CN112105235A - Plate-tube combined heat dissipation structure and electronic equipment - Google Patents
Plate-tube combined heat dissipation structure and electronic equipment Download PDFInfo
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- CN112105235A CN112105235A CN202011002295.8A CN202011002295A CN112105235A CN 112105235 A CN112105235 A CN 112105235A CN 202011002295 A CN202011002295 A CN 202011002295A CN 112105235 A CN112105235 A CN 112105235A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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Abstract
The invention provides a heat dissipation structure combined by plates and pipes, which comprises a heat dissipation plate, a connecting pipe and heat dissipation fins, wherein a plurality of criss-cross pipelines which are communicated with each other are arranged on the heat dissipation plate; the heat dissipation fin is arranged on the connecting pipe and is in contact with the connecting pipe, and a gap is reserved between the heat dissipation fin and the heat dissipation plate; the inside of the connecting pipe has no capillary structure. According to the invention, under the condition of not using a compressor, high-density heat can be added on the heat dissipation plate and quickly dispersed to the heat dissipation fins through the connecting pipe, so that the power consumption can be effectively reduced, the heat dissipation effect is improved, and the requirements of miniaturization and light weight of electronic equipment can be greatly met. The heat dissipation structure is not limited by size and heat transfer distance, can be widely applied to various electronic and electric devices needing heat dissipation, and has great commercial utilization value.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a plate-tube combined heat dissipation structure and an electronic device.
Background
Along with the rapid development of science and technology and the continuous rising of people's consumption demand, electronic equipment is more and more to miniaturization, lightweight direction development, and the function of integrated on the single electronic equipment is more and more for electronic components's integrated level is higher and more, and the consumption is bigger and more, therefore electronic equipment's heat dissipation problem is more and more outstanding. If the heat dissipation problem is not well solved, the device may have degraded performance or even completely fail due to local hot spots.
In order to improve the heat dissipation problem of electronic devices, heat sinks having heat pipes combined with heat dissipation fins are increasingly used. The heat pipe used by the radiator comprises a pipe shell, a liquid absorption core and an end cover, wherein a capillary structure is arranged in the heat pipe, the heat pipe and the heat dissipation fins are combined to be used for manufacturing a condenser and an evaporator, heat transfer needs to be realized by means of a compressor, power consumption and cost are increased, the heat dissipation structure is complex, and the requirements of miniaturization and light weight of electronic equipment cannot be met.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a plate-tube combined heat dissipation structure and an electronic device, which are used to solve the problems that a heat sink in the prior art uses a heat pipe composed of a tube shell, a wick and an end cap, the heat pipe has a capillary structure, and heat needs to be transferred by means of a compressor, which not only increases power consumption and cost, but also complicates the heat dissipation structure, and thus the requirements of miniaturization and light weight of the electronic device cannot be met.
In order to achieve the above and other related objects, the present invention provides a heat dissipation structure with a plate-tube combination, including a heat dissipation plate, a connection tube and a heat dissipation fin, wherein the heat dissipation plate is provided with a plurality of criss-cross and mutually communicated pipelines, the connection tube is connected with the heat dissipation plate from two opposite sides of the heat dissipation plate, the connection tube is communicated with the pipelines of the heat dissipation plate and forms an annular closed pipeline together, and the annular closed pipeline is filled with a heat transfer medium; the heat dissipation fins are arranged on the connecting pipe and are in contact with the connecting pipe, and a gap is reserved between the heat dissipation fins and the heat dissipation plate; the connecting pipe has no capillary structure inside.
Optionally, the connecting pipe and the pipe of the heat dissipation plate form a plurality of annular closed pipes distributed in parallel at intervals, each connecting pipe of the annular closed pipe is provided with a row of heat dissipation fins, a plurality of heat dissipation fins are contained in a single row, and the heat dissipation fins are distributed in parallel at intervals, and the arrangement direction of the heat dissipation fins on each annular closed pipe is perpendicular to the thickness direction of the heat dissipation plate.
Optionally, the connecting pipe of each annular closed pipeline penetrates through the heat dissipation fin contacted with the connecting pipe once or many times.
Optionally, the connecting pipe and the pipe of the heat dissipation plate form a plurality of annular closed pipes distributed in parallel at intervals, each connecting pipe of the annular closed pipe is provided with two rows of heat dissipation fins distributed in intervals, each row of the heat dissipation fins includes a plurality of heat dissipation fins distributed in parallel at intervals, the connecting pipe is snaked to sequentially penetrate through the two rows of heat dissipation fins, the arrangement direction of the heat dissipation fins in the same row is perpendicular to the thickness direction of the heat dissipation plate, and the heat dissipation fins are located on one side of the reference surface of the heat dissipation plate, where the reference surface is the surface with the largest surface area of the heat dissipation plate.
In another alternative, the connecting pipe and the pipes of the heat dissipation plate form a plurality of annular closed pipes distributed in parallel at intervals, each connecting pipe of the annular closed pipe is provided with three rows of the heat dissipation fins distributed in intervals, each row includes a plurality of heat dissipation fins distributed in parallel at intervals, the connecting pipe of the annular closed pipe meanders and sequentially passes through three rows of the heat dissipation fins, the arrangement direction of the heat dissipation fins in the same row is parallel to the thickness direction of the heat dissipation plate, and the heat dissipation fins are located on one side of a reference surface of the heat dissipation plate, where the reference surface is a surface with the largest surface area of the heat dissipation plate.
Optionally, the connecting pipe of each annular closed pipe passes through the heat dissipation fin contacted with the connecting pipe at least twice.
Optionally, the heat dissipation plate includes a first plate and a second plate, and the pipeline on the heat dissipation plate is formed between the first plate and the second plate, or the pipeline is an internal pipeline formed by a single plate through a machining drilling manner.
Optionally, the surface morphology of the heat dissipation plate includes one of single-sided flat, double-sided flat, and double-sided swelling.
Optionally, the heat dissipation plate is a square plate, and the heat dissipation fins are circumferentially square thin sheets.
The invention also provides electronic equipment, which comprises a power heating element and the heat dissipation structure combined with the plate tube in any scheme, wherein the power heating element is positioned on the heat dissipation plate.
As described above, the heat dissipation structure and the electronic device combined by the plate and the tube of the present invention have the following advantages: according to the invention, the connecting pipe without the capillary pipe inside is combined with the heat dissipation plate with the pipe inside and the heat dissipation fins, so that high-density heat can be applied to the heat dissipation plate and quickly dispersed to the heat dissipation fins through the connecting pipe without the aid of a compressor, the power consumption can be effectively reduced, the heat dissipation effect is improved, and the requirements of miniaturization and light weight of electronic equipment can be greatly met. The heat dissipation structure is not limited by size and heat transfer distance, can be widely applied to various electronic and electric devices needing heat dissipation, and has great commercial utilization value.
Drawings
Fig. 1 is a schematic view illustrating a heat dissipation structure of a plate-tube combination according to a first embodiment of the invention.
Fig. 2 to 4 are schematic sectional views of fig. 1 in different directions.
Fig. 5 is a schematic structural diagram of a heat dissipation plate in the heat dissipation structure of the present invention.
Fig. 6 to 9 are schematic sectional views of fig. 5 in different directions.
Fig. 10 is a schematic view illustrating a heat dissipation structure of a plate-tube combination according to a second embodiment of the invention.
Fig. 11 to 13 are schematic sectional views of fig. 10 in different directions.
Fig. 14 is a schematic view illustrating a heat dissipation structure of a plate-tube combination according to a third embodiment of the present invention.
Fig. 15 to 17 are schematic sectional views in different directions of fig. 14.
Description of the element reference numerals
1 Heat sink
11 pipeline
12 working medium port
13 first plate
14 second plate
2 connecting pipe
21 straight line segment
22 curve segment
3 heat radiation fin
4 Heat transfer working medium
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Please refer to fig. 1 to 17. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications of the relative relationship may be made without substantial technical changes.
Example one
As shown in fig. 1 to 4, the present invention provides a plate-tube combined heat dissipation structure, including a heat dissipation plate 1, a connection pipe 2 and a heat dissipation fin 3, where the heat dissipation plate 1 is provided with a plurality of criss-cross and mutually communicated pipelines 11, the pipelines 11 are in the form of a plurality of nozzles on a side surface of the heat dissipation plate 1 (i.e., a surface of the heat dissipation plate 1 extending in a thickness direction), the connection pipe 2 is connected with the heat dissipation plate 1 from opposite sides of the heat dissipation plate 1, the connection pipe 2 is communicated with the pipelines 11 of the heat dissipation plate 1, and the connection pipe 2 and the pipelines 11 of the heat dissipation plate 1 together form an annular closed pipeline 11, and the annular closed pipeline 11 is filled with a heat transfer operation 4; the heat dissipation fins 3 are arranged on the connecting pipe 2 and are in contact with the connecting pipe 2, and a gap is formed between the heat dissipation fins 3 and the heat dissipation plate 1; the connecting pipe 2 has no capillary structure inside, that is, the connecting pipe used in the present application is not a traditional heat pipe consisting of a pipe shell, a liquid absorbing core and an end cover. The power heating device of equipment is located the surface of heating panel 1, the heat that the power heating device sent not only can pass through heating panel 1 itself distributes away, simultaneously through with connecting pipe 2 that heating panel 1 is connected disperses fast to heat dissipation fin 3, distributes away the heat with the convection current form by heat dissipation fin 3. According to the invention, the connecting pipe 2 without the capillary pipe 11 inside is combined with the heat dissipation plate 1 with the pipe 11 inside and the heat dissipation fins 3, so that high-density heat can be applied to the heat dissipation plate 1 and quickly dispersed to the heat dissipation fins 3 through the connecting pipe 2 without the aid of a compressor, the power consumption can be effectively reduced, the heat dissipation effect is improved, and the requirements of miniaturization and light weight of electronic equipment can be greatly met. The heat dissipation structure is not limited by size and heat transfer distance, can be widely applied to various electronic and electric devices needing heat dissipation, and has great commercial utilization value.
The connecting pipe 2 and the pipeline 11 on the heat dissipation plate 1 form a single or a plurality of annular closed pipelines 11, that is, the connecting pipe 2 is a part of the annular closed pipelines 11. In this embodiment, as an example, the connecting pipe 2 and the pipe 11 of the heat dissipation plate 1 form a plurality of annular closed pipe lines 11 distributed in parallel at intervals (for example, 3, 4, 5 or more, the number of the annular closed pipe lines 11 may be the same as or less than the number of nozzles on a certain side surface of the heat dissipation plate 1), a row of the heat dissipation fins 3 is provided on the connecting pipe 2 of each annular closed pipe line 11 (or the heat dissipation fins 3 are distributed in a single row on the connecting pipe 2), the number of the heat dissipation fins 3 contained in a single row is plural, for example, 3 or more, plural heat dissipation fins 3 are distributed in parallel at intervals, the arrangement direction of the heat dissipation fins 3 on each annular closed pipe line 11 is perpendicular to the thickness direction of the heat dissipation plate 1 (as shown in fig. 1, if the surface with the largest surface area of the heat dissipation plate 1 is used as a reference surface, the arrangement direction of the heat dissipation fins 3 is perpendicular to the direction of the reference surface, that is, the orthographic projection of the heat dissipation fins 3 does not fall in the reference surface. ). The thickness direction of the heat sink 1 is a direction perpendicular to the device mounting surface (i.e., the reference surface) of the heat sink 1. The larger the number of the heat dissipating fins 3 is, the larger the heat dissipating area is, and the structure introduced in the present embodiment helps to increase the contact area between the heat dissipating fins 3 and the connecting pipe 2, and helps to dissipate heat uniformly and quickly. In order to increase the heat dissipation effect as much as possible, for example, a single annular closed pipe 11 (substantially, the connection pipe 2 portion) passes through the heat dissipation fin 3 in contact therewith one or more times, for example, 2 times or more. Specifically, as can be seen from fig. 4, the connecting pipe 2 includes a linear section 21 and a curved section 22, the linear section 21 passes through the heat dissipation fin 3 (the heat dissipation fin 3 is provided with a through hole, so the heat dissipation fin 3 can also be considered to be erected on the connecting pipe 2 through the through hole), and the linear section 21 is preferably perpendicular to the heat dissipation fin 3 (i.e., perpendicularly passes through the heat dissipation fin 3), so that the aforementioned single annular closed-pipe 11 (i.e., the connecting pipe 2 portion) passes through the heat dissipation fin 3 in contact therewith at least twice, that is, the linear section 21 passing through a single heat dissipation fin 3 is at least two sections. In a further example, two straight segments 21 passing through the same heat dissipating fin 3 are preferably parallel to each other, and the curved segment 22 is connected between the two straight segments 21. Of course, in other examples, the number of times that the connecting pipe 2 passes through a single heat dissipation fin 3 may be three or more times, depending on the size of the heat dissipation fin 3, and this embodiment is not limited strictly.
As an example, the closed loop pipe 11 may realize heat transfer based on a thermal superconducting heat transfer technology. The heat superconducting technology is a phase-change heat transfer technology which fills heat transfer work 4 in sealed interconnected micro-channels and realizes heat superconducting heat transfer through evaporation or condensation phase change of the heat transfer work 4, wherein the heat transfer work 4 comprises but is not limited to one of a gas, a liquid or a gas-liquid mixture (preferably the gas-liquid mixture). In one example, as shown in fig. 6, the heat dissipation plate 1 has a composite plate structure, and includes a first plate 13 and a second plate 14, and the pipeline 11 of the heat dissipation plate 1 is formed between the first plate 13 and the second plate 14. The first plate 13 and the second plate 14 may be combined together through a rolling process or a welding process, and the pipe 11 may be formed between the first plate 13 and the second plate 14 through a roll-and-blow process or a die-forming brazing process, that is, the pipe 11 is only a spatial location and has no physical material space with the heat dissipation plate 1, so that the heat transfer working medium in the pipe 11 absorbs heat and then rapidly dissipates the heat to the entire surface of the heat dissipation plate 1 and the connection pipe 2. In another example, the heat dissipation plate is a single plate, and the pipe is an internal pipe formed by drilling a single plate through machining. The pipe 11 may not protrude from any surface of the heat dissipation plate 1, or protrude from one or both surfaces of the heat dissipation plate 1, that is, the surface form of the heat dissipation plate 1 includes one of single-sided flat, double-sided flat, and double-sided expansion, and in this embodiment, it is preferable that at least one surface of the heat dissipation plate 1 is a flat surface for mounting a heat generating power device. The first plate 13 and the second plate 14 are made of a metal material with good thermal conductivity, and may include, but are not limited to, copper, a copper alloy, aluminum, an aluminum alloy, titanium, a titanium alloy, or any combination of any one of the above, that is, the first plate 13 and the second plate 14 may be a single layer material layer or a multi-layer material layer, but the inner layer is preferably an aluminum material layer. In an example, the first plate 13 and the second plate 14 may be a copper-aluminum composite plate including a copper material layer and an aluminum material layer, a stainless steel-aluminum composite plate including a stainless steel material layer and an aluminum material layer, an iron-aluminum composite plate including an iron material layer and an aluminum material layer, or an aluminum-alloy-aluminum composite plate including an aluminum-alloy material layer and an aluminum material layer; the aluminum material layers of the first plate 13 and the second plate 14 are in contact with each other, that is, the second material layer of the first plate 13 is an aluminum material layer, and the second material layer of the second plate 14 is an aluminum material layer. The surface of the heat dissipation plate 1 can be subjected to anti-oxidation treatment. The heat dissipation plate 1 may be in a single-side expansion form, that is, the pipeline 11 protrudes from only one surface of the heat dissipation plate 1, or in a double-side expansion form, that is, the thermal superconducting heat dissipation pipeline 11 protrudes from both surfaces of the heat dissipation plate 1, or in a single-side flat form or a double-side flat form, but preferably, the surface where the heat dissipation plate 1 is attached to the power heating device is in a flat form. The material of the connecting pipe 2 may also include, but is not limited to, copper alloy, aluminum alloy, titanium alloy, or any combination thereof, the connecting pipe 2 may be connected to the heat dissipation plate 1 by a welding process, the welding position generally corresponds to the pipeline 11 (such as the pipeline 11 shown in fig. 7) of the heat dissipation plate 1, so that the connecting pipe 2 is communicated with the pipeline 11 of the heat dissipation plate 1, and the working medium port 12 is sealed after the working medium port 12 is filled with the working medium, so as to form the sealed annular connecting pipe 2 pipeline 11. The working medium port 12 may be located on the heat dissipation plate 1 or on the connection pipe 2.
In order to make the whole heat dissipation structure more stable, increase the heat dissipation area as much as possible, and better match with the electronic device, the heat dissipation plate 1 is a square plate, and the pipelines 11 are distributed on the heat dissipation plate 1 in rows and columns in a longitudinal and transverse manner (as shown in fig. 9), as an example. The heat dissipation fin 3 is preferably a sheet having a square circumferential shape.
Example two
As shown in fig. 10 to 13, the present invention also provides another heat dissipation structure. The difference between the heat dissipation structure in this embodiment and the first embodiment is mainly that in the first embodiment, a row of heat dissipation fins 3 is arranged on the connecting pipe 2 of each annular closed pipeline 11, a plurality of heat dissipation fins 3 are included in a single row, and the plurality of heat dissipation fins 3 are distributed in parallel at intervals, and the arrangement direction of the heat dissipation fins 3 on each annular closed pipeline 11 is perpendicular to the thickness direction of the heat dissipation plate 1. The connecting pipe 2 and the pipe 11 of the heat dissipation plate 1 also form a plurality of annular closed pipes 11 distributed in parallel at intervals, however, in this embodiment, two rows of the heat dissipation fins 3 distributed at intervals are provided on the connecting pipe 2 of each annular closed pipe 11, the number of the heat dissipation fins 3 included in each row is plural, and a plurality of the heat dissipation fins 3 are distributed in parallel at intervals (and the number of the heat dissipation fins 3 in each row is preferably the same to improve the weight balance of the whole heat dissipation structure and improve the heat dissipation uniformity), the connecting pipe 2 is passed through two rows of the heat dissipation fins 3 in a winding manner (substantially, the connecting pipe 2 includes a plurality of linear segments 21 and a plurality of curved segments 22, the linear segments 21 pass through the heat dissipation fins 3, and the curved segments 22 connect the mutually parallel linear segments 21 in a head-to-tail manner in sequence), the arrangement direction of the heat dissipation fins 3 in the same row is the thickness direction of the heat dissipation plate 1 in, and the heat dissipation fin 3 is located on one side of a reference surface of the heat dissipation plate 1, where the reference surface is a surface with the largest surface area of the heat dissipation plate 1. (as shown in fig. 10, the surface of the heat dissipation plate 1 having the largest surface area is usually the device mounting surface, and thus the heat dissipation fins 3 are located on one side of the device mounting surface). In a further example, the connection pipe 2 passes through each of the heat dissipation fins 3 in contact with the connection pipe at least twice (i.e. at least two straight segments 21 passing through a single heat dissipation fin 3) to increase the contact area between the heat dissipation fin 3 and the connection pipe 2 as much as possible, so as to enhance heat dissipation. Except for this difference, other parts of the heat dissipation structure of the present embodiment, including the structure, material, and the like of the heat dissipation plate 1, are the same as those of the first embodiment.
EXAMPLE III
As shown in fig. 14 to 17, the present invention also provides another heat dissipation structure. The main difference between the heat dissipation structure of the present embodiment and the second embodiment is: in the second embodiment, the plurality of heat dissipation fins 3 are arranged in two rows, the connection pipe 2 meanders and sequentially passes through the two rows of heat dissipation fins 3, and the arrangement direction of the heat dissipation fins 3 in the same row is perpendicular to the thickness direction of the heat dissipation plate 1. In this embodiment, the connecting pipe 2 and the pipe 11 of the heat dissipation plate 1 also form a plurality of parallel and spaced annular closed pipes 11, three rows of the heat dissipation fins 3 are disposed on the connecting pipe 2 of each annular closed pipe 11, the number of the heat dissipation fins 3 included in each row is plural, and the plurality of heat dissipation fins 3 are distributed in parallel and spaced, the connecting pipe 2 of the annular closed pipe 11 sequentially passes through three rows of the heat dissipation serpentine fins 3 (similarly, the connecting pipe 2 substantially includes a plurality of linear segments 21 and a plurality of curved segments 22, the linear segments 21 pass through the heat dissipation fins 3, and the curved segments 22 connect the mutually parallel linear segments 21 in sequence end to end), the arrangement direction of the heat dissipation fins 3 in the same row is parallel to the thickness direction of the heat dissipation plate 1, and the heat dissipation fins 3 are also located on one side of the reference surface of the heat dissipation plate 1, the reference surface is a surface having the largest surface area of the heat dissipation plate 1 (specifically, refer to fig. 14). In this embodiment, the number of the heat dissipation fins 3 in each row is also preferably the same, so as to improve the weight balance of the whole heat dissipation structure and improve the heat dissipation uniformity. In a further example, the connection pipe 2 passes through the heat dissipation fin 3 in contact with the connection pipe at least twice (i.e. at least two straight segments 21 passing through a single heat dissipation fin 3) to increase the contact area between the heat dissipation fin 3 and the connection pipe 2 as much as possible, so as to enhance heat dissipation. Except for this difference, other parts of the heat dissipation structure of this embodiment, including the structure, material, etc. of the heat dissipation plate, are the same as those of the embodiment two, and specific reference is made to embodiment two, which is not repeated for brevity.
Of course, in other examples, the plurality of heat dissipation fins may be arranged in 4 rows or an array of more than 4 rows according to heat dissipation requirements, which is not strictly limited in this embodiment and is not further expanded.
Example four
The invention further provides an electronic device, which includes a power heating element and a heat dissipation structure combined with the plate tube as described in any one of the first to third embodiments, wherein the power heating element is located on the heat dissipation plate. The electronic devices include, but are not limited to, 5G base station devices, power generation devices, and the like, and the power heating elements include, but are not limited to, radio frequency generators, power amplifiers, filters, microprocessors, memories, power managers, and the like. In the electronic device of the present invention, since the heat dissipation structure according to any one of the first to third embodiments is adopted, high-density heat emitted from the power heating element can be quickly dissipated to the heat dissipation plate and quickly dissipated to the heat dissipation fin via the connection pipe without using a compressor, so that power consumption can be effectively reduced, the heat dissipation effect can be improved, the requirements for miniaturization and light weight of the electronic device can be greatly satisfied, and the performance of the electronic device can be improved.
In summary, the present invention provides a heat dissipation structure and an electronic device with a plate and a tube combined together. The heat dissipation structure comprises a heat dissipation plate, a connecting pipe and heat dissipation fins, wherein a plurality of criss-cross pipelines which are communicated with each other are arranged on the heat dissipation plate, the connecting pipe is connected with the heat dissipation plate from two opposite sides of the heat dissipation plate, the connecting pipe is communicated with the pipelines of the heat dissipation plate to form an annular closed pipeline, and heat transfer working medium is filled in the annular closed pipeline; the heat dissipation fins are arranged on the connecting pipe and are in contact with the connecting pipe, and a gap is reserved between the heat dissipation fins and the heat dissipation plate; the connecting pipe has no capillary structure inside. According to the invention, the connecting pipe without the capillary pipe inside is combined with the heat dissipation plate with the pipe inside and the heat dissipation fins, so that high-density heat can be applied to the heat dissipation plate and quickly dispersed to the heat dissipation fins through the connecting pipe without the aid of a compressor, the power consumption can be effectively reduced, the heat dissipation effect is improved, and the requirements of miniaturization and light weight of electronic equipment can be greatly met. The heat dissipation structure is not limited by size and heat transfer distance, can be widely applied to various electronic and electric devices needing heat dissipation, and has great commercial utilization value. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A plate-tube bonded heat dissipation structure, comprising: the heat dissipation plate is provided with a plurality of criss-cross pipelines which are communicated with each other, the connecting pipes are connected with the heat dissipation plate from two opposite sides of the heat dissipation plate, the connecting pipes are communicated with the pipelines of the heat dissipation plate and jointly form an annular closed pipeline, and heat transfer working medium is filled in the annular closed pipeline; the heat dissipation fins are arranged on the connecting pipe and are in contact with the connecting pipe, and a gap is reserved between the heat dissipation fins and the heat dissipation plate; the connecting pipe has no capillary structure inside.
2. The heat dissipation structure according to claim 1, wherein: the connecting pipe and the pipe of the heat dissipation plate form a plurality of annular closed pipes distributed in parallel at intervals, each connecting pipe of the annular closed pipe is provided with a row of heat dissipation fins, a plurality of heat dissipation fins are contained in a single row, and the heat dissipation fins are distributed in parallel at intervals, and the arrangement direction of each heat dissipation fin on the annular closed pipe is perpendicular to the thickness direction of the heat dissipation plate.
3. The heat dissipation structure according to claim 2, wherein: the connecting pipe of each annular closed pipeline penetrates through the heat dissipation fin contacted with the connecting pipe once or for many times.
4. The heat dissipation structure according to claim 1, wherein: the connecting pipe and the pipelines of the heat dissipation plate form a plurality of annular closed pipelines which are distributed in parallel at intervals, each connecting pipe of the annular closed pipelines is provided with two rows of heat dissipation fins which are distributed in intervals, each row of the heat dissipation fins comprises a plurality of heat dissipation fins which are distributed in parallel at intervals, the connecting pipe is wound to sequentially penetrate through the two rows of the heat dissipation fins, the arrangement direction of the heat dissipation fins in the same row is perpendicular to the thickness direction of the heat dissipation plate, the heat dissipation fins are positioned on one side of a reference surface of the heat dissipation plate, and the reference surface is a surface with the largest surface area of the heat dissipation plate.
5. The heat dissipation structure according to claim 1, characterized in that: the connecting pipe and the pipe of the heat dissipation plate form a plurality of annular closed pipes which are distributed at intervals in parallel, each connecting pipe of the annular closed pipe is provided with three rows of heat dissipation fins which are distributed at intervals, each row of the heat dissipation fins comprises a plurality of heat dissipation fins which are distributed at intervals in parallel, the connecting pipe of the annular closed pipe is snaked to sequentially penetrate through the three rows of the heat dissipation fins, the arrangement direction of the heat dissipation fins in the same row is parallel to the thickness direction of the heat dissipation plate, the heat dissipation fins are positioned on one side of a reference surface of the heat dissipation plate, and the reference surface is the surface with the largest surface area of the heat dissipation plate.
6. The heat dissipation structure according to any one of claims 4 or 5, wherein: the connecting pipe of each annular closed pipeline penetrates through the heat dissipation fin contacted with the connecting pipe at least twice.
7. The heat dissipation structure according to claim 1, wherein: the heat dissipation plate comprises a first plate and a second plate, and a pipeline on the heat dissipation plate is formed between the first plate and the second plate, or the pipeline is an internal pipeline formed by a single plate in a machining and drilling mode.
8. The heat dissipation structure according to claim 1, wherein: the surface form of the heat dissipation plate comprises one of single-side flat, double-side flat and double-side expansion.
9. The heat dissipation structure according to claim 1, wherein: the heat dissipation plate is a square plate, and the heat dissipation fins are thin sheets with square circumferential directions.
10. An electronic apparatus, comprising a heat dissipation structure in which a power heating element and the plate-tube combination according to any one of claims 1 to 9 are combined, the power heating element being located on the heat dissipation plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011002295.8A CN112105235A (en) | 2020-09-22 | 2020-09-22 | Plate-tube combined heat dissipation structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011002295.8A CN112105235A (en) | 2020-09-22 | 2020-09-22 | Plate-tube combined heat dissipation structure and electronic equipment |
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| CN112105235A true CN112105235A (en) | 2020-12-18 |
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| CN202011002295.8A Pending CN112105235A (en) | 2020-09-22 | 2020-09-22 | Plate-tube combined heat dissipation structure and electronic equipment |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2708371Y (en) * | 2004-06-28 | 2005-07-06 | 施展 | Heat pipe type radiator for desktop computer |
| CN101471308B (en) * | 2007-12-26 | 2011-03-23 | 中强光电股份有限公司 | Radiating module |
| US20110079376A1 (en) * | 2009-10-03 | 2011-04-07 | Wolverine Tube, Inc. | Cold plate with pins |
| CN101478868B (en) * | 2009-01-23 | 2012-06-13 | 北京奇宏科技研发中心有限公司 | Heat radiating device |
| CN104613440A (en) * | 2015-03-03 | 2015-05-13 | 中国科学院工程热物理研究所 | Heat dissipation device of remote LED lamp |
| CN104613439A (en) * | 2015-03-03 | 2015-05-13 | 中国科学院工程热物理研究所 | Radiator for LED device |
| CN110351991A (en) * | 2019-07-22 | 2019-10-18 | 浙江嘉熙科技有限公司 | Heat transfer substrate and heat spreader structures |
-
2020
- 2020-09-22 CN CN202011002295.8A patent/CN112105235A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2708371Y (en) * | 2004-06-28 | 2005-07-06 | 施展 | Heat pipe type radiator for desktop computer |
| CN101471308B (en) * | 2007-12-26 | 2011-03-23 | 中强光电股份有限公司 | Radiating module |
| CN101478868B (en) * | 2009-01-23 | 2012-06-13 | 北京奇宏科技研发中心有限公司 | Heat radiating device |
| US20110079376A1 (en) * | 2009-10-03 | 2011-04-07 | Wolverine Tube, Inc. | Cold plate with pins |
| CN104613440A (en) * | 2015-03-03 | 2015-05-13 | 中国科学院工程热物理研究所 | Heat dissipation device of remote LED lamp |
| CN104613439A (en) * | 2015-03-03 | 2015-05-13 | 中国科学院工程热物理研究所 | Radiator for LED device |
| CN110351991A (en) * | 2019-07-22 | 2019-10-18 | 浙江嘉熙科技有限公司 | Heat transfer substrate and heat spreader structures |
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