is prior art, and inside piles up places the discrete semiconductor device copper frame, and exports a slice discrete semiconductor device copper frame at every discharge gate at every turn.

According to the structure, in operation, the translation mechanism 4 firstly moves 4 semiconductor discrete device copper frames to 2 groups of discharging units on the right side of the discharging mechanism 2 of the material placing mechanism 3, then moves 4 semiconductor discrete device copper frames to 2 groups of discharging units on the left side of the discharging mechanism 2, and then manually lifts the material placing mechanism 3 to move 8 semiconductor discrete device copper frames for subsequent plastic package and other processes.

Specifically, the translation shell 42 moves to the leftmost side along the translation guide rail 41, the lifting cylinder 43 drives the lifting bar 45 to descend, the guide rod 44 assists in limiting the lifting, the material moving head 46 extends into a hole on a copper frame of a discrete semiconductor device at a preorder station (such as a discharge hole of a material storage and discharge mechanism), the translation shell 42 moves to the rightmost side along the

translation guide rail

41, 4 copper frames of the discrete semiconductor device are driven to move to a discharge unit of 2 groups at the right side of the discharge mechanism 2 at one time, each copper frame of the discrete semiconductor device is supported on 3 discharge tables 22, the front side edge and the rear side edge of each copper frame of the discrete semiconductor device are positioned between the inner barrier strip 24 and the outer barrier strip 23, after the copper frames are moved in place, the lifting bar 45 is lifted, the material moving head 46 is separated from the copper frame of the discrete semiconductor device, the translation shell 42 returns to the original position, the other copper frames of the discrete semiconductor device are continuously moved to the discharge unit of 2 groups at the left side of the discharge mechanism 2, and then the mounting frame 31 is manually lifted by the handle 32, the limiting pins 36 are inserted into corresponding holes in the copper frame of the discrete semiconductor device to jack up the copper frame of the discrete semiconductor device, meanwhile, the auxiliary cross bars 38 support the bottom surface of the copper frame of the discrete semiconductor device, 8 copper frames of the discrete semiconductor device are transferred at one time, the copper frames are sent into subsequent plastic packaging equipment to be subjected to processes of plastic packaging, curing and the like, the material rest mechanism 3 is taken out after the processes are completed, the copper frame of the discrete semiconductor device is manually taken down, and then the material rest mechanism 3 is placed back to the material placing mechanism 2 to perform the chip arrangement of the next batch of workpieces.

All the above components are prior art, and those skilled in the art can use any model and existing design that can implement their corresponding functions.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications are all within the scope of the present invention.

Claims

1. The chip arranging machine for plastic package of the semiconductor discrete device is characterized by comprising a material placing mechanism (2) and a translation mechanism (4) which are adjacently arranged on a machine table (1), wherein a material rack mechanism (3) is arranged on the material placing mechanism (2); the material discharging mechanism (2) comprises 4 material discharging units which are identical in structure and distributed in a rectangular array, each material discharging unit comprises 2 material discharging blocks (21) which are symmetrical front and back, the material discharging blocks (21) are provided with 3 material discharging tables (22) protruding out of the top surfaces of the material discharging blocks (21) at intervals along the length direction, one material discharging table (22) is positioned in the middle of each material discharging block (21), the other 2 material discharging tables (22) are positioned on the edges of the inner side and the outer side of each material discharging block (21), the outer sides of the material discharging tables (22) on the edges of the inner side and the outer side of each material discharging block (21) are respectively provided with an inner barrier strip (24) and an outer barrier strip (23) protruding out of the top surface of each material discharging table (22), the bottom surface of a copper frame of a single-chip semiconductor discrete device is supported by the top surface of each material discharging table (22) on each material discharging block (21), and the edges of the two sides are positioned between the inner barrier strip (24) and the outer barrier strip (23).

2. The chip arranging machine for plastic package of discrete semiconductor devices as claimed in claim 1, wherein the translation mechanism (4) comprises a translation guide rail (41) disposed along a rear side edge of the discharging mechanism (2), a bottom of one end of the translation housing (42) is slidably connected to the translation guide rail (41), a lifting cylinder (43) is disposed inside the other end of the translation housing (42), an output end of the lifting cylinder (43) is vertically connected downward to a center of a top surface of a lifting bar (45) disposed below the translation housing (42), two sides of the top surface of the lifting bar (45) are further connected to the translation housing (42) through a guide rod (44) in a lifting manner, 4 groups of 2 material moving heads (46) are disposed on a bottom surface of the lifting bar (45), and each group of material moving heads (46) corresponds to one discharging block (21).

3. The chip arranging machine for plastic package of discrete semiconductor devices as claimed in claim 2, wherein the material rest mechanism (3) comprises a mounting frame (31), 4 material rest units are arranged on the mounting frame (31) corresponding to 4 groups of material placing units, a handle (32) is arranged on the front side surface of the mounting frame (31), the right side surface and the rear side surface of the mounting frame (31) contact the inner side surface of the limiting block (27) at the corresponding position on the machine table (1), the material rest units comprise frame bodies (33), the front side and the rear side of each frame body (33) are respectively pressed on the steps at the corresponding position on the mounting frame (31) by screws (34) on the mounting frame (31), each frame body (33) is internally wound around one group of the material placing units, a pair of vertical bars (35) is respectively arranged on the front side surface and the rear side surface of each frame body (33), the vertical bars (35) extend into the grooves (25) at the corresponding position on the material placing block (21), the grooves (25) extend from the outer blocking bars (23) to the inner sides of the adjacent material placing tables (22), vertical retort (35) tip is equipped with spacing needle (36) perpendicularly, locating hole on the discrete device copper frame of semiconductor is corresponded in spacing needle (36), a pair of horizontal bar (37) is established respectively to two medial surfaces about framework (33), vice horizontal bar (38) are established to horizontal bar (37) tip, horizontal bar (37) and vice horizontal bar (38) extend to put in breach (26) of corresponding position on material piece (21), both ends about breach (26) are located material piece (21) inboard side, vice horizontal bar (38) extend to discrete device copper frame edge below of semiconductor.