CN112105138A - Electronic component parallel current-sharing circuit, design method and PCB - Google Patents
Electronic component parallel current-sharing circuit, design method and PCB Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
- H05K2201/0784—Uniform resistance, i.e. equalizing the resistance of a number of conductors
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- Microelectronics & Electronic Packaging (AREA)
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- Computer Hardware Design (AREA)
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Abstract
The invention discloses a parallel current-sharing circuit of electronic components, a design method and a PCB, wherein the circuit comprises: n electronic components connected in parallel, wherein one end of each electronic component is connected with the first metal wire; n impedance metal blocks with different impedances, wherein one end of each impedance metal block is connected with the other end of each electronic component, and the other end of each impedance metal block is connected with the second metal wire; the impedance of the impedance metal block is adjusted to enable the currents of the n current branches corresponding to the n electronic components to be the same, the impedance of the impedance metal block is adjusted and controlled through the width of the metal block, and n is an integer larger than 2. According to the invention, through metal wiring of the PCB, the impedance of electronic components connected in parallel in the loop is quantized, and through adjusting the width of a PCB circuit, the metal path impedance of each electronic component is adjusted, so that the current equalization in practical significance is realized; in addition, the invention is easy to realize, has low cost and higher stability, and can be widely applied to the technical field of parallel current sharing.
Description
Technical Field
The invention relates to the technical field of parallel current sharing, in particular to a parallel current sharing circuit of an electronic component, a design method and a PCB.
Background
In the background of wide application of electronic products, more and more high-power devices (such as diodes, transistors, etc.) are used, and in the parallel current-sharing design of power diodes, the current sharing is a key and difficult point of the design, and has a very important meaning for the service life, performance and reliability of the products. In general, the parallel connection of power diodes in design has the condition of inconsistent current in different degrees, and because the diodes are positive temperature coefficient devices, the inconsistent current used in parallel connection not only affects the service life and performance of the whole product, but also may affect the safety performance of the product.
Disclosure of Invention
In order to solve one of the above technical problems, an object of the present invention is to provide a parallel current sharing circuit for electronic components, a design method thereof, and a PCB board, wherein the parallel current sharing of the electronic components is realized by adjusting the width of the PCB trace.
The technical scheme adopted by the invention is as follows:
a parallel current sharing circuit for electronic components comprises:
the device comprises n electronic components connected in parallel, wherein one end of each electronic component is connected with a first metal wire;
n impedance metal blocks with different impedances, wherein one end of each impedance metal block is connected with the other end of the electronic component, and the other end of each impedance metal block is connected with a second metal wire;
the impedance of the impedance metal block is adjusted to enable the currents of the n current branches corresponding to the n electronic components to be the same, the impedance of the impedance metal block is adjusted and controlled through the width of the metal block, and n is an integer larger than 2.
Further, the electronic component is a diode.
Further, the cathode of the diode is connected to the first metal wire, and the anode of the diode is connected to the second metal wire through a resistance metal block.
Further, the first metal line and the second metal line are both straight lines, the distance from the electronic component to the first metal line is the same, and the distance from the electronic component to the second metal line is the same.
Further, the first metal line and the second metal line are parallel.
Further, the widths of the first metal line and the second metal line are the same, the lengths of the electronic components corresponding to the first metal line are the same, and the lengths of the electronic components corresponding to the second metal line are the same.
The other technical scheme adopted by the invention is as follows:
a PCB board comprises a parallel current-sharing circuit, wherein the parallel current-sharing circuit adopts the electronic component parallel current-sharing circuit.
The other technical scheme adopted by the invention is as follows:
a design method of a parallel current-sharing circuit of electronic components comprises the following steps:
carrying out impedance quantization on metal wires of current branches corresponding to n parallel electronic components to obtain an impedance expression of each current branch;
calculating the resistance value of the impedance metal block corresponding to each current branch according to the impedance expression, and adjusting the width of each impedance metal block on the PCB according to the resistance value so as to enable the current on each current branch to be equal;
wherein n is an integer greater than 2.
Further, the electronic component is a diode.
Further, the current branch comprises at least one impedance metal block.
The invention has the beneficial effects that: according to the invention, through metal wiring of the PCB, the impedance of electronic components connected in parallel in the loop is quantized, and through adjusting the width of a PCB circuit, the metal path impedance of each electronic component is adjusted, so that the current equalization in practical significance is realized; in addition, the invention is easy to realize, has low cost and higher stability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description is made on the drawings of the embodiments of the present invention or the related technical solutions in the prior art, and it should be understood that the drawings in the following description are only for convenience and clarity of describing some embodiments in the technical solutions of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a parallel current sharing circuit of an electronic component in an embodiment of the present invention;
fig. 2 is a schematic diagram of a power diode in an embodiment of the invention.
Fig. 3 is a flowchart illustrating steps of a method for designing a parallel current sharing circuit of an electronic device according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
In order to make the currents flowing through the electronic components in the parallel circuit the same, the present embodiment provides a low-cost, high-reliability solution. The PCB wiring is skillfully utilized, the impedance of the electronic components connected in parallel in the loop is quantized, and the path impedance of each electronic component is adjusted by adjusting the width of the PCB circuit, so that the current sharing in practical significance is realized. The electronic component includes a power diode, a capacitor, an inductor, a transistor, and the like, and in the following embodiments, the power diode is mainly used as an example for discussion.
As shown in fig. 1, a parallel current sharing circuit for electronic components includes:
n electronic components connected in parallel, wherein one end of each electronic component is connected with the first metal wire;
n impedance metal blocks with different impedances, wherein one end of each impedance metal block is connected with the other end of each electronic component, and the other end of each impedance metal block is connected with the second metal wire;
the current of n current branches corresponding to the n electronic components is the same by adjusting the impedance of the impedance metal block, the impedance of the impedance metal block is regulated and controlled by the width of the metal block, and n is an integer greater than 2.
In this embodiment, the electronic component is a power diode, and in the parallel circuit, the electronic component can be expanded according to the specific requirements of customers, and different parallel power diodes are connected in parallelAnd the requirements of different customers are met. In the PCB, the resistance value of metal is related to the metal conductivity, the metal line width, the metal line length and the like, and the specific calculation formula is as follows:
by adjusting the parameters of the metal block or the metal wire, the impedance of the metal can be adjusted, so that the total impedance value of the current branch circuit is influenced, and the current of the branch circuit is adjusted under the condition that the voltage of the parallel circuit is the same. This embodiment does not carry out the mode that flow equalizes for the tradition or only design ordinary structure flow equalizes, has increased PCB and has walked line impedance matching, adjusts circuit impedance, has effectively utilized PCB's the line, has improved the actual meaning of flow equalizing. Meanwhile, the impedance can be quantized from the current input end to the current output end, the overall impedance of the system is controllable, and the equal distribution of the current is really realized.
In some embodiments, the first metal line and the second metal line are both straight lines, and the distance from the electronic component to the first metal line is the same, and the distance from the electronic component to the second metal line is the same. In the PCB, a plurality of power diodes are arranged in order, and then a first metal wire and a second metal wire are distributed at the upper end and the lower end of each power diode, wherein the first metal wire and the second metal wire are respectively an inflow bus of current and an outflow bus of the current, and the current is larger, so that the first metal wire and the second metal wire are designed into straight lines; in addition, the straight line distance between the pin of the diode and the first metal wire and the straight line distance between the pin of the diode and the second metal wire are equal.
In some embodiments, the first metal line and the second metal line have the same width, and the electronic components have the same length corresponding to the first metal line and the electronic components have the same length corresponding to the second metal line. Designing the width and the length of the first metal wire and the second metal wire to be the same, so that the impedance generated by the first metal wire and the second metal wire is the same; the length of the electronic component corresponding to the metal wire means: there are n electronic components, and the metal wire (including first metal wire and second metal wire) is divided into n sections, and the length of each section is the same, and corresponds to the position of electronic component on the position of PCB, namely directly above or below the electronic component, etc.
The embodiment also provides a PCB board, which comprises a parallel current-sharing circuit, wherein the parallel current-sharing circuit is realized by adopting the electronic component parallel current-sharing circuit as described in the right.
The above embodiments will be described in detail below using a power diode as an example.
Referring to fig. 1, boxes 1-5 in fig. 1 represent power diodes, R1 "-R5" refers to common cathode PCB trace impedance (i.e., impedance of the first metal line, see fig. 2, for power diode K-side cathode trace impedance), R1'-R5' refers to design-adjustable PCB trace impedance (i.e., impedance of the impedance metal block), R1-R5 refer to common anode PCB trace impedance (i.e., impedance of the second metal line, see fig. 2, for power diode a-side anode trace impedance), L0 represents lengths of the first metal line and the second metal line, and L1 represents width of the second metal line. The metal blocks R1'-R5' are used for connecting the anode of the power diode with the second metal wire, and the impedance of the metal blocks R1'-R5' is adjustable, specifically, the PCB line impedance of the power diode # 1-5 is controlled by adjusting the width of R1'-R5' (i.e., the length of the connection with the second metal wire), so as to achieve the purpose of current sharing.
The impedances R1'-R5' and R1-R5 are fixed resistances, and the calculation mode is as follows:
where ρ is the conductivity of the metal, L is the length of the metal line, and S is the cross-sectional area of the metal line.
Since the three parameters of ρ, L and S of the impedances R1-R5 are the same, R1 ═ R2 ═ R3 ═ R4 ═ R5 ═ R0; in the same way, R1 ═ R2 ═ R3 ═ R4 ═ R5 ═ R0 ″. For the sake of convenience in the following calculation, R1 ═ R2 ═ R3 ═ R4 ═ R5 ═ R1 ═ R2 ═ R3 ═ R4 ═ R5 ═ R0 may be used.
In this embodiment, the current sharing calculation model refers to the following:
voltage drop of the first power diode 1: v1 ═ I1 (R1+ R1' + R1 ");
voltage drop of the second power diode 2: v2 ═ I2 (R1+ R2+ R1 "+ R2" + R2');
voltage drop of the third power diode 3: v3 ═ I3 (R1+ R2+ R3+ R1 "+ R2" + R3 "+ R3');
voltage drop of the fourth power diode 4: v4 ═ I4 (R1+ R2+ R3+ R4+ R1 "+ R2" + R3 "+ R4" + R4');
voltage drop of fifth power diode 5: v5 ═ I5 (R1+ R2+ R3+ R4+ R5+ R1 "+ R2" + R3 "+ R4" + R5 "+ R5');
if the current sharing requirement is satisfied, I1, I2, I3, I4, I5, I0, and V1, V2, V3, V4, V5 are required; from the above impedance matching, the equivalent impedance of the loop can be calculated, wherein R1'-R5' and R1-R5 are fixed resistances, and the calculation method is as follows:
R4'＝R5+R5”+R5'＝2R0+R5'；
R3'＝R5+R5”+R5'+R4”+R4＝4R0+R5'；
R2'＝R5+R5”+R5'+R4”+R4+R3”+R3＝6R0+R5'；
R1'＝R5+R5”+R5'+R4”+R4+R3”+R3+R2”+R2＝8R0+R5'；
the initial value of R5' is set to obtain the calculated value of R1' -R4 '. Meanwhile, the width of R1'-R5' can be reversely deduced according to the formula, so that the quantification and equalization of impedance are realized.
The PCB of the embodiment and the electronic component parallel current sharing circuit of the embodiment have a one-to-one correspondence relationship, and have corresponding functions and beneficial effects.
As shown in fig. 3, the present embodiment further provides a design method for a parallel current sharing circuit of electronic components, which includes, but is not limited to, the following steps:
s1, carrying out impedance quantization on metal wires of current branches corresponding to the n parallel electronic components to obtain an impedance expression of each current branch;
s2, calculating the resistance value of the impedance metal block corresponding to each current branch according to the impedance expression, and adjusting the width of each impedance metal block on the PCB according to the resistance value so as to enable the current on each current branch to be equal;
wherein n is an integer greater than 2.
In this embodiment, each current branch is provided with an impedance metal block, and the impedance value of the impedance metal block is adjusted by adjusting the width of the impedance metal block, so that the impedances of different parallel current branches are the same, and the purpose of parallel current sharing is achieved.
As a further alternative embodiment, the electronic component is a diode or a capacitor.
As a further alternative embodiment, the current branch comprises at least one resistive metal block.
It will be understood that all or some of the steps, systems of methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A parallel current sharing circuit for electronic components is characterized by comprising:
the device comprises n electronic components connected in parallel, wherein one end of each electronic component is connected with a first metal wire;
n impedance metal blocks with different impedances, wherein one end of each impedance metal block is connected with the other end of the electronic component, and the other end of each impedance metal block is connected with a second metal wire;
the impedance of the impedance metal block is adjusted to enable the currents of the n current branches corresponding to the n electronic components to be the same, the impedance of the impedance metal block is adjusted and controlled through the width of the metal block, and n is an integer larger than 2.
2. The parallel current sharing circuit of claim 1, wherein the electronic component is a diode.
3. The parallel current sharing circuit of claim 2, wherein the cathode of the diode is connected to the first metal line, and the anode of the diode is connected to the second metal line through a resistive metal block.
4. The parallel current sharing circuit of claim 3, wherein the first metal line and the second metal line are straight lines, the distance from the electronic component to the first metal line is the same, and the distance from the electronic component to the second metal line is the same.
5. The parallel current sharing circuit of claim 4, wherein the first metal line and the second metal line are parallel.
6. The parallel current sharing circuit of claim 1, wherein the first metal line and the second metal line have the same width, the length of each electronic component corresponding to the first metal line is the same, and the length of each electronic component corresponding to the second metal line is the same.
7. A PCB board, characterized by comprising a parallel current-sharing circuit, wherein the parallel current-sharing circuit adopts an electronic component parallel current-sharing circuit as claimed in claims 1-6.
8. A design method of a parallel current-sharing circuit of an electronic component is characterized by comprising the following steps:
carrying out impedance quantization on metal wires of current branches corresponding to n parallel electronic components to obtain an impedance expression of each current branch;
calculating the resistance value of the impedance metal block corresponding to each current branch according to the impedance expression, and adjusting the width of each impedance metal block on the PCB according to the resistance value so as to enable the current on each current branch to be equal;
wherein n is an integer greater than 2.
9. The method for designing the parallel current-sharing circuit of the electronic components as claimed in claim 8, wherein the electronic components are diodes.
10. The method as claimed in claim 8, wherein the current branch comprises at least one resistive metal block.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113392552A (en) * | 2021-06-15 | 2021-09-14 | 武汉大学 | Current-sharing optimization design method for multiple parallel switch devices based on finite element simulation |
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| US20110006604A1 (en) * | 2009-07-07 | 2011-01-13 | Delta Electronics, Inc. | Current-sharing supply circuit for driving multiple sets of dc loads |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113392552A (en) * | 2021-06-15 | 2021-09-14 | 武汉大学 | Current-sharing optimization design method for multiple parallel switch devices based on finite element simulation |
| CN113392552B (en) * | 2021-06-15 | 2022-04-15 | 武汉大学 | Current-sharing optimization design method for multiple parallel switch devices based on finite element simulation |
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